Abstract: Described herein is a method of bonding a piezoelectric substrate to a support substrate to form a composite substrate. The piezoelectric substrate has one surface which is positively polarized, and a second surface which is negatively polarized. The method described herein includes the steps of bonding the positively polarized surface of the piezoelectric substrate to one surface of the support substrate by a direct bonding method.

Abstract: A wire clamp includes a base and first and second jaws. The first jaw is pivotally mounted to a first upright portion of the base via a first pivot axle, and the second jaw is pivotally mounted to a second upright portion of the base via a second pivot axle. The first and second jaws crisscross each other at an overlap area, and are spring-biased to pivot relative to the base towards a closed position. Respective hook members of the first and second jaws define a mouth above the overlap area that is configured to receive a wire. A size of the mouth adjusts automatically to a size of the wire within the mouth as the first and second jaws pivot towards the closed position. The wire may be held within the mouth in an in-line orientation with a corresponding terminal to which the wire will be crimped.

Abstract: A method for assembling and installing a wire bundle assembly group (WBAG) is disclosed. The method includes placing a first grouping of components of a first WBAG on a first assembly panel of a fabrication table. The method also includes assembling the first WBAG from the first grouping of components and attaching the first WBAG to the first assembly panel. The method also includes actuating a pivot of an assembly frame supporting the first assembly panel to rotate the first assembly panel about a longitudinal axis. The method further includes placing a WBAG receiving panel of a transport tool adjacent the first WBAG and the first assembly panel. The method also includes releasing the first WBAG from the first assembly panel and dropping the WBAG onto the WBAG receiving panel. Finally, the method includes attaching the first WBAG to the WBAG receiving panel.

Abstract: A method for producing a magnetic core includes a processing step of giving a desired shape to a strip made of an alloy composition, a heat-treating step of forming bcc-Fe crystals, and then a stacking step of obtaining a magnetic core having a shape. Here, the alloy composition is Fe—B—Si—P—Cu—C and has an amorphous phase as a primary phase. In the heat-treating step, the strip is heated up to a temperature higher than a crystallization temperature of the alloy composition at a high heating rate.

Abstract: An integrated transformer can be fabricated to include multiple first conductors, a magnetic core, and multiple second conductors. The first conductor can be fabricated within a first layer of a semiconductor layer stack. The magnetic core can be fabricated within multiple second layers, below the first layer, of the semiconductor layer stack. The multiple second conductors can be fabricated within a third layer, below the second layer, of the semiconductor layer stack. The multiple first conductors can be connected to the multiple second conductors to form a primary winding of the integrated transformer. The integrated transformer can additionally include a coupling element to wrap around the magnetic core to form a secondary winding of the integrated transformer.

Abstract: A method of manufacturing a printed board, the method comprising: a first step of preparing a laminate having a base member in which a plurality of layers of glass cloths and a plurality of resin layers are alternately laminated, a first metal layer attached to one surface of the base member, and a second metal layer attached an opposite surface of the base member; a second step of forming a protective layer removable with a predetermined solvent on each of the first metal layer and the second metal layer; and a third step of irradiating the laminate on which the protective layer is formed with a laser beam to thereby form a through-hole penetrating in a thickness direction of the laminate.

Abstract: A filter removal method for removing a filter held in a filter holding space provided in a tip part of a nozzle shaft in a component suction head, in which a suction nozzle is detachably attached to the tip part of the nozzle shaft, from the component suction head. The method comprises a deforming step of compressing and deforming the filter in the filter holding space, and a discharging step of discharging the compressed and deformed filter from the filter holding space.

Abstract: A method for repairing a fine line is provided. Nano metal particles are filled in a defect of a circuit board. The nano metal particles in the defect are irradiated by a laser, or heated, such that the nano metal particles in the defect are metallurgically bonded to an original line of the circuit board. A surface of the circuit board is cleaned to remove residual nano metal particles on parts of the circuit board where metallurgical bonding is not performed, thereby completing line repairing of the circuit board.

Abstract: A method of mounting a component includes an approaching step of causing the pair of clamping members to approach each other with the first body of the first component disposed between the paired clamping members, a clamping step of clamping the first component, and a mounting step of moving the pair of clamping members clamping the first component to the substrate and pressing out the first component clamped by the pair of clamping members with the pusher for mounting on the substrate, when the clamping members mount the first component on the substrate.

Abstract: A method for producing a printed circuit board is disclosed, In the method, a slot is formed in a substrate having at least three layers with the slot extending through at least two of the layers. The slot has a length and a width with the length being greater than the width. The sidewall of the substrate surrounding the slot is coated with a conductive layer. Then, the conductive layer is separated into at least two segments that are electrically isolated along the side wall of the substrate.

Abstract: A winder includes a winding mechanism, a chamber housing the winding mechanism, at least one vacuum pump, and a product case. The winding mechanism is configured to wind a belt-shaped raw film around a winding core. The belt-shaped raw film is composed of a plurality of electrodes and a plurality of separating films. The at least one vacuum pump is configured to suck air into the chamber. The product case is configured to house a plurality of winding products each formed by winding the raw film with use of the winding mechanism disposed in the chamber.

Abstract: A method of manufacturing a substrate for an acoustic wave device includes: a substrate joining step of joining a piezoelectric material layer to a surface on one side of a support substrate; a grinding step of grinding the piezoelectric material layer; a removal amount map forming step of measuring in-plane thickness of the piezoelectric material layer by an optical thickness meter, and calculating a removal amount for the piezoelectric material layer for adjusting thickness variability of the piezoelectric material layer to or below a threshold on the basis of each coordinate in the plane, to form a removal amount map; a laser processing step of applying a pulsed laser beam of such a wavelength as to be absorbed in the piezoelectric material layer, to selectively remove the piezoelectric material layer, based on the removal amount map; and a polishing step of polishing the surface of the piezoelectric material layer.

Abstract: A winder includes a winding mechanism, a chamber, a vacuum pump, a conveying route and a product case. The winding mechanism winds a belt-shaped raw film around a winding core, the belt-shaped raw film being composed of a plurality of electrodes and a plurality of separating films. The chamber houses the winding mechanism. The vacuum pump sucks air into the chamber. The conveying route has a sealed outer space outside the chamber, an inner space of the chamber leading to the outer space in the conveyance route. The product case is disposed in the conveying route to house a plurality of winding products each formed by winding the raw film with use of the winding mechanism.

Abstract: Various implementations described herein refer to a method. The method may include providing multiple rows of cells having porosity segments including a first row of cells having first porosity segments and a second row of cells having second porosity segments that are arranged differently than the first porosity segments. The method may include providing multiple power distribution rails for the multiple rows of cells having a first power distribution rail and a second power distribution rail disposed adjacent to the first row of cells and the second row of cells. The method may include adjusting position of the second row of cells with respect to the first row of cells to align one or more of the second porosity segments with one or more of the first porosity segments to enable rail stitch insertion between the first power distribution rail and the second power distribution rail.

Abstract: A method of manufacturing a laminated core includes supplying a stator material to a punching device and obtaining an electromagnetic steel plate corresponding to a rectangular processed body by punching the stator material. To obtain the electromagnetic steel plate ES, a slit is formed outside a processed body forming area in the stator material along a long side of the processed body forming area, and a center portion of the processed body forming area is punched out in a circular shape. Additionally, the processed body forming area is punched out after the slit is formed and the center portion is punched out. The laminated core is obtained by laminating and fastening a plurality of the electromagnetic steel plates.

Abstract: A crimping machine having a multiplicity of magazines for contact elements which are transportable to a transfer position via a conveyor device. A component to be crimped is then brought from the transfer position into a crimping position by means of a transport device. This transport device is assigned to all of the storage arrangements.

Abstract: Described are processes for developing laminated circuit boards, as well as the resulting circuit boards themselves. Accordingly, at least two circuit boards at least partially overlap each other, and at least one through-hole is formed in an overlapping region thereof. The through-hole is filled with an electrically-conductive material, forming a through-via that enables the circuit boards to be electrically connected. When a circuit on each circuit board is laid out so that a part thereof reaches a region in which the through-via is to be formed, then that part of the circuit can be electrically connected to the through-via. Thus, portions of the circuits on the circuit boards can be electrically connected to each other via common through-vias to realize an integrated device in which the circuits on the laminated circuit boards function.

Abstract: Provided are interconnect circuits and methods of forming thereof. A method may involve laminating a substrate to a conductive layer followed by patterning the conductive layer. This patterning operation forms individual conductive portions, which may be also referred to as traces or conductive islands. The substrate supports these portions relative to each other during and after patterning. After patterning, an insulator may be laminated to the exposed surface of the patterned conductive layer. At this point, the conductive layer portions are also supported by the insulator, and the substrate may optionally be removed, e.g., together with undesirable portions of the conductive layer. Alternatively, the substrate may be retained as a component of the circuit and the undesirable portions of the patterned conductive layer may be removed separately. These approaches allow using new patterning techniques as well as new materials for substrates and/or insulators.

Abstract: A wire harness assembly work cell includes a wire harness assembly work table with a pneumatically powered or spring-fed universal applicator tool for mass terminating sets of wires into insulator wafers. The insulator wafers may be assembled in stacks to form cable-end connector headshells. Insulation displacement terminals (IDT) are designed to receive wide ranges of wire diameters so that larger varieties of wire sizes may be received into these connector assemblies while using fewer different sizes of terminals, thus reducing the number of items in a bill of material (BOM) and substantially reducing the volumes and overhead costs of testing and quality control documentation dedicated to each individual BOM item.

Abstract: Methods of manufacturing high frequency ultrasound transducers configured for use with high frequency ultrasound diagnostic imaging systems are disclosed herein. In one embodiment, methods of manufacturing an ultrasound transducer includes providing a concave lens having an average thickness in a center portion that that is substantially equal to an odd multiple of a ¼-wavelength of the center frequency of the ultrasound transducer.