Intel Patents
Intel Corporation designs and manufactures microprocessors and chipsets for computing and communications equipment manufacturers. Its products may be found in desktops, servers, tablets, smartphones and other devices.
Intel Patents by Type- Intel Patents Granted: Intel patents that have been granted by the United States Patent and Trademark Office (USPTO).
- Intel Patent Applications: Intel patent applications that are pending before the United States Patent and Trademark Office (USPTO).
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Publication number: 20210375716Abstract: A hybrid thermal interface material (TIM) suitable for an integrated circuit (IC) die package assembly. The hybrid TIM may include a heat-spreading material having a high planar thermal conductivity, and a supplemental material having a high perpendicular thermal conductivity at least partially filling through-holes within the heat-spreading material. The hybrid TIM may offer a reduced effective spreading and vertical thermal resistance. The heat-spreading material may have high compressibility (low bulk modulus or low hardness), such as a carbon-based (e.g., graphitic) material. The supplemental material may be of a suitable composition for filling the through-hole. The heat-spreading material, once compressed by a force applied through an IC die package assembly, may have a thickness substantially the same as that of the supplemental material such that both materials make contact with the IC die package and a thermal solution.Type: ApplicationFiled: June 1, 2020Publication date: December 2, 2021Applicant: INTEL CORPORATIONInventors: Pooya Tadayon, Joe Walczyk
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Publication number: 20210374897Abstract: Embodiments described herein include, software, firmware, and hardware logic that provides techniques to perform arithmetic on sparse data via a systolic processing unit. Embodiment described herein provided techniques to skip computational operations for zero filled matrices and sub-matrices. Embodiments additionally provide techniques to maintain data compression through to a processing unit. Embodiments additionally provide an architecture for a sparse aware logic unit.Type: ApplicationFiled: June 3, 2021Publication date: December 2, 2021Applicant: Intel CorporationInventors: Joydeep Ray, Scott Janus, Varghese George, Subramaniam Maiyuran, Altug Koker, Abhishek Appu, Prasoonkumar Surti, Vasanth Ranganathan, Andrei Valentin, Ashutosh Garg, Yoav Harel, Arthur Hunter, JR., SungYe Kim, Mike Macpherson, Elmoustapha Ould-Ahmed-Vall, William Sadler, Lakshminarayanan Striramassarma, Vikranth Vemulapalli
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Publication number: 20210374062Abstract: In an example, an apparatus comprises a plurality of execution units, and a cache memory communicatively coupled to the plurality of execution units, wherein the cache memory is structured into a plurality of sectors, wherein each sector in the plurality of sectors comprises at least two cache lines. Other embodiments are also disclosed and claimed.Type: ApplicationFiled: August 12, 2021Publication date: December 2, 2021Applicant: Intel CorporationInventors: Abhishek R. Appu, Altug Koker, Joydeep Ray, David Puffer, Prasoonkumar Surti, Lakshminarayanan Striramassarma, Vasanth Ranganathan, Kiran C. Veernapu, Balaji Vembu, Pattabhiraman K
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Publication number: 20210375830Abstract: Composite IC chip including a chiplet embedded within metallization levels of a host IC chip. The chiplet may include a device layer and one or more metallization layers interconnecting passive and/or active devices into chiplet circuitry. The host IC may include a device layer and one or more metallization layers interconnecting passive and/or active devices into host chip circuitry. Features of one of the chiplet metallization layers may be directly bonded to features of one of the host IC metallization layers, interconnecting the two circuitries into a composite circuitry. A dielectric material may be applied over the chiplet. The dielectric and chiplet may be thinned with a planarization process, and additional metallization layers fabricated over the chiplet and host chip, for example to form first level interconnect interfaces. The composite IC chip structure may be assembled into a package substantially as a monolithic IC chip.Type: ApplicationFiled: August 11, 2021Publication date: December 2, 2021Applicant: Intel CorporationInventors: Adel Elsherbini, Johanna Swan, Shawna Liff, Patrick Morrow, Gerald Pasdast, Van Le
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Patent number: 11189065Abstract: The present disclosure provides at least an apparatus for a depth enhanced image editing. In an example, the apparatus includes a processor and a storage, comprising instructions that when executed with the processor cause the apparatus to store a received depth enhanced image. In an example, the depth enhanced image comprises image data, depth data, and calibration data. The apparatus may apply an edit to the image data and the calibration data without editing the depth data in response to a request for an image edit. The apparatus may further return an edited depth enhanced image.Type: GrantFiled: April 17, 2017Date of Patent: November 30, 2021Assignee: Intel CorporationInventors: Jonathan Abramson, Avigdor Eldar, Omer Levy
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Patent number: 11190450Abstract: This disclosure is directed to system to monitor and control data flow in a network. At least one device in a core network may be responsible for charging functions related to the data requests. During certain high usage scenarios (e.g., emergencies, special events, etc.), it may be possible for the charging system to be overwhelmed. For example, a policing system may be implemented in the core network to at least manage the flow of requests to the charging system. The policing system may monitor and control request flow to the charging system based on at least one policy. When a request is determined to violate a policy, the policing system may take corrective action to prevent the charging system from being overwhelmed. For example, the policing system may block the request, divert the request to another charging system that may have available capacity, etc.Type: GrantFiled: June 30, 2016Date of Patent: November 30, 2021Assignee: Intel CorporationInventors: Damien Power, Chris Macnamara, Sinead Murtagh, Laura Hunt, Gary Loughnane
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Patent number: 11188255Abstract: An integrated circuit may include a memory controller circuit for communicating with an off-chip memory device. The memory controller is operable in a read-write major mode that is capable of dynamically adapting to any memory traffic pattern, which results in improved memory scheduling efficiency across different user applications. The memory controller may include at least a write command queue, a read command queue, an arbiter, and a command scheduler. The command scheduler may monitor a write command count, a read command count, a write stall count, and a read stall count to determine whether to dynamically adjust a read burst threshold setting and a write burst threshold setting.Type: GrantFiled: March 28, 2018Date of Patent: November 30, 2021Assignee: Intel CorporationInventors: Chee Hak Teh, Yu Ying Ong, Kevin Chao Ing Teoh
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Patent number: 11189076Abstract: Apparatus and method for preventing re-traversal of a prior path on a restart. For example, one embodiment of an apparatus comprises: a ray generator to generate a plurality of rays in a graphics scene; a bounding volume hierarchy (BVH) generator to construct a BVH comprising a plurality of hierarchically arranged nodes, wherein the BVH comprises a specified number of child nodes at a current BVH level beneath a parent node in the hierarchy; circuitry to traverse one or more of the rays through the BVH to form a current traversal path and intersect the one or more rays with primitives contained within the nodes, wherein the circuitry is to process entries from the top of a first data structure comprising entries each associated with a child node at the current BVH level, the entries being ordered from top to bottom based on a sorted distance of each respective child node.Type: GrantFiled: July 15, 2020Date of Patent: November 30, 2021Assignee: INTEL CORPORATIONInventors: Karthik Vaidyanathan, Sven Woop, Carsten Benthin
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Patent number: 11189790Abstract: Spacer-based patterning for tight-pitch and low-variability random access memory (RAM) bit cells, and the resulting structures, are described. In an example, a semiconductor structure includes a substrate having a top layer. An array of non-volatile random access memory (RAM) bit cells is disposed on the top layer of the substrate. The array of non-volatile RAM bit cells includes columns of non-volatile RAM bit cells along a first direction and rows of non-volatile RAM bit cells along a second direction orthogonal to the first direction. A plurality of recesses is in the top layer of the substrate, along the first direction between columns of the array of non-volatile RAM bit cells.Type: GrantFiled: September 30, 2016Date of Patent: November 30, 2021Assignee: Intel CorporationInventors: Kevin L. Lin, Sarah E. Atanasov, Kevin P. O'Brien, Robert L. Bristol
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Patent number: 11189085Abstract: Technologies for generating 3D and using models are described. In some embodiments the technologies employ a content creation device to produce a 3D model of an environment based at least in part on depth data and color data, which may be provided by one or more cameras. Contextual information such as location information, orientation information, etc., may also be collected or otherwise determined, and associated with points of the 3D model. Access points to the imaged environments may be identified and labeled as anchor points within the 3D model. Multiple 3D models may then be combined into an aggregate model, wherein anchor points of constituent 3D models in the aggregate model are substantially aligned. Devices, systems, and computer readable media utilizing such technologies are also described.Type: GrantFiled: May 27, 2016Date of Patent: November 30, 2021Assignee: INTEL CORPORATIONInventors: Shivakumar Doddamani, Jim S. Baca
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Patent number: 11189000Abstract: An embodiment of an image processor device includes technology to fetch a feature point data set from outside a local memory, locally store three or more fetched feature point data sets in the local memory, compute orientation information for each fetched feature point data set, compute first descriptor information based on the computed orientation information and a first locally stored feature point data set in parallel with a fetch and local store of a second feature point data set in the local memory, and compute second descriptor information based on the computed orientation information and the second locally stored feature point data set in parallel with the compute of the first descriptor information. Other embodiments are disclosed and claimed.Type: GrantFiled: June 24, 2019Date of Patent: November 30, 2021Assignee: Intel CorporationInventors: Gopi Neela, Dipan Kumar Mandal, Gurpreet S. Kalsi, Prashant Laddha, Om J. Omer, Anirud Thyagharajan, Srivatsava Jandhyala
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Patent number: 11190973Abstract: Technologies for link-bandwidth-aware routing are disclosed. In order to avoid congestion while still allowing link bandwidth to be decreased in order to save power, a network switch may select a port to send a packet over based on the present link bandwidth of the data links connected to the various output ports of the network switch. The network switch preferentially sends the packet over the minimal output port, or, if the minimal output port is congested, over one of the ports with the highest available link bandwidth. If the link bandwidth of the data link connected to the selected output port is not high enough, the network switch will automatically dynamically increase the link bandwidth of the data link as necessary.Type: GrantFiled: March 6, 2017Date of Patent: November 30, 2021Assignee: Intel CorporationInventors: Eric R. Borch, Keith D. Underwood
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Patent number: 11188492Abstract: Apparatuses and methods relating to an enhanced serial peripheral interface (eSPI) port expander circuitry are described. In an embodiment, an apparatus includes an upstream eSPI port, a plurality of downstream eSPI ports, and an eSPI aggregator. The upstream eSPI port is to operate as an eSPI slave on an upstream eSPI bus. Each of the plurality of downstream eSPI ports is to operate as an eSPI master on a corresponding one of a plurality of downstream eSPI buses. The eSPI aggregator is to forward or broadcast transactions from the upstream eSPI bus to one or more of the plurality of downstream eSPI buses and to aggregate responses from one or more of the downstream eSPI buses.Type: GrantFiled: December 27, 2018Date of Patent: November 30, 2021Assignee: Intel CorporationInventors: Zhenyu Zhu, Joel L. Finkel, Lean Kim Ong, Siow Hoay Lim, Mikal Hunsaker
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Patent number: 11188117Abstract: An apparatus is provided for low latency adaptive clocking, the apparatus comprises: a first power supply rail to provide a first power; a second power supply rail to provide a second power; a third power supply rail to provide a third power; a voltage divider coupled to the first, second, and third power supply rails; a bias generator coupled to voltage divider and the third power supply rail; an oscillator coupled to the bias generator and the first supply rail; and a clock distribution network to provide an output of the oscillator to one or more logics, wherein the clock distribution network is coupled to the second power supply rail.Type: GrantFiled: September 6, 2018Date of Patent: November 30, 2021Assignee: Intel CorporationInventors: Praveen Mosalikanti, Nasser Kurd
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Patent number: 11189733Abstract: Techniques are disclosed for forming thin-film transistors (TFTs) with low contact resistance. As disclosed in the present application, the low contact resistance can be achieved by intentionally thinning one or both of the source/drain (S/D) regions of the thin-film layer of the TFT device. As the TFT layer may have an initial thickness in the range of 20-65 nm, the techniques for thinning the S/D regions of the TFT layer described herein may reduce the thickness in one or both of those S/D regions to a resulting thickness of 3-10 nm, for example. Intentionally thinning one or both of the S/D regions of the TFT layer induces more electrostatic charges inside the thinned S/D region, thereby increasing the effective dopant in that S/D region. The increase in effective dopant in the thinned S/D region helps lower the related contact resistance, thereby leading to enhanced overall device performance.Type: GrantFiled: January 10, 2018Date of Patent: November 30, 2021Assignee: Intel CorporationInventors: Abhishek A. Sharma, Van H. Le, Li Huey Tan, Tristan A. Tronic, Benjamin Chu-Kung, Jack T. Kavalieros, Tahir Ghani
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Patent number: 11189074Abstract: An apparatus and method for efficiently reconstructing a BVH. For example, one embodiment of a method comprises: constructing an object bounding volume hierarchy (BVH) for each object in a scene, each object BVH including a root node and one or more child nodes based on primitives included in each object; constructing a top-level BVH using the root nodes of the individual object BVHs; performing an analysis of the top-level BVH to determine whether the top-level BVH comprises a sufficiently efficient arrangement of nodes within its hierarchy; and reconstructing at least a portion of the top-level BVH if a more efficient arrangement of nodes exists, wherein reconstructing comprises rebuilding the portion of the top-level BVH until one or more stopping criteria have been met, the stopping criteria defined to prevent an entire rebuilding of the top-level BVH.Type: GrantFiled: June 2, 2020Date of Patent: November 30, 2021Assignee: INTEL CORPORATIONInventors: Carsten Benthin, Sven Woop
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Patent number: 11187807Abstract: Frequency modulated lasers, LIDAR systems, and methods of controlling laser are disclosed. A laser source emits an optical beam having an optical frequency that changes in response to a signal applied to an input of the laser source. A laser driver that generates the signal applied to the input to cause the optical frequency to vary in accordance with a periodic frequency versus time function. The laser driver generates the signal for a current period of the periodic frequency versus time function based, at least in part, on optical frequency versus time measurements of one or more prior periods of the periodic frequency versus time function.Type: GrantFiled: July 11, 2018Date of Patent: November 30, 2021Assignee: Intel CorporationInventors: Naresh Satyan, George Rakuljic
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Patent number: 11188643Abstract: Methods, apparatus, systems and articles of manufacture for detecting a side channel attack using hardware performance counters are disclosed. An example apparatus includes a hardware performance counter data organizer to collect a first value of a hardware performance counter at a first time and a second value of the hardware performance counter at a second time. A machine learning model processor is to apply a machine learning model to predict a third value corresponding to the second time. An error vector generator is to generate an error vector representing a difference between the second value and the third value. An error vector analyzer is to determine a probability of the error vector indicating an anomaly. An anomaly detection orchestrator is to, in response to the probability satisfying a threshold, cause the performance of a responsive action to mitigate the side channel anomaly.Type: GrantFiled: December 27, 2018Date of Patent: November 30, 2021Assignee: INTEL CORPORATIONInventors: Li Chen, Abhishek Basak, Salmin Sultana, Justin Gottschlich
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Patent number: 11191042Abstract: In some embodiments, a first user device may synchronize a time associated with a second user device. The first user device may generate a neighbor awareness network (NAN) service discovery frame. The first user device may transmit the NAN service discovery frame to the second user device. The first user device may receive a request frame from the second user device based at least in part on transmitting the NAN service discovery frame, wherein the request frame comprises a request for ranging or location information from the first user device. The first user device may receive a NAN service discovery frame from the second user device, wherein the NAN service discovery frame comprises a request for ranging or location information from the first user device. The first user device may transmit a response frame comprising the ranging or location information in response to the received request frame.Type: GrantFiled: January 30, 2019Date of Patent: November 30, 2021Assignee: Intel CorporationInventors: Emily Qi, Carlos Cordeiro, Jonathan Segev
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Patent number: 11189614Abstract: A grating structure has a plurality of grating members that extend upward from a base in a spaced-apart parallel relationship and include an end member. For example, the grating structure is a plurality of semiconductor fins on a base. The base can be any structure underlying the grating members. The grating members have a member width and a member height. Adjacent grating members are spaced by a grating spacing. A process artifact is adjacent the end member and is spaced from the end member by a horizontal distance consistent with the member spacing. In some cases, the process artifact can be a stub of a second material on or otherwise extending from the base adjacent an end member of the grating structure. In other cases, the process artifact can be a recess in or otherwise extending into the base adjacent an end member of the grating structure.Type: GrantFiled: March 16, 2018Date of Patent: November 30, 2021Assignee: Intel CorporationInventors: Leonard Guler, Elliot Tan
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Patent number: 11188335Abstract: Systems, methods, and apparatuses relating to performing hashing operations on packed data elements are described.Type: GrantFiled: November 2, 2020Date of Patent: November 30, 2021Assignee: Intel CorporationInventors: Regev Shemy, Zeev Sperber, Wajdi Feghali, Vinodh Gopal, Amit Gradstein, Simon Rubanovich, Sean Gulley, Ilya Albrekht, Jacob Doweck, Jose Yallouz, Ittai Anati
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Patent number: 11188835Abstract: In some embodiments, the disclosed subject matter involves a system and method to identify objects in an environment or scene to assist in locating objects and individuals. In at least one embodiment, users register with a service to help locate and/or track objects and individuals. The service may provide recommendations on how to locate, reach, or avoid the target object or individual. Identifying and tracking an object may be used to locate an individual when the object is correlated with the individual. Individuals may register with the service for purposes of user authentication and for defining privacy authorizations for data related to the identifying the user and user's location to other parties. The service may execute in a trusted execution environment to help preserve privacy. Embodiments may be used for games, geo-caching, finding groups and individuals for meeting up, avoiding objects or individuals, etc. Other embodiments are described and claimed.Type: GrantFiled: December 30, 2016Date of Patent: November 30, 2021Assignee: Intel CorporationInventors: Igor Tatourian, Rita H. Wouhaybi, Rajesh Poornachandran
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Patent number: 11188342Abstract: An apparatus and method for a speculative conditional move instruction. A processor comprising: a decoder to decode a first speculative conditional move instruction; a prediction storage to store prediction data related to previously executed speculative conditional move instructions; and execution circuitry to read first prediction data associated with the speculative conditional move instruction and to execute the speculative conditional move instruction either speculatively or non-speculatively based on the first prediction data.Type: GrantFiled: April 1, 2020Date of Patent: November 30, 2021Assignee: Intel CorporationInventors: Amjad Aboud, Gadi Haber, Jared Warner Stark, IV
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Patent number: 11188467Abstract: A method is described. The method includes receiving a read or write request for a cache line. The method includes directing the request to a set of logical super lines based on the cache line's system memory address. The method includes associating the request with a cache line of the set of logical super lines. The method includes, if the request is a write request: compressing the cache line to form a compressed cache line, breaking the cache line down into smaller data units and storing the smaller data units into a memory side cache. The method includes, if the request is a read request: reading smaller data units of the compressed cache line from the memory side cache and decompressing the cache line.Type: GrantFiled: September 28, 2017Date of Patent: November 30, 2021Assignee: Intel CorporationInventors: Israel Diamand, Alaa R. Alameldeen, Sreenivas Subramoney, Supratik Majumder, Srinivas Santosh Kumar Madugula, Jayesh Gaur, Zvika Greenfield, Anant V. Nori
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Patent number: 11188138Abstract: In an embodiment, a processor includes a plurality of processing engines to execute instructions and a power management unit. The power management unit is to: control an operating frequency and a supply voltage according to a first voltage/frequency curve associated with a first temperature; and in response to a detection of a second temperature in the processor, increase the operating frequency to a second frequency based on a second voltage/frequency curve, wherein, at least one voltage of a first range of voltages, the second voltage/frequency curve specifies a higher frequency than the first voltage/frequency curve. Other embodiments are described and claimed.Type: GrantFiled: November 30, 2018Date of Patent: November 30, 2021Assignee: Intel CorporationInventors: Michael Bitan, Andrey Gabdulin, Efraim Rotem, Eli Efron, Nadav Shulman, David Ben Shimon, Nir Levitin, Esfir Natanzon
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Patent number: 11189700Abstract: Embodiments of the invention include non-planar InGaZnO (IGZO) transistors and methods of forming such devices. In an embodiment, the IGZO transistor may include a substrate and an IGZO fin formed above the substrate. Embodiments may include a source contact and a drain contact that are formed adjacent to more than one surface of the IGZO fin. Additionally, embodiments may include a gate electrode formed between the source contact and the drain contact. The gate electrode may be separated from the IGZO layer by a gate dielectric. In one embodiment, the IGZO transistor is a finfet transistor. In another embodiment the IGZO transistor is a nanowire or a nanoribbon transistor. Embodiments of the invention may also include a non-planar IGZO transistor that is formed in the back end of line stack (BEOL) of an integrated circuit chip.Type: GrantFiled: December 23, 2015Date of Patent: November 30, 2021Assignee: Intel CorporationInventors: Van H. Le, Rafael Rios, Gilbert Dewey, Jack T. Kavalieros, Marko Radosavljevic
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Patent number: 11191038Abstract: Among other things, embodiments of the present disclosure help provide stable wideband transmissions through interference. Other embodiments may be described and claimed.Type: GrantFiled: December 26, 2019Date of Patent: November 30, 2021Assignee: Intel CorporationInventor: Minyoung Park
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Patent number: 11189574Abstract: A microelectronic package may be fabricated with a microelectronic substrate, a microelectronic die electrically attached to the microelectronic substrate, and an electromagnetic interference shield layer contacting one or both of the microelectronic substrate and the microelectronic die, wherein the electromagnetic interference shield layer has an electrical conductivity between about 10,000 siemens per meter and 100,000 siemens per meter. The specific range of electrical conductivity results in electromagnetic fields either generated by the microelectronic die or generated by components external to the microelectronic package scattering within the electromagnetic interference shield layer and attenuating. Thus, the electromagnetic interference shield layer can prevent electromagnetic field interference without the need to be grounded.Type: GrantFiled: May 31, 2017Date of Patent: November 30, 2021Assignee: Intel CorporationInventors: Li-Sheng Weng, Chung-Hao Chen, James C. Matayabas, Jr., Min Keen Tang
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Patent number: 11188324Abstract: Methods, apparatus, systems, and articles of manufacture to perform heterogeneous data structure selection via programmer annotations. An example apparatus includes a phase tracker to identify a first phase and a second phase, a cost predictor to estimate interaction costs of interacting with respective types of data structures within the first phase and the second phase, a tree constructor to construct a tree corresponding to a first data structure type, the tree including a first node in the first phase, a second node in the second phase, and an edge connecting the first node and the second node, the second node representing a second data structure type different from the first data structure type, a transformation cost calculator to calculate a transformation cost for the edge, and a branch selector to select a sequence of data structures based on the combined interaction costs and transformation costs.Type: GrantFiled: December 23, 2019Date of Patent: November 30, 2021Assignee: Intel CorporationInventor: Justin Gottschlich
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Patent number: 11189580Abstract: Disclosed herein are structures, devices, and methods for electrostatic discharge protection (ESDP) in integrated circuits (ICs). For example, in some embodiments, an IC package support may include: a first conductive structure in a dielectric material; a second conductive structure in the dielectric material; and a material in contact with the first conductive structure and the second conductive structure, wherein the material includes a polymer, and the material is different from the dielectric material. The material may act as a dielectric material below a trigger voltage, and as a conductive material above the trigger voltage.Type: GrantFiled: December 19, 2019Date of Patent: November 30, 2021Assignee: Intel CorporationInventors: Adel A. Elsherbini, Krishna Bharath, Feras Eid, Johanna M. Swan, Aleksandar Aleksov, Veronica Aleman Strong
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Patent number: 11189730Abstract: Integrated circuit transistor structures and processes are disclosed that reduce n-type dopant diffusion, such as phosphorous or arsenic, from the source region and the drain region of a germanium n-MOS device into adjacent channel regions during fabrication. The n-MOS transistor device may include at least 70% germanium (Ge) by atomic percentage. In an example embodiment, source and drain regions of the transistor are formed using a low temperature, non-selective deposition process of n-type doped material. In some embodiments, the low temperature deposition process is performed in the range of 450 to 600 degrees C. The resulting structure includes a layer of doped mono-crystyalline silicon (Si), or silicon germanium (SiGe), on the source/drain regions. The structure also includes a layer of doped amorphous Si:P (or SiGe:P) on the surfaces of a shallow trench isolation (STI) region and the surfaces of contact trench sidewalls.Type: GrantFiled: December 26, 2017Date of Patent: November 30, 2021Assignee: Intel CorporationInventors: Glenn A. Glass, Anand S. Murthy, Karthik Jambunathan, Cory C. Bomberger, Tahir Ghani, Jack T. Kavalieros, Benjamin Chu-Kung, Seung Hoon Sung, Siddharth Chouksey
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Patent number: 11188618Abstract: An apparatus to facilitate acceleration of matrix multiplication operations. The apparatus comprises a systolic array including matrix multiplication hardware to perform multiply-add operations on received matrix data comprising data from a plurality of input matrices and sparse matrix acceleration hardware to detect zero values in the matrix data and perform one or more optimizations on the matrix data to reduce multiply-add operations to be performed by the matrix multiplication hardware.Type: GrantFiled: September 5, 2019Date of Patent: November 30, 2021Assignee: Intel CorporationInventors: Subramaniam Maiyuran, Mathew Nevin, Jorge Parra, Ashutosh Garg, Shubra Marwaha, Shubh Shah
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Patent number: 11188639Abstract: The disclosed embodiments relate to system, method and apparatus to compartmentalize information in a program so as to protect against malware. In one embodiment, the disclosed provides a compiler that is enhanced to automatically define multiple compartments within a program based on the data sets that they access. The disclosed embodiments may be implemented at a compiler and certain embodiments may be referred to as compartmentalizing compiler. For each data set, an exemplary compartmentalizing compiler separates program elements that need direct access to the data set from those that do not and it defines a boundary around the data set and the program elements that need to access it. In certain embodiments, other portions of the program may still need to invoke the compartment. Thus, the disclosure also generates interface routines to copy data back and forth through the compartment boundary.Type: GrantFiled: July 19, 2018Date of Patent: November 30, 2021Assignee: INTEL CORPORATIONInventors: Michael LeMay, Ye Zhuang
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Patent number: 11190335Abstract: A method for performing pattern detection and alignment on a programmable logic device is disclosed. A word aligner unit, implemented by a hard intellectual property block, is configured to detect a plurality of control characters by recognizing a proper subset of bits that are common among the plurality of control characters. It is determined whether a predetermined number of consecutive control characters has been detected in a frame of data. A boundary location associated with a detected predetermined number of consecutive control characters from the word aligner unit is identified. The frame of data is aligned in response to the boundary location associated with the detected predetermined number of consecutive control characters.Type: GrantFiled: January 23, 2018Date of Patent: November 30, 2021Assignee: Intel CorporationInventors: Boon Hong Oh, Ivan Fu Sun Teh, Chee Seng Tan
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Patent number: 11188127Abstract: Embodiments are generally directed to a flexible overlapping display. An embodiment of a mobile device includes a processor to process data for the mobile device, a bendable and foldable display screen one or more device sensors to sense an orientation of the mobile device, and one or more display sensors to sense a current arrangement of the display screen. The processor is to identify one or more portions of the display screen that are visible to a user based at least in part on data from the one or more device sensors and the one or more display sensors.Type: GrantFiled: December 26, 2015Date of Patent: November 30, 2021Assignee: Intel CorporationInventors: Guy M. Therien, David W. Browning, Joshua L. Zuniga
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Patent number: 11185755Abstract: A system includes at least one processor and at least one non-transitory computer-readable media communicatively coupled to the at least one processor. In some embodiments, the at least one non-transitory computer-readable media stores instructions which, when executed, cause the processor to perform operations including receiving a first set of sensor data within a first time frame and receiving a set of skycam actions within the first time frame. In certain embodiments, the operations also include generating a set of reference actions corresponding to the first set of sensor data and the set of skycam actions. In some embodiments, the operations also include receiving a second set of sensor data associated with a second game status, a second game measurement, or both. The operations also include generating a sequence of skycam actions based on a comparison between the second set of sensor data and the set of reference actions.Type: GrantFiled: March 27, 2020Date of Patent: November 30, 2021Assignee: Intel CorporationInventors: Fai Yeung, Patrick Youngung Shon, Shaun Peter Carrigan, Gilson Goncalves de Lima, Vasanthi Jangala Naga
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Patent number: 11189409Abstract: An inductor may be fabricated comprising a magnetic material layer and an electrically conductive via or trace extending through the magnetic material layer, wherein the magnetic material layer comprises dielectric magnetic filler particles within a carrier material. Further embodiments may include incorporating the inductor of the present description into an electronic substrate and may further include an integrated circuit device attached to the electronic substrate and the electronic substrate may further be attached to a board, such as a motherboard.Type: GrantFiled: December 28, 2017Date of Patent: November 30, 2021Assignee: Intel CorporationInventors: Andrew J. Brown, Prithwish Chatterjee, Lauren A. Link, Sai Vadlamani
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Patent number: 11188132Abstract: Modular power delivery techniques for electronic devices are described. In one embodiment, an apparatus may comprise native power delivery circuitry to source a native power delivery current, power management circuitry to control the native power delivery circuitry, a power delivery connector to mate with a counterpart power delivery connector of an external device, and a processing device conductively coupled to the power delivery connector via a supplemental power delivery line, the processing device to draw a supplemental power delivery current from the external device via the supplemental power delivery line. Other embodiments are described and claimed.Type: GrantFiled: May 31, 2016Date of Patent: November 30, 2021Assignee: INTEL CORPORATIONInventors: Yu Liang Shiao, Tawfik M. Rahal-Arabi, Chang-Wu Yen, Celia H. Yang
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Patent number: 11188394Abstract: Technologies for synchronizing triggered operations include a host fabric interface (HFI) of a compute device configured to receive an operation execution command associated with a triggered operation that has been fired and determine whether the operation execution command includes an instruction to update a table entry of a table managed by the HFI. Additionally, the HFI is configured to issue, in response to a determination that the operation execution command includes the instruction to update the table entry, a triggered list enable (TLE) operation and a triggered list disable (TLD) operation to a table manager of the HFI and disable a corresponding table entry in response to the TLD operation having been triggered, the identified table entry. The HFI is further configured to execute one or more command operations associated with the received operation execution command and re-enable, in response to the TLE operation having been triggered, the table entry. Other embodiments are described herein.Type: GrantFiled: March 30, 2018Date of Patent: November 30, 2021Assignee: Intel CorporationInventors: James Dinan, Mario Flajslik, Timo Schneider, Keith D. Underwood
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Patent number: 11189585Abstract: An Integrated Circuit (IC) device comprising a first component, the first component comprising a first dielectric and a plurality of adjacent first interconnect structures within the first dielectric. The IC device comprising a second component, the second component comprising a second dielectric and a plurality of adjacent second interconnect structures within the second dielectric. A first of the second interconnect structures is in direct contact with a first of the first interconnect structures at a bond interface between the first and second components. A second of the first interconnect structures is set back a distance from a plane of the bond interface.Type: GrantFiled: December 4, 2019Date of Patent: November 30, 2021Assignee: Intel CorporationInventors: Brennen K. Mueller, Adel Elsherbini, Mauro Kobrinsky, Johanna Swan, Shawna Liff, Pooya Tadayon
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Patent number: 11190329Abstract: An apparatus of user equipment (UE) includes processing circuitry coupled to a memory, where to configure the UE for DMRS processing in an NR network, the processing circuitry is to generate a plurality of binary sequences of length L, the binary sequences being arranged according to a signal quality metric. A set of CGSs is generated using the binary sequences, based on minimizing cross-correlation between subsets of binary sequences of different lengths selected from the plurality of binary sequences. A CGS is selected from the set of CGSs as a DMRS, based on uplink PRB resource allocation. The DMRS is encoded for transmission, where the encoding includes BPSK modulation and discrete Fourier transformation (DFT) spreading of the DMRS.Type: GrantFiled: December 20, 2019Date of Patent: November 30, 2021Assignee: Intel CorporationInventors: Avik Sengupta, Sameer Pawar, Alexei Vladimirovich Davydov, Guotong Wang, Gregory Vladimirovich Morozov
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Patent number: 11188794Abstract: A convolutional neural network framework is described that uses reverse connection and obviousness priors for object detection. A method includes performing a plurality of layers of convolutions and reverse connections on a received image to generate a plurality of feature maps, determining an objectness confidence for candidate bounding boxes based on outputs of an objectness prior, determining a joint loss function for each candidate bounding box by combining an objectness loss, a bounding box regression loss and a classification loss, calculating network gradients over positive boxes and negative boxes, updating network parameters within candidate bounding boxes using the joint loss function, repeating performing the convolutions through to updating network parameters until the training converges, and outputting network parameters for object detection based on the training images.Type: GrantFiled: August 10, 2017Date of Patent: November 30, 2021Assignee: Intel CorporationInventors: Anbang Yao, Tao Kong, Ming Lu, Yiwen Guo, Yurong Chen
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Patent number: 11189487Abstract: A high-pressure dielectric film curing apparatus, such as a high-pressure batch furnace, is controlled to an elevated cure temperature and super-atmospheric pressure for the duration of the film curing time with the cure pressure achieved at least partially with a vapor of aqueous ammonia in fluid communication with the chamber. The cure temperature may vary, for example between 175° C., and 400° C., or more. The cure pressure may also vary as limited by the saturated water vapor pressure, for example between 100 PSIA and 300 PSIA, or more. The aqueous ammonia may be injected into the chamber or vaporized upstream of the chamber. One or more carrier and/or diluent gas (vapor) may be introduced into the chamber to adjust the partial pressure of ammonia vapor, water vapor, and the diluent.Type: GrantFiled: September 30, 2016Date of Patent: November 30, 2021Assignee: Intel CorporationInventors: Jonathan E. Leonard, Aravind S. Killampalli, Chad Byers, Jay P. Gupta
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Patent number: 11185285Abstract: Mouth guard that includes a flexible printed circuit board encapsulated within a base member is provided. The flexible printed circuit board includes multiple separate stiff sections spaced apart from each other within the base member. One or more electronic devices are disposed within the base member. In particular, the one or more electronics are disposed on the base member.Type: GrantFiled: December 26, 2018Date of Patent: November 30, 2021Assignee: INTEL CORPORATIONInventors: Braxton Lathrop, Cody Gabriel, James Hall, Michael Rosen, Nathan Stebor, Philip Muse, Rita Brugarolas Brufau, Shea Dillon, Stephanie Moyerman, Steven Xing, Tyler Fetters
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Patent number: 11189564Abstract: Embodiments herein may describe techniques for an integrated circuit including a MOSFET having a source area, a channel area, a gate electrode, and a drain area. The channel area may include a first channel region with a dopant of a first concentration next to the source area, and a second channel region with the dopant of a second concentration higher than the first concentration next to the drain area. A source electrode may be in contact with the source area, a gate oxide layer above the channel area, and the gate electrode above the gate oxide layer. A first resistance exists between the source electrode and the gate electrode. A second resistance exists between the source electrode, the gate electrode, and a path through the gate oxide layer to couple the source electrode and the gate electrode after a programming operation is performed. Other embodiments may be described and/or claimed.Type: GrantFiled: April 2, 2018Date of Patent: November 30, 2021Assignee: Intel CorporationInventors: Yu-Lin Chao, Sarvesh H. Kulkarni, Vincent E. Dorgan, Uddalak Bhattacharya
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Patent number: 11190460Abstract: This disclosure relates to integrated circuit devices that may include a network processor in a data processing die and an on-package memory in a base die. The data processing die may implement one or more network functionalities that may exchange data with low-latency memory, high capacity in the base die. The data processing die may be programmable fabric, which may be dynamically reconfigured during operation.Type: GrantFiled: March 29, 2019Date of Patent: November 30, 2021Assignee: Intel CorporationInventors: Kevin Clark, Scott J. Weber, Ravi Prakash Gutala, Aravind Raghavendra Dasu
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Patent number: 11189573Abstract: A semiconductor package is described herein with electromagnetic shielding using metal layers and vias. In one example, the package includes a silicon substrate having a front side and a back side, the front side including active circuitry and an array of contacts to attach to a substrate, a metallization layer over the back side of the die to shield active circuitry from interference through the back side, and a plurality of through-silicon vias coupled to the back side metallization at one end and to front side lands of the array of lands at the other end to shield active circuitry from interference through the sides of the die.Type: GrantFiled: March 31, 2016Date of Patent: November 30, 2021Assignee: Intel CorporationInventors: Vijay K. Nair, Digvijay Raorane
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Patent number: 11188264Abstract: A memory system includes a nonvolatile (NV) memory device with asymmetry between intrinsic read operation delay and intrinsic write operation delay. The system can select to perform memory access operations with the NV memory device with the asymmetry, in which case write operations have a lower delay than read operations. The system can alternatively select to perform memory access operations with the NV memory device where a configured write operation delay that matches the read operation delay.Type: GrantFiled: February 3, 2020Date of Patent: November 30, 2021Assignee: Intel CorporationInventors: Shekoufeh Qawami, Philip Hillier, Benjamin Graniello, Rajesh Sundaram
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Patent number: 11190208Abstract: Computing devices and techniques for providing link partner health reporting are described. In one embodiment, for example, an apparatus may include at least one memory, and logic, at least a portion of the logic comprised in hardware coupled to the at least one memory, the logic to determine a plurality of error counters, each of the plurality of error counters associated with a number of errors, determine the number of errors for each data unit of a plurality of data units associated with a data block, increment each of the plurality of error counters corresponding with the number of errors for each data unit of the plurality of data units, provide a plurality of error counts for the data block to a link partner, the plurality of error counts corresponding to the number of errors accumulated in each of the plurality of error counters for the data block, and reset the plurality of error counters. Other embodiments are described and claimed.Type: GrantFiled: June 18, 2020Date of Patent: November 30, 2021Assignee: Intel CorporationInventors: Adee Ofir Ran, Amir Mezer, Alon Meisler, Assaf Benhamou, Itamar Levin, Yoni Landau
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Patent number: 11188341Abstract: In one embodiment, an apparatus includes: a plurality of execution lanes to perform parallel execution of instructions; and a unified symbolic store address buffer coupled to the plurality of execution lanes, the unified symbolic store address buffer comprising a plurality of entries each to store a symbolic store address for a store instruction to be executed by at least some of the plurality of execution lanes. Other embodiments are described and claimed.Type: GrantFiled: March 26, 2019Date of Patent: November 30, 2021Assignee: Intel CorporationInventors: Jeffrey J. Cook, Srikanth T. Srinivasan, Jonathan D. Pearce, David B. Sheffield