Abstract: An actuator module is provided. The actuator module includes a motor part including a drive shaft and a drive part configured to rotate the drive shaft, a reducer installed on one side of the drive part and configured to increase an output torque according to driving of the motor part, a brake installed on an opposite side of the drive part and configured to suppress rotation of the motor part, an encoder installed on one side of the brake and configured to sense an operation of the drive shaft, a controller installed on one side of the encoder and electrically connected to the motor part to control the motor part, and a first housing configured to surround the motor part, the reducer, the brake, the encoder and the controller. An airflow path through which an airflow can flow is formed to extend from the motor part.

Abstract: The present invention relates to an etching device using an etching chamber, comprising: an etchant storage chamber in which an etchant is stored; a connection unit communicating with the etching liquid storage chamber; an etching chamber which is connected with the etching liquid storage chamber through the connection unit, and in which an object is etched; and a pressurization maintaining unit for maintaining the etching liquid storage chamber and/or the etching chamber in a pressurized atmosphere.

Abstract: The present invention relates to an etching device comprising: an etching chamber; an opening/closing unit for opening/closing the etching chamber; and a locking unit for selectively locking the opening/closing unit.

Abstract: A wafer processing apparatus includes a vacuum chuck on which a wafer is seated, a ring cover disposed along a circumferential portion of the vacuum chuck to press the wafer to seal the circumferential portion of the vacuum chuck, and a sealing ring pressed against an adhesive sheet on the wafer and pressed by the ring cover.

Abstract: A wafer processing apparatus includes a rotating chuck rotatably installed on a driver, a vacuum chuck which is disposed on the rotating chuck and on which a wafer is seated, a ring cover disposed along a circumferential portion of the vacuum chuck to press the wafer to seal the circumferential portion of the vacuum chuck, and a chuck module installed in the rotating chuck to fix the ring cover to the rotating chuck.

Abstract: A wafer processing apparatus includes a rotating chuck rotatably installed on a driver, a vacuum chuck which is disposed on the rotating chuck and on which a wafer is seated, a chuck module installed in the rotating chuck to fix the wafer to the vacuum chuck, and a moving module configured to move the vacuum chuck or the chuck module to increase a gap between adjacent dies of the wafer.

Abstract: A wafer processing apparatus includes a vacuum chuck on which a wafer is seated, a ring cover installed on a circumferential portion of the vacuum chuck, a medium supply part connected to the vacuum chuck to supply an inspection medium to the vacuum chuck, and a sealing ring which is installed in the vacuum chuck to support the wafer and into which the inspection medium supplied to the vacuum chuck is introduced.

Abstract: A fluid medium monitoring apparatus of the present invention comprises: a light source unit for irradiating light; a first collimator unit for collimating light irradiated from the light source unit; a flow cell unit in which a fluid medium flows and light is allowed to absorb the wavelength of the fluid medium while proceeding along the moving direction of the fluid medium; and a light detection unit for detecting the wavelength of the light passing through the flow cell unit.

Abstract: A wafer processing apparatus includes a rotating chuck which is rotatably installed inside a cup housing and on which a substrate is mounted, a nozzle table rotatably installed inside the rotating chuck, a guide installed inside the nozzle table, a moving module movably installed on the guide, a guide arm configured to support a fluid supply line part, a lower nozzle part coupled to the guide arm to move together with the moving module and connected to the fluid supply line part, a driving shaft part connected to the rotating chuck and the nozzle table to rotate the rotating chuck and the nozzle table, a moving shaft rotatably installed inside the driving shaft part and connected to the moving module to move the moving module, and a driver connected to the driving shaft part and the moving shaft.

Abstract: A double tube structure flow cell apparatus according to the present disclosure includes: a first flow path formation part connected to a medium inlet part such that a fluid medium is introduced into the medium inlet part and having a first flow path part such that the fluid medium flows in the first flow path part; a second flow path formation part having a second flow path part in communication with the first flow path part and connected to a medium discharge part such that the fluid medium of the second flow path part is discharged through the medium discharge part; and a bubble discharge part connected to the first flow path formation part to discharge air bubbles mixed with the fluid medium of the first flow path part.

Abstract: In one aspect, the present disclosure relates to a quantum dot bead comprising a multifunctional ligand having a first binding material and a second antibody, and an immunochromatographic detection method for a target antigen in a biological sample, comprising forming multiple bonds with a quantum dot having a second binding material. In addition, the present disclosure has the effect of remarkably amplifying the detection intensity and significantly improving the detection sensitivity without a separate washing step, and thus enables the detection and diagnosis of physiological materials in a biological sample even in an actual product, and may be used to provide a product with excellent competitiveness in price.

Abstract: One aspect of the present disclosure relates to an immunochromatographic detection method for a target antigen in a biological sample, comprising the step of joining a linker having a first antibody and a quantum dot bead having a second antibody, with respect to the target antigen. By using the quantum dot beads and the linker, the method can successfully amplify detection strength and significantly increase detection sensitivity through a simple process without causing the loss of antigens participating in the detection when using only quantum dot beads. Furthermore, the present disclosure can significantly amplify detection strength without an additional washing step, thus enabling excellent detection and identification of a physiological substance in a biological sample, even in an actual product, and can be used to provide a product with a competitive price.

Abstract: A wire processing apparatus for a tabbing apparatus is provided. The wire processing apparatus for a tabbing apparatus has: a wire supplying device cutting a wire to a predetermined length; a cell conveying device, on which the wire and a cell are placed, and which conveys the wire and the cell in a conveyance direction; and a wire transferring device receiving the wire from the wire supplying device and transferring the wire to the cell conveying device. The cell is placed on the wire in the state where the wire transferring device grips the wire placed on the cell conveying device.

Abstract: A wire processing apparatus for a tabbing apparatus is provided. The wire processing apparatus for a tabbing apparatus has: a wire supplying device cutting a wire to a predetermined length; a cell conveying device, on which the wire and a cell are placed, and which conveys the wire and the cell in a conveyance direction; and a wire transferring device receiving the wire from the wire supplying device and transferring the wire to the cell conveying device. The cell is placed on the wire in the state where the wire transferring device grips the wire placed on the cell conveying device.

Abstract: A supporter pin and a heat treatment apparatus are provided in which a substrate subject to heat treatment may be supported while preventing itself from damaging the substrate. The supporter pin includes a housing in which a groove is formed; a ball accommodated in the groove and supporting the substrate; and a retainer accommodated in the housing and preventing separation of the ball.

Abstract: Provided is a wire transfer apparatus of a tabbing apparatus. A wire transfer apparatus of a tabbing apparatus according to the present invention includes: a first transfer gripper unit configured to grip a wire; a second transfer gripper unit disposed in parallel to the first transfer gripper unit and configured to grip the wire at a location spaced apart from the first transfer gripper unit together with the first transfer gripper unit; and a gripper transfer unit configured to transfer the wire while moving the first transfer gripper unit and the second transfer gripper unit.

Abstract: Provided is a wire setting apparatus of a tabbing apparatus. A wire setting apparatus of a tabbing apparatus according to the present invention includes: a conveyer; a wire placement platform installed adjacent to the conveyer such that a portion of a wire placed on the conveyor lies on the wire placement platform; and a placement gripper device configured to grip the wire and to place the wire on the wire placement platform.

Abstract: Disclosed are a substrate processing apparatus and a substrate processing method. The substrate processing apparatus includes an emissivity setting unit to which emissivity at a liquid chemical which is brought into contact with a substrate or emissivity at an interface at which the substrate and the liquid chemical are in contact with each other is input, a radiant energy input unit to which radiant energy radiating from the liquid chemical or the interface is input, and a calculation unit that calculates a calculation temperature of the liquid chemical or the interface based on the emissivity and the radiant energy.

Abstract: Disclosed are a substrate processing apparatus and a substrate processing method. The substrate processing apparatus includes an emissivity setting unit to which emissivity at a liquid chemical which is brought into contact with a substrate or emissivity at an interface at which the substrate and the liquid chemical are in contact with each other is input, a radiant energy input unit to which radiant energy radiating from the liquid chemical or the interface is input, and a calculation unit that calculates a calculation temperature of the liquid chemical or the interface based on the emissivity and the radiant energy.

Abstract: The present invention relates to a substrate liquid processing apparatus which etches and cleans a substrate for a semiconductor. The substrate liquid processing apparatus comprises: a substrate supporting unit for supporting a substrate to be spaced apart from an upper portion of a table so that a surface to be processed faces a lower side; a rotational driving unit for driving a rotation axis which rotates the table; and a processing liquid supplying unit for supplying, in a processing space between the table and the substrate, processing liquid that is in a mist state in which a gas is mixed or processing liquid that is in a steam state. According to the substrate liquid processing apparatus, it is possible to uniformize an atmosphere of the processing space between the substrate and the table, and to uniformly spray the processing liquid on the surface to be processed.