Patents Assigned to Walton Advanced Engineering, Inc.
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Patent number: 7903408Abstract: A heat dissipation device of electronic circuit modules has a substrate, a heat dissipation element and a housing. The housing is hollow and has an airflow passage therein. Heat generated when electronic components of the substrate is operated is conducted to the heat dissipation element and is guided out of the device by heat convection generated inside the housing by the design of the airflow passage.Type: GrantFiled: November 17, 2009Date of Patent: March 8, 2011Assignee: Walton Advanced Engineering Inc.Inventor: Hong-Chi Yu
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Publication number: 20110050117Abstract: An IC module having a display device includes an IC module, a power supply device and at least a display panel. The IC module has a substrate, at least an IC chip and a package. The power supply device has a magnetic block, a circuit board, a housing and a coil. At least a capacitor is mounted on the circuit board. Besides, the display panel is mounted on an outer surface of the housing. Given the aforementioned components, when those components are shaken back and forth, the magnetic block is moved back and forth in the coil to make the coil generate power. The generated power is further stored in the capacitor of the circuit board. As such, after acquiring power, the display panel displays the information in association with the IC module.Type: ApplicationFiled: September 28, 2009Publication date: March 3, 2011Applicant: WALTON ADVANCED ENGINEERING INC.Inventor: Hong-Chi Yu
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Patent number: 7887342Abstract: A structure having an USB memory module has a housing and a storage device. The housing is hollow and has a chamber defined therein. The memory module of the data storage device is partially received in the chamber of the housing and partially exposed beyond the housing.Type: GrantFiled: January 21, 2010Date of Patent: February 15, 2011Assignee: Walton Advanced Engineering Inc.Inventor: Hong-Chi Yu
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Publication number: 20110029721Abstract: Disclosed is a cascaded combination structure of flash disks to create security function, comprising of a plurality of data disks and a key disk. Each of the data disks includes a public zone and a private zone matched with the key disk. When the key disk is series-connected with the data disks, the private zone can be displayed and load/save by a public program in the key disk. Accordingly, there can be secured and hid the data in the private zone so that the data in the private zone is unable to be embezzled by other illegal users.Type: ApplicationFiled: May 17, 2010Publication date: February 3, 2011Applicant: WALTON ADVANCED ENGINEERING INC.Inventors: Hong-Chi Yu, Mao-Ting Chang
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Publication number: 20100238622Abstract: The present invention relates to an attached-type memory device, which includes a support seat, a connection part. The support seat has an accommodation room for housing a flash memory; the connection part contains at least an elastic sleeve member and at least a fitting member, in which the fitting member is integrated with the support seat, and two sides of the elastic sleeve member are disposed on two side edges of an end face of the fitting member.Type: ApplicationFiled: April 15, 2009Publication date: September 23, 2010Applicant: WALTON ADVANCED ENGINEERING INC.Inventors: Hong-Chi Yu, Tse-Ming Lin
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Patent number: 7795720Abstract: An inversely alternate stacked structure of integrated circuit (IC) modules includes at least one IC module, and at least a spring strip set. The IC module contains a substrate, at least an IC chip and a molding body, in which the substrate has an inner surface and an outer surface, at least an external contact pad is provided on one end of the outer surface, and at least a switch contact pad is provided on the other end of the outer surface, the external contact pad and the switch contact pad are disposed in an inversely symmetrical manner. The spring strip set has at least a non-flat structure. The external contact pad of an IC module is electrically connected with the switch contact pad of another IC module via the electrical contact of the non-flat structure so that the IC modules are integrated to form an inversely alternate stacked structure.Type: GrantFiled: July 1, 2009Date of Patent: September 14, 2010Assignee: Walton Advanced Engineering Inc.Inventor: Hong-Chi Yu
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Publication number: 20100221060Abstract: The present invention relates to a pen featuring as a USB memory device, which includes a penholder having an upper penholder and a lower penholder, in which the upper penholder has an accommodation room whose one end communicates with the outer periphery of the upper penholder, and the lower penholder is provided to house a pen body; a foldable connection plug housed in the accommodation room of the upper penholder and having a support seat, at least a first connection part, at least a second connection part, and metal contacts being compatible with a USB transmission interface; and a main body housed in the accommodation room of the upper penholder and having at least an electronic component.Type: ApplicationFiled: March 30, 2009Publication date: September 2, 2010Applicant: WALTON ADVANCED ENGINEERING INC.Inventor: Hong-Chi Yu
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Publication number: 20100216350Abstract: The present invention relates to a foldable connection structure, including a foldable plug. The foldable plug contains at least a connection part, in which the foldable plug has metal contacts being compatible with a data transmission interface and is electrically connected with an electronic device being compatible with the data transmission interface through the metal contacts.Type: ApplicationFiled: March 30, 2009Publication date: August 26, 2010Applicant: WALTON ADVANCED ENGINEERING INC.Inventor: Hong-Chi Yu
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Patent number: 7768112Abstract: A method for cutting and molding in small windows of a window-type semiconductor package and the semiconductor package fabricated from the same are revealed. According to the method, a substrate strip has a plurality of small windows disposed at the sides or at the corners of the substrate strip. The external surface of the substrate strip includes a plurality of window molding areas surrounding the small windows and extending to the scribe lines. A plurality of chips are disposed on the substrate strip. Then, an encapsulant is formed in the small windows to encapsulate the electrical connecting components and formed on the window molding areas so that the encapsulant extends to the scribe lines. Therefore, the mold flashes at the small windows can be effectively reduced.Type: GrantFiled: August 17, 2009Date of Patent: August 3, 2010Assignee: Walton Advanced Engineering Inc.Inventors: Kuo-Yuan Lee, Yung-Hsiang Chen
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Patent number: 7723157Abstract: A method for cutting and molding in small windows of a window-type semiconductor package and the semiconductor package fabricated from the same are revealed. According to the method, a substrate strip has a plurality of small windows disposed at the sides or at the corners of the substrate strip. The external surface of the substrate strip includes a plurality of window molding areas surrounding the small windows and extending to the scribe lines. A plurality of chips are disposed on the substrate strip. Then, an encapsulant is formed in the small windows to encapsulate the electrical connecting components and formed on the window molding areas so that the encapsulant extends to the scribe lines. Therefore, the mold flashes at the small windows can be effectively reduced.Type: GrantFiled: December 28, 2007Date of Patent: May 25, 2010Assignee: Walton Advanced Engineering, Inc.Inventors: Kuo-Yuan Lee, Yung-Hsiang Chen
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Publication number: 20100077229Abstract: A method of utilizing USB record carriers is disclosed. A USB security drive is serially connected with at least a USB drive to encrypt/decrypt stored data in the USB drive and to integrate a plurality of data regions or even a plurality of encrypted data regions to provide multi-level security protections. In a more specific embodiment, the USB security drive further enables the automatic backup of data stored in the USB drive. A related assembled module by the implementation is also disclosed.Type: ApplicationFiled: June 5, 2009Publication date: March 25, 2010Applicant: WALTON ADVANCED ENGINEERING, INC.Inventors: HONG-CHI YU, MAO-TING CHANG
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Publication number: 20090098773Abstract: A space-minimized flash drive has a USB connector and a body, where the flash drive comprises a printed circuit board, a plurality of contact fingers, one or more memory devices, and a controller. The printed circuit board has a component section located inside the body and an insertion section extending into and located inside the USB connector. The memory device is disposed on the component section. The contact fingers are disposed on the top surface of the insertion section. The controller is disposed on the bottom surface of the insertion section located inside the USB connector. The footprint occupied by the controller and the corresponding empty footprint are saved to effectively reduce the length of the flash drive to miniaturize flash drives without interfering with the electrical connections of the contact fingers when plugging in the flash drive.Type: ApplicationFiled: November 29, 2008Publication date: April 16, 2009Applicant: Walton Advanced Engineering, IncInventors: CHIH-CHIEN CHENG, TSE-MING LIN
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Patent number: 7413470Abstract: A modular linking assembly of memory module packages primarily comprises a plurality of memory module components and at least a flexible connector. A plurality of USB contact fingers and a plurality of expanding fingers are formed on two opposing sides of the outer surface on each memory module component. The flexible connector has a first casing, a second casing and a plastic elastomer connecting the first casing to the second casing. The first casing has a plurality of first connecting terminals for electrically contacting the expanding fingers. The second casing has a plurality of second connecting terminals for electrically contacting the USB contact fingers. The plastic elastomer has a plurality of conductive wiring electrically connecting the first terminals to the second terminals so that the connected memory module components are electrically connected to each other to increase readable memory capacities with only one USB slot.Type: GrantFiled: March 26, 2007Date of Patent: August 19, 2008Assignee: Walton Advanced Engineering, Inc.Inventor: Hong-Chi Yu
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Patent number: 7311460Abstract: A digital storage device mounted in a pen shaped housing has a barrel, a reservoir tube assembly and a memory device with a USB plug. The memory device is held in the barrel and the USB plug can be extended from the barrel to insert into a USB socket of a computer to access digital data from the computer. In addition, the memory device uses a flash memory IC for storing data so that the memory device does not use a battery. Therefore, the digital storage device can be used to store data and to perform other functions such as writing.Type: GrantFiled: March 10, 2003Date of Patent: December 25, 2007Assignee: Walton Advanced Engineering, Inc.Inventor: Hong-Chi Yu
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Patent number: 7270557Abstract: A high-density storage device has a housing and a memory and controller assembly. The housing has a plug part and a socket part receiving the plug part of other high-density storage device. The memory and controller assembly is mounted in the housing and has a circuit board, a source controller integrated circuit and a memory integrated circuit. The circuit board has an upper surface and a bottom surface. The source controller integrated circuit is mounted on the bottom surface. The memory integrated circuit is mounted on the bottom surface of the circuit board. Because the source controller integrated circuit and the memory integrated circuit are mounted on the same side of the circuit board, so high-density storage device has a reduced size. Furthermore, the socket part may connect with another high-density storage devices.Type: GrantFiled: June 12, 2006Date of Patent: September 18, 2007Assignee: Walton Advanced Engineering, Inc.Inventor: Hong-Chi Yu
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Patent number: 6763410Abstract: A portable USB memory device has a housing, a memory and driver board and a USB plug. The memory and driver board has a memory IC, a driver IC and some electronic components so that the thickness of the memory device is decreased and the memory device is only 3 times larger than the USB plug. The memory device is small enough small to adapt to mount in an external housing, which further is adapted to attach to other devices like key chains, belts, etc.Type: GrantFiled: March 10, 2003Date of Patent: July 13, 2004Assignee: Walton Advanced Engineering, Inc.Inventor: Hong-Chi Yu