Patents Assigned to Yield Engineering Systems, Inc.
  • Method and apparatus for heating semiconductor wafers
    Patent number: 4597736
    Abstract: A method and apparatus for heating semiconductor wafers characterized by the release of preheated nitrogen into an oven to considerably reduce heating time for the wafers. The oven is evacuated prior to the release of the preheated nitrogen.
    Type: Grant
    Filed: May 3, 1985
    Date of Patent: July 1, 1986
    Assignee: Yield Engineering Systems, Inc.
    Inventor: William Moffat