Abstract: A wafer processing method of the present invention includes mounting a wafer part on a chuck table, loading the wafer part on the chuck table, spraying, by a spray arm module, a first processing solution onto the wafer part to process the wafer part, spraying, by the spray arm module, a second processing solution onto the wafer part to process the wafer part, drying the wafer part on the chuck table, and unloading the wafer part from the chuck table.

Abstract: The disclosed wafer processing apparatus includes a vacuum chuck unit configured to adsorb and support a wafer assembly including a wafer; a rotary chuck unit configured to rotate the vacuum chuck unit; a rotating shaft connected to the rotary chuck unit to rotate the rotary chuck unit; a ring cover unit configured to press the wafer assembly such that a processing solution sprayed onto the wafer is not diffused into the vacuum chuck unit; a sealing ring installed in the vacuum chuck unit and configured to support the wafer assembly; and a medium supply unit configured to supply an inspection medium to the vacuum chuck unit such that the inspection medium for identifying damage to the sealing ring flows into the sealing ring.

Abstract: A wafer processing apparatus includes a rotating chuck rotatably installed on a driver, a vacuum chuck which is disposed on the rotating chuck and on which a wafer is seated, a chuck module installed in the rotating chuck to fix the wafer to the vacuum chuck, and a moving module configured to move the vacuum chuck or the chuck module to increase a gap between adjacent dies of the wafer.

Abstract: A wafer processing apparatus includes a rotating chuck rotatably installed on a driver, a vacuum chuck which is disposed on the rotating chuck and on which a wafer is seated, a chuck module installed in the rotating chuck to fix the wafer to the vacuum chuck, and a moving module configured to move the vacuum chuck or the chuck module to increase a gap between adjacent dies of the wafer.

Abstract: A wafer cleaning apparatus according to the present disclosure includes a rotary table that supports and rotates a wafer so that the wafer rotates about a rotational axis, and an ultrasonic vibration device that vibrates a liquid film so that vibration having an ultrasonic frequency is generated in the liquid film formed on an upper surface of the wafer.

Abstract: A wafer processing apparatus includes a rotating chuck which is rotatably installed inside a cup housing and on which a substrate is mounted, a nozzle table rotatably installed inside the rotating chuck, a guide installed inside the nozzle table, a moving module movably installed on the guide, a guide arm configured to support a fluid supply line part, a lower nozzle part coupled to the guide arm to move together with the moving module and connected to the fluid supply line part, a driving shaft part connected to the rotating chuck and the nozzle table to rotate the rotating chuck and the nozzle table, a moving shaft rotatably installed inside the driving shaft part and connected to the moving module to move the moving module, and a driver connected to the driving shaft part and the moving shaft.

Abstract: A fluid discharging nozzle cleaning apparatus includes: a cup in which an inner space, an upper opening which is open to allow a fluid discharging nozzle to enter the inner space, and a lower opening through which a cleaning liquid is discharged from the inner space to an outside are formed; a cleaning liquid discharger configured to discharge the cleaning liquid to the fluid discharging nozzle in a state in which the fluid discharging nozzle is positioned in the inner space of the cup; and a drying gas discharger configured to discharge a drying gas for drying the fluid discharging nozzle after the discharge of the cleaning liquid ends.

Abstract: A fluid medium monitoring apparatus of the present invention comprises: a light source unit for irradiating light; a first collimator unit for collimating light irradiated from the light source unit; a flow cell unit in which a fluid medium flows and light is allowed to absorb the wavelength of the fluid medium while proceeding along the moving direction of the fluid medium; and a light detection unit for detecting the wavelength of the light passing through the flow cell unit.

Abstract: A fluid spray device for processing a substrate according to the present invention includes a spray nozzle configured to spray a processing fluid toward a substrate supported on a table, and a scattering prevention cover configured to block contaminants from being scattered by the sprayed processing fluid hitting the substrate.

Abstract: A wafer processing method of the present invention includes mounting a wafer part on a chuck table, loading a ring cover unit on the chuck table to restrain the wafer part to the chuck table, spraying, by a spray suction arm module, a processing solution onto the wafer part and suctioning, by the spray suction arm module, foreign materials from the processing solution, unloading the ring cover unit from the chuck table, and spraying, by a spray arm module, a cleaning solution onto the wafer part to clean the wafer part.

Abstract: A wafer processing method of the present invention includes mounting a wafer part on a chuck table, loading the wafer part on the chuck table, spraying, by a spray arm module, a first processing solution onto the wafer part to process the wafer part, spraying, by the spray arm module, a second processing solution onto the wafer part to process the wafer part, drying the wafer part on the chuck table, and unloading the wafer part from the chuck table.

Abstract: The present invention relates to an etching apparatus including an etching chamber in which a target object is etched by an etchant, an etchant supply part which collects the etchant in the etching chamber and supplies the etchant to the etching chamber using an etchant pump, a first pressure adjusting unit which injects a gas into the etchant pump to apply an operation pressure, a second pressure adjusting unit which pressurizes the etching chamber and the etchant supply part at the same predetermined pressure, a back pressure adjusting unit which adjusts a pressure of the gas discharged when the etchant pump operates, and a valve which controls an order and a direction in which the gas is injected into or discharged from the etchant pump.

Abstract: The present invention relates to an etching apparatus including an etching chamber in which a target object is etched by an etchant, an etchant supply part which collects the etchant in the etching chamber and supplies the etchant to the etching chamber using an etchant pump, a gas circulation pipe connected from a predetermined point of an upper portion of the etchant supply part to a predetermined point of an upper portion of the etching chamber and formed to circulate a gas, and an air pump formed at one side of the gas circulation pipe and configured to forcibly circulate the gas.

Abstract: A flow cell device of the present invention comprises a flow path part in which a flow medium flows, and a flow cell part in which a flow path is formed.

Abstract: A wafer cleaning apparatus of the present invention includes a vacuum chuck unit on which a wafer is mounted, a ring cover unit facing a retainer ring portion of the wafer, an expander module installed to move the ring cover unit and configured to press the retainer ring portion toward the vacuum chuck unit such that a gap between dies of the wafer widens, and a chucking module installed in the vacuum chuck unit to restrain the ring cover unit pressed by the expander module to the vacuum chuck unit.

Abstract: A wafer processing apparatus of the present invention includes a first chamber unit in which a first wafer part including a retainer ring portion and a plurality of sawn first dies is processed, a second chamber unit in which a second wafer part including a wafer part or a carrier substrate is processed, and a third chamber unit in which the first dies of the first wafer part processed in the first chamber unit and the second wafer part processed in the second chamber unit are stacked and pre-bonded.

Abstract: A wafer processing apparatus of the present invention includes a suction nozzle configured to suction sludge from a cup housing, a flow line connected to the suction nozzle such that the sludge and a chemical solution flow therein, a suction tank connected to the flow line such that the sludge and the chemical solution flow thereto, and an ejector installed on a flow line to generate suction pressure in the suction nozzle and the flow line.

Abstract: A wafer cleaning apparatus of the present invention includes a vacuum chuck unit on which a wafer is mounted, and an ultrasonic cleaning module configured to spray a cleaning solution onto the wafer and apply ultrasonic waves to the cleaning solution to ultrasonically vibrate the cleaning solution.

Abstract: The disclosed wafer processing apparatus includes a vacuum chuck unit configured to adsorb and support a wafer assembly including a wafer; a rotary chuck unit configured to rotate the vacuum chuck unit; a rotating shaft connected to the rotary chuck unit to rotate the rotary chuck unit; a ring cover unit configured to press the wafer assembly such that a processing solution sprayed onto the wafer is not diffused into the vacuum chuck unit; a sealing ring installed in the vacuum chuck unit and configured to support the wafer assembly; and a medium supply unit configured to supply an inspection medium to the vacuum chuck unit such that the inspection medium for identifying damage to the sealing ring flows into the sealing ring.

Abstract: The present invention relates to an etching device and an etching method thereof, the etching device comprising: an etchant supply unit for supplying an etchant to an etching chamber; a rinsing liquid supply unit for supplying a rinsing liquid to the etching chamber; a cleaning liquid supply unit for supplying a cleaning liquid to the etching chamber; and a first pressurization maintaining unit for maintaining at least one of the etching chamber and the etchant supply unit in a pressurized atmosphere.