Patents Assigned to Walton Advanced Engineering, Inc.
  • Patent number: 7903408
    Abstract: A heat dissipation device of electronic circuit modules has a substrate, a heat dissipation element and a housing. The housing is hollow and has an airflow passage therein. Heat generated when electronic components of the substrate is operated is conducted to the heat dissipation element and is guided out of the device by heat convection generated inside the housing by the design of the airflow passage.
    Type: Grant
    Filed: November 17, 2009
    Date of Patent: March 8, 2011
    Assignee: Walton Advanced Engineering Inc.
    Inventor: Hong-Chi Yu
  • Publication number: 20110050117
    Abstract: An IC module having a display device includes an IC module, a power supply device and at least a display panel. The IC module has a substrate, at least an IC chip and a package. The power supply device has a magnetic block, a circuit board, a housing and a coil. At least a capacitor is mounted on the circuit board. Besides, the display panel is mounted on an outer surface of the housing. Given the aforementioned components, when those components are shaken back and forth, the magnetic block is moved back and forth in the coil to make the coil generate power. The generated power is further stored in the capacitor of the circuit board. As such, after acquiring power, the display panel displays the information in association with the IC module.
    Type: Application
    Filed: September 28, 2009
    Publication date: March 3, 2011
    Applicant: WALTON ADVANCED ENGINEERING INC.
    Inventor: Hong-Chi Yu
  • Patent number: 7887342
    Abstract: A structure having an USB memory module has a housing and a storage device. The housing is hollow and has a chamber defined therein. The memory module of the data storage device is partially received in the chamber of the housing and partially exposed beyond the housing.
    Type: Grant
    Filed: January 21, 2010
    Date of Patent: February 15, 2011
    Assignee: Walton Advanced Engineering Inc.
    Inventor: Hong-Chi Yu
  • Publication number: 20110029721
    Abstract: Disclosed is a cascaded combination structure of flash disks to create security function, comprising of a plurality of data disks and a key disk. Each of the data disks includes a public zone and a private zone matched with the key disk. When the key disk is series-connected with the data disks, the private zone can be displayed and load/save by a public program in the key disk. Accordingly, there can be secured and hid the data in the private zone so that the data in the private zone is unable to be embezzled by other illegal users.
    Type: Application
    Filed: May 17, 2010
    Publication date: February 3, 2011
    Applicant: WALTON ADVANCED ENGINEERING INC.
    Inventors: Hong-Chi Yu, Mao-Ting Chang
  • Publication number: 20100238622
    Abstract: The present invention relates to an attached-type memory device, which includes a support seat, a connection part. The support seat has an accommodation room for housing a flash memory; the connection part contains at least an elastic sleeve member and at least a fitting member, in which the fitting member is integrated with the support seat, and two sides of the elastic sleeve member are disposed on two side edges of an end face of the fitting member.
    Type: Application
    Filed: April 15, 2009
    Publication date: September 23, 2010
    Applicant: WALTON ADVANCED ENGINEERING INC.
    Inventors: Hong-Chi Yu, Tse-Ming Lin
  • Patent number: 7795720
    Abstract: An inversely alternate stacked structure of integrated circuit (IC) modules includes at least one IC module, and at least a spring strip set. The IC module contains a substrate, at least an IC chip and a molding body, in which the substrate has an inner surface and an outer surface, at least an external contact pad is provided on one end of the outer surface, and at least a switch contact pad is provided on the other end of the outer surface, the external contact pad and the switch contact pad are disposed in an inversely symmetrical manner. The spring strip set has at least a non-flat structure. The external contact pad of an IC module is electrically connected with the switch contact pad of another IC module via the electrical contact of the non-flat structure so that the IC modules are integrated to form an inversely alternate stacked structure.
    Type: Grant
    Filed: July 1, 2009
    Date of Patent: September 14, 2010
    Assignee: Walton Advanced Engineering Inc.
    Inventor: Hong-Chi Yu
  • Publication number: 20100221060
    Abstract: The present invention relates to a pen featuring as a USB memory device, which includes a penholder having an upper penholder and a lower penholder, in which the upper penholder has an accommodation room whose one end communicates with the outer periphery of the upper penholder, and the lower penholder is provided to house a pen body; a foldable connection plug housed in the accommodation room of the upper penholder and having a support seat, at least a first connection part, at least a second connection part, and metal contacts being compatible with a USB transmission interface; and a main body housed in the accommodation room of the upper penholder and having at least an electronic component.
    Type: Application
    Filed: March 30, 2009
    Publication date: September 2, 2010
    Applicant: WALTON ADVANCED ENGINEERING INC.
    Inventor: Hong-Chi Yu
  • Publication number: 20100216350
    Abstract: The present invention relates to a foldable connection structure, including a foldable plug. The foldable plug contains at least a connection part, in which the foldable plug has metal contacts being compatible with a data transmission interface and is electrically connected with an electronic device being compatible with the data transmission interface through the metal contacts.
    Type: Application
    Filed: March 30, 2009
    Publication date: August 26, 2010
    Applicant: WALTON ADVANCED ENGINEERING INC.
    Inventor: Hong-Chi Yu
  • Patent number: 7768112
    Abstract: A method for cutting and molding in small windows of a window-type semiconductor package and the semiconductor package fabricated from the same are revealed. According to the method, a substrate strip has a plurality of small windows disposed at the sides or at the corners of the substrate strip. The external surface of the substrate strip includes a plurality of window molding areas surrounding the small windows and extending to the scribe lines. A plurality of chips are disposed on the substrate strip. Then, an encapsulant is formed in the small windows to encapsulate the electrical connecting components and formed on the window molding areas so that the encapsulant extends to the scribe lines. Therefore, the mold flashes at the small windows can be effectively reduced.
    Type: Grant
    Filed: August 17, 2009
    Date of Patent: August 3, 2010
    Assignee: Walton Advanced Engineering Inc.
    Inventors: Kuo-Yuan Lee, Yung-Hsiang Chen
  • Patent number: 7723157
    Abstract: A method for cutting and molding in small windows of a window-type semiconductor package and the semiconductor package fabricated from the same are revealed. According to the method, a substrate strip has a plurality of small windows disposed at the sides or at the corners of the substrate strip. The external surface of the substrate strip includes a plurality of window molding areas surrounding the small windows and extending to the scribe lines. A plurality of chips are disposed on the substrate strip. Then, an encapsulant is formed in the small windows to encapsulate the electrical connecting components and formed on the window molding areas so that the encapsulant extends to the scribe lines. Therefore, the mold flashes at the small windows can be effectively reduced.
    Type: Grant
    Filed: December 28, 2007
    Date of Patent: May 25, 2010
    Assignee: Walton Advanced Engineering, Inc.
    Inventors: Kuo-Yuan Lee, Yung-Hsiang Chen
  • Publication number: 20100077229
    Abstract: A method of utilizing USB record carriers is disclosed. A USB security drive is serially connected with at least a USB drive to encrypt/decrypt stored data in the USB drive and to integrate a plurality of data regions or even a plurality of encrypted data regions to provide multi-level security protections. In a more specific embodiment, the USB security drive further enables the automatic backup of data stored in the USB drive. A related assembled module by the implementation is also disclosed.
    Type: Application
    Filed: June 5, 2009
    Publication date: March 25, 2010
    Applicant: WALTON ADVANCED ENGINEERING, INC.
    Inventors: HONG-CHI YU, MAO-TING CHANG
  • Publication number: 20090098773
    Abstract: A space-minimized flash drive has a USB connector and a body, where the flash drive comprises a printed circuit board, a plurality of contact fingers, one or more memory devices, and a controller. The printed circuit board has a component section located inside the body and an insertion section extending into and located inside the USB connector. The memory device is disposed on the component section. The contact fingers are disposed on the top surface of the insertion section. The controller is disposed on the bottom surface of the insertion section located inside the USB connector. The footprint occupied by the controller and the corresponding empty footprint are saved to effectively reduce the length of the flash drive to miniaturize flash drives without interfering with the electrical connections of the contact fingers when plugging in the flash drive.
    Type: Application
    Filed: November 29, 2008
    Publication date: April 16, 2009
    Applicant: Walton Advanced Engineering, Inc
    Inventors: CHIH-CHIEN CHENG, TSE-MING LIN
  • Patent number: 7413470
    Abstract: A modular linking assembly of memory module packages primarily comprises a plurality of memory module components and at least a flexible connector. A plurality of USB contact fingers and a plurality of expanding fingers are formed on two opposing sides of the outer surface on each memory module component. The flexible connector has a first casing, a second casing and a plastic elastomer connecting the first casing to the second casing. The first casing has a plurality of first connecting terminals for electrically contacting the expanding fingers. The second casing has a plurality of second connecting terminals for electrically contacting the USB contact fingers. The plastic elastomer has a plurality of conductive wiring electrically connecting the first terminals to the second terminals so that the connected memory module components are electrically connected to each other to increase readable memory capacities with only one USB slot.
    Type: Grant
    Filed: March 26, 2007
    Date of Patent: August 19, 2008
    Assignee: Walton Advanced Engineering, Inc.
    Inventor: Hong-Chi Yu
  • Patent number: 7311460
    Abstract: A digital storage device mounted in a pen shaped housing has a barrel, a reservoir tube assembly and a memory device with a USB plug. The memory device is held in the barrel and the USB plug can be extended from the barrel to insert into a USB socket of a computer to access digital data from the computer. In addition, the memory device uses a flash memory IC for storing data so that the memory device does not use a battery. Therefore, the digital storage device can be used to store data and to perform other functions such as writing.
    Type: Grant
    Filed: March 10, 2003
    Date of Patent: December 25, 2007
    Assignee: Walton Advanced Engineering, Inc.
    Inventor: Hong-Chi Yu
  • Patent number: 7270557
    Abstract: A high-density storage device has a housing and a memory and controller assembly. The housing has a plug part and a socket part receiving the plug part of other high-density storage device. The memory and controller assembly is mounted in the housing and has a circuit board, a source controller integrated circuit and a memory integrated circuit. The circuit board has an upper surface and a bottom surface. The source controller integrated circuit is mounted on the bottom surface. The memory integrated circuit is mounted on the bottom surface of the circuit board. Because the source controller integrated circuit and the memory integrated circuit are mounted on the same side of the circuit board, so high-density storage device has a reduced size. Furthermore, the socket part may connect with another high-density storage devices.
    Type: Grant
    Filed: June 12, 2006
    Date of Patent: September 18, 2007
    Assignee: Walton Advanced Engineering, Inc.
    Inventor: Hong-Chi Yu
  • Patent number: 6763410
    Abstract: A portable USB memory device has a housing, a memory and driver board and a USB plug. The memory and driver board has a memory IC, a driver IC and some electronic components so that the thickness of the memory device is decreased and the memory device is only 3 times larger than the USB plug. The memory device is small enough small to adapt to mount in an external housing, which further is adapted to attach to other devices like key chains, belts, etc.
    Type: Grant
    Filed: March 10, 2003
    Date of Patent: July 13, 2004
    Assignee: Walton Advanced Engineering, Inc.
    Inventor: Hong-Chi Yu