Abstract: Embodiments described herein perform incisions along the direction of the long axis of the waveguide, thereby exposing a trench structure which can be readily plated. Once divided and plated, the individual cut pieces can then be secured together to restore the original waveguide structure. In this fashion, multiple cut pieces can be secured together and used as “building blocks” to create a modular solution which can be used to provide a number of different customizable waveguide structures. Thus, embodiments described herein can perform plating procedures in a less expensive manner while achieving the benefits of ganged waveguide structures. Moreover, embodiments described herein can offer a modular approach to ganged waveguide design thereby allowing for end-user flexibility in testing.

Abstract: An approach includes a method of fabricating a switch. The approach includes forming a first cantilevered electrode, forming a second cantilevered electrode over an electrode and operable to contact the first cantilevered electrode upon an application of a voltage to the electrode, and forming an arm on the first cantilevered electrode with an extending protrusion extending upward from an upper surface of the arm.

Abstract: Provided is a method for manufacturing a laminated electrode body which is excellent in terms of productivity and production cost. The method for manufacturing a laminated electrode body disclosed herein includes the steps of: preparing a wound body having a flat portion and two curved portions by using a laminate formed of an elongated positive electrode, an elongated negative electrode, and an elongated separator that insulates the positive electrode and the negative electrode from each other; preparing an electrode laminate structure having two cut surfaces by cutting out and removing the two curved portions of the wound body; and removing active materials on the cut surfaces of the electrode laminate structure by spraying an inactive gas or electrically insulating particles onto the cut surfaces while applying, to the electrode laminate structure, a voltage of 25 V or more and less than a voltage causing a dielectric breakdown of the separator.

Abstract: A component mounting device includes a mounting head that mounts a component at a mounting position on a substrate, an imaging unit capable of imaging the mounting position from a plurality of fields of view, imaging directions of which are different from each other, and a controller that selects a success or failure determination field of view used for success or failure determination of whether or not the component has been mounted at the mounting position from the plurality of fields of view according to a state of a shield around the mounting position.

Abstract: A method of manufacturing a printed circuit board includes providing an insulating layer, forming a plating seed layer on the insulating layer, forming a first circuit pattern on the plating seed layer and a second circuit pattern on the first circuit pattern, and forming a top metal layer on the second circuit pattern. The second circuit pattern can be thinner than the first circuit pattern, and the top metal layer can be wider than the second circuit pattern.

Abstract: A method for control device adjustment comprising applying a preload simultaneously to a plurality of shafts of a control device so as to take up initial assembly play, wherein the control device comprises an upper actuating element that is movable relative to a lower supporting mounting, a lower supporting mounting, a switch that is actuated by the upper actuating element, and an articulated structure that is interposed vertically between the upper actuating element and the lower mounting to keep the upper actuating element parallel to a horizontal plane during its vertical downward movement relative to a frame, and the at least one shaft. The method also comprises providing an adjustment stop fixed relative to the lower mounting and forming a stop surface that interacts with a facing portion of the shaft.

Abstract: An integrated circuit (IC) chip module includes a carrier, a stiffening frame, an IC chip, a first directional heat spreader, and a second directional heat spreader. Presented herein is a fabrication method that includes attaching the stiffening frame to the carrier. The stiffening frame includes a central opening, a base portion, a first pair of opposing sidewalls, and a second pair of opposing sidewalls. The method includes electronically coupling the semiconductor chip to the carrier concentrically arranged within the central opening. The method includes thermally contacting the first directional heat spreader to the semiconductor chip. The first directional heat spreader transfers heat from the semiconductor chip towards the first pair of opposing sidewalls. The method includes thermally contacting the second directional heat spreader to the first directional heat spreader.

Abstract: A manufacturing method for a microphone is provided. The microphone includes a case that is vibrated by a vibration signal. A sound inlet through which a sound signal is input is formed at a portion of the case and a first sound element is formed in the case at a position corresponding to the sound inlet. The first sound element receives the sound signal and the vibration signal to output a first initial signal. A second sound element is formed to be adjacent to the first sound element and receives the vibration signal to output a second initial signal. A semiconductor chip is connected to the first sound element and the second sound element and receives the first initial signal and the second initial signal to output a final signal.

Abstract: A method of manufacturing a liquid supply unit includes a first molding step and a second molding step. In a first molding step, a resin is injected into different positions inside a mold assembly and a first member having a first contact portion, a second member having a second contact portion and an intermediate passage member having a passage structure to connect the first contact portion to the second contact portion are molded. In a second molding step, the mold assembly is disassembled, a die slide mold disposed inside the mold assembly is moved for positioning the members. Then, the mold assembly is clamped again and a resin is injected into the mold assembly. The first contact portion and the second contact portion are respectively held on the same surfaces inside the mold assembly during a period from the first molding step to completion of the second molding step.

Abstract: A method for preparing a power inductor includes the following steps A to E: A: preparing a composite wire; B: winding the composite wire according to a predetermined shape and a predetermined coil quantity, so as to form coils; C: placing the coils into a mold cavity, adding metal soft magnetic powder to the mold cavity, and pressing the metal soft magnetic powder and the coils to form a base comprising the coils; D: performing sintering treatment on the base; and E: plating two terminal electrodes on two ends of the base to form the power inductor.

Abstract: A method in the manufacturing of an insulated electric high voltage DC termination or joint includes providing an insulated electric high voltage DC cable including a high voltage DC conductor, a polymer based insulation system surrounding the high voltage DC conductor, the polymer based insulation system including an insulation layer and a semiconducting layer surrounding the insulation layer, and a grounding layer surrounding the semiconducting layer; removing the grounding layer and the semiconducting layer in at least one end portion of the high voltage DC cable, mounting a field grading adapter or joint body in the at least one end portion of the high voltage DC cable; and subjecting the insulation layer of the polymer based insulation system in the at least one end portion of the high voltage DC cable for a heat treatment procedure, while being covered by the mounted field grading adapter or joint body.

Abstract: A method for curing solder paste on a thermally fragile substrate is disclosed. An optically reflective layer and an optically absorptive layer are printed on a thermally fragile substrate. Multiple conductive traces are selectively deposited on the optically reflective layer and on the optically absorptive layer. Solder paste is then applied on selective locations that are corresponding to locations of the optically absorptive layer. After a component has been placed on the solder paste, the substrate is irradiated from one side with uniform pulsed light. The optically absorptive layer absorbs the pulsed light and becomes heated, and the heat is subsequently transferred to the solder paste and the component via thermal conduction in order to heat and melt the solder paste.

Abstract: Methods of assembling motor windings comprising wrapping windings around a central longitudinal axis in a cylindrical shape having a plurality of annularly spaced positions such that the windings form “n” and/or “u” shapes around the positions. As the windings encircle the longitudinal axis, they are wrapped in an outward spiral or inward spiral such that each pass of the windings is stacked on a previous pass.

Abstract: An approach includes a method of fabricating a switch. The approach includes forming a first cantilevered electrode over a first electrode, forming a second cantilevered electrode over a second electrode and operable to directly contact the first cantilevered electrode upon an application of a voltage to at least one of the first electrode and a second electrode, and the first cantilevered electrode includes an arm with an extending protrusion which extends upward from an upper surface of the arm.

Abstract: A method of mounting a module to a land grid array is provided. The method includes installing a tool to a fixture. The tool includes at least one alignment member and at least one cavity partially defined by the at least one alignment member. The at least one cavity of the tool is aligned with one or more corresponding sockets of the land grid array. The method further includes installing a module through the cavity such that the module is substantially aligned with the socket as it is connected to the land grid array.

Abstract: A cable bushing fitting machine includes: a fitting region; a mandrel disposed at said fitting region, said mandrel being hollow to receive a cable therethrough; a first rotatably mounted stripping jaw arranged in the fitting region; a second rotatably mounted stripping jaw arranged in the fitting region; a drive configured to mount cable bushings onto cable by successively disposing respective ones of the cable bushings onto the mandrel, feeding the cable through the mandrel, and executing a relative movement between the mandrel and the first and second rotatably mounted stripping jaws to locate the respective cable bushings onto the cable; a camera directed toward the fitting region to capture images of the respective cable bushings located on the cable; and at least the first rotatably mounted stripping jaw having a rotation axis, the first stripping jaw rotation axis being laterally offset from an optical axis of said camera by a distance sufficient to permit the camera unimpeded views of cable bushings i

Abstract: A fabrication method of a circuit includes drilling holes in a substrate, so as to form a plurality of first opening holes and second opening holes in the substrate. A cover film is attached onto the substrate, so as to cover the first opening holes and the second opening holes. A portion of the cover film covering the first opening holes is removed, so as to expose the first opening holes. The first opening holes are filled.

Abstract: A device for automatically mounting a connector-housing with a contact-part attached to an electrical line includes a holder, a movable-gripper, an alignment-station, a camera, and a control-device. The holder fixes the connector-housing. The movable-gripper holds the contact-part and inserts the contact-part into a cavity of the connector-housing. The alignment-station includes an alignment-gripper that holds the contact-part and rotates the contact-part about a rotation-axis parallel to an insertion-direction. The camera determines an actual-rotational-position of the contact-part held by the alignment-gripper in relation to the rotation-axis. The control-device compares the actual-rotational-position with a predetermined-rotational-position based on the characteristics and arrangement of the connector-housing. The control-device further controls the alignment-gripper to perform a corrective rotational movement based on the result of the comparison.

Abstract: Methods for producing ceramic multi-layer components and multi-layer components made by such methods. A method includes the following steps: providing green layers for the ceramic multi-layer components, stacking the green layers into a stack and subsequently pressing the stack into a block, singulating the block into partial blocks each having a longitudinal direction, thermally treating the partial blocks and subsequently machining surfaces of the partial blocks. Recesses are produced on the surfaces of the partial blocks during the machining, and the partial blocks are singulated.

Abstract: Techniques and structures are provided for manufacturing a flexible PMUT array. In one embodiment, a piezoelectric micromechanical ultrasonic transducer (PMUTs) array comprises a plurality of PMUTs, where each PMUT in the flexible array of PMUTs includes: a first polymer layer configured to support the PMUT, a mechanical layer configured to provide planarization to the PMUT, a first electrode, a second electrode, a piezoelectric layer configured to separate the first electrode and the second electrode, patterns on the first electrode, the piezoelectric material, and the second electrode configured to route electrical signals, and a cavity configured to adjust a frequency response of the PMUT.