Abstract: A probe pin cartridge includes a first substrate disposed opposite to a positioning member, a second substrate laid beneath the first substrate, having the same contour as that of the first substrate and a plurality of probe pins held by the first and second substrates.

Abstract: A probe pin cartridge includes a first substrate disposed opposite to a positioning member, a second substrate laid beneath the first substrate, having the same contour as that of the first substrate and a plurality of probe pins held by the first and second substrates.

Abstract: In a pressing cap forming part of a semiconductor device carrier unit, a pressing portion of a pressure body has recesses, to each of which a bump is inserted.

Abstract: The probe pin cartridge is held in the cartridge accommodating region of the frame body when the slider members are in the locked state, and detachable from the cartridge accommodating region when the slider members are in the unlocked state by the operation of the operating buttons.

Abstract: The configuration comprises a base board to be mounted a circuit board, with an IC receiving concave place and a resilient member receiving area, having an upper wall and a lower wall surrounding the resilient member receiving area, the upper wall provided with a first slot for contact and the lower wall provided with a second slot, a contact comprising a first contact portion on which a lead of the IC is loaded, a second contact portion coming into contact with a circuit lead of the circuit board, a contact main body communicating the first contact portion with the second contact portion, and a compressing portion protruding from the rear of the contact main body, the resilient member receiving area receiving the resilient member of integral structure, set in the resilient member receiving area, in which a plurality of contacts are implanted, wherein the compressing portion compresses the resilient member in order that a contact pressure can be obtained for the contact to the IC lead and the circuit lead by

Abstract: A semiconductor device socket is for electrically connecting between a semiconductor device and a printed-wiring board. The semiconductor device socket includes a socket body having contacts to be electrically contacted with the semiconductor device, and a connection mechanism provided between the socket body and the printed-wiring board, and having connection members for electrically connecting between the contacts and the printed-wiring board and an alignment plate having through-holes in which the connection members are provided, wherein the connection member of the connection mechanism has a first spring portion having a first free end, a support portion having an outer diameter greater than an inner diameter of the through-hole, and a second spring portion having a second free end.

Abstract: A connector for a flexible conductor includes a connector body, a plurality of contacts provided in the connector body, an operator capable of vertically moving between a first position and a second position within the connector body, and a driver capable of moving between a first position and a second position relative to the connector body. The driver causes the operator to move vertically between the first and second positions correspondingly to a movement thereof between the first and second positions. The operator, in the first position, is in a position distant a predetermined spacing from the plurality of contacts so that a flexible conductor can be placed between the operator and the plurality of contacts, and, in the second position, is allowed to bring external terminals of the flexible conductor into contact, at a predetermined contact pressure, with the plurality of contacts.

Abstract: The connector housing 30 is formed with a pair of guide grooves 50a, 50b and a pair of side walls 60. The guide grooves 50a, 50b support the both side edges of the upper body portion 21 of the thick first card 20 and also the both side edges of the card body 11 of the thin second card 10 and guide these cards as they are inserted or extracted. The side walls 60 define, below a space between the paired guide grooves 50a, 50b, a space in which to accommodate the lower body portion 23 of the first card 20. This construction ensures that, whichever of the first and second cards is inserted, the elastic displacements of the contact terminals 40 of a card connector 1 remain the same, allowing the card to be electrically connected stably.

Abstract: In a carrier unit, a posture-stabilizing member 30 for stabilizing a bare chip to be generally parallel to a flat surface of an electrode sheet 32 is placed on the electrode sheet 32 in a carrier unit 21.

Abstract: A probe pin cartridge includes a first substrate disposed opposite to a positioning member, a second substrate laid beneath the first substrate, having the same contour as that of the first substrate and a plurality of probe pins held by the first and second substrates.

Abstract: Engaging portions of a wrong insertion restraining member for restraining wrong insertion of a MINI SD CARD have respective notches engaging the outer edges of openings of locking members.

Abstract: In a cable connector, a sliding surface in a pressing portion of an actuator member is rotatable or movable relative to an arc-shaped portion and slant part of a contact terminal.

Abstract: Lengths of arms of pressing members held at a lower end of an arm section of a cover member are determined in correspondence to the retention of semiconductor devices having contour dimensions different from each other, and are shorter than a length of the arm section so that part of the pressing members is projected outside through a recess of the socket body.

Abstract: A semiconductor device carrier comprising; a carrier housing having a housing portion for accommodating a semiconductor device; an electrode sheet disposed in the carrier housing, having a front surface wiring conductively arranged on a front surface of an insulation substrate, a rear surface wiring conductively arranged on a rear surface of the insulation substrate, a rear surface bump contact placement wiring, and a bump contact disposed in a contact placement portion and an elastic sheet disposed in the carrier housing to be in contact with the bottom of the electrode sheet; wherein a width of the rear surface bump contact placement wiring in correspondence to a bump contact to be in contact with an extreme electrode section of the semiconductor device is smaller than a width of the front surface bump contact placement wiring on which a bump contact to be in contact with the extreme electrode section is arranged.

Abstract: A plug connector for electrically connecting a printed wiring board with a card-edge connector includes a first connector-contact arrangement and a second connector-contact arrangement. The first connector-contact arrangement is inserted to the card-edge connector and includes a first blade with a front surface having a recessed surface partly recessed therefrom and a plurality of first contact components arranged parallel one with another in the first blade. The second connector-contact arrangement is inserted to a card-edge connector and includes a second blade with a front surface having a recessed surface partly recessed therefrom and a plurality of second contact components arranged parallel one with another in the second blade.

Abstract: A card connector of the present invention includes a connector body, a cover member in combination with the connector body, contact terminals arranged in the connector body, and a card-ejection preventing mechanism provided in a card-inserting opening of the connector body, wherein the card-ejection preventing mechanism has a card-stopper cap adapted to be slidable along the card-inserting opening of the connector body, so that the ejection of a card due to the vibration or the shock is prevented and a contact portion is always brought into contact with a card pad section.

Abstract: In a state wherein front ends of latch members 18A and 18B are apart from each other so that the upper surface of an alignment plate/positioning member 24 is outside, a pressing section 12PU of a heat sink member 12 is brought into contact with the periphery of a semiconductor device 22.

Abstract: Several embodiments of multi-bandpass filters for processing optical signals are shown. The filters may include a transparent substrate with a thin film superimposed thereon. The thin film may have mirror layers and cavity layers, and may have multiple kinds of dielectrics with different refractive indices. The optical film may have a thickness that is a quarter of a reference wavelength, so as to form a plurality of Fabry-Perrot interferometer structures, and may have multiple groups of superimposed mirror and cavity layers depending on the desired effect. By using the described filters, the isolation between a plurality of the transmission bands can be sufficiently large, and separation of lights in a plurality of different wavelength regions can be carried out through a single multi-bandpass filter.

Abstract: An Integrated Circuit (IC) card connector includes a housing member, an ejection mechanism, and a plurality of braking pieces. The housing member includes an accommodation portion for selectively accommodating an IC card. When the ejection mechanism ejects the IC card from the accommodation portion, an end of at least one of the plurality of braking pieces contacts a movable part of the ejection mechanism. After contacting the movable part of the ejection mechanism, the end of the at least one braking piece retreats. Thus, the braking piece decelerates the ejection speed of the IC card and avoids the undesirable jumping-out of the IC card. Embodiments consistent with the invention may also include an improper insertion piece provided in the housing member.

Abstract: Lengths of arms of pressing members held at a lower end of an arm section of a cover member are determined in correspondence to the retention of semiconductor devices having contour dimensions different from each other, and are shorter than a length of the arm section so that part of the pressing members is projected outside through a recess of the socket body.