Patents Assigned to Toray Engineering Co.
  • Patent number: 7753253
    Abstract: A dispensing device (4) for charging underfill agent into a gap between a substrate (K) and a chip (C) includes means for storing underfill agent (66, 67), a chamber (52) provided for containing substrate (K) to be charged with underfill agent and capable of being opened/closed, a dispenser (73) provided in the chamber (52) and discharging underfill agent introduced from the storing means (66, 67) into the gap between the substrate (K) and the chip (C), and a first pressure reducing means (46) for reducing the pressure in the chamber (52) at a predetermined vacuum pressure prior to the discharge of underfill agent by the dispenser (73). The dispensing device (4) can supply underfill agent with no bubbles to the substrate (K). A mounting system using this dispensing device (4) is also provided by the invention.
    Type: Grant
    Filed: November 9, 2006
    Date of Patent: July 13, 2010
    Assignee: Toray Engineering Co., Ltd.
    Inventors: Katsumi Terada, Takashi Takei
  • Publication number: 20100136123
    Abstract: In order to heighten the density of microcapsules and facilitate handling by the unit composed of microcapsules in a given amount smaller than in the whole sheet, a microcapsule sheet which comprises a substrate constituted of an edible film and microcapsules each obtained by surrounding a core layer with a first shell film and a second shell film, the microcapsules being arranged according to a given pattern so as to be arranged only in those regions of the substrate which are separated from each other.
    Type: Application
    Filed: October 12, 2007
    Publication date: June 3, 2010
    Applicant: TORAY ENGINEERING CO., LTD.
    Inventors: Shinya Izumida, Takashi Iwade, Takashi Nagayama, Masashi Motoi, Kiyohito Yamamoto
  • Patent number: 7673864
    Abstract: A folding device for folding continuous paper, which is previously provided with fold lines at given intervals, along the fold lines in a zigzag pattern. The folding device comprises a feeding member of the continuous paper, a swinger fin that swings using its one end as a fulcrum like a pendulum in synchronization with the fold lines while feeding the continuous paper into its inside, and a table to be surmounted by the continuous paper that has been folded. The swinger fin includes a feed roller pair for feeding the continuous paper while sandwiching the paper therebetween, and at least a pair of guide plates facing each other with a given gap therebetween, in which the continuous paper is fed through the gap. One of the feed rollers constructing the feed roller pair and one of the guide plates, which are located on one side of the continuous paper, can be integrally opened or detached from the swinger fin.
    Type: Grant
    Filed: June 20, 2005
    Date of Patent: March 9, 2010
    Assignee: Toray Engineering Co., Ltd.
    Inventors: Yasuhisa Mizuno, Hajime Kanamori, Riki Murakami
  • Publication number: 20090321895
    Abstract: Issue Providing a silicon film which can prevent damage of electronic devices formed on a substrate from occurrence, can prevent apparatus arrangement from becoming large-scale one, can improve coherency of a silicon thin film to a substrate, and is hardly happened crack and/or flaking, and providing a method for forming the silicon thin film. Solving Means A method for forming a silicon thin film according to the present invention is a method for forming a silicon thin film having isolation function or barrier function, on a substrate K using CVD method, and comprises a step for forming a first thin film on the substrate using plasma CVD method employing gas containing hydrogen element and a gas containing silicon element; a step for forming a second thin film using plasma CVD method employing a gas containing nitrogen element and a gas containing silicon element; and a step for forming a third thin film using plasma CVD method employing a gas containing oxygen element and a gas containing silicon element.
    Type: Application
    Filed: May 30, 2007
    Publication date: December 31, 2009
    Applicant: Toray Engineering Co., Ltd
    Inventors: Masamichi Yamashita, Takashi Iwade, Kohshi Taguchi, Mitsuo Yamazaki
  • Patent number: 7621969
    Abstract: A mounting system is provided with a substrate loader section, a chip mounting section, and a substrate unloader section for sequentially taking out substrates whereupon chips are mounted. The mounting system is characterized in that the substrate loader section is provided with an oven capable of heat insulating a substrate together with a substrate magazine capable of containing a plurality of substrates, a stage heater for heating/heat insulating a substrate is provided, respectively, at a substrate conveying portion from a substrate waiting stage for the chip mounting section to the chip mounting section, at the chip mounting section, and at a substrate conveying portion from the chip mounting section to the substrate unloader section, and the substrate unloader section is provided with an oven capable of heat insulating a substrate together with a substrate magazine capable of containing a plurality of substrates whereupon chips are mounted.
    Type: Grant
    Filed: March 13, 2006
    Date of Patent: November 24, 2009
    Assignee: Toray Engineering Co., Ltd.
    Inventors: Mutsumi Masumoto, Katsumi Terada
  • Patent number: 7614338
    Abstract: A piston 1 which is to be movably supported in a cylinder 11 of a pump 10 to be reciprocally driven is formed by a fluororesin so that it is not impaired by a corrosive liquid. A cylindrical outer peripheral portion 2 of the piston 1 has a thickness of 1 mm or less, and is flexible. The outer peripheral portion has a flange portion 7 in an open end portion via an approximately 180-degree folded-back portion 3. The flange portion 7 is attached to the cylinder 11. When the pump 10 is driven, the cylindrical outer peripheral portion 2 of the piston 1 smoothly rolls without producing deflections or bends in a gap between the outer peripheral face of a piston support member 15 and the inner peripheral face of the cylinder 11, while being in close contact with the two faces.
    Type: Grant
    Filed: March 26, 2007
    Date of Patent: November 10, 2009
    Assignees: Toray Engineering Co., Ltd., Nippon Pillar Packing Co., Ltd.
    Inventors: Junichi Uehara, Kazukiyo Teshima
  • Patent number: 7591293
    Abstract: A device and method for bonding objects to be bonded each having a metal bonding portion on a substrate, comprising cleaning means for exposing the metal bonding portions to a plasma having an energy enough to etch the surfaces of the metal bonding portions at a depth of 1.6 nm or more over the entire surfaces of the metal bonding portions under a reduced pressure and bonding means for bonding the metal bonding portions of the objects taken out of the cleaning means in an atmospheric air. By using a specific scheme, metal bonding portions after the plasma cleaning can be bonded in the atmospheric air, thereby significantly simplifying the bonding process and the whole device and lowering the cost.
    Type: Grant
    Filed: September 22, 2003
    Date of Patent: September 22, 2009
    Assignees: Toray Engineering Co., Ltd., Oki Electric Industry Co., Ltd., Sanyo Electric Industry Co., Ltd., Sharp Kabushiki Kaisha, Sony Corporation, Kabushiki Kaisha Toshiba, Fujitsu Limited, Matsushita Electric Industrial Co., Ltd., Rohm Co., Ltd., Renesas Technology Corp.
    Inventors: Tadatomo Suga, Toshihiro Ito, Akira Yamauchi
  • Patent number: 7591899
    Abstract: An applicator device comprises a reservoir tank trapping embrocation, a stage holding a substrate, a ferrule having a slit-shaped opening section above the stage, a fluid transfer pump guiding the embrocation within the reservoir tank to the ferrule, a first opening and closing valve between a suction opening of the fluid transfer pump and the reservoir tank, opening when a suction operation is carried out and closing when a discharge operation is carried out, a second opening and closing valve between a discharge opening of the fluid transfer pump and the ferrule, opening when a discharge operation is carried out and closing when a suction operation is carried out, and driving means relatively moving the ferrule and/or substrate when the slit-shaped opening section and the substrate are adjacent to one another, wherein the fluid transfer pump comprises a membranous sealing member sealing a gap between a cylinder and a plunger.
    Type: Grant
    Filed: March 24, 2006
    Date of Patent: September 22, 2009
    Assignee: Toray Engineering Co., Ltd.
    Inventors: Junichi Uehara, Takashi Iwade
  • Patent number: 7573387
    Abstract: A continuous paper processing system comprises a post-processing device for continuous paper equipped with at least one RFID tag, an RFID reader for reading electronic information written in the RFID tag, storage device that stores check information to be checked against the electronic information read by the RFID reader, and check device that checks the electronic information read by the RFID reader against the check information.
    Type: Grant
    Filed: June 20, 2005
    Date of Patent: August 11, 2009
    Assignee: Toray Engineering Co., Ltd.
    Inventors: Ryoji Shimazu, Hideaki Sugio, Yasuhisa Mizuno
  • Publication number: 20090188630
    Abstract: An apparatus capable of producing a laminated microcapsule sheet through transferring with high productivity of a drug solution of high viscosity accurately as much as a given weight while avoiding run-off from an enteric layer. There is provided an apparatus comprising edible film holding means (1) for holding an edible film (4); solution transfer printing means (2) equipped with multiple needles (22) for transfer printing of a solution containing any of materials; and a pallet (3) for applying of the solution containing any of materials to the solution transfer printing means (2).
    Type: Application
    Filed: February 2, 2007
    Publication date: July 30, 2009
    Applicants: TORAY ENGINEERING CO., LTD.
    Inventors: Kanji Takada, Takashi Iwade, Shinya Izumida, Masamichi Yamashita, Kiyohito Yamamoto
  • Publication number: 20090071703
    Abstract: The present invention provides a conductive paste, which is suitable for forming and protecting a circuit, an electrode and the like and is capable of connecting electrodes of a plurality of circuit boards in a short time, a circuit board, a circuit article excellent in moisture and heat resistance and the like, and a method for producing the circuit article. The present conductive paste comprises a conductive material that is scaly, has a mean particle diameter of 1 ?m or more and 10 ?m or less, and is at least one material selected from the group consisting of Ag, an Ag alloy, an Ag-coated material, and an Ag alloy-coated material, and a resin having a storage modulus at 25° C. of 100 MPa or more. The present circuit board (1?) is provided with a substrate (11) and an electrode (12) formed at least on one side of the substrate (11) using the above conductive paste. On the surface of the electrode (12), an adhesive insulating area composed of a composition having a storage modulus at 25° C.
    Type: Application
    Filed: April 4, 2006
    Publication date: March 19, 2009
    Applicants: TOAGOSEI CO., LTD., TORAY ENGINEERING CO., LTD, KYORITSU CHEMICAL & CO., LTD.
    Inventors: Makoto Imahori, Takashi Nakaya, Masanori Akita, Kousei Nogami, Teruo Tagai
  • Patent number: 7341877
    Abstract: A method of accurately calibrating a movement control system of mark recognition means in a chip mounting device, comprising the steps of: recognizing a first recognition mark put on a head (2) and a second recognition mark (13) put on a stage (26) with two-field recognition means (7) so as to calibrate and update the preceding control parameters inputted into the movement control system of the two-field recognition means (7); and, with the head (2) lowered to position the first recognition mark closely to the second recognition mark (13), recognizing both marks with third recognition means (20) when the two-field recognition means (7) is moved back so as to calibrate and update the preceding control parameters inputted into the movement control system of the two-field recognition means (7).
    Type: Grant
    Filed: December 21, 2004
    Date of Patent: March 11, 2008
    Assignee: Toray Engineering Co., Ltd.
    Inventors: Akira Yamauchi, Yoshiyuki Arai
  • Patent number: 7299545
    Abstract: Positioning recognition marks are read by movable recognition device for positioning objects to be bonded to each other. An alignment method includes a step of reading the recognition marks during movement of the recognition device before its complete stop, and a step of identifying absolute positions of the recognition marks by correcting the mark recognition positions having been read based on a position feedback signal of the moving recognition device. A mounting method using the alignment method is also disclosed. It is possible to maintain a high alignment accuracy, eliminate necessity of assuring a settling time for complete stop of the movable recognition device, and significantly reduce the alignment time and mounting tact.
    Type: Grant
    Filed: March 27, 2003
    Date of Patent: November 27, 2007
    Assignee: Toray Engineering Co., Ltd.
    Inventors: Akira Yamauchi, Mikio Kawakami
  • Patent number: 7279358
    Abstract: A mounting method includes the steps of, after positioning objects being bonded relative to each other, moving a movable wall positioned there around until coming into contact with one object holding means to form a local chamber having a local enclosed space, enclosing both objects in the chamber, reducing the pressure in the chamber, moving the object holding means in a direction for reducing the volume of the chamber and moving the movable wall following the movement of the object holding means, and bonding both objects to each other by pressing. Since the bonding part and the vicinity of the bonding part can be locally and efficiently enclosed from the surroundings, and the local chamber can vary the shape of the enclosed space with the bonding operation while maintaining the enclosed state even at the time of bonding.
    Type: Grant
    Filed: April 22, 2003
    Date of Patent: October 9, 2007
    Assignee: Toray Engineering Co., Ltd.
    Inventors: Akira Yamauchi, Katsumi Terada, Satoru Naraba, Takashi Hare
  • Patent number: 7273165
    Abstract: A printing system capable of writing RFID data consistent with print information printed on a print-information recoding medium into an RFID chip carried on the print-information recording medium. The printing system includes a printer engine for printing print information, including at least either one of contactlessly readable information and image information visible to human being, onto at least the print-information recording medium, and an RFID reader/writer for writing RFID data consistent with the print information into the RFID chip carried on the print-information recording medium.
    Type: Grant
    Filed: February 2, 2006
    Date of Patent: September 25, 2007
    Assignee: Toray Engineering Co., Ltd.
    Inventors: Masato Satake, Jun Inagaki, Hideaki Sugio, Ryoji Shimazu, Yasuhisa Mizuno
  • Patent number: 7267926
    Abstract: There are disclosed; an active energy beam curing type conductive paste, containing a conductive substance, and an active energy beam polymerizable compound, wherein a cured matter, obtained when a composition of the paste excluding the conductive substance is cured with an electron beam having an acceleration voltage of 150 kV and an irradiated dose of 40 kGy, has an internal stress of 5 to 50 Mpa; a production method and a device for a conductor circuit substrate using the active energy beam curing type conductive paste; and a non-contact ID using the active energy beam curing type conductive paste and a production method for the ID.
    Type: Grant
    Filed: February 20, 2001
    Date of Patent: September 11, 2007
    Assignee: Toray Engineering Co., Ltd.
    Inventors: Hiroaki Tsuruta, Minoru Nakamura, Masanori Akita, Koji Ito, Toshihiro Mori
  • Publication number: 20070171619
    Abstract: Adverse affects due to a failure interposer board and a blank section are prevented from occurrence by arranging only conforming interposer boards on a carrier tape at every predetermined interval.
    Type: Application
    Filed: December 24, 2004
    Publication date: July 26, 2007
    Applicant: Toray Engineering Co., Ltd.
    Inventors: Masanori Akita, Yoshiki Sawaki
  • Publication number: 20070107793
    Abstract: Disclosed is a liquid transfer pipe comprising a thin first pipe (32a) of a small diameter in which a liquid can flow and a thick second pipe (32b) of a large diameter in which the first pipe (32a) is housed. By setting the outer diameter of the first pipe (32a) and the inner diameter of the second pipe (32b) so that the first pipe (32a) can be placed in the second pipe (32b) at least with a certain gap, the channel for flowing the liquid is not affected even when an external force is applied to the liquid transfer pipe.
    Type: Application
    Filed: December 24, 2004
    Publication date: May 17, 2007
    Applicant: TORAY ENGINEERING CO., LTD.
    Inventor: Yukihiro Uehara
  • Publication number: 20060219166
    Abstract: An applicator device comprises a reservoir tank trapping embrocation, a stage holding a substrate, a ferrule having a slit-shaped opening section above the stage, a fluid transfer pump guiding the embrocation within the reservoir tank to the ferrule, a first opening and closing valve between a suction opening of the fluid transfer pump and the reservoir tank, opening when a suction operation is carried out and closing when a discharge operation is carried out, a second opening and closing valve between a discharge opening of the fluid transfer pump and the ferrule, opening when a discharge operation is carried out and closing when a suction operation is carried out, and driving means relatively moving the ferrule and/or substrate when the slit-shaped opening section and the substrate are adjacent to one another, wherein the fluid transfer pump comprises a membranous sealing member sealing a gap between a cylinder and a plunger.
    Type: Application
    Filed: March 24, 2006
    Publication date: October 5, 2006
    Applicant: TORAY ENGINEERING CO., LTD.
    Inventors: Junichi Uehara, Takashi Iwade
  • Publication number: 20060171828
    Abstract: A fluid transfer pump comprises a cylinder having a suction opening and a discharge opening, a plunger provided within the cylinder movable to and fro in a direction of an axis line of the cylinder, and a membrane-like sealing member for sealing a gap between the cylinder and the plunger, wherein the plunger is driven to and fro for carrying out suction operation and discharge operation alternately, so that fluid is sucked through the suction opening, then the sucked fluid is discharged through the discharge opening, wherein the suction opening is provided on a side portion of the cylinder so that a fluid transfer pump is provided which has an extremely small accumulation rate of fluid, and has good fluid displacement characteristic.
    Type: Application
    Filed: January 25, 2006
    Publication date: August 3, 2006
    Applicant: TORAY ENGINEERING CO., LTD.
    Inventors: Junichi Uehara, Takashi Iwade