Intel Patents

Intel Corporation designs and manufactures microprocessors and chipsets for computing and communications equipment manufacturers. Its products may be found in desktops, servers, tablets, smartphones and other devices.

Intel Patents by Type
  • Intel Patents Granted: Intel patents that have been granted by the United States Patent and Trademark Office (USPTO).
  • Intel Patent Applications: Intel patent applications that are pending before the United States Patent and Trademark Office (USPTO).
  • Publication number: 20230018585
    Abstract: A processor is to execute a first instruction to perform a simulated return in a program from a callee function to a caller function based on a first input stack pointer encoded with a first security context of a first callee stack frame. To perform the simulated return is to include generating a first simulated stack pointer to the caller stack frame. The processor is further to, in response to identifying an exception handler in the first caller function, execute a second instruction to perform a simulated call based on a second input stack pointer encoded with a second security context of the caller stack frame. To perform the simulated call is to include generating a second simulated stack pointer to a new stack frame containing an encrypted instruction pointer associated with the exception handler. The second simulated stack pointer is to be encoded with a new security context.
    Type: Application
    Filed: September 16, 2022
    Publication date: January 19, 2023
    Applicant: Intel Corporation
    Inventors: Hans G. Liljestrand, Sergej Deutsch, David M. Durham, Michael LeMay, Karanvir S. Grewal
  • Publication number: 20230020484
    Abstract: Particular embodiments described herein provide for a modular vapor chamber and the connection of segments of the modular vapor chamber for an electronic device. In an example, the electronic device can include one or more heat sources and a modular vapor chamber over the one or more heat sources. The modular vapor chamber includes at least two vapor chamber segments and a vapor chamber coupling to couple the at least two vapor chamber segments.
    Type: Application
    Filed: September 28, 2022
    Publication date: January 19, 2023
    Applicant: Intel Corporation
    Inventors: Feroze Khan, Arnab Sen, Jeff Ku, Samarth Alva
  • Publication number: 20230014680
    Abstract: Particular embodiments described herein provide for a privacy cover in an electronic device. The electronic device includes a camera facing a first direction towards a user, an illumination source facing a second direction, opposite the first direction, and the privacy slider. The privacy slider includes a camera cover, an illumination source reflector, and an indicator that is illuminated by the illumination source when the camera is covered by the camera cover, where the indicator is located in a plane that is perpendicular to a plane that includes the camera.
    Type: Application
    Filed: September 28, 2022
    Publication date: January 19, 2023
    Applicant: Intel Corporation
    Inventors: Mark E. Sprenger, Aleksander Magi
  • Publication number: 20230018149
    Abstract: Systems and methods for code generation for a plurality of architectures. At a host architecture, a JIT compile operation is performed for a received JavaScript or Web Assembly file. The JIT compiler references a host library that has been updated to include at least one new JIT instruction. Output from the JIT compile operation is compiled machine code for the host architecture that has new opcodes (OPX) added, responsive to the new JIT instruction. The JIT compiler executes the opcodes (OPX) in XuCode mode, meaning that the host architecture switches into a hardware protected private ISA (Instruction Set Architecture) called XuCode to implement the new JIT opcode instruction in XuCode.
    Type: Application
    Filed: September 22, 2022
    Publication date: January 19, 2023
    Applicant: Intel Corporation
    Inventors: Mingqiu Sun, Rajesh Poornachandran, Vincent Zimmer, Gopinatth Selvaraje
  • Publication number: 20230018793
    Abstract: A processing integrated circuit includes a processing core comprising hard logic circuits and a programmable interface circuit configurable to exchange signals between an external terminal of the processing integrated circuit and the hard logic circuits in the processing core.
    Type: Application
    Filed: September 22, 2022
    Publication date: January 19, 2023
    Applicant: Intel Corporation
    Inventors: Md Altaf Hossain, Mahesh Kumashikar, Ankireddy Nalamalpu, Sreedhar Ravipalli
  • Publication number: 20230013023
    Abstract: In one embodiment, an apparatus includes a processor comprising an address translation cache (ATC); a shared work queue (SWQ) associated with the ATC, and a port to couple to a host processor over a Peripheral Component Interconnect Express (PCIe)-based link. The apparatus also includes circuitry to receive address translation information from a memory management unit of the host processor that includes virtual memory address to physical memory address translations, store the address translation information in the ATC, receive an invalidation command from the host processor indicating an invalidation of address translation information stored in the ATC, modify the address translation information in the ATC based on the invalidation command, and store completion data in a memory location indicated by the invalidation command.
    Type: Application
    Filed: September 22, 2022
    Publication date: January 19, 2023
    Applicant: Intel Corporation
    Inventors: Rupin H. Vakharwala, Philip R. Lantz
  • Publication number: 20230013235
    Abstract: A system management mode (SMM) runtime resiliency manager (SRM) augments computing resource protection policies provided by an SMM policy shim The SMM shim protects system resources by deprivileging system management interrupt (SMI) handlers to a lower level of privilege (e.g., ring 3 privilege) and by configuring page tables and register bitmaps (e.g., I/O, MSR, and Save State register bitmaps). SRM capabilities include protecting the SMM shim, updating the SMM shim, protecting a computing system during SMM shim update, detecting SMM attacks, and recovering attacked or faulty SMM components.
    Type: Application
    Filed: March 24, 2022
    Publication date: January 19, 2023
    Applicant: Intel Corporation
    Inventors: Jiewen Yao, Vincent Zimmer
  • Publication number: 20230017447
    Abstract: A mechanism is described for facilitating unified accelerator for classical and post-quantum digital signature schemes in computing environments, according to one embodiment. A method of embodiments, as described herein, includes unifying classical cryptography and post-quantum cryptography through a unified hardware accelerator hosted by a trusted platform of the computing device. The method may further include facilitating unification of a first finite state machine associated with the classical cryptography and a second finite state machine associated with the post-quantum cryptography though one or more of a single the hash engine, a set of register file banks, and a modular exponentiation engine.
    Type: Application
    Filed: September 23, 2022
    Publication date: January 19, 2023
    Applicant: Intel Corporation
    Inventors: SANU MATHEW, MANOJ SASTRY, SANTOSH GHOSH, VIKRAM SURESH, ANDREW H. REINDERS, RAGHAVAN KUMAR, RAFAEL MISOCZKI
  • Publication number: 20230018902
    Abstract: Microelectronic assemblies, and related devices and methods, are disclosed herein. For example, in some embodiments, a microelectronic assembly may include a package substrate, a first die coupled to the package substrate with first interconnects, and a second die coupled to the first die with second interconnects, wherein the second die is coupled to the package substrate with third interconnects, a communication network is at least partially included in the first die and at least partially included in the second die, and the communication network includes a communication pathway between the first die and the second die.
    Type: Application
    Filed: September 29, 2022
    Publication date: January 19, 2023
    Applicant: Intel Corporation
    Inventors: Adel A. Elsherbini, Amr Elshazly, Arun Chandrasekhar, Shawna M. Liff, Johanna M. Swan
  • Publication number: 20230017304
    Abstract: A mechanism is described for facilitating smart distribution of resources for deep learning autonomous machines. A method of embodiments, as described herein, includes detecting one or more sets of data from one or more sources over one or more networks, and introducing a library to a neural network application to determine optimal point at which to apply frequency scaling without degrading performance of the neural network application at a computing device.
    Type: Application
    Filed: July 27, 2022
    Publication date: January 19, 2023
    Applicant: Intel Corporation
    Inventors: Rajkishore Barik, Brian T. Lewis, Murali Sundaresan, Jeffrey Jackson, Feng Chen, Xiaoming Chen, Mike Macpherson
  • Publication number: 20230013499
    Abstract: A computing apparatus, including: a hardware platform; and an interworking broker function (IBF) hosted on the hardware platform, the IBF including a translation driver (TD) associated with a legacy network appliance lacking native interoperability with an orchestrator, the IBF configured to: receive from the orchestrator a network function provisioning or configuration command for the legacy network appliance; operate the TD to translate the command to a format consumable by the legacy network appliance; and forward the command to the legacy network appliance.
    Type: Application
    Filed: September 15, 2022
    Publication date: January 19, 2023
    Applicant: Intel Corporation
    Inventors: John J. Browne, Timothy Verrall, Maryam Tahhan, Michael J. McGrath, Sean Harte, Kevin Devey, Jonathan Kenny, Christopher MacNamara
  • Publication number: 20230014741
    Abstract: Embodiments described herein are generally directed to improving performance of high-performance computing (HPC) or artificial intelligence (AI) workloads on cluster computer systems. According to one embodiment, a section of a high-performance computing (HPC) or artificial intelligence (AI) workload executing on a cluster computer system is identified as significant to a figure of merit (FOM) of the workload. An alternate placement among multiple heterogeneous compute resources of a node of the cluster computer system is determined for a portion of the section currently executing on a given compute resource of the multiple heterogeneous compute resources. After predicting an improvement to the FOM based on the alternate placement, the portion is relocated to the alternate placement.
    Type: Application
    Filed: September 15, 2022
    Publication date: January 19, 2023
    Applicant: Intel Corporation
    Inventors: Antonio Valles, Rebecca David
  • Publication number: 20230015829
    Abstract: An apparatus of a computing node of a communication network, a system, a machine-readable storage medium, and a method. One or more processing circuitries of the apparatus are to: receive a plurality of service data flows (SDFs) associated with respective applications to be executed, the SDFs including data packets; determine first Quality of Service (QoS) flows corresponding to a plurality of first QoS requirements for the SDFs, wherein SDFs associated with a same application correspond to a same QoS requirement of the plurality of first QoS requirements; change the first QoS flows to second QoS flows different from the first QoS flows, the second QoS flows corresponding to a plurality of second QoS requirements for respective ones of the SDFs, the second QoS flows based on the respective applications and further based on respective ones of the data packets; and send for transmission from the output the plurality of SDFs based on the second QoS flows.
    Type: Application
    Filed: September 14, 2022
    Publication date: January 19, 2023
    Applicant: Intel Corporation
    Inventors: Maruti Gupta Hyde, Yi Zhang
  • Publication number: 20230018828
    Abstract: Techniques and mechanisms for providing a thread scheduling hint to an operating system of a processor which comprises first cores and second cores. In an embodiment, the first cores are of a first type which corresponds to a first range of sizes, and the second cores are of a second type which corresponds to a second range of sizes smaller than the first range of sizes. A power control unit (PCU) of the processor is to detect that an inefficiency, of a first operational mode of the processor, would exist while an indication of an amount of power, to be available to the processor, is below a threshold. Based on the detecting, the PCU hints to an executing software process that a given core is to be included in, or omitted from, a pool of cores available for thread scheduling. The hint indicates the given core based on a relative prioritization of the first core type and the second core type.
    Type: Application
    Filed: July 13, 2021
    Publication date: January 19, 2023
    Applicant: Intel Corporation
    Inventors: Vadim Bassin, Eliezer Weissmann, Efraim Rotem, Julius Mandelblat
  • Publication number: 20230018398
    Abstract: A time-to-digital converter (TDC) that combines the energy efficiency of a successive approximation (SAR) design with the high speed of pipelined converters by leveraging the inherently pipelined nature of time-domain signaling. The TDC achieves high speed by removing a comparator decision from a signal path, instead using AND/OR gates to separate early and late edges. The TDC uses a pipelined SAR architecture to digitize a differential delay between two incoming clock edges with high speed and low power consumption. Described is a modular digital reference voltage generator that can be used for a capacitive digital-to-analog converter (DAC). The generator comprises a decoupling capacitor, one or more clocked comparators, and power transistor(s). A simplified digital low dropout (LDO) circuitry is used to provide fast reference voltage generation with minimal overhead. The LDO circuitry is arrayed using time-interleaved synchronous clocks or staggered asynchronous clocks to provide finer timing resolution.
    Type: Application
    Filed: June 8, 2021
    Publication date: January 19, 2023
    Applicant: Intel Corporation
    Inventors: Amy Whitcombe, Brent Carlton
  • Publication number: 20230016505
    Abstract: Technologies for timestamping data packets with forward error correction is disclosed. Alignment markers may be inserted in a data stream in order to assist with synchronization on the receiving end. After insertion of the alignment markers, a start of frame delimiter or other trigger may be detected, triggering a timestamp corresponding to the start of frame delimiter or other trigger. The data and the timestamp are sent to a remote compute device, which may timestamp the data before removing the alignment markers. With this approach, insertion of the alignment markers does not lead to a deviation in the timestamp of the sending compute device or the receiving compute device.
    Type: Application
    Filed: September 20, 2022
    Publication date: January 19, 2023
    Applicant: Intel Corporation
    Inventors: Yoni Landau, Janardhan Satyanarayana, Assaf Benhamou, Mark Bordogna
  • Patent number: 11557529
    Abstract: A microprocessor heat sink fastener assembly, comprising a base to couple to a heat sink a retention nut to be received by a cavity of the base, and a retention clip to be attached to the base and to be cantilevered therefrom. The retention clip is to engage with a latching structure extending from a latching structure of a retention plate.
    Type: Grant
    Filed: March 30, 2018
    Date of Patent: January 17, 2023
    Assignee: Intel Corporation
    Inventors: Thomas Boyd, Ming-Chen Chang, Evan A. Chenelly, Divya Swamy Bandaru, Craig J. Jahne, Andrew Larson, Eric W. Buddrius, Eric D. McAfee, Mustafa Haswarey, Ralph V. Miele, Rolf Laido
  • Patent number: 11556480
    Abstract: Systems and methods for providing shared virtual memory addressing support for a host system are disclosed. In one embodiment, a graphics processor includes processing resources to perform graphics operations. A memory management unit (MMU) is coupled to the processing resources. The MMU to support a first virtual address size for managing allocation of non-shared virtual memory and to support a second virtual address size for managing allocation of shared virtual memory that is shared between the graphics processor and a host.
    Type: Grant
    Filed: May 3, 2021
    Date of Patent: January 17, 2023
    Assignee: Intel Corporation
    Inventors: Joydeep Ray, Altug Koker, Aditya Navale, Ankur Shah, Murali Ramadoss, Ben Ashbaugh, Ronald Silvas
  • Patent number: 11556437
    Abstract: Examples include a method of live migrating a virtual device by creating a virtual device in a virtual machine, creating first and second interfaces for the virtual device, transferring data over the first interface, detecting a disconnection of the virtual device from the virtual machine, switching data transfers for the virtual device from the first interface to the second interface, detecting a reconnection of the virtual device to the virtual machine, and switching data transfers for the virtual device from the second interface to the first interface.
    Type: Grant
    Filed: December 6, 2018
    Date of Patent: January 17, 2023
    Assignee: Intel Corporation
    Inventors: Mitu Aggarwal, Nrupal Jani, Manasi Deval, Kiran Patil, Parthasarathy Sarangam, Rajesh M. Sankaran, Sanjay K. Kumar, Utkarsh Y. Kakaiya, Philip Lantz, Kun Tian
  • Patent number: 11556436
    Abstract: Examples may include a method of protecting memory and I/O transactions. The method includes allocating memory for an application, assigning a resource of a physical device to the application, assigning a process address space identifier to the assigned resource, creating a security enclave to protect the allocated memory of the application, and associating the security enclave with the process address space identifier to protect the allocated memory and the assigned resource.
    Type: Grant
    Filed: December 6, 2018
    Date of Patent: January 17, 2023
    Assignee: Intel Corporation
    Inventors: Manasi Deval, Nrupal Jani, Parthasarathy Sarangam, Mitu Aggarwal, Kiran Patil, Rajesh M. Sankaran, Sanjay K. Kumar, Utkarsh Y. Kakaiya, Philip Lantz, Kun Tian
  • Patent number: 11557541
    Abstract: Embodiments disclosed herein include electronic packages. In an embodiment, the electronic package comprises, a package substrate, an interposer on the package substrate, a first die cube and a second die cube on the interposer, wherein the interposer includes conductive traces for electrically coupling the first die cube to the second die cube, a die on the package substrate, and an embedded multi-die interconnect bridge (EMIB) in the package substrate, wherein the EMIB electrically couples the interposer to the die.
    Type: Grant
    Filed: December 28, 2018
    Date of Patent: January 17, 2023
    Assignee: Intel Corporation
    Inventors: Md Altaf Hossain, Ankireddy Nalamalpu, Dheeraj Subbareddy, Robert Sankman, Ravindranath V. Mahajan, Debendra Mallik, Ram S. Viswanath, Sandeep B. Sane, Sriram Srinivasan, Rajat Agarwal, Aravind Dasu, Scott Weber, Ravi Gutala
  • Patent number: 11556748
    Abstract: Methods, apparatus, systems and articles of manufacture to improve accuracy of a fog/edge-based classifier system are disclosed.
    Type: Grant
    Filed: September 28, 2018
    Date of Patent: January 17, 2023
    Assignee: Intel Corporation
    Inventors: Keith Ellis, Giovani Estrada, Michael Nolan, Niall Cahill, David Coates
  • Patent number: 11558265
    Abstract: An apparatus to facilitate telemetry targeted query injection for enhanced debugging in microservices architectures is disclosed. The apparatus includes one or more processors to: identify contextual trace of a previous query recorded in collected data of a service, where microservices of the service responded to the previous query; access an interdependency flow graph representing an architecture and interaction of microservices deployed for a service; retrieve, based on the interdependency flow graph, telemetry data of the microservices corresponding to the contextual trace; identify, based on the telemetry data, an activation profile corresponding to the previous query, the activation profile detailing a response of the microservices to the previous query; compare the activation profile to a correlation profile for the previous query to detect whether an anomaly occurred in the service in response to the previous query; and recommend a modified query based on detection of the anomaly.
    Type: Grant
    Filed: December 21, 2021
    Date of Patent: January 17, 2023
    Assignee: INTEL CORPORATION
    Inventors: Rajesh Poornachandran, Marcos Carranza
  • Patent number: 11556352
    Abstract: Examples provided herein provide a manner of monitoring performance characteristics of a central processing unit or other instruction executing hardware device and adjusting settings of the central processing unit or other instruction executing hardware device. Performance characteristics can be gathered and stored in a secure memory or storage device. The performance characteristics can be transmitted to a control center using a provisioned network transceiver that does not rely on an operating system executed by the central processing unit or the hardware platform of the central processing unit. The control center can determine settings that are to be applied by the central processing unit or instruction executing hardware device and transmit the settings for use by the central processing unit or instruction executing hardware device.
    Type: Grant
    Filed: December 17, 2018
    Date of Patent: January 17, 2023
    Assignee: Intel Corporation
    Inventors: Jamel Tayeb, Robert Kwasnick, Johan Van De Groenendaal
  • Patent number: 11558032
    Abstract: A bulk acoustic resonator architecture is fabricated by epitaxially forming a piezoelectric film on a top surface of post formed from an underlying substrate. In some cases, the acoustic resonator is fabricated to filter multiple frequencies. In some such cases, the resonator device includes two different resonator structures on a single substrate, each resonator structure configured to filter a desired frequency. Including two different acoustic resonators in a single RF acoustic resonator device enables that single device to filter two different frequencies in a relatively small footprint.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: January 17, 2023
    Assignee: Intel Corporation
    Inventors: Sansaptak Dasgupta, Bruce A. Block, Paul B. Fischer, Han Wui Then, Marko Radosavljevic
  • Patent number: 11557667
    Abstract: A device including a III-N material is described. The device includes a transistor structure having a first layer including a first group III-nitride (III-N) material, a polarization charge inducing layer above the first layer, the polarization charge inducing layer including a second III-N material, a gate electrode above the polarization charge inducing layer and a source structure and a drain structure on opposite sides of the gate electrode. The device further includes a plurality of peripheral structures adjacent to transistor structure, where each of the peripheral structure includes the first layer, but lacks the polarization charge inducing layer, an insulating layer above the peripheral structure and the transistor structure, wherein the insulating layer includes a first dielectric material. A metallization structure, above the peripheral structure, is coupled to the transistor structure.
    Type: Grant
    Filed: September 30, 2017
    Date of Patent: January 17, 2023
    Assignee: Intel Corporation
    Inventors: Marko Radosavljevic, Sansaptak Dasgupta, Han Wui Then, Ibrahim Ban, Paul B. Fischer
  • Patent number: 11557085
    Abstract: Embodiments are directed to neural network processing for multi-object three-dimensional (3D) modeling. An embodiment of a computer-readable storage medium includes executable computer program instructions for obtaining data from multiple cameras, the data including multiple images, and generating a 3D model for 3D imaging based at least in part on the data from the cameras, wherein generating the 3D model includes one or more of performing processing with a first neural network to determine temporal direction based at least in part on motion of one or more objects identified in an image of the multiple images or performing processing with a second neural network to determine semantic content information for an image of the multiple images.
    Type: Grant
    Filed: December 4, 2020
    Date of Patent: January 17, 2023
    Assignee: Intel Corporation
    Inventors: Jill Boyce, Soethiha Soe, Selvakumar Panneer, Adam Lake, Nilesh Jain, Deepak Vembar, Glen J. Anderson, Varghese George, Carl Marshall, Scott Janus, Saurabh Tangri, Karthik Veeramani, Prasoonkumar Surti
  • Patent number: 11558818
    Abstract: This disclosure describes systems, methods, and devices related to wake-up radio (WUR) advertisement channels. A device may include a wake-up receiver (WURx) and a primary connectivity radio. The device may determine a wake-up radio (WUR) discovery subchannel for WUR advertisement. The WUR discovery subchannel may be associated with a channel of a frequency band. The device may generate a WUR discovery frame comprising a WUR advertisement. The device may transmit, by the WURx, the WUR discovery frame to a second device using the WUR discovery subchannel. The device may identify a response from the second device indicating an acknowledgment of the WUR discovery frame.
    Type: Grant
    Filed: June 30, 2021
    Date of Patent: January 17, 2023
    Assignee: Intel Corporation
    Inventors: Po-Kai Huang, Shahrnaz Azizi, Noam Ginsburg, Daniel F. Bravo, Thomas J. Kenney
  • Patent number: 11558777
    Abstract: Embodiments of a multi-link device (MLD) are generally described herein. The MLD may be configured for multi-link communication on a plurality of links. The MLD may be configured with a plurality of stations (STAs). Each STA may be a logical entity that includes a singly addressable instance of a medium access control (MAC) layer and a physical (PHY) layer of a link of the plurality of links. The MLD may configure traffic identifier (TID) assignment for the MLD for multi-link communication with another MLD. The multi-link communication may be configurable to support one or more data streams, wherein each of the data streams corresponds to a TID. The MLD may determine an assignment of the TIDs to the STAs of the MLD.
    Type: Grant
    Filed: December 27, 2019
    Date of Patent: January 17, 2023
    Assignee: Intel Corporation
    Inventors: Po-Kai Huang, Daniel F. Bravo, Laurent Cariou
  • Patent number: 11557536
    Abstract: Integrated circuit (IC) interconnect lines having improved electromigration resistance. Multi-patterning may be employed to define a first mask pattern. The first mask pattern may be backfilled and further patterned based on a second mask layer through a process-based selective occlusion of openings defined in the second mask layer that are below a threshold minimum lateral width. Portions of material underlying openings defined in the second mask layer that exceed the threshold are removed. First trenches in an underlying dielectric material layer may be etched based on a union of the remainder of the first mask layer and the partially occluded second mask layer. The first trenches may then be backfilled with a first conductive material to form first line segments. Additional trenches in the underlayer may then be etched and backfilled with a second conductive material to form second line segments that are coupled together by the first line segments.
    Type: Grant
    Filed: December 27, 2017
    Date of Patent: January 17, 2023
    Assignee: Intel Corporation
    Inventors: Kevin Lin, Christopher J. Jezewski, Manish Chandhok
  • Patent number: 11558158
    Abstract: A wireless communication device for communicating across a wireless communication channel includes one or more processors configured to determine whether a further device is generating a radio frequency interference at an operating frequency; transmit a request message to the further device requesting the further device vacate the operating frequency based on the determination that the further device is generating radio frequency interference; receive a response message from the further device; and generate an instruction based on the response message.
    Type: Grant
    Filed: November 10, 2020
    Date of Patent: January 17, 2023
    Assignee: Intel Corporation
    Inventors: Michael Shusterman, John Fallin, Ana M. Yepes, Dong-Ho Han, Nasser A. Kurd, Tomer Levy, Ehud Reshef, Arik Gihon, Ido Ouzieli, Yevgeni Sabin, Maor Tal, Zhongsheng Wang, Amit Zeevi
  • Patent number: 11557629
    Abstract: A spin orbit memory device includes a material layer stack on a spin orbit electrode. The material layer stack includes a magnetic tunnel junction (MTJ) and a synthetic antiferromagnetic (SAF) structure on the MTJ. The SAF structure includes a first magnet structure and a second magnet structure separated by an antiferromagnetic coupling layer. The first magnet structure includes a first magnet and a second magnet separated by a single layer of a non-magnetic material such as platinum. The second magnet structure includes a stack of bilayers, where each bilayer includes a layer of platinum on a layer of a magnetic material such.
    Type: Grant
    Filed: March 27, 2019
    Date of Patent: January 17, 2023
    Assignee: Intel Corporation
    Inventors: Kaan Oguz, Christopher Wiegand, Noriyuki Sato, Angeline Smith, Tanay Gosavi
  • Patent number: 11557098
    Abstract: Technologies for time-delayed augmented reality (AR) presentations includes determining a location of a plurality of user AR systems located within the presentation site and determining a time delay of an AR sensory stimulus event of an AR presentation to be presented in the presentation site for each user AR system based on the location of the corresponding user AR system within the presentation site. The AR sensory stimulus event is presented to each user AR system based on the determined time delay associated with the corresponding user AR system. Each user AR system generates the AR sensory stimulus event based on a timing parameter that defines the time delay for the corresponding user AR system such that the generation of the AR sensory stimulus event is time-delayed based on the location of the user AR system within the presentation site.
    Type: Grant
    Filed: October 28, 2020
    Date of Patent: January 17, 2023
    Assignee: INTEL CORPORATION
    Inventors: Pete A. Denman, Glen J. Anderson, Giuseppe Raffa
  • Patent number: 11558816
    Abstract: This disclosure describes systems, methods, and devices related to wake-up frame indication. A device may determine a wake up receiver (WUR) wake-up frame to be sent to a first station device of one or more station devices. The device may determine one or more indications associated with the first station device, wherein the one or more indications indicate to the first station device, one or more actions to be taken by the first station device after waking up a primary connectivity radio (PCR) of the first station device. The device may cause a medium access control (MAC) layer to encode the WUR wake-up frame with the one or more indications associated with the first station device. The device may cause to send the WUR wake-up frame to the first station device using a physical layer (PHY).
    Type: Grant
    Filed: September 25, 2020
    Date of Patent: January 17, 2023
    Assignee: Intel Corporation
    Inventors: Po-Kai Huang, Noam Ginsburg, Daniel Bravo, Robert Stacey
  • Patent number: 11556772
    Abstract: One embodiment provides for a computing device comprising a parallel processor compute unit to perform a set of parallel integer compute operations; a ternarization unit including a weight ternarization circuit and an activation quantization circuit; wherein the weight ternarization circuit is to convert a weight tensor from a floating-point representation to a ternary representation including a ternary weight and a scale factor; wherein the activation quantization circuit is to convert an activation tensor from a floating-point representation to an integer representation; and wherein the parallel processor compute unit includes one or more circuits to perform the set of parallel integer compute operations on the ternary representation of the weight tensor and the integer representation of the activation tensor.
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: January 17, 2023
    Assignee: Intel Corporation
    Inventors: Abhisek Kundu, Naveen Mellempudi, Dheevatsa Mudigere, Dipankar Das
  • Patent number: 11555923
    Abstract: LIDAR systems, and methods of measuring a scene are disclosed. A laser source emits one or more optical beams. A scanning optical system scans the optical beams over a scene and captures reflections from the scene. A measurement subsystem independently measures the reflections from N subpixels within each scene pixel, where N is an integer greater than 1, and combines the measurements of the reflections from the N subpixels to determine range and/or range rate for the pixel.
    Type: Grant
    Filed: August 21, 2018
    Date of Patent: January 17, 2023
    Assignee: Intel Corporation
    Inventors: Naresh Satyan, George Rakuljic
  • Patent number: 11557630
    Abstract: Disclosed herein are quantum dot devices and techniques. In some embodiments, a quantum computing processing device may include a quantum well stack, an array of quantum dot gate electrodes above the quantum well stack, and an associated array of selectors above the array of quantum dot gate electrodes. The array of quantum dot gate electrodes and the array of selectors may each be arranged in a grid.
    Type: Grant
    Filed: September 28, 2017
    Date of Patent: January 17, 2023
    Assignee: Intel Corporation
    Inventors: Ravi Pillarisetty, Nicole K. Thomas, Abhishek A. Sharma, Hubert C. George, Jeanette M. Roberts, Zachary R. Yoscovits, Roman Caudillo, Kanwaljit Singh, James S. Clarke
  • Patent number: 11556730
    Abstract: Methods, apparatus, systems and articles of manufacture for distributed use of a machine learning model are disclosed. An example edge device includes a model partitioner to partition a machine learning model received from an aggregator into private layers and public layers. A public model data store is implemented outside of a trusted execution environment of the edge device. The model partitioner is to store the public layers in the public model data store. A private model data store is implemented within the trusted execution environment. The model partitioner is to store the private layers in the private model data store.
    Type: Grant
    Filed: March 30, 2018
    Date of Patent: January 17, 2023
    Assignee: Intel Corporation
    Inventors: Micah Sheller, Cory Cornelius
  • Patent number: 11558059
    Abstract: Examples relate to a digitally controlled oscillator circuit arrangement, a digitally controlled oscillation means, a method for a digitally controlled oscillator, a digital loop filter circuit arrangement, a digital loop filtering means, a method for a digital loop filter, a phase locked loop circuit arrangement and phase locked loop, a user device and a base station.
    Type: Grant
    Filed: August 27, 2020
    Date of Patent: January 17, 2023
    Assignee: Intel Corporation
    Inventors: Igal Kushnir, Evgeny Shumaker, Aryeh Farber, Gil Horovitz
  • Patent number: 11557676
    Abstract: Techniques and mechanisms to impose stress on a transistor which includes a channel region and a source or drain region each in a fin structure. In an embodiment, a gate structure of the transistor extends over the fin structure, wherein a first spacer portion is at a sidewall of the gate structure and a second spacer portion adjoins the first spacer portion. Either or both of two features are present at or under respective bottom edges of the spacer portions. One of the features includes a line of discontinuity on the fin structure. The other feature includes a concentration of a dopant in the second spacer portion being greater than a concentration of the dopant in the source or drain region. In another embodiment, the fin structure is disposed on a buffer layer, wherein stress on the channel region is imposed at least in part with the buffer layer.
    Type: Grant
    Filed: September 29, 2017
    Date of Patent: January 17, 2023
    Assignee: Intel Corporation
    Inventors: Rishabh Mehandru, Stephen M. Cea, Tahir Ghani, Anand S. Murthy
  • Patent number: 11556677
    Abstract: An apparatus to facilitate scalable runtime validation for on-device design rule checks is disclosed. The apparatus includes a memory to store a contention set, one or more multiplexors, and a validator communicably coupled to the memory. In one implementation, the validator is to: receive design rule information for the one or more multiplexers, the design rule information referencing the contention set; analyze, using the design rule information, a user bitstream against the contention set at a programming time of the apparatus, the user bitstream for programming the one or more multiplexors; and provide an error indication responsive to identifying a match between the user bitstream and the contention set.
    Type: Grant
    Filed: December 23, 2020
    Date of Patent: January 17, 2023
    Assignee: INTEL CORPORATION
    Inventors: Furkan Turan, Patrick Koeberl, Alpa Trivedi, Steffen Schulz, Scott Weber
  • Patent number: 11556327
    Abstract: Systems, apparatuses and methods may provide for technology that assumes, by a root of trust located in a trusted region of a system on chip (SOC), control over a reset of the SOC and conducting, by the root of trust, an authentication of an update package in response to an update condition. The root of trust technology may also apply the update package to firmware located in non-volatile memory (NVM) associated with a microcontroller of the SOC if the authentication is successful.
    Type: Grant
    Filed: August 10, 2020
    Date of Patent: January 17, 2023
    Assignee: Intel Corporation
    Inventors: Karunakara Kotary, Michael Kubacki, Sean Dardis
  • Patent number: 11556157
    Abstract: According to the present disclosure, a laptop may be provided with a smaller z-height using a motherboard assembly, including a motherboard having a plurality of components coupled thereon, a thermal transfer unit coupled to one or more component on the motherboard and attachment members for holding the motherboard in a lower compartment of a laptop clamshell casing at an inclining position.
    Type: Grant
    Filed: November 5, 2020
    Date of Patent: January 17, 2023
    Assignee: INTEL CORPORATION
    Inventors: Min Suet Lim, Chee Chun Yee, Yew San Lim, Jeff Ku, Tin Poay Chuah
  • Patent number: 11557579
    Abstract: Microelectronic assemblies, related devices, and methods are disclosed herein. In some embodiments, a microelectronic assembly may include a die having a first surface and an opposing second surface; a capacitor having a surface, wherein the surface of the capacitor is coupled to the first surface of the die; and a conductive pillar coupled to the first surface of the die. In some embodiments, a microelectronic assembly may include a capacitor in a first dielectric layer; a conductive pillar in the first dielectric layer; a first die having a surface in the first dielectric layer; and a second die having a surface in a second dielectric layer, wherein the second dielectric layer is on the first dielectric layer, and wherein the surface of the second die is coupled to the capacitor, to the surface of the first die, and to the conductive pillar.
    Type: Grant
    Filed: December 21, 2020
    Date of Patent: January 17, 2023
    Assignee: Intel Corporation
    Inventors: Chong Zhang, Cheng Xu, Junnan Zhao, Ying Wang, Meizi Jiao
  • Patent number: 11557552
    Abstract: A voltage-reference plane has gradient regions that provide altered thicknesses that are useful in a power-deliver network for a semiconductor package substrate. Different signal trace types are located over various portions of the gradient regions to facilitate signal integrity.
    Type: Grant
    Filed: March 13, 2020
    Date of Patent: January 17, 2023
    Assignee: Intel Corporation
    Inventors: Chin Lee Kuan, Jackson Chung Peng Kong, Bok Eng Cheah
  • Patent number: 11556856
    Abstract: A method for training an analytics engine hosted by an edge server device is provided. The method includes determining a classification for data in an analytics engine hosted by an edge server and computing a confidence level for the classification. The confidence level is compared to a threshold. The data is sent to a cloud server if the confidence level is less than the threshold. A reclassification is received from the cloud server and the analytics engine is trained based, at least in part, on the data and the reclassification.
    Type: Grant
    Filed: December 24, 2020
    Date of Patent: January 17, 2023
    Assignee: Intel Corporation
    Inventor: Yen Hsiang Chew
  • Patent number: 11558750
    Abstract: This disclosure describes systems, methods, and devices related to security for multi-link operation. A device may determine a multi-link communication with a first multi-link device comprising two or more links associated with two or more station devices (STAs) included in the first multi-link device. The device may determine a first medium access control (MAC) address associated with a first link of the two or more links. The device may determine a second MAC address associated with a second link of the two or more links. The device may generate one or more pairwise security keys to be used in the multi-link communication on the two or more links. The device may cause to send a frame to the first multi-link device using at least one combination of the one or more pairwise security keys.
    Type: Grant
    Filed: May 6, 2020
    Date of Patent: January 17, 2023
    Assignee: Intel Corporation
    Inventors: Po-Kai Huang, Laurent Cariou, Carlos Cordeiro, Daniel Bravo, Robert Stacey, Arik Klein, Avner Epstein, Daniel Leiderman
  • Patent number: 11556692
    Abstract: Techniques for designing and implementing networks-on-chip (NoCs) are provided. For example, a computer-implemented method for programming a network-on-chip (NoC) onto an integrated circuit includes determining a first portion of a plurality of registers to potentially be included in a NoC design, determining routing information regarding datapaths between registers of the first portion of the plurality of registers, and determining an expected performance associated with the first portion of the plurality of registers. The method also includes determining whether the expected performance is within a threshold range, including the first portion of the plurality of registers and the datapaths in the NoC design after determining that the expected performance is within the threshold range, and generating instructions configured to cause circuitry corresponding to the NoC design to be implemented on the integrated circuit.
    Type: Grant
    Filed: December 24, 2020
    Date of Patent: January 17, 2023
    Assignee: Intel Corporation
    Inventors: Gregg William Baeckler, Martin Langhammer, Sergey Vladimirovich Gribok
  • Patent number: 11557717
    Abstract: A memory apparatus is provided which comprises: a stack comprising a magnetic insulating material and a transition metal dichalcogenide (TMD), wherein the magnetic insulating material has a first magnetization. The stack behaves as a free magnet. The apparatus includes a fixed magnet with a second magnetization. An interconnect is further provided which comprises a spin orbit material, wherein the interconnect is adjacent to the stack.
    Type: Grant
    Filed: November 16, 2018
    Date of Patent: January 17, 2023
    Assignee: Intel Corporation
    Inventors: Chia-Ching Lin, Tanay Gosavi, Sasikanth Manipatruni, Dmitri Nikonov, Ian Young
  • Patent number: 11557082
    Abstract: There is disclosed in an example, a pourable smart matter having a plurality of compute nodes, the compute nodes having: a mechanical structure having a plurality of faces, the faces having abutting face detectors; a network interface; and one or more logic elements comprising a positional engine to: identify a neighbor compute node abutting at least one of the faces; and build an individual positional profile based at least in part on the identifying. The pourable smart matter may be used, for example, to determine the geometry or volume of a container.
    Type: Grant
    Filed: March 31, 2016
    Date of Patent: January 17, 2023
    Assignee: Intel Corporation
    Inventors: Simon Hunt, Mark E. Scott-Nash