Abstract: A card connector can selectively receive one of two IC cards. The card connector has an improved structure of contacts arranged in a card receiving space to simplify the structure thereof and to allow the card connector to be manufactured easily. The card connector at least includes a space for receiving a card and a plurality of contacts that are provided in the space parallel to the direction along which a card is inserted. The respective contacts provided in the space for receiving the IC card include a plurality of contact points that respectively correspond to the respective pads of the plurality of IC cards and that are provided in the direction along which the IC card is inserted. Thus, the card connector can be selectively attached with one of a plurality of IC cards having the same pad pitch.

Abstract: A female side connector for high current includes at least one contact unit including a contact, a contact support section, and a connection terminal: and a connector housing for placing the contact support section. The contact is provided by superposing a plurality of L-shaped and thin plate-like contact elements in the plate thickness direction, the contact element has a rectangular base end and a pair of elastically deformable arms that extend from the upper part of the rectangular base end and that respectively have opposing contact points at the neighborhood of the tip end. The contact support section supports the contact. The connection terminal is integrated with the contact support section and electrically contacts with outside. The contact is provided such that at least two or more contact elements having respectively different distances from the arm tip end to the contact point are superposed in the plate thickness direction.

Abstract: While a transfer surface 10a of a transfer plate 10 having a predetermined surface roughness is brought into contact with a plurality of bumps 44B on a contact sheet 44 formed on a substrate 44M having the coefficient of linear expansion larger than that of the transfer plate 10 at a predetermined pressure, the substrate 44M and the transfer plate 10 are heated to a predetermined temperature to recover the surface roughness of the bump 44B to a predetermined value.

Abstract: A probe unit comprises a flexible substrate made of an inorganic substance and having an almost straight edge, an electro conductive film formed on a surface of the substrate and having a plurality of contact parts aligned on a surface of the edge and can contact with electrodes of a sample and lead parts connected to the contact parts, wherein the substrate is elastically deformed together with the contact part while the plurality of the contacts parts are supported by the edge when a force is added to press a surface of the contact part.

Abstract: A male connector section is held on a female connector section by the engagement of nibs in the metallic holding fixture with projections of the metallic holding fixture in the female connector section.

Abstract: In a structure where the lid portion is mounted on the main housing body comprising apertures and in such a manner as to turn freely thereon, the concave lock portion and the locking protrusion adjacent thereto capable of locking the lid in the closed state are located in the aperture side of the main housing body. The lid portion is provided with the hooking piece comprising the spring portion and the arc-shaped protrusion. When the lid portion turns to open or close the aperture portion, the arc-shaped protrusion comes into contact with the locking protrusion under pressure with the spring portion, in order that a force opposing to the turning direction may be applied thereto before and after it passes through the locking protrusion, to keep the lid portion in two states i.e. the open state and the closed state.

Abstract: Lengths of arms of pressing members held at a lower end of an arm section of a cover member are determined in correspondence to the retention of semiconductor devices having contour dimensions different from each other, and are shorter than a length of the arm section so that part of the pressing members is projected outside through a recess of the socket body.

Abstract: An organic electroluminescence display includes a transparent glass substrate, an ITO anode layer, a positive hole transition layer, an RGB luminescence layer, an electron transition layer and a metallic cathode layer. Highly pressurized N2 gas is sealed in the interior of the display. To absorb and retain the moisture in the sealed gas, a hygroscopic member is disposed between a sealing member and the cathode layer. The hygroscopic member includes a nonwoven fabric including a fiber layer made of fibers bonding to each other and a hygroscopic agent adhering to one surface of the fiber layer and an air-permeable sheet covering the nonwoven fabric as a whole.

Abstract: An Integrated Circuit (IC) card connector includes a housing member, an ejection mechanism, and a plurality of braking pieces. The housing member includes an accommodation portion for selectively accommodating an IC card. When the ejection mechanism ejects the IC card from the accommodation portion, an end of at least one of the plurality of braking pieces contacts a movable part of the ejection mechanism. After contacting the movable part of the ejection mechanism, the end of the at least one braking piece retreats. Thus, the braking piece decelerates the ejection speed of the IC card and avoids the undesirable jumping-out of the IC card. Embodiments consistent with the invention may also include an improper insertion piece provided in the housing member.

Abstract: A card connector of the present invention includes a connector body, a cover member in combination with the connector body, contact terminals arranged in the connector body, and a card-ejection preventing mechanism provided in a card-inserting opening of the connector body, wherein the card-ejection preventing mechanism has a card-stopper cap adapted to be slidable along the card-inserting opening of the connector body, so that the ejection of a card due to the vibration or the shock is prevented and a contact portion is always brought into contact with a card pad section.

Abstract: A sacrificial layer is formed in a recess of a substrate, and leads extending from the substrate into an area of the sacrificial layer are formed. A cut is formed from the bottom surface of the substrate, the cut extending from the bottom surface to the area of the sacrificial layer via the substrate, then the sacrificial layer is removed. A probe unit can be obtained having the leads whose front portions extend beyond the edge of the substrate. A through conductor may be formed in a through hole formed in a substrate. Leads may be formed on a photosensitive etching glass substrate to thereafter selectively etch the chemically cutting type glass.

Abstract: A card connector device comprising: a case 11 having a card slit port 19 capable of inserting hereinto a functional card having a terminal, and accommodating an internal connector 15 for card holding the functional card to be inserted and comprising a terminal 15b to be connected electrically with the terminal of the functional card; an external connector 17 provided protrusively on the case apart from the card slit port 19 and connected electrically with the internal connector for card; and a card stopper 20 located as being capable of sliding between the card slit port 19 of the case and the external connector, and comprising a first end 20b at the card slit port side and a second end 20c capable of protruding toward the external connector side; wherein the first end 20b clutches the functional card 14 when the card stopper 20 moves to the card slit port 19 side to suppress the functional card being pulled out of the card slit port, and the second end 20c protrudes in the protrusively provided direction of

Abstract: A multi-bandpass filter comprising a thin film superimposed layer portion 3 by mirror layers, cavity layers, etc., provided on a substrate 2 with two kinds of dielectrics having different refractive indices, the optical film thickness thereof being a quarter of a reference wavelength as one unit, so as to form a plurality of Fabry-Perrot interferometer structures, wherein the thin film superimposed layer portion 3 has a structure having relationship for superimposition i.e. [M0C1M1 . . . CiMi(T)]k or [M0C1M1 . . . CiMi]k (where i and k are an integer not less than 2, films of the dielectrics being represented by X and Y, the mirror layer being represented by M, the cavity layer being represented by C, and the matching layer being represented by T, and M is a single layer, the optical film thickness of films thereof being odd times of a quarter of the reference wavelength, or an alternating layer represented by [(2p+1)X, (2q+1)Y, . . . ] different dielectrics X, Y (where p, q, . . .

Abstract: A card connector of the present invention includes: a housing; a card insertion opening formed by opening at least one end of the housing; and a plurality of contacts arranged in the housing; wherein switching mechanism constructed of at least actuator members and a shutter member is provided in the housing. This construction allows a plurality of kinds of cards of different sizes in thickness and width to be used on one and the same card connector without requiring the cards to have any additional member, by performing a switching operation on such members as shutter, actuators and latch arms. This construction can make a distinction between appropriate and inappropriate cards for use on the card connector by permitting the insertion of appropriate cards and blocking the insertion of inappropriate cards.

Abstract: A guide member is supported to be movable relative to an accommodation portion of a contact-moving member An engagement pin is engaged with a post portion so that the maximum displacement of the guide member is limited within the maximum displacement of a semiconductor element. The inner circumference of the accommodation portion of the contact-moving member is brought into contact with the outer circumference of the guide member so that the maximum displacement A of the contact-moving member is limited. Thus, a gap CL (=A?B) is defined between the inner circumference of the contact-moving member and an end surface of the guide member opposed thereto.