Patents Assigned to Tokyo Seimitsu Co., Ltd.
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Publication number: 20230003510Abstract: The inner surface shape measurement device, which measures an inner surface shape of a small hole formed in a workpiece, includes: a rotating body for rotating the workpiece around a rotation axis, and a linear-and-tilting-motion stage; an elongated probe capable of being inserted into the small hole of the workpiece; a probe linear-and-tilting-motion mechanism capable of adjusting posture of the probe; a camera, configured to be rotatable integrally with the rotating body, for imaging the probe from at least three circumferential positions on a rotation trajectory centered on a rotation axis; and a controller for adjusting the posture of the probe using the probe linear-and-tilting-motion mechanism based on an image taken by the camera at each of the circumferential positions.Type: ApplicationFiled: September 7, 2022Publication date: January 5, 2023Applicant: Tokyo Seimitsu Co., Ltd.Inventors: Hideki MORII, Katsufumi MORIYAMA
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Patent number: 11525660Abstract: When an index table is installed on a rotary table in a surface shape measuring device, deterioration in measurement accuracy can be suppressed. The surface shape measuring device includes: a rotary table which is configured to place a workpiece thereon and to be freely rotatable around a rotation center axis; and a detector configured to detect a displacement of a probe brought into contact with the workpiece. The rotary table has a centering mechanism configured to align a center axis of the workpiece and the rotation center axis. An index table freely detachably mounted on the rotary table is provided, the index table configured so as to be able to perform indexing along a first axis and a second axis which are perpendicular to the rotation center axis. Eccentric load cancelling means configured to cancel an eccentric load caused by the indexing of the index table is provided.Type: GrantFiled: May 20, 2022Date of Patent: December 13, 2022Assignee: TOKYO SEIMITSU CO., LTD.Inventor: Michihiro Sekimoto
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Patent number: 11504869Abstract: A workpiece processing device includes a workpiece supporting unit configured to support a workpiece so that the workpiece is rotatable around a first axis parallel to a central axis of the workpiece, a cutting unit having a blade configured to cut a surface of the workpiece, a detecting unit configured to calculate a position of a vertex of the surface in a direction along a second axis which is perpendicular to the first axis and parallel to the blade, and a control unit configured to control the workpiece supporting unit so that a cutting position on the surface is located at a vertex in the direction along the second axis, and relatively move the workpiece supporting unit and the cutting unit so that an incision direction of the blade is on a plane defined by the central axis and the cutting position, thereby forming a groove at the cutting position.Type: GrantFiled: February 26, 2021Date of Patent: November 22, 2022Assignee: TOKYO SEIMITSU CO., LTD.Inventors: Takahiro Iida, Teruhiko Nishikawa, Tasuku Shimizu
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Publication number: 20220362958Abstract: A dicing device includes: a workpiece table; a cutting unit including a blade and a spindle; an XY-direction drive unit; a Z-direction drive unit; a first measuring instrument for measuring a Z-direction position of a surface of a workpiece held on a holding surface of the workpiece table; a second measuring instrument for measuring a Z-direction displacement of the holding surface; a correction amount calculation unit for calculating a correction amount for the Z-direction position of the cutting unit based on a table displacement map showing the Z-direction displacement at each position on the holding surface, the Z-direction displacement having been measured in advance by the second measuring instrument and based on the Z-direction position of the surface of the workpiece, measured by the first measuring instrument; and a control unit for controlling, when the workpiece is cut by a blade, the Z-direction drive unit based on the correction amount.Type: ApplicationFiled: July 29, 2022Publication date: November 17, 2022Applicant: Tokyo Seimitsu Co., Ltd.Inventors: Marina EKI, Shiori SAITO
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Publication number: 20220357143Abstract: A workpiece diameter measurement method includes: detecting positions of a probe while relatively rotating an uncalibrated standard and a detector around a rotation center in a state where the probe is in contact with a circumferential face of the standard from one side in a displacement direction of the probe, detecting the positions of the probe while relatively rotating the standard and the detector around the rotation center in a state where the probe is in contact with the circumferential face from another side in the displacement direction, calculating the position of the rotation center based on the detected positions, relatively rotating a workpiece and the detector around the rotation center in a state where the probe is in contact with the workpiece from the other side, and calculating a diameter of a circumferential face of the workpiece.Type: ApplicationFiled: July 25, 2022Publication date: November 10, 2022Applicant: Tokyo Seimitsu Co., Ltd.Inventors: Kosuke TOMITA, Ryo TAKANASHI
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Patent number: 11472055Abstract: A workpiece processing device includes a workpiece supporting unit configured to support a workpiece so that the workpiece is rotatable around a first axis parallel to a central axis of the workpiece, a cutting unit having a blade configured to cut a surface of the workpiece, a detecting unit configured to calculate a position of a vertex of the surface in a direction along a second axis which is perpendicular to the first axis and parallel to the blade, and a control unit configured to control the workpiece supporting unit so that a cutting position on the surface is located at a vertex in the direction along the second axis, and relatively move the workpiece supporting unit and the cutting unit so that an incision direction of the blade is on a plane defined by the central axis and the cutting position, thereby forming a groove at the cutting position.Type: GrantFiled: February 26, 2021Date of Patent: October 18, 2022Assignee: TOKYO SEIMITSU CO., LTD.Inventors: Takahiro Iida, Teruhiko Nishikawa, Tasuku Shimizu
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Patent number: 11458594Abstract: This method for manufacturing a cutting blade includes: a mixing step of adding a liquid dispersion medium to a mixed powder containing a resin powder of a thermocompression-bondable resin, abrasive grains and fibrous fillers; a compression step of cold pressing, in a forming die, the mixed powder to which the dispersion medium has been added to form an original plate of a blade main body; and a sintering step of hot pressing and sintering the original plate.Type: GrantFiled: December 18, 2019Date of Patent: October 4, 2022Assignee: TOKYO SEIMITSU CO., LTD.Inventor: Masato Nakamura
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Patent number: 11435175Abstract: Provided are a displacement detector, a surface shape measuring apparatus, and a roundness measuring apparatus capable of measuring displacement in a plurality of directions, having a simple configuration, and capable of highly accurate measurement. A displacement measurer includes: a detector body; a substantially L-shaped stylus having a contactor to be in contact with a measuring surface of an object to be measured; a stylus holding part that is provided in the detector body and holds the stylus in a swingable manner, with a swing plane being a plane including a first direction and a second direction that are perpendicular to each other; and a displacement detecting unit that is provided in the detector body and detects displacement of the contactor associated with contact between the contactor and the measuring surface.Type: GrantFiled: June 2, 2021Date of Patent: September 6, 2022Assignee: TOKYO SEIMITSU CO., LTD.Inventor: Hideki Morii
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Publication number: 20220276037Abstract: When an index table is installed on a rotary table in a surface shape measuring device, deterioration in measurement accuracy can be suppressed. The surface shape measuring device includes: a rotary table which is configured to place a workpiece thereon and to be freely rotatable around a rotation center axis; and a detector configured to detect a displacement of a probe brought into contact with the workpiece. The rotary table has a centering mechanism configured to align a center axis of the workpiece and the rotation center axis. An index table freely detachably mounted on the rotary table is provided, the index table configured so as to be able to perform indexing along a first axis and a second axis which are perpendicular to the rotation center axis. Eccentric load cancelling means configured to cancel an eccentric load caused by the indexing of the index table is provided.Type: ApplicationFiled: May 20, 2022Publication date: September 1, 2022Applicant: Tokyo Seimitsu Co., Ltd.Inventor: Michihiro SEKIMOTO
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Publication number: 20220262660Abstract: A temperature control device for a semiconductor wafer includes a placement part having a placement surface on which a semiconductor wafer is placed and having a plurality of regions in which the placement surface is partitioned in a plan view, a temperature adjustment part configured to independently adjust a temperature of the placement part for each of the plurality of regions, a plurality of temperature detection parts provided in at least one of the plurality of regions and configured to detect a temperature of the region of which the temperature has been adjusted by the temperature adjustment part, and a control part configured to monitor detection temperatures of the plurality of temperature detection parts, to select one having a large temperature change per unit time among a plurality of monitored detection temperatures, and to control the temperature adjustment part based on the selected detection temperature.Type: ApplicationFiled: February 2, 2022Publication date: August 18, 2022Applicants: KELK Ltd., TOKYO SEIMITSU CO., LTD.Inventors: Wataru Omuro, Atsushi Kobayashi, Takashi Motoyama, Takenori Takahashi
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Patent number: 11397073Abstract: Provided are a displacement detector, a surface shape measuring apparatus, and a roundness measuring apparatus capable of measuring displacement in a plurality of directions, having a simple configuration, and capable of highly accurate measurement. A displacement measurer includes: a detector body; a substantially L-shaped stylus having a contactor to be in contact with a measuring surface of an object to be measured; a stylus holding part that is provided in the detector body and holds the stylus in a swingable manner, with a swing plane being a plane including a first direction and a second direction that are perpendicular to each other; and a displacement detecting unit that is provided in the detector body and detects displacement of the contactor associated with contact between the contactor and the measuring surface.Type: GrantFiled: June 2, 2021Date of Patent: July 26, 2022Assignee: TOKYO SEIMITSU CO., LTD.Inventor: Hideki Morii
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Patent number: 11365959Abstract: The three-dimensional measuring method includes: a conveying step of conveying a workpiece to be measured by a robot arm configured to change an attitude of the workpiece; a measuring step of performing three-dimensional measurement on the workpiece by a probe configured to be movable relative to the surface plate in a state in which the workpiece is held by the robot arm; a relative-position change detecting step of detecting a change in a relative position between the surface plate and the robot arm; and a vibration correcting step of correcting a result of the measurement performed on the workpiece in the measuring step based on a result of detection performed in the relative-position change detecting step.Type: GrantFiled: June 2, 2021Date of Patent: June 21, 2022Assignee: TOKYO SEIMITSU CO., LTD.Inventors: Hitoshi Tamura, Tomotaka Yamagata, Kento Kurihara, Yoichi Togawa
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Patent number: 11260470Abstract: A laser machining device which condenses a laser light inside a wafer and forms modified regions in a plurality of layers in the wafer, includes an infrared imaging optical system configured to face one surface of the wafer. In a case where a modified region positioned on a side of another surface opposite to the one surface of the wafer is defined as a first modified region and another modified region is defined as a second modified region, among the modified regions in the plurality of layers, the infrared imaging optical system has a focusing range that includes the first modified region and the another surface, and simultaneously images the first modified region and the another surface, and the second modified region is positioned outside the focusing range.Type: GrantFiled: May 6, 2021Date of Patent: March 1, 2022Assignee: TOKYO SEIMITSU CO., LTD.Inventors: Takashi Shimanuki, Masanobu Koyata, Shuhei Oshida
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Patent number: 11141830Abstract: Processing device for uniformly grinding wafers held by a plurality of chucks, and a method for setting the processing device. A processing device includes a coarse grinding device and a fine grinding device that are provided in a column straddling over a holding device. The holding device includes: an index table; chucks concentrically disposed about a rotation shaft; a first movable support unit on the outer peripheral side of the chuck in the radial direction of the index table; and a first fixed support unit on the inner peripheral side of the chuck in the radial direction of the index table. The first movable support unit is interposed between the index table and the chuck, and can be freely expanded and contracted in a vertical direction.Type: GrantFiled: September 11, 2017Date of Patent: October 12, 2021Assignee: Tokyo Seimitsu Co., LTDInventors: Makoto Shimoda, Masaki Kanazawa
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Publication number: 20210293519Abstract: The three-dimensional measuring method includes: a conveying step of conveying a workpiece to be measured by a robot arm configured to change an attitude of the workpiece; a measuring step of performing three-dimensional measurement on the workpiece by a probe configured to be movable relative to the surface plate in a state in which the workpiece is held by the robot arm; a relative-position change detecting step of detecting a change in a relative position between the surface plate and the robot arm; and a vibration correcting step of correcting a result of the measurement performed on the workpiece in the measuring step based on a result of detection performed in the relative-position change detecting step.Type: ApplicationFiled: June 2, 2021Publication date: September 23, 2021Applicant: Tokyo Seimitsu Co., Ltd.Inventors: Hitoshi TAMURA, Tomotaka YAMAGATA, Kento KURIHARA, Yoichi TOGAWA
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Publication number: 20210283745Abstract: A workpiece processing device includes a workpiece supporting unit configured to support a workpiece so that the workpiece is rotatable around a first axis parallel to a central axis of the workpiece, a cutting unit having a blade configured to cut a surface of the workpiece, a detecting unit configured to calculate a position of a vertex of the surface in a direction along a second axis which is perpendicular to the first axis and parallel to the blade, and a control unit configured to control the workpiece supporting unit so that a cutting position on the surface is located at a vertex in the direction along the second axis, and relatively move the workpiece supporting unit and the cutting unit so that an incision direction of the blade is on a plane defined by the central axis and the cutting position, thereby forming a groove at the cutting position.Type: ApplicationFiled: May 28, 2021Publication date: September 16, 2021Applicant: Tokyo Seimitsu Co., Ltd.Inventors: Takahiro IIDA, Teruhiko NISHIKAWA, Tasuku SHIMIZU
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Publication number: 20210285751Abstract: Provided are a displacement detector, a surface shape measuring apparatus, and a roundness measuring apparatus capable of measuring displacement in a plurality of directions, having a simple configuration, and capable of highly accurate measurement. A displacement measurer includes: a detector body; a substantially L-shaped stylus having a contactor to be in contact with a measuring surface of an object to be measured; a stylus holding part that is provided in the detector body and holds the stylus in a swingable manner, with a swing plane being a plane including a first direction and a second direction that are perpendicular to each other; and a displacement detecting unit that is provided in the detector body and detects displacement of the contactor associated with contact between the contactor and the measuring surface.Type: ApplicationFiled: June 2, 2021Publication date: September 16, 2021Applicant: Tokyo Seimitsu Co., Ltd.Inventor: Hideki MORII
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Publication number: 20210276121Abstract: A laser machining device which condenses a laser light inside a wafer and forms modified regions in a plurality of layers in the wafer, includes an infrared imaging optical system configured to face one surface of the wafer. In a case where a modified region positioned on a side of another surface opposite to the one surface of the wafer is defined as a first modified region and another modified region is defined as a second modified region, among the modified regions in the plurality of layers, the infrared imaging optical system has a focusing range that includes the first modified region and the another surface, and simultaneously images the first modified region and the another surface, and the second modified region is positioned outside the focusing range.Type: ApplicationFiled: May 6, 2021Publication date: September 9, 2021Applicant: Tokyo Seimitsu Co., Ltd.Inventors: Takashi SHIMANUKI, Masanobu KOYATA, Shuhei OSHIDA
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Publication number: 20210245324Abstract: A workpiece processing device includes a workpiece supporting unit configured to support a workpiece so that the workpiece is rotatable around a first axis parallel to a central axis of the workpiece, a cutting unit having a blade configured to cut a surface of the workpiece, a detecting unit configured to calculate a position of a vertex of the surface in a direction along a second axis which is perpendicular to the first axis and parallel to the blade, and a control unit configured to control the workpiece supporting unit so that a cutting position on the surface is located at a vertex in the direction along the second axis, and relatively move the workpiece supporting unit and the cutting unit so that an incision direction of the blade is on a plane defined by the central axis and the cutting position, thereby forming a groove at the cutting position.Type: ApplicationFiled: March 3, 2020Publication date: August 12, 2021Applicant: Tokyo Seimitsu Co., Ltd.Inventors: Takahiro IIDA, Teruhiko NISHIKAWA, Tasuku SHIMIZU
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Patent number: 11075071Abstract: To provide a wafer processing method which can simplify the wafer processing process and efficiently obtain chips of stable quality. A wafer processing method includes: a tape attaching step of attaching a back grinding tape to the front surface of a wafer; a modified region forming step of applying a laser beam from the back surface of the wafer along a cut line to form modified regions inside the wafer; a back surface processing step of processing the back surface of the wafer having the modified regions to reduce a thickness of the wafer; and a dividing step of, in a state in which the back grinding tape is attached to the front surface of the wafer, applying a load to the cut line from the back surface of the wafer to divide the wafer along the cut line and obtain individual chips.Type: GrantFiled: May 5, 2020Date of Patent: July 27, 2021Assignee: TOKYO SEIMITSU CO., LTD.Inventors: Ryosuke Kataoka, Takashi Tamogami, Syuhei Oshida