Abstract: Disclosed is a flash memory, which includes: a memory cell array including two planes; a controller configured to control the read action and program action of the two planes; and two latches configured to hold data read from one plane or data that should be programmed to one plane; and two latches configured to hold data read from another plane or data that should be programmed to another plane. The controller is configured to perform read operation of the other plane according to a simultaneous command input from the outside while performing programming operation of one plane.

Abstract: A semiconductor device is provided. The semiconductor device includes a substrate, a first source/drain region and a second source/drain region disposed within the substrate, and a gate structure disposed on the substrate and between the first source/drain region and the second source/drain region. The semiconductor device further includes an interlayer dielectric layer disposed over the first source/drain region, the second source/drain region, and the gate structure. The interlayer dielectric layer includes a second trench extending into the second source/drain region. The semiconductor device further includes a dielectric layer disposed in the second trench, and a second source/drain contact disposed over the second source/drain region and filling the remaining portion of the second trench.

Abstract: A probe tip landing method for a measurement system is provided. The probe tip landing method includes performing a first descending operation to lower a probe toward a sample by a first descending distance; performing a second descending operation to lower the probe toward the sample; and performing an inspection operation during the second descending operation. The inspection operation includes an imaging operation, scanning the sample to obtain a first image including a probe tip of the probe; and a determining operation, checking the first image to determine that in the first image, whether a region connected with the probe tip becomes bright. The probe tip landing method further includes in response to the region connected with the probe tip in the first image becoming bright, determining that the probe has contacted a surface of the sample and the probe has landed successfully.

Abstract: A memory device including a memory cell array, a signal generator, a word line decoder, a bit line decoder, a sensing amplifier circuit and a register circuit is provided. The signal generator generates a control signal according to a wrap around read command. The word line decoder, the bit line decoder, and the sensing amplifier circuit read data stored in the memory cell array according to the wrap around read command, so as to output a first wrap around read data. The register circuit is configured to latch the first wrap around read data and outputs successive wrap around read data according to the control signal and the latched first wrap around read data after the first wrap around read data is output. When the register circuit outputs the successive wrap around read data, the word line decoder, the bit line decoder, and the sensing amplifier circuit are disable.

Abstract: A pick-up structure for a memory device and method for manufacturing memory device are provided. The pick-up structure includes a substrate and a plurality of pick-up electrode strips. The substrate has a memory cell region and a peripheral pick-up region adjacent thereto. The pick-up electrode strips are parallel to a first direction and arranged on the substrate in a second direction. The second direction is different from the first direction. Each pick-up electrode strip includes a main part in the peripheral pick-up region and an extension part extending from the main part to the memory cell region. The main part is defined by fork-shaped patterns of a first mask layer. The extension part has a width less than that of the main part, and the extension part has a side wall surface aligned with a side wall surface of the main part.

Abstract: The present invention provides a stress testing circuit including a control circuit. In a test mode, the control circuit controls a supply voltage which is applied to a pre-charge circuit including transistors in a semiconductor memory device. The control circuit controls the supply voltage according to the voltage of an external power supply and the threshold voltage of the transistors included in the pre-charge circuit.

Abstract: A memory controller for controlling a flash memory is provided. The memory controller includes a control circuit and a voltage generator. The control circuit is configured to program one or more pages of the flash memory in sequence, wherein each page includes a plurality of bytes. The voltage generator is configured to adjust the output voltage according to the control signal from the control circuit. The control circuit performs a programming verification operation on each byte of a current page of the one or more pages in a page programming mode, and calculates the first number of bytes which fail the programming verification operation and performs a programming operation again. The control circuit determines the programming mode of the page after the current page as the page programming mode or the byte programming mode according to the first number.

Abstract: A pseudo-static random access memory is provided herein, which may improve the speed of data transmission. After a first delay from a command and a row address being input in a first operation, the pseudo-static random access memory inputs or outputs the data in the memory cells corresponding to the input row address and the input column address, which includes a control unit controlling a delay in the second operation less than the initial delay when a specific condition is satisfied. The second operation is executed after the first operation.

Abstract: A semiconductor memory device has a NOR-type memory cell array, a crossbar array, an entry gate, and a column selecting/signal processing unit. The crossbar array has a plurality of rows and columns, variable resistor elements formed in intersections of rows and columns respectively. The entry gate arranged between the memory cell array and the crossbar array, connects a selected bit line of the memory cell array to the crossbar array based on a selection signal. The column selecting/signal processing unit has a column writing unit, a column reading unit, and a NOR writing unit. The column writing unit writes data read from the memory cell array to a selected column of the crossbar array. The column reading unit reads data of the selected column of the crossbar array. The NOR writing unit at least writes data read by the column writing unit to the memory cell array.

Abstract: A delay control circuit provided herein includes a DLL control circuit, a delay line circuit, and an N-value detection circuit. The DLL control circuit determines the delay amount based on the phase difference between the input and output clock signals. The delay line circuit delays the input clock signal based on the delay amount to generate an output clock signal. The N-value detection circuit performs an N-value detection operation for detecting the number of delayed clock cycles from the input clock signal to the output clock signal. When it is determined to be in an overflow state, the DLL control circuit outputs a signal indicating an overflow state to the N-value detection circuit. When the signal indicating the overflow state is received, the N-value detection circuit does not perform the N-value detection operation, but instead sets the number of delayed clock cycles to a predetermined value.

Abstract: A voltage generating device includes a low-dropout voltage regulator and a control signal generator. The low-dropout voltage regulator provides an output voltage to a power distribution network. The low-dropout voltage regulator has a feedback circuit. The feedback circuit divides the output voltage to generate a feedback voltage according to a voltage dividing ratio, and the feedback circuit sets the voltage dividing ratio according to multiple control signals. The control signal generator is coupled to the feedback circuit and the power distribution network, and generates the control signals by comparing a sensing voltage at a reference terminal of the power distribution network with multiple threshold voltages.

Abstract: A delay locked loop includes a delay line, a phase detector, a controller, an output clock generator, and a feedback circuit. The delay line receives an input clock signal and a control code, and generates a delayed clock signal by delaying the input clock signal according to the control code. The phase detector receives a reference clock signal and a feedback clock signal, and detects a phase difference between the reference clock signal and the feedback clock signal to generate phase comparison information. The controller generates the control code and a switching signal according to the phase comparison information. The output clock generator selects the delayed clock signal or an inverted signal of the delayed clock signal according to the switching signal to generate an output clock signal. The feedback circuit generates the feedback clock signal according to the output clock signal.

Abstract: A semiconductor memory device that can easily recognize the content of errors in data is provided. The semiconductor memory device includes a memory cell array, an error detection and correction circuit, and an input/output circuit. The memory cell array includes a plurality of memory cells. The error detection and correction circuit detects and corrects error bits included in the data output by the memory cell array. The error detection and correction circuit activates an error detection signal when the data includes a correctable error bit. The input/output circuit stops the clocking of the data strobe signal output with data when the data includes uncorrectable error bits.

Abstract: A sense amplifier capable of performing a logical NOT operation is provided, which includes a sense circuit, configured to sense a first voltage of a bit line and a second voltage of an inverse bit line; a first transistor, coupled between a first terminal of the sense circuit and the bit line; a second transistor, coupled between a second terminal of the sense circuit and the inverse bit line; and a third transistor, coupled between the bit line and the inverse bit line. First and second memory cells are respectively controlled by first and second word lines, and connected to the bit line. When the sense amplifier is in an inverse writing state, the sense amplifier writes the second voltage to the second memory cell through a predetermined path. A first logical state of the first voltage is complementary to a second logical state of the second voltage.

Abstract: A voltage generation circuit and a semiconductor memory device capable of decreasing the layout size and the consumed current are provided. A voltage generation circuit includes a plurality of voltage generation units which generate different output voltages based on an external power supply voltage. Each of the plurality of voltage generation unit comprises a plurality of resistors that are connected in series to detect the output voltages. At least one of these resistors is coupled to and shared by the plurality of voltage generation units.

Abstract: A memory device capable of performing in-memory computing is provided and includes a memory cell array, a sense amplifier, a voltage control circuit, and a word line decoding circuit. The memory cell array includes memory cells arranged in a two-dimensional array. The memory cells on each row of the memory cell array are connected to a corresponding word line, and the memory cells on each column of the memory cell array are connected to a corresponding bit line. The sense amplifier detects a voltage level of the activated bit line and a voltage level of an inverse bit line corresponding to the bit line. The voltage control circuit selects a detection voltage provided to the sense amplifier according to a control signal from a memory controller. The word line decoding circuit activates a first word line and a second word line according to the control signal.

Abstract: The present invention provides a memory system in which a semiconductor memory device can be accessed properly. The memory system includes a memory controller and a semiconductor memory device. The memory controller sends a command, an address, and first checking data to the semiconductor memory device. When the semiconductor memory device receives first response information that indicates that no error has been detected, it sends or receives read data or write data from the semiconductor memory device. When the semiconductor memory device receives the command, the address, and the first checking data, it uses the first checking data to detect errors in the command and the address, and sends the first reply information when no error is detected, and when no error is detected in the command and the address, it sends or receives read data or write data from the semiconductor memory device.

Abstract: A fuse block unit includes a share flip-flop. The share flip-flop includes a first switch element, a second switch element, a third switch element, a fourth switch element, a first latch, and a second latch. The first switch element selectively couples a first laser latch to a first node according to the first load voltage. The second switch element selectively couples a second laser latch to the first node according to the second load voltage. The third switch element selectively couples an input node to the first node according to the inverted shift voltage. The first latch is coupled between the first node and a second node. The fourth switch element selectively couples the second node to a third node according to the shift voltage. The second latch is coupled between the third node and an output node.

Abstract: A synchronization circuit, a semiconductor storage device, and a synchronization method provided herein, which are capable of performing synchronization on a small circuit scale, includes: a first delay circuit delaying a input synchronization signal by a first predetermined time to generate a first delay synchronization signal; a second delay circuit delaying the first delay synchronization signal by a second predetermined time to generate a second delay synchronization signal; a first synchronization circuit outputting a first output data generated by synchronizing the input data with the input synchronization signal; a second synchronization circuit outputting a second output data generated by synchronizing the input data with the first delay synchronization signal; and a resynchronization circuit resynchronizing the input data with the second delay synchronization signal to update the first output data to the first synchronization circuit when the first output data is inconsistent with the second output d

Abstract: The present invention provides a short-circuit probe card, including: a substrate having an upper surface and a lower surface; a plurality of first contacts formed on the upper surface; and a plurality of second contacts formed on the lower surface and connected to the plurality of first contacts. The first contacts and second contacts are all grounded.