Abstract: A bonding apparatus comprising a cleaning chamber; cleaning means for irradiating energy waves to bonding surfaces in the cleaning chamber under a reduced pressure condition; bonding means for bonding metal bonding portions of objects to be bonded in an atmospheric air which have been taken out from the cleaning chamber; and carrying means for, with respect to at least one member of the objects to be bonded, carrying a foregoing object and an ensuing object substantially simultaneously in at least the carrying-in direction to the cleaning chamber and the carrying-out direction from the cleaning chamber. At the time of taking out the objects after cleaning into an atmospheric air and bonding them to each other, the carrying in, carrying out and delivery of objects to be bonded especially around the cleaning chamber can be performed smoothly within a short period of time, and mass production of desired bonded products can be realized at high throughput.

Abstract: A chip mounting device of the present invention includes: an adhesive application unit 11; a temporary crimp unit 12; and a main crimp unit 13. In the unit 11, a camera 21 is used for detecting base material marks for each section region on a film base material 1 and substrate marks for each substrate pattern in the section region. The detected results are transferred to the unit 12. In the unit 12, a camera 45 is used for detecting base material marks, and the position of each substrate pattern is recognized on the basis of on the detection results and the positional data of each substrate pattern transmitted from the unit 11, thereby crimping chips temporarily. This enables the chips to be mounted with high precision even when the film base material 1 is expanded and contracted. In the unit 12, there is no detection of substrate marks, which minimizes a decrease in processing efficiency.

Abstract: Positioning recognition marks (A, B, C, D) are read by movable recognition means (5) for positioning objects (2, 4) to be bonded to each other. An alignment method includes a step of reading the recognition marks (A, B, C, D) during movement of the recognition means (5) before its complete stop, and a step of identifying absolute positions of the recognition marks (A, B, C, D) by correcting the mark recognition positions having been read based on a position feedback signal of the moving recognition means (5). A mounting method using the alignment method is also disclosed. It is possible to maintain a high alignment accuracy, eliminate necessity of assuring a settling time for complete stop of the movable recognition means (5), and significantly reduce the alignment time and mounting tact.

Abstract: A mounting device including a plurality of heads, each holding a chip, arranged on a circle, is used to realize accurate and high-speed mounting. A mounting device comprises a plurality of heads with calibration marks, first recognition mechanism fixed in a chip mounting position, and second recognition mechanism fixed in another position. Prior to mounting operation, the first recognition mechanism and the second recognition mechanism recognize and store the positions of the calibration marks of the heads. In mounting operation, the first recognition mechanism recognizes the positions of a substrate and the calibration marks of the heads, whereas the second recognition mechanism recognizes the positions of chips attracted on the heads. The heads are moved vertically to adjust plane to be recognized. The chip and the substrate are aligned according to the position information obtained by the recognition mechanisms, and the chips are mounted.

Abstract: A method of mounting a chip in which an underfill agent having specific viscosity behavior and a trigger temperature is applied to at least one of a substrate and the chip, bumps are press-contacted to electrodes, the underfill agent is spread around the press-contacted bumps and the electrodes between the chip and the substrate, the bumps are melted by heating while the bumps are embedded in the underfill agent to bond the molten bumps and the electrodes, and in melt-bonding the bumps, a time to wet-spread the molten bumps is kept before the underfill agent is cured. Highly reliable excellent bonding between the bumps and the electrodes can be achieved by thoroughly wet-spreading the molten bumps while secondary oxidation in the underfill agent does not occur, and the time required until the underfill agent is cured to a specified state, and further resultantly, the time required until the press of the chip is stopped can be shortened.

Abstract: In a probe apparatus comprising an inspecting device, an intermediate substrate and a probe substrate, in which the inspecting device is electrically connected to a proximal end of the intermediate substrate, and the intermediate substrate has a distal end electrically connected to a proximal end of the probe substrate, and the probe substrate has a distal end electrically connectable to a substrate under inspection, a plurality of probe substrates are electrically connected to the single intermediate substrate. When a particular probe substrate 4 is damaged, only the particular probe substrate 4 may be changed, the other probe substrates 4 continuing to be used, thereby achieving economy.

Abstract: A ceramic holder 2 is mounted on the lower end of a connecting block 30 of metal mounted on the lower end of a tool main body 1 of metal, such ceramic holder 2, a ceramic heater 4 and a ceramic presser 5 being sintered. In addition) the coefficient of linear expansion of the ceramic holder 2 is approximately equal to those of the ceramic heater 4 and ceramic presser 5; furthermore, the thermal conductivities of the ceramic holder 2 and ceramic presser 5 are greater as the pressure side of the ceramic presser 5 as seen from the ceramic heater 4 is approached and are smaller as the attaching surface side of the ceramic holder 2 is approached.

Abstract: A chip mounting device comprising a first recognition means (3) for recognizing a first recognition mark (5) on the upper chip-retainable head (2) side, a second recognition means (4) for recognizing a second recognition mark (6) on the lower substrate-retainable stage (1) side, a third recognition means (18) for recognizing the recognition marks (5, 6) concurrently when the first recognition mark (5) is brought close to or into contact with the second recognition mark (6), and a temperature detection means (17) attached to the first recognition means (3) or the second recognition means (4), wherein calibration is carried out based on the recognition of the recognition marks when the temperature detection means (17) detects a beyond-allowance temperature change, whereby permitting a high-accuracy, efficient calibration independently of mechanical deformation and temperature change in environmental atmosphere.

Abstract: A method for mounting a chip on a substrate includes applying the underfill agent onto at least one of the substrate and the chip and moving the chip to the substrate to bring the bump into contact with the electrode. The method also includes steps to distribute the underfill agent in a space between the chip and the substrate, to around the bump and the electrode, heating the bump or electrode in the state that the bump is buried in the underfill agent to melt the bump or electrode so as to weld the bump to the electrode.

Abstract: The present invention is directed to a catamenial tampon, comprising: a primary absorbent member; and a withdrawal cord having a withdrawal portion and an attachment portion. The attachment portion is joined to the primary absorbent member. The withdrawal cord includes a composite yarn which includes a continuous string, and a secondary absorbent member joined to a part of the continuous string. The continuous string which has the secondary absorbent member joined thereto is woven according to a predetermined weaving manner after being provisionally twisted, thereby forming the attachment portion and the withdrawal portion. The present invention is also directed to a composite yarn having thinner portions and thicker portions which are alternatively disposed. The composite yarn comprises: a continuous string; and a plurality of fleeces intermittently joined to the continuous string.

Abstract: The present invention relates to a chip bonding apparatus for bonding a chip to a substrate, with a support structure for preventing a deviation or error in parallelism of a head 1 holding the chip. A first support mechanism 4 supports a pressure cylinder 3 for pressing the head 1 toward a substrate 2. A second support mechanism 5 is provided separately from and independently of the first support mechanism 4 for supporting a reactive force acting on the pressure cylinder 3 when the head 1 is pressed toward the substrate 2. The second support mechanism 5 is in contact with the pressure cylinder 3 through a spherical point of contact 12.

Abstract: An apparatus 10 for pressing a prober according to the present invention, which can press a prober 6 on an electrode-forming portion 4 of an inspection substrate 3 at a sufficient pressure by pivoting four split pressure heads 13 separately by a cylinder 16, and ensure an intimate contact between the prober 6 and the elestrode-forming portion 4 of the inspection substrate 3.

Abstract: A surface profile measuring apparatus for measuring rugged profiles of object surfaces includes a white light source, a varying device for varying a relative distance between an object surface and a reference surface, a frequency band limiting device for limiting the frequency band of white light to a particular frequency band, an image pickup device for picking up an image of the object surface, a sampling device for successively acquiring intensity values of interference light corresponding to varying interference fringes, from a particular location at sampling intervals corresponding to a bandwidth of the particular frequency band, a storage device for storing a group of interference light intensity values acquired, and a computing device for estimating characteristic functions from the group of interference light intensity values stored, and determining a height in the particular location based on a peak position of the characteristic functions.

Abstract: The invention provides processes for bonding a flip chip to a substrate in a manner that maximizes reliability of the bonding operation. Electrically conductive polymer bumps are formed on bond pads of a flip chip and the flip chip polymer bumps are at least partially hardened. Electrically conductive polymer bumps are formed on bond pads of a substrate, and a layer of electrically insulating adhesive paste is then applied on the substrate, covering the substrate polymer bumps with the adhesive. The bond pads of the flip chip are then aligned with the bond pads of the substrate and the at least partially hardened flip chip polymer bumps are then pushed through the substrate adhesive and at least partially into the substrate polymer bumps. In a further method, electrically conductive polymer bumps are formed on bond pads of a flip chip and the flip chip polymer bumps are at least partially hardened.

Abstract: In a flip chip bonding method, polymer bumps are formed, using a bonding tool, on an IC chip, held via suction to the bonding tool. An insulating adhesive film is pressed onto the upper surface of a circuit board held via suction with a suction stage. Heat is then applied to bring the film into close contact with bond pads of the circuit board. At this point, the bonding tool is moved downward, bonding the polymer bumps to the circuit board electrodes. During the time of this downward movement, bonding of the polymer bumps to the circuit board bond pads can be achieved by piercing the insulating adhesive film with the polymer bumps, and it is found that strong bonding can be achieved with adequate reliability. This method eliminates the need for a process in which through-holes must be pierced in the insulating adhesive film to accommodate the polymer bumps.

Abstract: A resin etching solution containing a hydroxyalkylamine, an alkali metal compound and water, or an aliphatic alcohol, an aliphatic amine, an alkali metal compound and water, and a process for etching a polyimide film containing a resist pattern or metal layer pattern formed on either or both sides using the resin etching solution.

Abstract: An apparatus for producing yarns comprising a first yarn feeding roller, a second yarn feed roller, winders for winding the respective yarns, yarn breakage detectors and detect yarn breakage, and yarn cutting and sucking devices disposed upstream from the yarn feed rollers and operative in response to a yarn breakage detection signal to cut the group of yarns being wound to which the broken yarn belongs. The respective one yarn cutting and sucking device and the respective one winder form winding units, respectively, and at least two such winding units share at least one of the yarn feed rollers. Therefore, it is possible to increase the yield of yarns.

Abstract: The invention provides a flip chip mounting process in which a layer of electrically insulating adhesive paste is applied on a substrate having bond pads, covering the bond pads with the adhesive. Electrically conductive polymer bumps are formed on bond pads of a flip chip to be bonded to the substrate, and the polymer bumps are at least partially hardened. The bond pads of the flip chip are then aligned with the bond pads of the substrate, and the at least partially hardened polymer bumps are pushed through the adhesive on the substrate to contact directly and bond the polymer bumps to the bond pads of the substrate. This process results in direct electrical and mechanical bonding of the polymer bumps between the chip and substrate bond pads, even though the adhesive film was applied on the substrate in a manner that covered the substrate bond pads. The polymer bumps displace the adhesive as they are pushed through it and expand laterally on the substrate bond pads.

Abstract: A film conveying apparatus includes a conveying mechanism and a speed control mechanism. The conveying mechanism includes a plurality of lower rollers arranged in a lateral direction perpendicular to a film conveyed direction. The lower roller is equipped with a motor to variably control its speed. A plurality of upper rollers is disposed to correspond to the lower rollers so as to sandwich the continuous film with the lower rollers. The roller-speed control mechanism controls a rotation speed of each lower roller so that the film is conveyed at a desired speed in a desired direction.

Abstract: A method of sealing electronic parts mounted on the substrates with a resin, by porous plate-printing, by employing a primary porous plate-printing in which sealing portions of an electronic part mounted on a substrate are filled with a sealing resin through resin push-in pores formed in the porous plate in vacuum by reciprocally moving a squeeze, the resin is introduced based on a pressure difference in vacuum of a degree lower than that of the above vacuum state so that the sealing resin infiltrates into every gap under the wires bonding the lead wires of the substrate to the electronic part, and supplementary sealing with the resin is effected by a secondary porous plate-printing. Even those portions in the structure of the electronic part that cannot be easily filled with the sealing resin can be filled with the sealing resin without forming air-containing voids. Besides, such portions can be filled without causing damage to the wires.