Abstract: A programming method for a three-dimensional ferroelectric memory device is disclosed. The programming method includes applying a first voltage on a selected word line of a target memory cell. The target memory cell has a first logic state and a second logic state corresponding to a first threshold voltage and a second threshold voltage, respectively. The first and second threshold voltages are determined by two opposite electric polarization directions of a ferroelectric film in the target memory cell. The programming method also includes applying a second voltage on a selected bit line, where a voltage difference between the first and second voltages has a magnitude larger than a coercive voltage of the ferroelectric film such that the target memory cell is switched from the first logic state to the second logic state.

Abstract: Aspects of the disclosure provide a semiconductor device including a string of transistors stacked in a vertical direction over a substrate of the semiconductor device having a channel structure extending in the vertical direction. The string of transistors includes a first substring arranged along a first portion of the channel structure, a second substring arranged along a second portion of the channel structure, and a third substring arranged along a third portion of the channel structure. The second substring is between the first and the third substrings. Gate structures of transistors in the first substring are separated by first insulating layers. Gate structures of transistors in the second substring are separated by second insulating layers. Gate structures of transistors in the third substring are separated by third insulating layers. A volumetric mass density of the second insulating layers is lower than a volumetric mass density of the third insulating layers.

Abstract: The present invention relates to a semiconductor structure and a manufacturing method thereof. The semiconductor structure includes a first substrate, and a bonding layer located on a surface of the first substrate. The material of the first bonding layer is a dielectric material containing element carbon (C). C atomic concentration of a surface layer of the first bonding layer away from the first substrate is higher than or equal to 35%. The first bonding layer of the semiconductor structure may be used to enhance bonding strength during bonding.

Abstract: Embodiments of 3D memory devices and methods for forming the same are disclosed. In an example, a 3D memory device includes a P-type doped region of a substrate, an N-type doped semiconductor layer on the P-type doped region, a memory stack including interleaved conductive layers and dielectric layers on the N-type doped semiconductor layer, a channel structure extending vertically through the memory stack and the N-type doped semiconductor layer into the P-type doped region, an N-type doped semiconductor plug extending vertically into the P-type doped region, and a source contact structure extending vertically through the memory stack to be in contact with the N-type doped semiconductor plug.

Abstract: In a method for fabricating an integrated circuit (IC) package, one or more IC chips are stacked on a package substrate. A marking plate is formed on the one or more IC chips with a first major surface facing the one or more IC chips. A plastic structure is formed to encapsulate the one or more IC chips and the marking plate such that a second major surface of the marking plate is a portion of an outer surface of the IC package.

Abstract: In a method for fabricating a semiconductor device, an initial stack of sacrificial word line layers and insulating layers is formed over a substrate of the semiconductor device. The sacrificial word line layers and the insulating layers are disposed over the substrate alternately. A first staircase is formed in a first staircase region of a connection region of the initial stack. A second staircase is formed in a second staircase region of the connection region of the initial stack. The connection region of the initial stack includes a separation region between the first and second staircases, and the connection region is positioned between array regions of the initial stack at opposing sides of the initial stack.

Abstract: High voltage semiconductor device is disclosed. The high voltage semiconductor device includes a semiconductor substrate, a gate structure on the semiconductor substrate, at least one first isolation structure, and at least on first drift region. The first isolation structure and the first drift region are disposed in the semiconductor substrate at a side of the gate structure. The first isolation structure vertically penetrates through the first drift region.

Abstract: The present disclosure provides a method for manufacturing a high voltage semiconductor device which includes providing a semiconductor substrate; forming at least one first isolation structure and at least one second isolation structure in the semiconductor substrate; forming a gate structure on the semiconductor substrate and at a side of the at least one first isolation structure; and forming at least one first drift region in the semiconductor substrate at a side of the gate structure, in which a bottom of the at least one first isolation structure and a bottom of the at least one second isolation structure are deeper than a bottom of the first drift region.

Abstract: A method of forming a structure of 3D NAND memory device, including steps of forming a first stack layer on a substrate, forming a first channel hole extending through the first stack layer, forming a block layer on a surface of the first stack layer and the first channel hole, forming a sacrificial layer in the first channel hole, forming a second stack layer on the first stack layer and the sacrificial layer, performing a first etch process to form a second channel hole extending through the second stack layer and at least partially overlapping the first channel hole and to remove the sacrificial layer in the first channel hole, removing the block layer exposed from the second channel hole, and forming a function layer on a surface of the first channel hole and the second channel hole.

Abstract: A memory device includes a top select cell, a top dummy cell and a string of memory cells. The top select cell has a first terminal coupled to a bit line and a control terminal coupled to a top select line. The top dummy cell has a control terminal coupled to a top dummy word line. The string of memory cells has control terminals coupled to respective word lines. A method operating the memory device includes prior to a program operation, applying a pre-pulse voltage to the top dummy word line, the top select line and the bit line while applying a low voltage to the word lines, and then sequentially applying the low voltage to the top dummy word line, the top select line and the bit line while applying the low voltage to the word lines.

Abstract: Methods and structures of a three-dimensional memory device are disclosed. In an example, the method comprises: providing a substrate; forming an alternating stack over the substrate, the alternating stack comprising a plurality of tiers of sacrificial layer/insulating layer pairs extending along a first direction substantially parallel to a top surface of the substrate; forming a plurality of tiers of word lines extending along the first direction based on the alternating stack; forming at least one connection portion conductively connecting two or more of the word lines of the plurality of tiers of word lines; and forming at least one metal contact via conductively shared by connected word lines, the at least one metal contact via being connected to at least one metal interconnect.

Abstract: A magnetic memory device includes a core element, a free layer surrounding the core element, a barrier layer surrounding the free layer, and a reference layer surrounding the barrier layer. Two ends of the core element are electrically coupled to a first electrode and a second electrode, respectively. A direction of magnetization of the free layer is switchable between a first direction and a second direction under an influence of an electrical current flowing along the core element. The barrier layer includes an electrically insulating material. The reference layer is electrically coupled to a third electrode. A direction of magnetization of the reference layer remains along the first direction or the second direction.

Abstract: Staircase structures for a three-dimensional (3D) memory device are disclosed. In some embodiments, the method includes disposing an alternating dielectric stack on a substrate with first and second dielectric layers alternatingly stacked on top of each other. Next, multiple division blocks can be formed in a staircase region. Each division block includes a first plurality of staircase steps in the first direction. Each staircase step in the first direction has two or more dielectric layer pairs. Then, a second plurality of staircase steps along a second direction, perpendicular to the first direction, can be formed. Each staircase step in the second direction includes the first plurality of staircase steps along the first direction. The method further includes forming an offset number of dielectric layer pairs between the multiple division blocks such that each dielectric layer pair is accessible from a top surface of a staircase step.

Abstract: Embodiments of three-dimensional (3D) memory devices with a 3D NAND memory array having a plurality of pages and an on-die data buffer coupled to the memory array on a same chip and configured to buffer a plurality of batches of program data between a host and the memory array. The on-die data buffer may include SRAM cells. The 3D memory device also includes a controller coupled to the on-die data buffer on the same chip. The controller may be configured to receive control instructions for performing a first pass program and a second pass program on memory cells in a page. The controller may also be configured to buffer, in the on-die data buffer, first program data for a first pass program and second program data for a second pass program from a host and retrieve the first program data from the on-die data buffer.

Abstract: Aspects of the disclosure provide methods of manufacturing a semiconductor device. In a method, a stack of alternating gate layers and insulating layers is formed over a first region and a second region of a substrate of the semiconductor device. The stack of alternating gate layers and insulating layers is of a stair-step form over the second region of the substrate. A channel structure is formed over the first region and dummy channel structures are formed over the second region. The dummy channel structures includes a first dummy channel structure disposed through a first stair region of the stair-step form, a second dummy channel structure disposed through a second stair region of the stair-step form adjacent to the first stair region, and a third dummy channel structure disposed at a boundary between the first stair region and the second stair region.

Abstract: A method for taping a wafer is disclosed. A wafer taping device comprising a wafer stage is provided. A wafer is mounted and secured on the wafer stage. A tape is delivered along a first direction over the wafer. The tape is forced into adhesion with a surface of the wafer in a non-contact manner. The tape is cut along a perimeter of the wafer.

Abstract: Aspects of the disclosure provide a method for fabricating semiconductor device. The method includes characterizing an etch process that is used to etch channel holes and dummy channel holes in a stack of alternating sacrificial gate layers and insulating layers upon a substrate of a semiconductor device. The channel holes are in a core region and the dummy channel holes are in a staircase region. The stack of alternating sacrificial gate layers and insulating layers extend from the core region into in the staircase region of a stair-step form. The method further includes determining a first shape for defining the dummy channel holes in a layout based on the characterization of the etch process. The first shape is different from a second shape for defining the channel holes.

Abstract: A fabricating method of a semiconductor device is provided. A temporary semiconductor structure is provided. The temporary semiconductor structure includes a temporary substrate and a conductive layer, the temporary substrate has a first surface, the conductive layer is disposed on the first surface of the temporary substrate, and the conductive layer includes one or more first trace. Then, a recess is formed in the temporary semiconductor structure to form a first semiconductor structure and a first substrate. The recess penetrates through the first substrate and expose the one or more first trace. Thereafter, an input/output pad is formed in the recess and on the one or more first trace.

Abstract: A memory includes a first portion, a second portion and a controller. The first portion includes a first word line to a kth word line. The second portion is formed above the first portion and includes a (k+1)th word line to an mth word line. When an xth word line is used to perform a program operation, the controller is used to apply a first voltage to the first word line to an (x?2)th word line, a second voltage to an (x?1)th word line, and a third voltage to an (x+1)th word line. x, k and m are positive integers.

Abstract: Embodiments of three-dimensional (3D) memory devices and methods for forming the 3D memory devices are disclosed. In an example, a NAND memory device includes a substrate, one or more peripheral devices on the substrate, a plurality of NAND strings above the peripheral devices, a single crystalline silicon layer above and in contact with the NAND strings, and interconnect layers formed between the peripheral devices and the NAND strings. In some embodiments, the NAND memory device includes a bonding interface at which an array interconnect layer contacts a peripheral interconnect layer.