Abstract: A wafer inspection method improving inspection accuracy and operation efficiency. A method for performing electrical inspection by bringing into contact with pads in chips on a wafer. A chuck step S1 for heating the wafer to an inspection temperature; a first position recognition step S2 for recognizing all the positions of the pads; a second position recognition step S3 for re-recognizing, before performing the electrical inspection, the position of the pads recognizing the positional shifts of the pads due to thermal expansion; and a correction step S4 for correcting contact positions with respect to the probes, the contact positions being corrected on the basis of pad positions, which have been re-recognized in the second position recognition step S3 on the basis of the pad positions recognized in the first position recognition step S2, and which have been updated.

Abstract: [Problem] To provide a processing device for grinding by suppressing brittle-mode grinding and stabilizing a wafer. [Solution] A processing device 1 is provided with: an index table 2 on which a wafer W is moved from a coarse grinding stage S2 to a fine grinding stage S3; a column 4 provided so as to span over the coarse grinding stage S2 and the fine grinding stage S3; a coarse grinding means 5 provided on the column 4 above the coarse grinding stage S2, the coarse grinding means 5 performing coarse-grinding processing on the wafer W; and a fine grinding means 6 provided on the column 4 over the fine grinding stage S3, the fine grinding means 6 performing fine-grinding processing on the wafer W.

Abstract: To provide a prober and a probe contact method capable of enhancing the reliability of electrical contact between electrode pads on a wafer and probes. A prober includes a wafer chuck, a probe card, a ring-shaped seal member provided on the wafer chuck, a Z-axis moving/rotating unit which lifts up and down the wafer chuck detachably fixed to a wafer chuck fixing part, a decompressor which depressurize an internal space formed by the probe card, the wafer chuck and the ring-shaped seal member, a lifting controller which controls the Z-axis moving/rotating unit to bring probes into contact with electrode pads in an overdrive condition, and a depressurization controller which controls the decompressor such that the wafer chuck is drawn to the probe card by depressurization of the internal space.

Abstract: Provided is a prober capable of maintaining parallelism between a probe card and a wafer as well as performing wafer-level inspection with high accuracy. A test head is held by a test head holding part, and the test head and a probe card are sucked and fixed to a pogo frame attached to a head stage. A wafer chuck is moved toward a probe card while being fixed to a Z-axis movement-rotation unit in a detachable manner, and the wafer chuck is drawn toward the probe card by reducing pressure in an air-tight space formed between the wafer chuck and the probe card using a pressure reducing unit. Then, an electrical inspection of a wafer is performed while the test head, the pogo frame, the probe card, and the wafer chuck are integrated with respect to the head stage.

Abstract: A height position of a surface of a wafer can be detected accurately and stably without being affected by variation in a thin film formed on the surface of the wafer. An AF (autofocus) device irradiates the surface of the wafer W with an AF laser beam, detects reflection light thereof for each wavelength with a detection optical system. An AF signal processing unit outputs a displacement signal indicating displacement of the surface of the wafer to a control unit on the basis of a detection result of the detection optical system. Moreover, the AF device includes a focus optical system disposed in an irradiation optical path which is an optical path from the light source unit to a light converging lens. The focus optical system adjusts a light converging point of the AF laser beam in a wafer thickness direction.

Abstract: Provided is an ultrasonic displacement sensor that more accurately identifies a plurality of models on a conveyance line on which a plurality of types of workpieces having different specifications coexists, in particular, on a conveyance line of cylinder blocks in a manufacturing facility of engines for automobiles, to thereby improve reliability.

Abstract: A grinding machine includes a rotatable spindle having a lower end to which a grindstone for grinding a wafer is attached; linear guides supporting the spindle slidably to a column; a spindle feeding mechanism feeding the spindle in a vertical direction; and constant-pressure feeding mechanism interposed between the spindle feeding mechanism and the column and suspending the spindle feeding mechanism. The constant-pressure feeding mechanism raises the spindle feeding mechanism in the vertical direction when a friction force acting on the grindstone is higher than a predetermined value.

Abstract: There are provided a surface shape measuring method and a surface shape measuring device which can measure the diameter of a workpiece to be measured with high precision and high reproducibility and have excellent versatility. These method include: acquiring first shape data indicating a surface shape of the workpiece with a detector being disposed on one side across a workpiece while rotating the workpiece relatively to the detector around a rotational center; acquiring second shape data indicating the surface shape of the workpiece with the detector being disposed on the other side across the workpiece while rotating the workpiece relatively to the detector around the rotational center; and calculating a shape parameter defining the surface shape of the workpiece by collating the first shape data and second shape data. In calculating the shape parameter, a deviation of the detector from the reference line is calculated based on the collation result.

Abstract: To provide a probing device and a probing method for an electronic device capable of confirming whether or not an electrical inspection has been executed appropriately, with an electrode pad being made in contact with a probe with a predetermined pressure, by utilizing a change in external shapes to be formed on the electrode pad when the probe and the electrode pad are pressed onto each other.

Abstract: There is provided a three-dimensional coordinate measurement apparatus capable of reducing shaking of a Y carriage and improving measurement accuracy. A groove is formed along a Y-axis direction in a right side part of a surface plate made of stone, and a Y guide is formed between the groove and a right side surface of the surface plate to support a Y carriage in a portal shape in a movable manner in the Y-axis direction. A support section is provided at a lower end of a right Y carriage on the right side of the Y carriage, and the support section is supported by the surface plate through air pads which are disposed by two air pads back and forth on the corresponding one of a top surface, a right side surface, and a bottom surface, of the surface plate, and a right side surface of the groove.

Abstract: A three-dimensional coordinate measuring machine includes a base, a moving mechanism provided on the base, and a probe moved by the moving mechanism, the three-dimensional coordinate measuring machine measures coordinates of a surface position of an object to be measured by using the probe, the moving mechanism includes: a linear guide using a mechanical bearing; and an air bearing mechanism provided in parallel to the linear guide, one of ends of the moving part is attached to a linear moving unit that moves by the linear guide and the other is attached to the air moving part so that the other end can swing with respect to the air moving part, and the air bearing mechanism absorbs a difference in the height change between the linear guide and the air bearing mechanism by the air bearing.

Abstract: The present invention provides a semiconductor wafer inspection apparatus and a semiconductor wafer inspection method that can suppress warpage in a semiconductor wafer due to a temperature difference between the mounting surface of a table and the semiconductor wafer. In a prober of the present invention, a semiconductor wafer is heated to have a second temperature which is equal to or lower than a first temperature in a preheating step using an oven, and then the semiconductor wafer is placed on a mounting surface of a table which is heated to the first temperature. Thus, because a temperature difference between the mounting surface of the table and the semiconductor wafer is reduced in the prober, it is possible to suppress warpage in the semiconductor wafer that occurs right after the semiconductor wafer is placed on the mounting surface.

Abstract: In a shape measuring apparatus for measuring the roughness and/or contour of a surface of a workpiece by sliding a sensing pin on a tip end side of an arm on the workpiece, the arm is provided with an engagement mechanism that makes a sensing pin side of the arm removable to a base end side of the arm. The engagement mechanism has two engagement surfaces which face each other and attract each other by a magnetic force. One of the engagement surfaces includes a linear first groove that is in parallel to an axis of the arm and another engagement part that is different from the first groove, and the other of the engagement surfaces includes a first fitting pin that is positioned to be fitted into the first groove and a second fitting pin that is fitted into the other engagement part.

Abstract: A rotation angle measurement device includes: relative angle detection means including a reference support whose rotation is regulated in a fixed range in an arbitrary direction of a rotation axis, and a driving rotating body which is coupled to the reference support and is axially supported so as to be all-round rotatable with respect to the reference support, the relative angle detection means which detects a relative rotation angle of the rotating body with respect to the reference support; and non-contact angle detection means which detects a rotation angle of the reference support with reference to a position that does not contact with the rotating body and the reference support. This provides improved accuracy in indexing the rotation angle of a rotating moving shaft and easy installation onto the rotating moving shaft.

Abstract: A bidirectional displacement detector according to the present invention includes: a displacement detector which includes a first detection element and a second detection element; a base at which the first detection element is provided; an arm which is coupled to the base so as to be rotatable around an arm rotation axis extending in a horizontal direction, and at which the second detection element is provided; and a probe which is coupled to the base so as to be rotatable around a probe rotation axis perpendicular to the arm rotation axis. The probe has a contact part provided at a position away from the probe rotation axis, and a pair of abutment parts which is disposed along a direction of the arm rotation axis and on both sides with the probe rotation axis interposed therebetween and comes into contact with the arm so as to be able to be separated from the arm. Each of the pair of abutment parts is in contact with the arm from the lower side thereof and is biased upward.

Abstract: An object of the present invention is to provide a dicing blade which does not cause cracking and breaking even in a workpiece formed from a brittle material, and can stably perform cutting process in a ductile mode on the workpiece with high precision. A dicing blade 26 which performs the cutting process on the workpiece is integrally formed of a diamond sintered body 80 which is formed by sintering diamond abrasive grains 82 so as to have a discoid shape, and a content of the diamond abrasive grains 82 of the diamond sintered body 80 is 80 vol % or more. It is preferable that recessed parts which are formed on a surface of the diamond sintered body 80 are continuously provided in an outer circumferential part of the dicing blade 26 along a circumferential direction.

Abstract: A laser dicing device includes a laser light source, an AF light source, a light path of the processing laser light and a light path of the AF laser light being partially shared with each other, a condenser lens arranged on the shared light path between the first laser light and the second laser light, an AF signal processing unit that generates a focus error signal based on reflected light of the AF laser light reflected by the surface of the wafer, a controller that moves the condenser lens such that a distance between the condenser lens and the surface of the wafer is made constant based on the focus error signal, and a focus lens group that adjusts the position of the condensing point of the AF laser light in a state where the position of the condensing point of the processing laser light is fixed.

Abstract: A probe device of the present invention measures a position of every chip in a wafer to be inspected to acquire the position as actual measurement data. Then, the probe device calculates a variation amount of an actual measurement position of each chip or a variation amount of a position at which a probe is brought into contact with the each chip of the wafer on the basis of the actual measurement data, and allows a monitor to display a range-of-variation display image that visually displays the variation amount. In the image, a quadrangular area corresponding to the each chip is displayed, and a dot is displayed in each the quadrangular area at a position shifted from a center position thereof in accordance with the variation amount.

Abstract: A roundness measuring apparatus, which has a small space required for installation and of which measurement error due to a temperature change is small, is disclosed. The roundness measuring apparatus includes: a base; a turn-table which is fixed to the base and rotates a work placed on the turn-table; a two-dimensional moving mechanism provided at the base so as to move a holder holding part in parallel to a measurement plane including a rotation axis of the turn-table and a measuring point of the work; a detector holder attached to the holder holding part; and a detector attached to the detector holder so that a probe can be displaced on the measurement plane.

Abstract: An angle measuring system including: a rotary encoder including an encoder main body and a rotating shaft which is freely rotatable with respect to the encoder main body, the rotary encoder which detects a relative rotation angle of the rotating shaft with respect to the encoder main body; a regulation member which regulates an absolute rotation angle of the encoder main body about the rotating shaft within a fixed range; an absolute angle detecting device which detects the absolute rotation angle of the encoder main body about the rotating shaft concurrently with detection of the relative rotation angle by the rotary encoder; and a correction device which corrects the rotation angle detected by the rotary encoder based on the rotation angle detected by the absolute angle detecting device.