Abstract: An inkjet head maintenance device includes a base, a liquid supplier and a liquid collector. The base has an upper face disposed closely opposite a nozzle face of an inkjet head to form a liquid reservoir space during maintenance of the inkjet head. The base includes a liquid supply hole and a liquid collection hole that open to the upper face. The liquid supplier is configured to supply liquid from the liquid supply hole to the liquid reservoir space. The liquid collector is configured to collect the liquid in the liquid reservoir space from the liquid collection hole.

Abstract: In an in-vivo signal source detection method, three electrodes are arranged on the circumference of a surface of an living body to surround multiple muscle fibers; a first voltage Vi generated when a first external resistor is connected to between each electrode and a ground potential and a second voltage V?i generated when a second external resistor is connected to between each electrode and the ground potential; and a ratio Vi/V?i is calculated from the first voltage Vi and the second voltage V?i, and the position of a signal source in the living body is detected based on three ratios Vi/V?i.

Abstract: A process for producing a resin-impregnated fiber bundle includes an unwinding step in which a resin-unimpregnated fiber bundle is unwound, a resin impregnation step in which the fiber bundle is passed through an impregnation bath filled with a resin, and an impregnation acceleration step in which after the resin impregnation step, the resin is permeated into the fiber bundle, at least the impregnation acceleration step being performed in a decompression space having a pressure lower than atmospheric pressure. It is possible to produce a resin-impregnated fiber bundle using a decompression space for which decompression can be achieved with a simple device and in which the airtightness is easy to maintain and which has been configured so as to result in satisfactory working efficiency.

Abstract: A thin-film forming device forms a thin film on a strip-shaped substrate by subjecting the strip-shaped substrate to a surface treatment while conveying the strip-shaped substrate in a state of being laid along an outer peripheral face of a main roll. The thin-film forming device comprises: a main roll chamber accommodating the main roll; a plurality of film formation chambers arranged in a peripheral direction of the main roll, the film formation chambers having partitions disposed radially outward of the main roll; and a main roll cover covering the outer peripheral face of the main roll over which the strip-shaped substrate travels, the main roll cover being provided to the partitions, the main roll cover having a film formation chamber communication component that communicates with the film formation chambers.

Abstract: In an LED module, modes to solve such a problem that a loss in the output of light discharged into the atmosphere occurs are embodied. Specifically, in an LED module in which an LED chip is sealed with a sealing resin, a surface of the sealing resin is covered with a thin film, the thin film is made of a material having a smaller linear expansion coefficient than the sealing resin, and an irregular surface is provided on a surface of the thin film such that light from the LED chip is multiply reflected.

Abstract: A film thickness measurement device includes a light source, an imaging component, and a controller. The controller estimates unknown variables I1(j), I20(j), k(j), and t(i) based on the Formula (1), where i represents an observation point number of an interference image captured by the imaging component, j represents a number for a type of wavelength of monochromatic light, ?(j) represents wavelength of the monochromatic light, n represents a refractive index of a semi-transparent film, g(i,j) represents a brightness value observed at an observation point, I1(j) represents an intensity of reflected light from a front face of the semi-transparent film, I20(j) represents an intensity of reflected light from a rear face of the semi-transparent film when there is no absorption of light in the semi-transparent film, k(j) represents an absorption coefficient of the semi-transparent film, and t(i) represents a film thickness of the semi-transparent film.

Abstract: A mounting device includes a thermocompression bonding head, a pressure reduction mechanism, and a resin sheet feed mechanism. The thermocompression bonding head is configured to heat a semiconductor chip while holding the semiconductor chip and to bond the semiconductor chip to a joined piece by compression. The thermocompression bonding head has a suction hole in a face that holds the semiconductor chip. The pressure reduction mechanism communicates with the suction hole and is configured to reduce pressure inside the suction hole. The resin sheet feed mechanism is configured to supply a resin sheet between the thermocompression bonding head and the semiconductor chip. An electrode that protrudes from a top face of the semiconductor chip is bonded by thermocompression after being embedded in the resin sheet.

Abstract: A method for manufacturing a semiconductor device includes laminating a plurality of semiconductor wafers via an adhesive, heating such that the adhesive reaches a specific viscosity, and pressing the semiconductor wafers under a provisional pressure bonding load such that a gap between solder of through-electrodes provided to chip parts and through-electrodes of an adjacent semiconductor wafer falls within a specific range that is greater than zero, to produce a provisional pressure-bonded laminate; cutting the provisional pressure-bonded laminate with a cutter to produce a provisional pressure-bonded laminate chip part; and heating the provisional pressure-bonded laminate chip part to at least curing temperature of the adhesive and at least melting point of the solder, and pressing the provisional pressure-bonded laminate chip part under a main pressure bonding load to produce a main pressure-bonded laminate chip part such that the solder comes into contact with the through-electrodes of adjacent chip parts

Abstract: A method for detecting a position of a signal source in a living body includes: arranging three electrodes on a surface of the living body and alternately connecting a first external resistance and a second external resistance in parallel between the electrodes and a ground potential; measuring first voltages Vi (i=1, 2, 3) generated at the respective electrodes when the first external resistance is connected in parallel between the electrodes and the ground potential, and second voltages Vi (i=1, 2, 3) generated at the respective electrodes when the second external resistance is connected in parallel between the electrodes and the ground potential; and calculating three ratios Vi/V?i (i=1, 2, 3) from the first and second voltages Vi and V?i, and detecting the position of the signal source in the living body based on the three ratios Vi/V?i (i=1, 2, 3).

Abstract: An operational feeling reproduction device includes an operation component, an actuator, and a drive shaft. The actuator generates a haptic drive force in response to operation of the operation component. The drive shaft couples the operation component and the actuator. The haptic drive force is transmitted to the operation component through the drive shaft in response to the operation of the operation component such that an actual operational feeling is experienced. The actuator has a stationary element and a movable element. The actuator generates the haptic drive force by a relative displacement while one of the stationary element and the movable element is inserted into the other one of the stationary element and the movable element. The movable element and the operation component are coupled by the drive shaft. Center axes of the stationary element, the movable element, and the drive shaft are provided on the same axis.

Abstract: A forceps system includes a forceps manipulator and a control unit. The forceps manipulator includes a forceps tip unit capable of bending with two degrees of freedom including a bending direction and a bending angle, a drive unit that generates a driving force for the forceps tip unit, an operation unit for instructing the bending direction and the bending angle, and a first detection unit that detects an angle in a rotation direction with respect to an axis of the drive transmitting unit. The control unit that controls the drive unit such that the forceps tip unit bends depending on a predetermined target bending direction and a predetermined target bending angle. The control unit sets a target bending direction on the basis of the bending direction instructed from the operation unit and the angle detected by the first detection unit.

Abstract: The surface profile of a coating material in a substrate width direction is optimized in coating a substrate with the coating material such as an electrode active material.

Abstract: A process for producing a resin-impregnated fiber bundle includes an unwinding step in which a resin-unimpregnated fiber bundle is unwound, a resin impregnation step in which the fiber bundle is passed through an impregnation bath filled with a resin, and an impregnation acceleration step in which after the resin impregnation step, the resin is permeated into the fiber bundle, at least the impregnation acceleration step being performed in a decompression space having a pressure lower than atmospheric pressure. It is possible to produce a resin-impregnated fiber bundle using a decompression space for which decompression can be achieved with a simple device and in which the airtightness is easy to maintain and which has been configured so as to result in satisfactory working efficiency.

Abstract: A method for detecting a position of a signal source in a living body includes: arranging three electrodes on a surface of the living body and alternately connecting a first external resistance and a second external resistance in parallel between the electrodes and a ground potential; measuring first voltages Vi (i=1, 2, 3) generated at the respective electrodes when the first external resistance is connected in parallel between the electrodes and the ground potential, and second voltages Vi (i=1, 2, 3) generated at the respective electrodes when the second external resistance is connected in parallel between the electrodes and the ground potential; and calculating three ratios Vi/V?i (i=1, 2, 3) from the first and second voltages Vi and V?i, and detecting the position of the signal source in the living body based on the three ratios Vi/V?i (i=1, 2, 3).

Abstract: A bonding apparatus bonds a plurality of device chips on a plurality of electrode pads that are provided to a surface of a substrate. The bonding apparatus includes a stage, a head unit, a head lifting mechanism, a head vibrator, a heater, and a bonding region observation component. The substrate is placed and supported on the stage. The head unit holds the device chips. The head lifting mechanism raises and lowers the head unit in an up and down direction relative to the stage. The head vibrator vibrate the head unit in the up and down direction. The heater heats a bonding paste that bonds the device chips and the electrode pads. The bonding region observation component observes a region that includes at least a peripheral part of the electrode pads.

Abstract: A three-dimensional mounting method for successively laminating N number of upper-layer joining materials includes positioning a first upper-layer joining material relative to a lowermost-layer joining material by recognizing an alignment position of the lowermost-layer joining material and a lower face alignment position of the first upper-layer joining material by a two-field image recognition unit, storing positional coordinates of the alignment position of the lowermost-layer joining material, positioning an (n+1)-th upper-layer joining material relative to an n-th upper-layer joining material by recognizing an upper face alignment position of the n-th upper-layer joining material and a lower face alignment position of the (n+1)-th upper-layer joining material, storing positional coordinates of the upper face alignment position of the n-th upper-layer joining material, recognizing an upper face alignment position of the N-th uppermost-layer joining material, and storing positional coordinates of the upper

Abstract: A device for testing an application state of a plurality of strips of fiber reinforced plastic tape affixed in rows on a surface of a structure, the device includes an illumination component emits observation-use illuminating light beams toward a test region of the fiber reinforced plastic tape, an observation component observes reflected light from the test region, and a testing component tests the application state of the fiber reinforced plastic tape based on an image observed by the observation component. The illumination component includes a plurality of irradiation units that light simultaneously and are disposed such that a pair of the observation-use illuminating light beams are emitted from directions that are mutually symmetrical with respect to a normal line of the test region, and an illumination direction change component that changes the directions of the pair of observation-use illuminating light beams emitted from the illumination component about the normal line.

Abstract: An apparatus for checking an adherence state of fiber reinforced plastic tape includes an illuminating section having first and second illuminating groups. The main optical axes of illumination light beams of light emitting sections of the first illuminating group are set at a designated inclination angle with respect to a surface of an imaging region and distances on the main optical axes between a surface of a structural object and each of the light emitting sections are set to be the same. The main optical axes of illumination light beams of light emitting sections of the second illuminating group are set at an inclination angle different from the first illuminating group with respect to the surface of the imaging region and distances on the main optical axes between the surface of the structural object and each of the light emitting sections are set to be the same.

Abstract: The surface profile of a coating material in a substrate width direction is optimized in coating a substrate with the coating material such as an electrode active material.

Abstract: A chemical vapor deposited film includes silicon atoms, oxygen atoms, carbon atoms, and hydrogen atoms. The chemical vapor deposited film is formed by a plasma CVD method such that the concentration of the oxygen atoms is 10-35% by element.