Abstract: Disclosed is a non-mounted storage test device based on FPGA, which comprises a processor unit for performing enumeration and configuration for device, creating a scenario for test and performing test; a device driver unit for managing storage device; a data engine unit for generating pattern data for test and performing test; a system memory interface unit for receiving data for test and storing test result; a monitoring unit for monitoring packet; a DMA driver/address translation unit for performing DMA operation and transmitting Memory Read Request to Root Complex; a message input/output unit for transmitting to the data engine unit and the device driver unit; a switch unit for constituting DUT unit; a storage-in DUT unit as device under test which is storage for direct interface to PCIe including HBA; and a memory unit for storing data for test and record generated between tasks.

Abstract: Disclosed is a storage tester capable of individual control for a plurality of storages, which comprises a host terminal for receiving user's control signal for storage test; a communication interface unit transmitting data among the host terminal, an embedded processor and a data engine unit; a data engine unit for generating pattern data and command data and reading the data from the storage; a sequence control module for controlling respectively a plurality of SATA/SAS/PCIe interface units; and SATA/SAS/PCIe interface unit for connecting to the storage through one among SATA, SAS, PCIe interface according to the signal for interface selection generated from the embedded processor and controlling a plurality of storages according to control of the sequence control module by the embedded processor in order to test respectively connected storage.

Abstract: A device for calculating round-trip time of a memory test using a programmable logic includes a pattern generation part including two pairs of input/output (IO) pins to generate a pattern signal for testing, and receiving a feedback signal through bidirectional buses from IO lines; two pairs of bidirectional buses for relaying a signal between the pattern generation part and a programmable logic part; and a programmable logic part for transmitting the pattern signal to the IO lines through the bidirectional buses and transmitting the feedback signal to the bidirectional buses from the IO lines, and including a multiplexer for crossing a signal connection direction upon calculation of the feedback signal, wherein the pattern generation part measures an input time of the feedback signal based on an output time of the pattern signal, thus calculating the round-trip time of the signal.

Abstract: An apparatus and method for acquiring data of fast fail memory includes a pattern generator for generating a pattern to be recorded to a device under test (DUT) and receiving DUT data from the DUT; a data transmitter for sending the DUT data and the pattern generated so as to correspond thereto to a failure analyzer from the pattern generator; and a failure analyzer for analyzing the DUT data and the pattern generated so as to correspond to the DUT data, which are received from the data transmitter, thus producing failure analysis information. The data transmitter (FIFO) able to advance the failure analysis time allows failure analysis to be performed before completion of testing, thereby shortening the total failure analysis time and overcoming hardware limitations for failure analysis.

Abstract: An apparatus and method for correcting an output signal of an FPGA-based memory test device includes a clock generator for outputting clock signals having different phases; and a pattern generator for outputting an address signal, a data signal and a clock signal in response to the clock signals input from the clock generator, and correcting a timing of each of the output signals using flip flops for timing measurement. Wherein the address signal, the data signal and the clock signal, through a pattern generator, are implemented with a programmable logic such as FPGA, thereby shortening the correcting time without the use of an external delay device, and increasing accuracy of output timing of the signal for memory testing, ultimately enhancing performance (accuracy) of a memory tester.

Abstract: A system for simultaneously determining a memory test result includes a pattern generation part generating a pattern signal for testing so as to transmit the signal through an address line and a command line; a delay part receiving read data through a first data line from a closest memory device that is disposed closer to the system and to receive read data through a second data line from a farthest memory device that is disposed farther from the system; and a determination part simultaneously determining the read data of the closest memory device and the read data of the farthest memory device, which are simultaneously output from the delay part, using a determination clock, wherein the delay part recognizes the read data of the closest memory device and the read data of the farthest memory device.

Abstract: Disclosed is a lighting device for a street lamp, of which a structure is improved such that the diffusion degree of light may be effectively controlled by improving the directivity of a luminous element. To this end, the lighting device for a street lamp includes: a base member which is formed at an upper side of a street lamp body arranged above a ground surface; a plurality of luminous element units, which are comprised of at least one luminous element, and are arranged on the bottom surface of the base member; and a plurality of reflection units, which are arranged to be adjacent to the luminous element units, and are arranged mutually isolated from each other by a predetermined distance on the bottom surface of the base member to diffuse light radiated from the luminous element units in multiple directions.

Abstract: A method for manufacturing a probe structure of a probe card is disclosed. In accordance with the present invention, a portion of a substrate exposed through a crossing region of one more probe beam regions defined by a first mask layer pattern and a windows defined by a second mask layer pattern are etched to form one or more self-aligning probe tip regions, thereby preventing a misalignment of the one or more probe tip regions.

Abstract: A tester for testing a semiconductor device is disclosed. In accordance with the tester of the present invention, the tester is configured to have different drive signal path and input/output signal path wherein the drive signal path has a fly-by structure, i.e. a daisy chain structure and the input/output signal path has a star-stub structure such that more DUTs may be tested simultaneously and an integrity of the signals is secured.

Abstract: A tester for testing a semiconductor device is disclosed. The tester for testing the semiconductor device employs a data selector for converting a logical test pattern data transmitted from a pattern generator into a physical test pattern data and an expected data based on the logical test pattern data, thereby generating various timings based on a time delay instead of using a plurality of clocks to improve a test efficiency and reduce a manufacturing cost.

Abstract: A sequential semiconductor device tester, and in particular to a sequential semiconductor device tester is disclosed. In accordance with the sequential semiconductor device tester, a function of generating a test pattern data for a test of a semiconductor device and a function of carrying out the test are separated to sequentially test the semiconductor device, to maintain a signal integrity and to improve an efficiency of the test by carrying out a test under an application environment or an ATE test according to the test selection command.

Abstract: A method for calibrating a semiconductor device tester is disclosed. In accordance with method of the present invention, a timing is calibrated using a programmable delay device and calibration boards so as to remove a timing difference between channels and compensate a linearity of the programmable delay device for an adjustment of a timing by building and using a database of the round trip delay actually generated during the test.

Abstract: A sequential semiconductor device tester, and in particular to a sequential semiconductor device tester is disclosed. In accordance with the sequential semiconductor device tester, a function of generating a test pattern data for a test of a semiconductor device and a function of carrying out the test are separated to sequentially test the semiconductor device, to maintain a signal integrity and to improve an efficiency of the test by carrying out a test under an application environment or an ATE test according to the test pattern data.

Abstract: Disclosed herein is a semiconductor test apparatus for simultaneously testing a plurality of semiconductor devices. The semiconductor test apparatus includes a plurality of pattern generation boards, a DUT board, a backplane board, and a power supply unit.

Abstract: A method for manufacturing a probe structure of a probe card is disclosed. In accordance with the method of the present invention, a dual etching process of a silicon substrate or an etching process of an SOI substrates is carried out using a sidewall insulating film pattern as an etching mask to facilitate a formation of a bump and microscopic probe structure of the probe card.

Abstract: A method for calibrating a semiconductor device tester is disclosed. In accordance with method of the present invention, a timing is calibrated using a programmable delay device and calibration boards so as to remove a timing difference between channels and compensate a linearity of the programmable delay device for an adjustment of a timing by building and using a database of the round trip delay actually generated during the test.

Abstract: A sequential semiconductor device tester, and in particular to a sequential semiconductor device tester is disclosed. In accordance with the sequential semiconductor device tester, a function of generating a test pattern data for a test of a semiconductor device and a function of carrying out the test are separated to sequentially test the semiconductor device, to maintain a signal integrity and to improve an efficiency of the test by carrying out a test under an application environment or an ATE test according to the test selection command.

Abstract: A sequential semiconductor device tester, and in particular to a sequential semiconductor device tester is disclosed. In accordance with the sequential semiconductor device tester, a function of generating a test pattern data for a test of a semiconductor device and a function of carrying out the test are separated to sequentially test the semiconductor device, to maintain a signal integrity and to improve an efficiency of the test by carrying out a test under an application environment or an ATE test according to the test pattern data.

Abstract: A method for manufacturing a bump of a probe card is disclosed. In accordance with the present invention, the bump has a high aspect ratio, a high elasticity, a high durability suitable for testing a high speed device. The bump is formed using a sacrificial substrate as a mold to have a shape of ? or II for elasticity and durability.

Abstract: A method for manufacturing a probe structure of a probe card is disclosed. In accordance with the present invention, a portion of a substrate exposed through a crossing region of one more probe beam regions defined by a first mask layer pattern and a windows defined by a second mask layer pattern are etched to form one or more self-aligning probe tip regions, thereby preventing a misalignment of the one or more probe tip regions.