Abstract: Various applications of interconnect substrates in power management systems are described.

Abstract: Disclosed are systems, devices, circuits, components, mechanisms, and processes in which a switching mechanism can be coupled between components. The switching mechanism is configured to have an on state or an off state, where the on state allows current to pass along a current path. A monitoring mechanism has one or more sensing inputs coupled to sense an electrical characteristic at the current path. The electrical characteristic can be a current, voltage, and/or power by way of example. The monitoring mechanism is configured to output a reporting signal indicating the sensed electrical characteristic. The monitoring mechanism can be integrated with the switching mechanism on a chip.

Abstract: Various applications of interconnect substrates in power management systems are described.

Abstract: A method for controlling a DC-to-DC converter includes: (a) regulating a magnitude of an output voltage of the DC-to-DC converter according to a magnitude of a reference voltage; (b) in response to a command to enter the unregulated operating mode, allowing the magnitude of the output voltage to fall; and (c) adjusting the magnitude of the reference voltage to track the magnitude of the output voltage. A controller for a DC-to-DC converter includes reference and switching modules. The reference module generates a reference voltage, such that: (a) a magnitude of the reference voltage is fixed, in a regulated operating mode, and (b) the magnitude of the reference voltage tracks a magnitude of an output voltage of the DC-to-DC converter, in the unregulated operating mode. The switching module controls a power stage of the DC-to-DC converter to regulate the magnitude of the output voltage, in the regulated operating mode.

Abstract: Disclosed are systems, devices, circuits, components, mechanisms, and processes in which a switching mechanism can be coupled between components. The switching mechanism is configured to have an on state or an off state, where the on state allows current to pass along a current path. A monitoring mechanism has one or more sensing inputs coupled to sense an electrical characteristic at the current path. The electrical characteristic can be a current, voltage, and/or power by way of example. The monitoring mechanism is configured to output a reporting signal indicating the sensed electrical characteristic. The monitoring mechanism can be integrated with the switching mechanism on a chip.

Abstract: Mixers are described which allow for information sharing in redundant systems, while providing sufficient isolation between redundant system components to enable fault-tolerant operation.

Abstract: Various applications of interconnect substrates in power management systems are described.

Abstract: Disclosed are devices, apparatus, circuitry, components, mechanisms, modules, units, systems, and processes for controlling a power switch of a voltage regulator. A capacitor is coupled to an output of the power switch. Charge delivery circuitry is coupled to the capacitor and configured to provide a charging current to the capacitor. Charge control circuitry can be coupled to the charge delivery circuitry and configured to selectively allow the providing of the charging current to the capacitor.

Abstract: Disclosed are devices, apparatus, circuitry, components, mechanisms, modules, systems, and processes for controlling a voltage regulator in response to information from a load. In some implementations, transient minimizer circuitry is coupled to receive a notification signal indicating a change or an anticipated change in an electrical characteristic of the load. The transient minimizer circuitry is configured to generate a state command signal responsive to the notification signal. The state command signal indicates a state of the voltage regulator. The switching control circuitry is coupled to receive the state command signal from the transient minimizer circuitry. The switching control circuitry is configured to operate switch circuitry to control the state of the voltage regulator in accordance with the state command signal.

Abstract: Disclosed are devices, apparatus, circuitry, components, mechanisms, modules, units, systems, and processes for controlling the switching frequency of a voltage regulator. Frequency monitoring and adjustment circuitry is coupled to sense a switching frequency of a power switch coupled to an output filter of the voltage regulator. The frequency monitoring and adjustment circuitry is configured to provide a frequency adjustment signal based on the sensed switching frequency. Power switch control circuitry is coupled to receive the frequency adjustment signal and is configured to control switching of the power switch based on the frequency adjustment signal.

Abstract: Disclosed are devices, apparatus, circuitry, components, mechanisms, modules, systems, and methods for virtual output voltage sensing for feed-forward control of a voltage regulator. A buffer has an input coupled to sense a monitored signal indicating a duty cycle of switch circuitry coupled to an output filter of the voltage regulator. The buffer is configured to provide at an output, responsive to the monitored signal, a buffer output signal having a high reference voltage for a high side on time and a low reference voltage for a low side on time of the switch circuitry. A filter is coupled to receive and filter the buffer output signal to provide a feed-forward signal indicating the output voltage of the voltage regulator. Control circuitry is configured to control the switching of the switch circuitry responsive to the feed-forward signal.

Abstract: A low-height coupled inductor having length, width, and height includes a composite magnetic core including: (1) first and second magnetic plates separated from each other in the height direction, and (2) a plurality of coupling teeth connecting the first and second magnetic plates in the height direction. The plurality of coupling teeth are formed of magnetic material having a lower magnetic permeability than magnetic material forming the first and second magnetic plates. The low-height coupled inductor further includes a respective winding wound around each of the plurality of coupling teeth.

Abstract: A regulated, power supply system is described using multiphase DC-DC converters with dynamic fast-turnon, slow-turnoff phase shedding, early phase turn-on, and both load-voltage and drive-transistor feedback to pulsewidth modulators to provide fast response to load transients. In an embodiment, a system master can automatically determine whether all, or only some, slave phase units are fully populated. The programmable system includes fault detection with current and voltage sensing, telemetry capability, and automatic shutdown capability. In an embodiment, these are buck-type converters with or without coupled inductors, however some of the embodiments illustrated include boost configurations.

Abstract: Various applications of interconnect substrates in power management systems are described.

Abstract: An integrated circuit includes a semiconductor die including one or more switching circuits, a magnetic core having length and width, first and second metallic leads, and integrated circuit packaging material. The first metallic lead forms a first winding turn around a portion of the magnetic core, and the first metallic lead is electrically coupled to the semiconductor die. The second metallic lead forms a second winding turn around a portion of the magnetic core. The first and second winding turns are offset from each other along both of the width and length of the magnetic core. The integrated circuit is included in an integrated electronic assembly.

Abstract: A semiconductor package can include a semiconductor die having an integrated circuit, a first die surface, and an opposite second die surface. A packaging can be attached to the die and have a holder surface opposite the first die surface. A heat spreader can be configured to cover the second die surface and the packaging surface and can be attached thereto by a layer of adhesive positioned between the heat spreader and the semiconductor die. A semiconductor package array can include an array of semiconductor dies and a heat spreader configured to cover each semiconductor die. A conductive lead can be electrically connected to the integrated circuit in a semiconductor die and can extend from the first die surface. Manufacturing a semiconductor package can include applying thermally conductive adhesive to the heat spreader and placing the heat spreader proximate the semiconductor die.

Abstract: A voltage regulator coupled to an unregulated DC input voltage source by an input terminal, and to a load by an output terminal is disclosed. The voltage regulator converts an input voltage at the input terminal to an output voltage at the output terminal. The voltage regulator includes one or more slaves, and each slave includes a switching circuit which serves as a power switch for alternately coupling and decoupling the input terminal to an intermediate node. The voltage regulator also includes a filter coupled to the slaves, the filter including one or more inductor banks each of which having a predetermined number of inductors.

Abstract: A switching circuit for extracting power from an electric power source includes (1) an input port for electrically coupling to the electric power source, (2) an output port for electrically coupling to a load, (3) a first switching device configured to switch between its conductive state and its non-conductive state to transfer power from the input port to the output port, (4) an intermediate switching node that transitions between at least two different voltage levels at least in part due to the first switching device switching between its conductive state and its non-conductive state, and (5) a controller for controlling the first switching device to maximize an average value of a voltage at the intermediate switching node.

Abstract: An M-winding coupled inductor includes a first end magnetic element, a second end magnetic element, M connecting magnetic elements, and M windings. M is an integer greater than one. Each connecting magnetic element is disposed between and connects the first and second end magnetic elements. Each winding is wound at least partially around a respective one of the M connecting magnetic elements. The coupled inductor further includes at least one top magnetic element adjacent to and extending at least partially over at least two of the M connecting magnetic elements to provide a magnetic flux path between the first and second end magnetic elements. The inductor may be included in an M-phase power supply, and the power supply may at least partially power a computer processor.

Abstract: An M phase coupled inductor includes a magnetic core including a first end magnetic element, a second end magnetic element, and M legs disposed between and connecting the first and second end magnetic elements. M is an integer greater than one. The coupled inductor further includes M windings, where each winding has a substantially rectangular cross section. Each one of the M windings is at least partially wound about a respective leg.