Abstract: A semiconductor device according to the present disclosure includes a vertical stack of channel members, a gate structure over and around the vertical stack of channel members, and a first source/drain feature and a second source/drain feature. Each of the vertical stack of channel members extends along a first direction between the first source/drain feature and the second source/drain feature. Each of the vertical stack of channel members is spaced apart from the first source/drain feature by a silicide feature.

Abstract: Semiconductor device and the manufacturing method thereof are disclosed. An exemplary semiconductor device comprises semiconductor layers over a substrate, wherein the semiconductor layers are stacked up and separated from each other, each semiconductor layer includes a first portion in a first channel region of the substrate and a second portion in a second channel region of the substrate, epitaxial layers formed in a source/drain region between the first channel region and the second channel region, wherein the epitaxial layers are separated from each other and each epitaxial layer is formed between the first portion and the second portion of each semiconductor layer, and a conductive feature wrapping each of the epitaxial layers.

Abstract: In one example aspect, the present disclosure is directed to a device. The device includes an active region on a semiconductor substrate. The active region extends along a first direction. The device also includes a gate structure on the active region. The gate structure extends along a second direction that is perpendicular to the first direction. Moreover, the gate structure engages with a channel on the active region. The device further includes a source/drain feature on the active region and connected to the channel. A projection of the source/drain feature onto the semiconductor substrate resembles a hexagon.

Abstract: According to an embodiment of inventive concepts, a substrate dicing method may include forming reformed patterns in a substrate using a laser beam, grinding a bottom surface of the substrate to thin the substrate, and expanding the substrate to divide the substrate into a plurality of semiconductor chips. The forming of the reformed patterns may include forming a first reformed pattern in the substrate and providing an edge focused beam to a region crossing the first reformed pattern to form a second reformed pattern in contact with the first reformed pattern.

Abstract: A method includes etching a first and a second semiconductor fin to form a first and a second recesses, epitaxially growing an n-type source/drain region comprising a first portion and a second portion from the first and the second recesses, and a first middle portion in between and having a concave top surface. A first contact opening is formed extending into the n-type source/drain region and having a first V-shaped bottom. The method further includes etching a third and a fourth semiconductor fin to form a third and a fourth recesses, and forming a p-type source/drain region including a third portion and a third portion grown from the third and the fourth recesses, and a second middle portion in between and having a convex top surface. A second contact opening is formed and has a second V-shaped bottom, with a tip of the second V-shaped bottom being downwardly pointing.

Abstract: A method includes planarizing a protective layer over gate materials overlying a recessed region in a substrate. The planarizing includes forming a first planarized surface by planarizing a sacrificial layer over the protective layer, and forming a second planarized surface of the protective layer by etching the first planarized surface of the sacrificial layer at an even rate across the recessed region. An etch mask layer is formed over the second planarized surface, and control gate stacks are formed in the recessed region by etching the gate materials.

Abstract: A semiconductor device includes a substrate; semiconductor fins over the substrate and oriented lengthwise along a first direction; first multi-dielectric-layer (MDL) fins and second MDL fins over the substrate and oriented lengthwise along the first direction, wherein the first and the second MDL fins are intermixed with the semiconductor fins, wherein each of the first MDL fins and the second MDL fins includes an outer dielectric layer and an inner dielectric layer, wherein the outer dielectric layer and the inner dielectric layer have different dielectric materials; and gate structures oriented lengthwise along a second direction generally perpendicular to the first direction, wherein the gate structures are spaced from each other along the first direction, and are separated by the first MDL fins along the second direction, wherein the gate structures engage the semiconductor fins and the second MDL fins.

Abstract: A system is provided for providing real-time actionable feedback. The system comprises: a server in communication with a plurality of client devices, which server comprises a first module configured to process clinical care data using a machine learning algorithm trained model to identify: (i) performance metrics that impact a clinical care outcome in a selected field, and (ii) one or more actions that influence the performance metrics and are actionable to a selected clinical care provider; a second module for generating a real-time measurement of the one or more performance metrics of the selected clinical care provider; and a third module configured to dynamically display on the graphical user interface of a client device of the selected clinical care provider: (i) the real-time measurement of the one or more performance metrics of the selected clinical care provider, and (ii) an adjustment of the one or more actions.

Abstract: This invention relates to a method of processing a substrate, having on one side a device area with a plurality of devices. The method includes attaching a first protective film to the one side of the substrate, so that at least a central area of a front surface of the first protective film is in direct contact with the one side of the substrate, and attaching a second protective film to the opposite side of the substrate. After attaching the second protective film, a laser beam is applied to the substrate from the opposite side of the substrate. The substrate and second protective film are transparent to the laser beam. The laser beam is applied to the substrate in a plurality of positions so as to form a plurality of modified regions in the substrate.

Abstract: In an embodiment, a device includes: a first semiconductor strip over a substrate, the first semiconductor strip including a first channel region; a second semiconductor strip over the substrate, the second semiconductor strip including a second channel region; a dielectric strip disposed between the first semiconductor strip and the second semiconductor strip, a width of the dielectric strip decreasing along a first direction extending away from the substrate, the dielectric strip including a void; and a gate structure extending along the first channel region, along the second channel region, and along a top surface and sidewalls of the dielectric strip.

Abstract: A method for the selective formation of epitaxial layers is described herein. In the method, epitaxial layers are deposited to form source and drain regions around a horizontal gate all around (hGAA structure). The method includes co-flowing a combination of chlorinated silicon containing precursors, antimony containing precursors, and n-type dopant precursors. The resulting source and drain regions are selectively grown from crystalline nanosheets or nanowires of the hGAA structure over the non-crystalline gate structure and dielectric layers. The source and drain regions are predominantly grown in a <110> direction.

Abstract: A method of generating a non-thermal microplasma, including the steps of providing a fibrous air-filter, arranging one or more pairs of elongated, adjacent, substantially parallel spaced-apart electrodes on the fibrous air-filter, wherein a discharge gap is defined between each pair; placing a component in signal communication with the electrodes for applying a voltage between each pair; and generating a non-thermal microplasma in a corresponding discharge gap and thereby removing one or more combustion byproducts from ambient air.

Abstract: Disclosed is an apparatus for capturing bioaerosols. More particularly, the apparatus for capturing bioaerosols includes a sprayer configured to spray a buffer solution for protecting aerosol particles in a form of droplets; and a capturer into which air including the droplets and the aerosol particles is introduced and in a capture solution in which the aerosol particles are captured, wherein discharge members provided with a plurality of nanostructures are provided on a surface of the capturer to charge the aerosol particles. Due to such a configuration, high discharge efficiency can be anticipated even at a low voltage without damage to aerosol particles.

Abstract: Systems, computer-implemented methods, and computer program products to facilitate employing a probabilistic model to generate a continuous disease status index based on observational data are provided. According to an embodiment, a system can comprise a memory that stores computer executable components and a processor that executes the computer executable components stored in the memory. The computer executable components can comprise a model component that employs a probabilistic model to generate probability distributions of disease states of a disease of an entity based on observational data of the entity. The computer executable components can further comprise an index component that generates a disease status index of the disease based on the probability distributions of the disease states.

Abstract: A method of managing the adaptive dispatching of a taxi includes receiving a request for a taxi, the received request being from a passenger; scoring a taxi driver based on at least one of an acceptance rate for assignment, a rejection rate for assignment, an idle rate, and a frequency of job acceptance; scoring the passenger based on at least one of a cancellation rate, a booking frequency, an abandonment rate, and a blacklist factor; matching the passenger to a taxi driver based on the taxi driver score and the passenger score; assigning a passenger to a taxi driver based on one of a conditional historical acceptance rate and a stochastic assignment of either chance constraints or a conditional value at risk; and dispatching the taxi driver to the passenger.

Abstract: A wafer assembly for use in a MEMS fabrication process. The wafer package includes: a MEMS wafer having a first side and an opposite second side; a silicone-free peel tape releasably attached to the first side of the wafer; a wafer bonding tape attached to the peel tape; and a carrier substrate releasably attached to the first wafer bonding tape.

Abstract: A substrate having a first side and a second side opposite the first side is processed by providing a protective film having a front surface and a back surface opposite the front surface and providing a holding frame for holding the substrate. The holding frame has a central opening. The holding frame is attached to the back surface of the protective film so as to close the central opening of the holding frame by the protective film, and the first side of the substrate or the second side of the substrate is attached to the front surface of the protective film. The substrate is processed from the side of the substrate which is opposite the side of the substrate attached to the front surface of the protective film, and/or the side of the substrate which is attached to the front surface of the protective film.

Abstract: A belt-type electric dust collection device capable of automatic cleaning includes a dust collection belt including a plurality of flat parts spaced apart at a predetermined distance, and a plurality of first bent parts and second bent parts formed at both ends of the plurality of flat parts. A plurality of first rollers are provided in a line at the plurality of first bent parts of the dust collection belt, to support and guide the dust collection belt. A plurality of second rollers are provided in a line at the plurality of second bent parts of the dust collection belt. A plurality of electrode plates are provided between the plurality of flat parts of the dust collection belt. A belt cleaning part is provided at one side of the dust collection belt, and a driving part is provided to move the dust collection belt.

Abstract: A device comprising a group of electrode elements for a condenser separator of a two-step electrofilter, which group of electrode elements comprises at least two electrode elements in the form of strips or flat planar sheets, the electrode elements being mostly comprised of a core. At least one of the electrode elements or group of electrode elements is formed of at least two different polymers with different electrical properties. A first portion of the electrode element that is disposed closest to an adjacent second electrode element in the condenser separator is formed of an insulating polymer, and a second portion of the electrode element is comprised of at least one current conductive element in the form of a thin coating on the core of the electrode element, or is embedded in the core.

Abstract: Computing systems, methods and management tools for scheduling, optimizing and completing a dynamically adjustable workflow process. The computing systems, methods and management tools being capable of evaluating the availability of resources available for completing the workflow process and ascertaining the reliability of the resources in order to pre-generate a workflow process schedule. The computing systems, methods and management tools are further able to communicate with the assigned resources to incrementally negotiate and receive approval for proposed improvements to the pre-generated workflow schedule prior to implementation of the workflow schedule in order to optimize the cycle time of the process and increase probability of successfully completing the workflow process. The computing systems, methods and management tools may dynamically track the due dates for completing particular tasks and generate amended workflow process schedules in the event a failure occurs.