Abstract: Systems, apparatuses and methods may provide for technology that estimates poses of a plurality of input images, reconstructs a proxy three-dimensional (3D) geometry based on the estimated poses and the plurality of input images, detects a user selection of a virtual viewpoint, encodes, via a first neural network, the plurality of input images with feature maps, warps the feature maps of the encoded plurality of input images based on the virtual viewpoint and the proxy 3D geometry, and blends, via a second neural network, the warped feature maps into a single image, wherein the first neural network is deep convolutional network and the second neural network is a recurrent convolutional network.

Abstract: Techniques related to automatically segmenting video frames into per pixel fidelity object of interest and background regions are discussed. Such techniques include applying tessellation to a video frame to generate feature frames corresponding to the video frame and applying a segmentation network implementing context aware skip connections to an input volume including the feature frames and a context feature volume corresponding to the video frame to generate a segmentation for the video frame.

Abstract: There is disclosed in one example a heat dissipator for an electronic apparatus, including: a planar vapor chamber having a substantially rectangular form factor, wherein a second dimension d2 of the rectangular form factor is at least approximately twice a first dimension d1 of the rectangular form factor; a first fan and second fan; and a first heat pipe and second heat pipe discrete from the planar vapor chamber and disposed along first and second d1 edges of the planar vapor chamber, further disposed to conduct heat from the first and second d1 edges to the first and second fan respectively.

Abstract: An integrated circuit includes a package substrate that includes first and second electrical traces. The integrated circuit includes first, second, third, and fourth configurable dies, which are mounted on the package substrate. The first and second configurable dies are arranged in a first row. The third and fourth configurable dies are arranged in a second row, which is approximately parallel to the first row. The first and third configurable dies are arranged in a first column. The second and fourth configurable dies are arranged in a second column, which is approximately parallel to the first column. The first electrical trace couples the first and third configurable dies, and the second electrical trace couples the second and third configurable dies. The second electrical trace is oblique with respect to the first electrical trace. The oblique trace improves the latency of signals transmitted between dies and thereby increases the circuit operating speed.

Abstract: A microelectronic structure, a semiconductor package including the structure, an IC device assembly including the structure, and a method of making the structure. The microelectronic structure includes: a first buildup layer and a second buildup layer including respective first and second electrically conductive structures; and a bridge layer including a glass material extending across a width thereof, the bridge layer between the first buildup layer and the second buildup layer and comprising: an interconnect bridge including third electrically conductive structures coupling a first set of the first electrically conductive structures to a second set of the first electrically conductive structures. Through glass vias (TGVs) extending from a top surface to a bottom surface of the bridge layer, the TGVs coupling a third set of the first electrically conductive structures to at least some of the second electrically conductive structures.

Abstract: In one embodiment, an integrated circuit device includes a first layer having input/output (IO) hub circuitry to interconnect a plurality of integrated circuit dies, and a second layer having a plurality of integrated circuit dies electrically connected to the IO hub circuitry. The first layer may include glass, and the IO hub circuitry may be in a die embedded within the first layer. The integrated circuit dies may be electrically connected to the IO hub circuitry through an interposer.

Abstract: Some demonstrative embodiments include devices, systems and/or methods of simultaneously communicating with a group of wireless communication devices. For example, a device may include a wireless communication unit to communicate with at least one group of a plurality of wireless communication devices over a wireless communication medium, wherein the wireless communication unit is to reserve the wireless communication medium for a time period, during which the wireless communication unit is to simultaneously transmit two or more different wireless communication transmissions to two or more wireless communication devices of the group, respectively. Other embodiments are described and claimed.

Abstract: Embodiments described herein are generally directed to improvements relating to power, latency, bandwidth and/or performance issues relating to GPU processing/caching. According to one embodiment, a system includes a producer intellectual property (IP) (e.g., a media IP), a compute core (e.g., a GPU or an AI-specific core of the GPU), a streaming buffer logically interposed between the producer IP and the compute core. The producer IP is operable to consume data from memory and output results to the streaming buffer. The compute core is operable to perform AI inference processing based on data consumed from the streaming buffer and output AI inference processing results to the memory.

Abstract: Embodiments described herein provide a processing apparatus comprising compute circuitry to generate neural network data for a convolutional neural network (CNN) and write the neural network data to a memory buffer. The compute circuitry additionally includes a direct memory access (DMA) controller including a hardware codec having encode circuitry and a decode circuitry. The DMA controller reads the neural network data from the memory buffer, encode the neural network data via the encode circuit, writes encoded neural network data to a memory device coupled with the processing apparatus, writes metadata for the encoded neural network data to the memory device coupled with the processing apparatus, and decodes encoded neural network data via the decode circuit in response to a request from the compute circuitry.

Abstract: Examples described herein relate to a network interface device comprising a multi-stage programmable packet processing pipeline circuitry to determine a path to transmit a packet based on relative network traffic transmitted via multiple paths. In some examples, determine a path to transmit a packet is based on Deficit Round Robin (DRR). In some examples, the programmable packet processing pipeline circuitry includes: a first stage to manage two or more paths, wherein a path of the two or more paths of the first stage is associated with two or more child nodes, a second stage to manage two or more paths, wherein a path of the two or more paths of the second stage is associated with two or more child nodes, and at least one child node is associated with the determined path.

Abstract: Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a conductive pad having a first surface, an opposing second surface, and lateral surfaces extending between the first and second surfaces; a conductive via coupled to the first surface of the conductive pad; a liner on the second surface and on the lateral surfaces of the conductive pad, wherein a material of the liner includes nickel, palladium, or gold; a microelectronic component having a conductive contact; and an interconnect electrically coupling the conductive contact of the microelectronic component and the liner on the second surface of the conductive pad, wherein a material of the interconnect includes nickel or tin.

Abstract: For example, an Access Point (AP) may be configured to configure a trigger frame to indicate an allocation of a triggered contention-based period to be allocated within a Transmit Opportunity (TxOP) of the AP. For example, the trigger frame may be configured to indicate that only one or more eligible non-AP stations (STAs), which are eligible to communicate during the triggered contention-based period, are to be allowed to contend a wireless medium during the triggered contention-based period. For example, the AP may be configured to transmit the trigger frame to initiate the allocation of the triggered contention-based period. For example, a non-AP STA may be configured to be allowed to contend the wireless medium for a transmission during the triggered contention-based period, for example, based on a determination that the non-AP STA is to be defined as an eligible non-AP STA for the triggered contention-based period.

Abstract: A mechanism is described for facilitating defining of interoperability signaling and conformance points for the PCC standard in computing environments. A computing device of embodiments, as described herein, includes a decoder to decode a compressed bitstream of video data representing a point cloud, point cloud reconstructor circuitry to reconstruct a point cloud from the decoded patch video data, a syntax element parser to receive at least one syntax element representing interoperability signaling in the compressed bitstream to indicate the number of points in one or more pictures of the video data, and processing hardware to determine if the number of points in the one or more pictures of the compressed bitstream is within the conformance limits of the point cloud reconstructor circuitry.

Abstract: Embodiments of a microelectronic assembly comprise: a package substrate including a first integrated circuit (IC) die embedded therein; and a second IC die coupled to the package substrate and conductively coupled to the first IC die by vias in the package substrate. The package substrate has a first side and an opposing second side, the second IC die is coupled to the first side of the package substrate, the first IC die is between the first side of the package substrate and the second side of the package substrate, the package substrate comprises a plurality of layers of conductive traces in an organic dielectric material, the first IC die is surrounded by the organic dielectric material of the package substrate, the vias are in the organic dielectric material between the first IC die and the first side of the package substrate, and the first IC die comprises through-substrate vias.

Abstract: Described herein is a computer memory system comprising a plurality of memory banks or other memory structures and circuitry configured to implement a hash function that produces output values that evenly distribute strided memory accesses across the plurality of memory structures. The memory banks can be cache memory banks that may include a plurality of cache lines, cache sets, or cache ways. The memory banks can also be DRAM memory banks accessed through different memory channels. The hash function facilitates the even distribution across memory structures in the face of a plurality of different strided memory access patterns.

Abstract: Techniques to improve performance of matrix multiply operations are described in which a compute kernel can specify one or more element-wise operations to perform on output of the compute kernel before the output is transferred to higher levels of a processor memory hierarchy.

Abstract: Described herein are apparatuses, systems, and methods associated with a voltage regulator circuit that includes one or more thin-film transistors (TFTs). The TFTs may be formed in the back-end of an integrated circuit. Additionally, the TFTs may include one or more unique features, such as a channel layer treated with a gas or plasma, and/or a gate oxide layer that is thicker than in prior TFTs. The one or more TFTs of the voltage regulator circuit may improve the operation of the voltage regulator circuit and free up front-end substrate area for other devices. Other embodiments may be described and claimed.

Abstract: Embodiments provide mechanisms to facilitate compute operations for deep neural networks. One embodiment comprises a graphics processing unit comprising one or more multiprocessors, at least one of the one or more multiprocessors including a register file to store a plurality of different types of operands and a plurality of processing cores. The plurality of processing cores includes a first set of processing cores of a first type and a second set of processing cores of a second type. The first set of processing cores are associated with a first memory channel and the second set of processing cores are associated with a second memory channel.

Abstract: Embodiments of systems, apparatuses and methods provide enhanced function as a service (FaaS) to users, e.g., computer developers and cloud service providers (CSPs). A computing system configured to provide such enhanced FaaS service include one or more controls architectural subsystems, software and orchestration subsystems, network and storage subsystems, and security subsystems. The computing system executes functions in response to events triggered by the users in an execution environment provided by the architectural subsystems, which represent an abstraction of execution management and shield the users from the burden of managing the execution. The software and orchestration subsystems allocate computing resources for the function execution by intelligently spinning up and down containers for function code with decreased instantiation latency and increased execution scalability while maintaining secured execution.

Abstract: Generally discussed herein are systems, devices, and methods to reduce crosstalk interference. An interconnect structure can include a first metal layer, a second metal layer, a third metal layer, the first metal layer closer to the first and second dies than the second and third metal layers, the first metal layer including a ground plane within a footprint of a bump field of the interconnect structure and signal traces outside the footprint of the bump field.

Abstract: Quantum dot devices with three of more accumulation gates provided over a single row of a quantum dot formation region are disclosed. Each accumulation gate is electrically coupled to a respective doped region. In this manner, multiple single electron transistors (SETs) are provided along the row. Side and/or center screening gates may be used to apply microwave pulses for qubit control and to control electrostatics so that source and drain regions of the multiple SETs with quantum dots formed along the single row of a quantum dot formation region are sufficiently isolated from one another. Such quantum dot devices provide strong spatial localization of the quantum dots, good control over quantum dot interactions and manipulation, good scalability in the number of quantum dots included in the device, and/or design flexibility in making electrical connections to the quantum dot devices to integrate the quantum dot devices in larger computing devices.

Abstract: Disclosed herein are IC structures with one or more decoupling capacitors based on dummy TSVs provided in a support structure. An example decoupling capacitor includes first and second capacitor electrodes and a capacitor insulator between them. The first capacitor electrode is a liner of a first electrically conductive material on sidewalls and a bottom of an opening in the support structure, the opening in the support structure extending from the first side towards, but not reaching, the second side. The capacitor insulator is a liner of a dielectric material on sidewalls and a bottom of the opening in the support structure lined with the first electrically conductive material. The second capacitor electrode is a second electrically conductive material filling at least a portion of the opening in the support structure lined with the first electrically conductive material and with the dielectric material.

Abstract: Apparatus, systems, articles of manufacture, and methods to generate acceptability criteria for autonomous systems plans are disclosed. An example apparatus includes a data compiler to compile data generated by the autonomous system into an autonomous system task dataset, a data encoder to encode the dataset for input into a rule distillation neural network architecture, a model trainer to train the rule distillation neural network architecture, an adaptor to adapt the trained rule distillation neural network architecture to a new input data domain using the autonomous system task dataset, a verifier to generate formally verified acceptability criteria, and an inferer to evaluate a control command, the evaluation resulting in an acceptance or rejection of the command.

Abstract: Thermal heat spreaders and/or an IC die with solderable thermal structures may be assembled together with a solder array thermal interconnects. A thermal heat spreader may include a non-metallic material and one or more metallized surfaces suitable for bonding to a solder alloy employed as thermal interface material between the heat spreader and an IC die. An IC die may include a metallized back-side surface similarly suitable for bonding to a thermal interconnect comprising a solder alloy. Metallization on the IC die and/or heat spreader may comprise a plurality of solderable structures. A multi-chip package may include multiple IC die having different die thickness that are accommodated by a z-height thickness variation in the thermal interconnects and/or the solderable structures of the IC die or heat spreader.

Abstract: Some demonstrative embodiments include apparatuses, devices, systems and methods of communicating an Enhanced Directional Multi-Gigabit (DMG) (EDMG) Physical Layer Protocol Data Unit (PPDU). For example, an EDMG wireless communication station (STA) may be configured to communicate an EDMG PPDU including a Channel Estimation Field (CEF) and/or a pilot sequence, which may be configured for an OFDM mode.

Abstract: A method is described. The method includes performing the following on a flash memory chip: measuring a temperature of the flash memory chip; and, changing a program step size voltage of the flash memory chip because the temperature of the flash memory chip has changed.

Abstract: An apparatus for generating a frequency estimate of an output signal includes a reference signal generator configured to generate a reference clock signal. The apparatus includes frequency estimation circuitry configured to generate a cycle count based frequency estimation of the output signal based on the reference clock signal and a clock cycle count of the output signal. The frequency estimation circuitry further generates a fractional frequency estimation of the output signal based on the reference clock signal and a plurality of time-to-digital conversion phase samples of the output signal. The frequency estimation circuitry further generates the frequency estimate of the output signal using the cycle count based frequency estimation within a range and a frequency error determined from the fractional frequency estimation. The plurality of time-to-digital conversion phase samples and the cycle count based frequency estimation use a same number of reference clock cycles of the reference clock signal.

Abstract: In one embodiment, a host controller includes: a first input/output (I/O) buffer to couple to a first communication line of an interconnect; a second I/O buffer to couple to a second communication line of the interconnect; and a device group selection circuit to dynamically cause the first communication line to communicate a clock signal to a first device group including one or more first devices to couple to the interconnect and dynamically cause the second communication line to communicate a data signal to the first device group when a communication is to be addressed to at least one of the one or more first devices of the first device group, such that the communication is transparent to at least another device group to couple to the interconnect. Other embodiments are described and claimed.

Abstract: Apparatus and Method for Fault Handling of an Offload Transaction. For example, one embodiment of a processor comprises: a plurality of cores; an interconnect coupling the plurality of cores; and offload circuitry to transfer work from a first core of the plurality of cores to a second core of the plurality of cores without operating system (OS) intervention, the work comprising a plurality of instructions; the second core comprising first fault management logic to determine an action to take responsive to a fault condition, wherein responsive to detecting a first type of fault condition, the first fault management logic is to cause the first core to be notified of the fault condition, the first core comprising second fault management logic to attempt to resolve the fault condition.

Abstract: A communication device includes a power amplifier that generates power signals according to one or more operating bands of communication data, with the amplitude being driven and generated in output stages of the power amplifier. The final stage can include an output passive network that suppresses suppress an amplitude modulation-to-phase modulation (AM-PM) distortion. During a back-off power mode a bias of a capacitive unit of the output power network component can be adjusted to minimize an overall capacitance variation. An output passive network can further generate a flat-phase response between dual resonances of operation.

Abstract: Hybrid microelectronic substrates, and related devices and methods, are disclosed herein. In some embodiments, a hybrid microelectronic substrate may include a low-density microelectronic substrate having a recess at a first surface, and a high-density microelectronic substrate disposed in the recess and coupled to a bottom of the recess via solder.

Abstract: An embodiment of a semiconductor package apparatus may include technology to identify workload control variables, add workload flags to respective edges in a static single assignment graph, and propagate constants based on the identified workload control variables and the workload flags. Other embodiments are disclosed and claimed.

Abstract: A die assembly is disclosed. The die assembly includes a die, one or more die pads on a first surface of the die and a die attach film on the die where the die attach film includes one or more openings that expose the one or more die pads and that extend to one or more edges of the die.

Abstract: Described is an apparatus which comprises: a plurality of transistors coupled to an input power supply and to a load; a first comparator with a first node coupled to the load, and a second node coupled to a first reference; a second comparator with a first node coupled to the load, and a second node coupled to a second reference, the second reference being different from the first reference; and a logic unit to receive output of the first comparator and output of the second comparator, the logic unit to turn on or off transistors of the plurality of transistors according to outputs of the first and second comparators.

Abstract: Techniques related to parallel partitioning and coding mode selection for improved video coding throughput are discussed. Such techniques include performing parallel partitioning and coding mode selection for a lower-right coding unit of a first largest coding unit and an upper-left coding unit of a second largest coding unit to the right of the first largest coding unit and, immediately subsequent thereto, performing parallel partitioning and coding mode selection for a lower-left coding unit and an upper-right coding unit of the second largest coding unit.

Abstract: Computing devices, computer-readable storage media, and methods associated with human computer interaction. In embodiments, a computing device may include a display, a processor coupled with the display, a user interface engine and one or more applications to be operated on the processor. In embodiments, the user interface engine or the one or more applications may be configured to detect movement of the portable computing device indicating a direction a user of the portable computing device would like a portion of the user interface to move and cause the portion of the user interface to be moved, from a current location on the display to another location on the display, in accordance with the indicated direction. Such movement may facilitate the user to interact with the portion of the user interface via the interaction zone of the display. Other embodiments may be described and/or claimed.

Abstract: Embodiments disclosed herein include semiconductor devices with source/drain interconnects that include a barrier layer. In an embodiment the semiconductor device comprises a source region and a drain region. In an embodiment, a semiconductor channel is between the source region and the drain region, and a gate electrode is over the semiconductor channel. In an embodiment, the semiconductor device further comprises interconnects to the source region and the drain region. In an embodiment, the interconnects comprise a barrier layer, a metal layer, and a fill metal.

Abstract: Embodiments are directed to providing a secure address translation service. An embodiment of a system includes memory for storage of data, an IOMMU coupled to the memory, and a host-to-device link to couple the IOMMU with one or more devices and to operate as a translation agent on behalf of one or more devices in connection with memory operations relating to the memory, including receiving a translated request from a discrete device via the host-to-device link specifying a memory operation and a physical address within the memory pertaining to the memory operation, determining page access permissions assigned to a context of the discrete device for a physical page of the memory within which the physical address resides, allowing the memory operation to proceed when the page access permissions permit the memory operation, and blocking the memory operation when the page access permissions do not permit the memory operation.

Abstract: A transistor includes a body of semiconductor material, where the body has laterally opposed body sidewalls and a top surface. A gate structure contacts the top surface of the body. A source region contacts a first one of the laterally opposed body sidewalls and a drain region contacts a second one of the laterally opposed body sidewalls. A first isolation region is under the source region and has a top surface in contact with a bottom surface of the source region. A second isolation region is under the drain region and has a top surface in contact with a bottom surface of the drain region. Depending on the transistor configuration, a major portion of the inner-facing sidewalls of the first and second isolation regions contact respective sidewalls of either a subfin structure (e.g., FinFET transistor configurations) or a lower portion of a gate structure (e.g., gate-all-around transistor configuration).

Abstract: This disclosure describes systems, methods, and devices related to a distributed relay. The distributed relay may utilize beamforming and/or a specific physical arrangement of transmit and receive antennas to ensure a high isolation between antennas. The distributed relay may further facilitate the concurrent operation of two different intermediate frequency (IF) chains to support communications between a network entity and user device, receiving and transmitting data on each of the two IF chains independently of one another.

Abstract: Technologies for providing efficient migration of services include a server device. The server device includes compute engine circuitry to execute a set of services on behalf of a terminal device and migration accelerator circuitry. The migration accelerator circuitry is to determine whether execution of the services is to be migrated from an edge station in which the present server device is located to a second edge station in which a second server device is located, determine a prioritization of the services executed by the server device, and send, in response to a determination that the services are to be migrated and as a function of the determined prioritization, data utilized by each service to the second server device of the second edge station to migrate the services. Other embodiments are also described and claimed.

Abstract: Embodiments disclosed herein include forksheet transistor devices having a dielectric or a conductive spine. For example, an integrated circuit structure includes a dielectric spine. A first transistor device includes a first vertical stack of semiconductor channels spaced apart from a first edge of the dielectric spine. A second transistor device includes a second vertical stack of semiconductor channels spaced apart from a second edge of the dielectric spine. An N-type gate structure is on the first vertical stack of semiconductor channels, a portion of the N-type gate structure laterally between and in contact with the first edge of the dielectric spine and the first vertical stack of semiconductor channels. A P-type gate structure is on the second vertical stack of semiconductor channels, a portion of the P-type gate structure laterally between and in contact with the second edge of the dielectric spine and the second vertical stack of semiconductor channels.

Abstract: An apparatus and method for merging primitives and coordinating between vertex and ray transformations on a shared transformation unit. For example, one embodiment of a graphics processor comprises: a queue comprising a plurality of entries; ordering circuitry/logic to order triangles front to back within the queue; pairing circuitry/logic to identify triangles in the queue sharing an edge and to merge the triangles sharing an edge to produce merged triangle pairs; and shared transformation circuitry to alternate between performing vertex transformations on vertices of the merged triangle pairs and to performing ray transformations on ray direction/origin data.

Abstract: Systems, apparatuses and methods may provide for detecting an identifier communication from a writing implement and transitioning a previously modified interior page of an electronic notepad from a locked state to an unlocked state if the identifier communication corresponds to one or more stored identifiers. Moreover, a plurality of additional interior pages of the electronic notepad may be maintained in the locked state while the previously modified interior page is in the unlocked state.

Abstract: Embodiments of an Extremely High Throughput Station (EHT STA) (STA1) configured for operating in a next-generation (NG) wireless local area network (WLAN) are described herein. In some embodiments, the EHT STA encodes a common signal field (SIG) (Coex-SIG) of an EHT PPDU to include a TXOP duration field. The TXOP duration field is more than seven bits to indicate an actual TXOP duration of a transmission from the EHT STA comprising the EHT PPDU transmitted to a second station (STA2). Decoding the TXOP duration field of the EHT PPDU by a third-party station (STA4) causes the third-party station (STA4) to defer a transmission until after an end of the transmission from the second station (STA2).

Abstract: Embodiments herein may include systems, apparatuses, methods, and computer-readable media, for a multi-access edge computing (MEC) system. An apparatus for MEC may include a communication interface, a local cost measurements module, and a service allocation module. The communication interface may receive, from a UE, a request for a service to be provided to the UE. The local cost measurements module may collect a set of local cost measurements for the service. The service allocation module may determine to allocate the service to a MEC host based on an allocation policy related to a cost for the MEC host to provide the service or a cost for a service provider to provide the service in view of the one or more local cost measurements. Other embodiments may be described and/or claimed.

Abstract: Embodiments of the disclosure are in the field of advanced integrated circuit structure fabrication and, in particular, integrated circuit structures having germanium-based channels are described. In an example, an integrated circuit structure includes a fin having a lower silicon portion, an intermediate germanium portion on the lower silicon portion, and a silicon germanium portion on the intermediate germanium portion. An isolation structure is along sidewalls of the lower silicon portion of the fin. A gate stack is over a top of and along sidewalls of an upper portion of the fin and on a top surface of the isolation structure. A first source or drain structure is at a first side of the gate stack. A second source or drain structure is at a second side of the gate stack.

Abstract: Methods, apparatus, systems, and articles of manufacture to load data into an accelerator are disclosed. An example apparatus includes data provider circuitry to load a first section and an additional amount of compressed machine learning parameter data into a processor engine. Processor engine circuitry executes a machine learning operation using the first section of compressed machine learning parameter data. A compressed local data re-user circuitry determines if a second section is present in the additional amount of compressed machine learning parameter data. The processor engine circuitry executes a machine learning operation using the second section when the second section is present in the additional amount of compressed machine learning parameter data.

Abstract: In one embodiment, an apparatus includes: a port circuit to receive a configuration write from a source circuit; a save restore memory coupled to the port circuit to store information of a plurality of control and status registers (CSRs); and a configuration network coupled to the port circuit, the configuration network coupled to a plurality of nodes, each of the plurality of nodes comprising at least one CSR. The port circuit may be configured to send the configuration write to a first node of the plurality of nodes and to the save restore memory. Other embodiments are described and claimed.

Abstract: Systems, apparatuses and methods may provide for technology that resumes a program operation with respect to NAND memory during a first tier in response to a suspension counter reaching a first threshold and resumes the program operation with respect to the NAND memory during a second tier in response to the suspension counter reaching a second threshold. The technology may also resume the program operation with respect to the NAND memory during a third tier in response to the suspension counter reaching a third threshold. Additionally, the technology may service one or more read operations with respect to the NAND memory until the suspension counter reaches the first threshold during the first tier, until the suspension counter reaches the second threshold during the second tier, and until the suspension counter reaches the third threshold during the third tier.