Samsung Electronics Patents

Samsung Electronics Co., Ltd. is a Korean electronics manufacturer and a part of the Samsung Group. Samsung Electronics manufactures and sells consumer electronics, including cell phones, televisions, tablets, digital cameras, computers, home appliances and home theater and audio components.

Samsung Electronics Patents by Type
  • Publication number: 20240152280
    Abstract: The present disclosure provides methods and apparatuses for programming operating system (OS) data before a surface mount technology (SMT) process. In some embodiments, a method includes erasing a plurality of memory cells in a memory block, classifying word lines coupled to the memory block into first word lines to be programmed with OS data and second word lines to be programmed in a state pattern, programming, with a multi-bit program, the OS data into first memory cells of the plurality of memory cells coupled to the first word lines, and programming second memory cells of the plurality of memory cells coupled to the second word lines to have the state pattern.
    Type: Application
    Filed: July 11, 2023
    Publication date: May 9, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyojin AHN, Dongwoo SHIN, Seongkuk KIM, Changjun LEE, Sungjun HONG
  • Publication number: 20240153425
    Abstract: Some example embodiments provides a display device including: a display panel on which a plurality of data lines are positioned; a source driver including a plurality of output switches connected to the plurality of data lines and supplying a plurality of data signals to the plurality of data lines during a period in which the plurality of output switches are turned on by an output control signal; and a source control circuit that differently controls an on-slew rate of the output control signal for each of a plurality of display areas of the display panel according to a distance between each display area and the source driver.
    Type: Application
    Filed: June 5, 2023
    Publication date: May 9, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Taek Su KWON, Woojoo KIM, Dongwook SUH
  • Publication number: 20240152636
    Abstract: According to an embodiment, an electronic device includes a memory, a first processor coupled to the memory and configured to control the electronic device in a normal execution environment (REE), and a second processor coupled to the memory and configured to control the electronic device in a secure execution environment (TEE). The first processor in the REE may be configured to transfer, to the second processor in the TEE, a request for generating a block including verification data of a data chunk. The second processor may be configured to generate the verification data of the data chunk by using key information of the electronic device, sign the verification data, and transmit, to an external electronic device, the block including the signed verification data.
    Type: Application
    Filed: November 3, 2023
    Publication date: May 9, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kyungsun CHO, Woochul SHIM
  • Publication number: 20240153563
    Abstract: A semiconductor memory device includes a source layer, a channel structure, gate electrodes on the source layer and spaced apart on a sidewall of the channel structure, and a common source line. The gate electrodes include a first word line group including first and second gate electrodes and a second word line group including third and fourth gate electrodes. The semiconductor memory device, in response to a voltage of the common source line reaching a target voltage, causes an inhibition voltage to be applied to the second word line group and an erase voltage to be applied to the first word line group in a first erase operation interval, and causes the inhibition voltage to be applied to the first word line group and the erase voltage to be applied to the second word line group in a second erase operation interval.
    Type: Application
    Filed: December 19, 2023
    Publication date: May 9, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Hye Ji LEE, Jin-Kyu KANG, Rae Young LEE, Se Jun PARK, Jae Duk LEE, Gu Yeon HAN
  • Publication number: 20240152283
    Abstract: A method for performing an inference includes: detecting a context among at least one context associated with at least one application; triggering a model execution command to a smart agent of an electronic device, based on the detected context; loading a machine learning (ML) model into a secure storage of the electronic device, based on the detected context and the triggered model execution command; generating, using the loaded ML model, an inference, based on data associated with the detected context; and sharing the generated inference with each application of the at least one application that is registered for the detected context.
    Type: Application
    Filed: July 31, 2023
    Publication date: May 9, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Aarif ZAFAR, Renju Chirakarotu NAIR, Nikhil SAHNI, Sagar Mahesh MALIYE, Aditya JHAWAR, Rajesh Kumar PANDA
  • Publication number: 20240153460
    Abstract: A display device includes a display area and a peripheral area disposed adjacent to the display area, a display element arranged in the display area, a first semiconductor layer, a gate conductive layer, a first connection electrode layer, and a second connection electrode layer, sequentially arranged on a substrate, and a bias voltage supply line arranged in the peripheral area. The bias voltage supply line includes a top supply line and a bottom supply line arranged on different layers, and the top supply line and the second connection electrode layer are arranged on a same layer.
    Type: Application
    Filed: November 6, 2023
    Publication date: May 9, 2024
    Applicant: Samsung Display Co., LTD.
    Inventors: Junhyun Park, Hyeongseok Kim, Heejean Park, Sunhwa Lee, Mukyung Jeon
  • Publication number: 20240152284
    Abstract: A storage controller configured to control a nonvolatile memory includes a one-time programmable (OTP) memory configured to store a first public key, and a processor configured to, based on a first signature added to a firmware image including a host authentication public key being verified using the first public key, receive a storage command including at least one second public key and a first host authentication signature for the at least one second public key and store the at least one second public key in the OTP memory based on the first host authentication signature being verified using the host authentication public key.
    Type: Application
    Filed: August 10, 2023
    Publication date: May 9, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yongjae Lee, Dongbin Park, Wonje Heo
  • Publication number: 20240153919
    Abstract: A semiconductor package includes a first semiconductor chip including a circuit layer on a first substrate, first through silicon vias passing through the first substrate, first lower bump pads on the circuit layer, and a first upper bump pad and a second upper bump pad on a second surface of the first substrate, each of the first upper bump pad and the second upper bump pad connected to a corresponding one of the first through silicon vias. The package includes a second semiconductor chip including a circuit layer on a first surface of a second substrate, and second lower bump pads on the circuit layer on the second substrate. The package includes a first solder bump to bond the first upper bump pad and the second lower bump pad, and a plurality of second solder bumps to bond the second upper bump pad and the second lower bump pads.
    Type: Application
    Filed: August 17, 2023
    Publication date: May 9, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Hyeonjeong KIM, Jongmin LEE, Jimin CHOI
  • Publication number: 20240152289
    Abstract: There is provided a storage device, which includes: a memory device that includes a plurality of memory blocks, and stores first meta data including first status data and a first parameter in a first memory block among the plurality of memory blocks; and a memory controller that stores second meta data including second status data and second parameters, determines final meta data among a plurality of pieces of meta data including the first meta data and the second status data by comparing a plurality of pieces of status data with the first status data and the second status data, performs parameter confirmation for storing the final meta data in the meta block, and controls the memory device based on a parameter stored in the meta block.
    Type: Application
    Filed: May 12, 2023
    Publication date: May 9, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: SANGJIN YOO, KWANGWOO LEE, HEEWON LEE, Byungchan Park, HYOJIN AHN, DONGCHEUL JANG
  • Publication number: 20240155212
    Abstract: A camera module includes: a first body including a substrate; an image sensor mounted on the substrate; a second body including a lens module; a ball bearing disposed between the first body and the second body to enable movement of the second body relative to the first body; and a driving member disposed between the first body and the second body to provide driving force to move the second body in at least one direction intersecting an optical axis.
    Type: Application
    Filed: May 16, 2023
    Publication date: May 9, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Do Hwan KIM, Ju Ho KIM, Sang Hyun JI, Jung Hyun PARK, Nam Keun OH, Doo Seub SHIN, Dong Hoon LEE, Jong Eun PARK, Sangik CHO
  • Publication number: 20240152307
    Abstract: Disclosed is an electronic device including a housing structure including a hinge, a first housing connected to the hinge, a first surface and a second surface oriented in a direction opposite to the first surface, a second housing connected to the hinge. The second housing may include a sensor, a third surface and a fourth surface oriented in a direction opposite to the third surface, the first surface facing the third surface in a folded state, and the first surface and the third surface being oriented in a same direction in an unfolded state, a first display provided over the first surface and the third surface.
    Type: Application
    Filed: January 12, 2024
    Publication date: May 9, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Joonsung HAN, Jinkyo CHUNG
  • Publication number: 20240153830
    Abstract: A semiconductor device includes a semiconductor die, a detection structure, a path control circuit and a detection circuit. The semiconductor die includes a central region in which a semiconductor integrated circuit is provided and an external region surrounding the central region. The detection structure is provided in the external region. The path control circuit includes a plurality of switches that controls electrical connection of the detection structure. The detection circuit determines whether a defect is present in the semiconductor die and a location of the defect based on a difference signal. The difference signal corresponds to a difference between a forward direction test output signal and a backward direction test output signal obtained by propagating a test input signal through the detection structure in a forward direction and a backward direction, respectively, via the path control circuit.
    Type: Application
    Filed: April 26, 2023
    Publication date: May 9, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Gyosoo CHOO, Daeseok BYEON, Sunghun KIM
  • Publication number: 20240152308
    Abstract: A multi-display device includes a plurality of display modules. At least one display module of the plurality of display modules includes: a receiver to receive first video data and first control data from another display module connected to a front stage, from among the plurality of display modules, or an external input device; one or more processors to obtain, from the first video data, a first area corresponding to video data that the at least one display module displays; and a merger to: allocate, to the first area, second control data including remaining control data of the first control data other than control data of the first control data to control the at least one display module, and merge the second control data with second video data including remaining video data of the first video data other than video data of the first video data that the at least one display module displays.
    Type: Application
    Filed: January 5, 2024
    Publication date: May 9, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sejun Kim, Kibo Kim, Jinsub Kim
  • Publication number: 20240153886
    Abstract: A semiconductor package includes a substrate including a substrate pad and plural vias, the substrate having a first trench on a top surface of the substrate, and a chip stack on the substrate that includes semiconductor chips. A chip pad of a first semiconductor chip, which is a lowermost one of the semiconductor chips, is bonded to the substrate pad of the substrate. The chip pad and the substrate pad are formed of a same metallic material. The first trench overlaps with a corner of the first semiconductor chip, when viewed in plan view.
    Type: Application
    Filed: July 24, 2023
    Publication date: May 9, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Haseob Seong, Seungduk Baek, Ae-Nee Jang
  • Publication number: 20240148206
    Abstract: A dust separation device includes: an air inlet, a dust collection chamber to collect dust in air flowing in from an air inlet, a rotating body rotatable inside the dust collection chamber and including a blocking member formed to block dust from the air flowing in from the air inlet, a motor to rotate the rotating body, a fixing body arranged to be spaced apart from the rotating body and supporting the motor, and a sealing member configured to seal at least a portion of a gap portion formed between the rotating body and the fixing body to prevent dust from entering the gap portion, the sealing member including a brush in contact with at least one of the rotating body and the fixing body.
    Type: Application
    Filed: January 8, 2024
    Publication date: May 9, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Yunsoo JANG, Seokman HONG, Kihwan KWON, Dokyung LEE, Joongkeun CHOI
  • Publication number: 20240153567
    Abstract: The present disclosure provides apparatuses and methods for operating a flash memory for programming operating system (OS) data before an surface mount technology (SMT) process. In some embodiments, the method includes erasing a plurality of memory cells in a memory block, reducing a lateral charge loss of the plurality of memory cells due to high temperature degradation during the SMT process by applying a pre-program voltage to word lines coupled to the memory block, and performing multi-bit programming of the OS data in the plurality of memory cells, prior to performing the SMT process. The applying of the pre-program voltage causes threshold voltages of the plurality of memory cells to increase.
    Type: Application
    Filed: June 13, 2023
    Publication date: May 9, 2024
    Applicant: Samsung Electronics Co.,Ltd.
    Inventors: Hyojin AHN, Seongkuk KIM, Dongwoo SHIN, Seoyeong LEE, Changjun LEE, Hoon JO
  • Publication number: 20240153238
    Abstract: An electronic device using a spatio-temporal self-similarity (STSS) and a method of operating the electronic device are disclosed. The electronic device may generate an STSS tensor including a spatial self-similarity map and spatial cross-similarity maps for each position of a video feature map corresponding to an input video based on a temporal offset and a spatial offset. STSS feature vectors may be generated from the STSS tensor by decreasing a dimension of the spatial offset and maintaining a dimension of the temporal offset for each position of the STSS tensor. An STSS feature map may be generated by integrating the dimension of the temporal offset for each position of the STSS feature vectors. An inference on the input video may be based on a result of adding the STSS feature map to the video feature map.
    Type: Application
    Filed: October 31, 2022
    Publication date: May 9, 2024
    Applicants: Samsung Electronics Co., Ltd., POSTECH Research and Business Development Foundation
    Inventors: Minsu CHO, Heeseung KWON, Manjin KIM, Suha KWAK
  • Publication number: 20240153948
    Abstract: A semiconductor device includes a substrate including a first region, and a second region, a first gate structure and a second gate structure on the substrate of the first region, a third gate structure and a fourth gate structure on the substrate of the second region, a first interlayer insulating film on the substrate of the first region and including a first lower interlayer insulating film and a first upper interlayer insulating film, a second interlayer insulating film on the substrate of the second region and including a second lower interlayer insulating film and a second upper interlayer insulating film, a first contact between the first gate structure and the second gate structure and within the first interlayer insulating film, and a second contact formed between the third gate structure and the fourth gate structure and within the second interlayer insulating film.
    Type: Application
    Filed: January 18, 2024
    Publication date: May 9, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Sung Soo KIM, Gi Gwan PARK, Jung Hun CHOI, Koung Min RYU, Sun Jung LEE
  • Publication number: 20240153130
    Abstract: An apparatus includes one or more processors configured to generate a plurality of feature maps having respective different resolutions based on an input image; and update, for each of the plurality of transformer layers, respective position estimation information comprising first position information of a respective bounding box corresponding to one object query and second position information of respective key points corresponding to the one object query, wherein each of the plurality of transformer layers includes a self-attention model configured to generate respective intermediate data by performing self-attention on respective content information on a feature of the input image; and a cross-attention model configured to generate respective output data by performing cross-attention on respective one or more feature maps among the plurality of feature maps and the respective generated intermediate data.
    Type: Application
    Filed: June 28, 2023
    Publication date: May 9, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Hyeongseok SON, Seungin PARK, Byung In YOO, Dongwook LEE, Solae LEE, Sangil JUNG
  • Publication number: 20240153975
    Abstract: An image sensor includes a substrate including a plurality of photoelectric conversion devices, a color filter arranged on the substrate, a reflective absorption layer on the color filter and comprising at least one of tungsten, titanium, and aluminum, an anti-reflective layer arranged on the reflective absorption layer, and a plurality of micro lenses on the anti-reflective layer. The color filter may include a plurality of dielectric layers extending in a first direction that is parallel to a rear surface of the substrate, the plurality of dielectric layers having different thicknesses in a second direction that is perpendicular to the rear surface of the substrate and perpendicular to the first direction, such that the plurality of dielectric layers includes at least one dielectric layer having a thickness in the second direction that varies along the first direction.
    Type: Application
    Filed: October 26, 2023
    Publication date: May 9, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Minkwan KIM, Minsung HEO, Jongwoo HONG, Insung JOE
  • Publication number: 20240153046
    Abstract: A computer-implemented method of configuring an electronic device for inpainting source three-dimensional (3D) scenes, includes: receiving the source 3D scenes and a user's input about a first object of the source 3D scenes; generating accurate object masks about the first object of the source 3D scenes; and generating inpainted 3D scenes of the source 3D scenes by using an inpainting neural radiance field (NeRF) based on the accurate object masks.
    Type: Application
    Filed: July 31, 2023
    Publication date: May 9, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ashkan MIRZAEI, Ttistan TY AUMENTADO-ARMSTRONG, Konstantinos G. DERPANIS, Marcus A. BRUBAKER, Igor GILITSCHENSKI, Aleksai LEVINSHTEIN
  • Publication number: 20240154073
    Abstract: According to embodiments, a light-emitting display device includes a light-emitting diode that emits blue light and green light, a color conversion layer on the light-emitting diode, and a scattering absorption layer disposed between the color conversion layer and the light-emitting diode and that transmits blue light and green light.
    Type: Application
    Filed: September 12, 2023
    Publication date: May 9, 2024
    Applicant: Samsung Display Co., LTD.
    Inventors: Gak Seok LEE, Byung-Chul KIM, Jang Wi RYU, Jae Min SEONG, Keun Chan OH, Sang Hun LEE, HALIM JI
  • Publication number: 20240153070
    Abstract: An apparatus including a processor configured to execute a plurality of instructions; and a memory storing the plurality of instructions, wherein execution of the plurality of instructions configures the processor to generate a defect prediction score of an input image through the use of a neural network provided reference image, the input image, and an enhanced image. The neural network may include an attention map modulator configured to adaptively adjust an intensity of an attention map generated during the use of the neural network.
    Type: Application
    Filed: May 19, 2023
    Publication date: May 9, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Byungjai KIM, Youngdong KIM, Jongin LIM, Seungju HAN
  • Publication number: 20240154000
    Abstract: A single crystal semiconductor structure includes: an amorphous substrate; a single crystal semiconductor layer provided on the amorphous substrate; and a thin orienting film provided between the amorphous substrate and the single crystal semiconductor layer, wherein the thin orienting film is a single crystal thin film, and the thin orienting film has a non-zero thickness that is equal to or less than 10 times a critical thickness hc.
    Type: Application
    Filed: January 19, 2024
    Publication date: May 9, 2024
    Applicants: SAMSUNG ELECTRONICS CO., LTD., iBeam Materials, Inc.
    Inventors: Junhee CHOI, Joohun Han, Vladimir Matias
  • Publication number: 20240153792
    Abstract: An apparatus and method for processing a substrate can reduce the concentration of process by-products in a chemical solution.
    Type: Application
    Filed: November 7, 2023
    Publication date: May 9, 2024
    Applicants: SEMES CO., LTD., SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Min Jung KIM, Jin Ah HAN, Hee Hwan KIM, Yong Hoon HONG, Kyoung Suk KIM, Jong Hyeok PARK, Jin Hyung PARK, Dae Hyuk CHUNG, Ji Hoon CHA
  • Publication number: 20240154066
    Abstract: Embodiments provide an emissive display device including a light emitting diode that includes a first circuit part disposed in a display area and a cathode electrically connected to the first circuit part; and a non-emissive element that includes a second circuit part disposed in the display area and a cathode electrically connected to the second circuit part, and the cathode of the non-emissive element is separated from the cathode of the light emitting diode by a separator.
    Type: Application
    Filed: October 24, 2023
    Publication date: May 9, 2024
    Applicant: Samsung Display Co., LTD.
    Inventors: Chung Sock CHOI, Byung Han YOO, Yoo Min KO, Ju Chan PARK, Dae-Young LEE
  • Publication number: 20240153811
    Abstract: A substrate processing method includes placing a substrate on a spin chuck and rotating the spin chuck around a central axis extending in a first direction; and applying a processing liquid onto the substrate through a nozzle. The nozzle includes a pipe extending in the first direction and through which the processing liquid moves, and a housing surrounding the pipe, and the pipe includes one or more first lower pipe sections, each of whose width in a second direction intersecting the first direction increases and then decreases in a direction toward the substrate.
    Type: Application
    Filed: May 25, 2023
    Publication date: May 9, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Sang Duk HWANG, Jai Hoon KANG, Young Joon KIM
  • Publication number: 20240153923
    Abstract: A display device includes a first pixel including a first emission area; a second pixel including a second emission area spaced apart from the first emission area in a second direction; and a bank defining a non-emission area between the first emission area and the second emission area. Each of the first pixel and the second pixel includes at least one dummy electrode spaced apart from each other in a first direction intersecting the second direction and extending in the second direction; light emitting elements disposed between the at least one dummy electrode in an emission area; a first pixel electrode electrically connected to a first driving power source and first ends of the light emitting elements; and a second pixel electrode electrically connected to a second driving power source and second ends of the light emitting elements.
    Type: Application
    Filed: June 5, 2023
    Publication date: May 9, 2024
    Applicant: Samsung Display Co., Ltd.
    Inventors: Veidhes BASRUR, Guang Hai JIN, Ki Nyeng KANG
  • Publication number: 20240153835
    Abstract: Provided is a semiconductor package including a preformed support structure. The semiconductor package includes a substrate, the preformed support structure provided on the substrate, the preformed support structure including a first chip encapsulated with a first molding material, a plurality of second chips, at least one of the second chips being provided on the preformed support structure, and a third chip provided on the second chips, wherein the first chip has a first size, each of the second chips has a second size, the third chip has a third size, and the first size is smaller than the second size and the third size, and wherein a top surface of the at least one of the second chips is at the same height level as top surfaces of other ones of the second chips.
    Type: Application
    Filed: September 25, 2023
    Publication date: May 9, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Peng Zhang
  • Publication number: 20240154587
    Abstract: Class-D amplification circuitry includes an operational amplifier configured to receive a differential input signal via summing nodes, and output a first signal, a loop filter configured to low-pass filter the first signal, a pulse width modulator configured to perform pulse width modulation on the filtered signal, a gate driver stage configured to generate a gate signal based on the modulated signal, an output stage configured to generate a differential output signal based on the gate signal, and a common mode canceller connected between an input node of the output stage and the summing nodes, the common mode canceller configured to generate an inverted pseudo output signal based on the differential output signal, and provide the inverted pseudo output signal the summing nodes, the inverted pseudo output signal cancelling a common mode noise when applied to a feedback signal provided to the summing nodes.
    Type: Application
    Filed: August 28, 2023
    Publication date: May 9, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventor: Ji-Hun LEE
  • Publication number: 20240153848
    Abstract: A semiconductor device may include an upper interlayer insulating film on a lower wiring structure and an upper wiring structure in an upper wiring trench of the upper interlayer insulating film. The lower wiring structure may include a lower filling film and a lower capping film including a capping opening exposing a portion of the lower filling film. The upper wiring structure may contact the lower filling film. The upper wiring structure may include an upper liner between an upper barrier film and an upper filling film. A sidewall portion of the upper liner may include cobalt doped with ruthenium. A bottom portion of the upper liner may not include cobalt doped with ruthenium. A sidewall portion of the upper barrier film may include tantalum nitride doped with ruthenium (Ru). A sidewall portion of the upper barrier film may not be in contact with the lower capping film.
    Type: Application
    Filed: July 13, 2023
    Publication date: May 9, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Seung Yong YOO, Eun-Ji JUNG
  • Publication number: 20240154662
    Abstract: A method for beamwidth management in a wireless communication system, includes: determining a first set of User Equipments (UEs) served by a beam in a transmission time interval (TTI); comparing a number of UEs in the first set of UEs with a threshold number of UEs that can be served by the beam in the TTI; adjusting a beamwidth of the beam, based on a result of the comparing, to create a second set of UEs served by the beam with the adjusted beamwidth in a subsequent TTI; and forming the beam with the adjusted beamwidth.
    Type: Application
    Filed: January 17, 2024
    Publication date: May 9, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ramesh CHANDRAN, Amarpreet Singh Sethi
  • Publication number: 20240153883
    Abstract: Provided is a device including a substrate and an overlay target structure provided on the substrate, the overlay target structure includes a first alignment key having a plurality of line masks having a first width and arranged at a first pitch, a second alignment key having a plurality of line masks having a second width and arranged at a second pitch, and a nanostructure layer arranged between the first alignment key and the second alignment key, and including a plurality of nanostructures having widths less than or equal to the first width and the second width, and arranged at a pitch less than the first pitch and the second pitch.
    Type: Application
    Filed: November 7, 2023
    Publication date: May 9, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seunghoon HAN, Doowon KWON, Taeyeong KIM, Minho JANG, Sohye CHO, Haesung KIM, Hyeonsoo PARK
  • Publication number: 20240155124
    Abstract: Provided are a method and apparatus for encoding or decoding a coding unit on an outline of a picture. An image decoding method and apparatus according to an embodiment determine whether a current coding unit extends across an outline of a picture, by comparing a location of the current coding unit in the picture to at least one of a width and a height of the picture, split the current coding unit in at least one direction into a plurality of coding units based on a shape of the current coding unit upon determining that the current coding unit extends across the outline of the picture, obtain block shape information and split type information of the current coding unit from a bitstream and split the current coding unit into a plurality of coding units based on the block shape information and the split type information upon determining that the current coding unit does not extend across the outline of the picture, and decode a coding unit that is no longer split among the plurality of coding units.
    Type: Application
    Filed: January 17, 2024
    Publication date: May 9, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Min-woo PARK, Bo-ra JIN, Chan-yul KIM, Jung-hye MIN
  • Publication number: 20240153898
    Abstract: A semiconductor package includes a lower chip including a first lower bonding pad and a second lower bonding pad, and an upper chip disposed on the lower chip, the upper chip including a first upper bonding pad and a second upper bonding pad respectively hybrid-bonded together. The first lower and upper bonding pads have a first shape in which first and second axis lengths are the same, and are disposed in a first center region of the chips. The second lower and upper bonding pads have a second shape in which third and fourth axis lengths differ, and are disposed in a first edge region which is near a corner point of the chip. In the second lower and upper bonding pads disposed in the first edge region, the third axis length is arranged in a direction perpendicular to a radial direction from the center point.
    Type: Application
    Filed: November 7, 2023
    Publication date: May 9, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Minseung JI, Seungduk Baek, Aenee Jang
  • Publication number: 20240154285
    Abstract: An electronic device includes: a glass substrate including a first surface and a second surface opposite to the first surface; a semiconductor element provided on the first surface of the glass substrate; a first pattern provided on the first surface of the glass substrate, the first pattern being electrically connected to a first end of the semiconductor element; a second pattern provided on the first surface of the glass substrate, the second pattern being electrically connected to a second end of the semiconductor element; a feeding line provided on the second surface of the glass substrate; and a via hole which passes through the glass substrate in a first direction, the via hole electrically connecting the feeding line to the second pattern.
    Type: Application
    Filed: January 17, 2024
    Publication date: May 9, 2024
    Applicants: SAMSUNG ELECTRONICS CO., LTD., POSTECH Research and Business Development Foundation
    Inventors: Seungtae KO, Youngju LEE, Jaehong CHOI, Wonbin HONG
  • Publication number: 20240154064
    Abstract: A display device includes: a base layer; and light emitting elements disposed on the base layer, the light emitting elements including an N-type semiconductor layer, a P-type semiconductor layer, and an active layer disposed between the N-type and P-type semiconductor layers. The light emitting elements include a first light emitting element emitting light of a first color and a second light emitting element emitting light of a second color. The N-type semiconductor layer includes a first N-type semiconductor layer of the first light emitting element and a second N-type semiconductor layer of the second light emitting element. The active layer includes a first active layer of the first light emitting element and a second active layer of the second light emitting element. The first and second N-type semiconductor layers are integral with each other, and form a plane surface in an area where the active layer is disposed.
    Type: Application
    Filed: May 1, 2023
    Publication date: May 9, 2024
    Applicant: Samsung Display Co., LTD.
    Inventors: Su Jeong KIM, Dae Hong MIN
  • Publication number: 20240154764
    Abstract: An operating method of a first multi-link device (MLD), including: transmitting, by the first MLD, first data to a second MLD using a first link, wherein the first MLD is configured to communicate with the second MLD using the first link and a second link; and receiving, by the first MLD, a first acknowledgement (ACK) with respect to the first data through the second link and not through the first link.
    Type: Application
    Filed: November 6, 2023
    Publication date: May 9, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Chulho CHUNG, Jonghun HAN, Seunghwan OH, Kyungik CHO
  • Publication number: 20240154079
    Abstract: A display device includes a first electrode and a second electrode that are disposed on a substrate and spaced apart from each other. A light emitting element is disposed between the first electrode and the second electrode. A first pixel electrode is disposed on the first electrode, and is electrically connected to a first end portion of the light emitting element and the first electrode. A second pixel electrode is disposed on the second electrode, and is electrically connected to a second end portion of the light emitting element. Each of the first electrode and the second electrode includes a multi-layer structure including a first layer and a second layer disposed on the first layer. The first layer includes a metal reflecting light. The second layer includes tungsten oxide.
    Type: Application
    Filed: October 30, 2023
    Publication date: May 9, 2024
    Applicant: Samsung Display Co., Ltd.
    Inventors: Hyun Eok SHIN, Ju Hyun LEE, Sung Joo KWON, Joon Yong PARK
  • Publication number: 20240154683
    Abstract: A wireless communication apparatus for supporting communication with multiple transmission and reception points (TRPs) includes a radio frequency integrated circuit (RFIC) configured to receive a first reference signal from a first TRP and a second reference signal from a second TRP, and processing circuitry configured to estimate channels of a plurality of subcarriers based on at least one of the first reference signal or the second reference signal, determine a beamforming parameter based on the estimated channels, the beamforming parameter being determined based on a capacity of an effective channel between the wireless communication apparatus and both the first TRP and the second TRP, and adjust a reception beam based on the beamforming parameter, and the RFIC being configured to receive a first physical downlink shared channel (PDSCH) from the first TRP through the adjusted reception beam, and receive a second PDSCH from the second TRP.
    Type: Application
    Filed: January 10, 2024
    Publication date: May 9, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Hongsik YOON, Jungmin PARK, Junho LEE
  • Publication number: 20240153416
    Abstract: A viewing angle expansion plate, which is a multi-pinhole mask, includes a plurality of cell areas; and a plurality of pinholes formed in the plurality of cell areas, wherein each cell area from among the plurality of cell areas corresponds to a respective pixel from among a plurality of pixels in a flat panel display. The flat panel display includes a light source configured to emit parallel light; a flat panel, on which the parallel light is incident, configured to provide a three-dimensional image; and the viewing angle expansion plate.
    Type: Application
    Filed: January 12, 2024
    Publication date: May 9, 2024
    Applicants: SAMSUNG ELECTRONICS CO., LTD., KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Wontaek Seo, Yongkeun Park, Hoon Song, Jungkwuen An, Jongchan Park
  • Publication number: 20240153435
    Abstract: A display driving circuit is provided. The display driving circuit includes a timing controller configured to output image data and a source control signal, a first source driver circuit configured to output first source data of the image data by activating a plurality of first data lines in accordance with the source control signal, the first data lines having a first output spreading time, a second source driver circuit configured to output second source data of the image data by activating a plurality of second data lines in accordance with the source control signal, the second data lines having a second output spreading time, and a third source driver circuit configured to output third source data of the image data by activating a plurality of third data lines in accordance with the source control signal, the third data lines having a third output spreading time, wherein the first output spreading time, the second output spreading time and the third output spreading time do not overlap.
    Type: Application
    Filed: September 27, 2023
    Publication date: May 9, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Jun-Hong PARK, Oh Jae KWON, Suk Ki MIN, Taek Kyun SHIN, Doo-Hee LIM, Young Ho CHOI
  • Publication number: 20240153459
    Abstract: A display device includes a display panel including a pixel and a sensor pixel, the pixel including a light emitting element and a driving transistor controlling a current flowing through the light emitting element, the sensor pixel including sensor transistors, a data driver that supplies a data signal to the pixel through a data line and provides a sensor data signal to the sensor pixel through a sensor data line, and a sensing driver that obtains sensing information on a current flowing through the sensor pixel. The sensor transistors are electrically connected in parallel to each other and are commonly electrically connected to the sensor data line. The sensor transistors and the driving transistor include a substantially same characteristic.
    Type: Application
    Filed: November 2, 2023
    Publication date: May 9, 2024
    Applicant: Samsung Display Co., LTD.
    Inventors: Byung Ki CHUN, Ji Hyun KA, Min Seok BAE, Chang Bin IM, Chae Han HYUN
  • Publication number: 20240153468
    Abstract: A display apparatus of a modular display apparatus including a plurality of display apparatuses includes a communication interface, and a plurality of driver integrated circuits (ICs), where a first driver IC among the plurality of driver ICs is configured to, based on receiving a first signal transmitted by an external device through the communication interface, transmit the first signal to a second driver IC adjacent to the first driver IC such that the first signal is sequentially transmitted to remaining driver ICs among the plurality of driver ICs that are connected in a daisy chain manner, and each of the first driver IC and the second driver IC is configured to transmit a second signal, that is transmitted by the external device, to a first other display apparatus among the plurality of display apparatuses that is connected to the display apparatus.
    Type: Application
    Filed: December 8, 2023
    Publication date: May 9, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Sangwon KIM
  • Publication number: 20240153705
    Abstract: A ceramic electronic component includes a body including a dielectric layer and an internal electrode disposed alternately with the dielectric layer; and an external electrode disposed on the body, wherein the dielectric layer includes a first region extending from an interfacial surface with the internal electrode to 50 nm of the dielectric layer in an inward direction and a second region excluding the first region, and wherein, in the first region, an average content of In based on overall elements excluding oxygen is 0.5 at % or more and 2.0 at % or less, and an average content of Sn based on overall elements excluding oxygen is 0.5 at % or more and 1.75 at % or less.
    Type: Application
    Filed: September 6, 2023
    Publication date: May 9, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: In Ho JEON, Seok Hyun YOON, Jin Woo KIM, Byung Kil YUN, Bon Hyeong KOO, Min Jung JANG, Mi Yang KIM
  • Publication number: 20240153710
    Abstract: A multilayer electronic component includes: a body including a dielectric layer and an internal electrode; and external electrodes disposed on the body. An average content of indium (In) relative to titanium (Ti) satisfies 0.3 at % or more and 3.8 at % or less in a region of the dielectric layer that is spaced apart by 2 nm from an interface thereof with the internal electrode.
    Type: Application
    Filed: August 25, 2023
    Publication date: May 9, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jun Oh KIM, Byung Kun KIM, Yu Hong OH, Hyun Ji YANG
  • Publication number: 20240155037
    Abstract: Provided is a wearable device. The wearable device is configured to identify first profile information corresponding to an external electronic device. The wearable device is configured to request second profile information that is browsable by the user, from the external electronic device. The wearable device is configured to change the first profile information based on the first profile information and the second profile information received from the external electronic device. The wearable device is configured to display, through a display, at least a portion of the changed first profile information in the FoV.
    Type: Application
    Filed: August 23, 2023
    Publication date: May 9, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jaewon BANG, Donghyun Yeom, Sanghun Lee, Moonsoo Chang
  • Publication number: 20240155478
    Abstract: An apparatus for selecting network slices for servicing application requests, includes: a memory storing at least one instruction; and at least one processor operatively connected to the memory and configured to execute the at least one instruction to: receive an application request from an application for establishing a new protocol data unit (PDU) session with a network over a first network slice, wherein the application request comprises one or more PDU session requirements, identify a plurality of network slices other than the first network slice, based on the one or more PDU session requirements; select a second network slice from the plurality of network slices, based on a configuration related to the apparatus; and perform a service corresponding to the application request using the second network slice.
    Type: Application
    Filed: January 12, 2024
    Publication date: May 9, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jagadeesh GANDIKOTA, Danish Ehsan HASHIMI, Jyotirmoy KARJEE, Ankur POONIYA
  • Publication number: 20240155097
    Abstract: The electronic device includes an infrared light emitter disposed on the printed circuit board, the infrared light emitter corresponding to a first light-transmitting area of the plurality of light-transmitting areas, and being configured to emit infrared light through the first light-transmitting area; and an infrared receiver corresponding to a second light-transmitting area of the plurality of light-transmitting areas. The infrared light emitter includes: a substrate including a third surface facing a third direction and a fourth surface facing a fourth direction opposite to the third direction; at least one electronic component including a light source disposed on the fourth surface of the substrate; a module housing surrounding the at least one electronic component of the substrate; and a shielding member disposed in the module housing, the shielding member being configured to shield electromagnetic waves.
    Type: Application
    Filed: January 16, 2024
    Publication date: May 9, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Byeonghoon PARK, Yongchan KEH
  • Publication number: 20240155127
    Abstract: Provided are a video decoding method and device. This specification provides a video decoding method comprising the steps of: acquiring a parameter indicating whether a multiple transform set is applicable to a block to be decoded, as well as information about the width of the block to be decoded and the height of the block to be decoded; determining the transform type of the block to be decoded on the basis of at least one of the parameter indicating whether a multiple transform set is applicable, or the information about the width and height of the block to be decoded, and setting a zero-out region of the block to be decoded; and inverse-transforming the block to be decoded on the basis of the zero-out region of the block to be decoded and the result of determining the transform type.
    Type: Application
    Filed: January 9, 2024
    Publication date: May 9, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Sun Young LEE