Abstract: Disclosed is a method of supplying power to a building equipment technician in the field. The method comprises providing a movable power conversion device having a transformer, an input voltage selector, a building power interface cable, and a power receptacle. The method further comprises moving the movable power conversion device to a location proximate a building power grid and an area comprising building equipment; setting the input voltage selector to an unpowered position; connecting the building power interface cable to the building power grid; and selecting a supply voltage of the building power grid with the input voltage selector.

Abstract: An electric appliance includes a housing part, and first, second, and third cooling fins are premolded or provided on the housing part. The housing part has a wall, e.g., a topside, and two side walls, and of the cooling fins extends along the wall and at least one of the side walls.

Abstract: A modular monitoring-and-control drawer (138) for an electrical connection enclosure is connected to an electricity source and to an electrical load. The drawer comprises functional elements dimensioned to be adapted to the electrical power delivered to the electrical load. The drawer comprises a base (328), on which the functional elements are attached, the height of the base, measured perpendicular to the base, being constant. The drawer comprises a frontal part (300) and a cover (330). The heights of the frontal part and of the cover, measured perpendicular to the base, are adapted to the dimensions of the functional elements. The monitoring-and-control drawer is configured to operate in a first orientation, with its base located at the bottom of the drawer and its cover located at the top, and in a second orientation, with its base located at the top and its cover located at the bottom.

Abstract: Disclosed embodiments are relate to heat transfer devices or heat exchangers for computing systems, and in particular, to heat pipes for improved thermal performance at a cold plate interface. A thermal exchange assembly includes a heat pipe (HP) directly coupled to a cold plate. The HP includes a window, which is a recessed or depressed portion of the HP. The window is attached to the cold plate at a window section of the cold plate. The cold plate is configured to be placed on a semiconductor device that generates heat during operation. The cold plate transfers the heat to the HP with less thermal resistance than existing HP solutions. Other embodiments may be described and/or claimed.

Abstract: A rack assembly unit for mounting a control unit to a vehicle rack system is provided; a rack chassis and a tray are configured to receive the control unit for coupling to a vehicle system. The tray is movably coupled to the rack chassis at a coupling mechanism, which provides for movement of the tray relative to the rack chassis between open and closed positions. At the open position, the tray is spaced apart from rack chassis to facilitate user access to the tray and receiving the control unit therein. At the closed position, the tray is located fully inserted relative to the rack chassis and such that the control unit located in the tray is provided at a control unit operating position thermally coupled to a cold plate of a cooling system to provide for cooling of components of the control unit.

Abstract: A power switch module includes a semiconductor die and a conductive busbar. The semiconductor die is electrically conductively mounted to the busbar. The module also includes a dielectric coolant fluid and the busbar and the semiconductor die mounted thereto are immersed in the dielectric coolant fluid. The module can be include in a power converter assembly.

Abstract: An enclosure for retaining at least one networking component may include a shell forming first and second chambers and having lower and upper portions, a dielectric fluid adapted to be disposed in the first chamber, an adjustable overflow assembly adapted to be disposed in the first chamber, a mounting mechanism at least partially disposed within the first chamber, a coolant distribution line at least partially disposed within the first chamber, and a coolant circulator at least partially disposed within the shell. The adjustable overflow assembly moves between the lower portion and the upper portion of the shell. The mounting mechanism includes at least one coupling member to retain at least one active networking component. The coolant circulator circulates the dielectric fluid within the first chamber of the shell via the coolant distribution line. The adjustable overflow assembly and mounting mechanism are adapted to be submerged in the dielectric fluid.

Abstract: A heat dissipation device includes: a rigid tube, including a first cavity; a first capillary structure, at least a portion of the first capillary structure being positioned within the first cavity; a flexible tube, including a second cavity, the flexible tube being more flexible than the rigid tube; and a second capillary structure, at least a portion of the second capillary structure being positioned within the second cavity, wherein the heat dissipation device is deformable via the flexible tube.

Abstract: The present disclosure provides for a heatshield that can be actively cooled during a rework process. The heatshield may include a backer plate and a metal plate. A plurality of vents may extend from air inlet ducts to a top surface of the backer plate such that the plurality of vents directs cooling gas forced into the heatshield towards the metal plate and a first ball grid array (BGA) package. The cooling gas may maintain the solder joint temperature of the first BGA package below a reflow temperature and below a solidus temperature to prevent reflow-related solder joint defects from occurring in the first BGA package during rework of a second BGA package.

Abstract: A heat sink component includes a cold plate including a first surface configured to engage a circuit component and a second surface opposing the first surface, and a plurality of fins extending transversely from the second surface of the cold plate. The first surface includes a non-planar surface portion and a planar surface portion surrounding the non-planar surface portion. The non-planar surface portion of the cold plate provides an adaptive contour to complement a surface of a circuit component that experiences thermal warpage due to change in temperature during operation.

Abstract: Some embodiments of the present disclosure are directed to a hybrid distribution unit that can distribute both power and data connections from a power and fiber cables (or from a hybrid cable containing both power and fiber) within a compact enclosure that helps reduce the overall footprint of the hybrid distribution unit mounted on a cellular tower. Some embodiments may also include circuit protection features, such as fuses or circuit breakers. Other embodiments may be described or claimed.

Abstract: The present disclosure relates to a surface-mounted heat sink and a power module using the same. The power module includes a circuit board, a magnetic element and at least one power device. The magnetic element is disposed at an upper side of the circuit board, the at least one power device is disposed on a surface of the circuit board and located between the magnetic element and a lower side of the circuit board. The surface-mounted heat sink is disposed on the surface of the circuit board and adjacent to the at least one power device. A top surface disposed on one side of the magnetic element and the surface of the circuit board form a limiting height, the surface-mounted heat sink has a first height formed between a sucked surface and a surface-mounted surface thereof, and the limiting height is greater than or equal to the first height.

Abstract: A processing unit. The processing unit includes a printed circuit board (PCB) including a lidless integrated circuit, a heatsink, and a damper system. The heatsink is coupled to the PCB and in thermal communication with the lidless integrated circuit via a thermal interface material. The damper system is compressed between the PCB and the heatsink and surrounding the lidless integrated circuit to absorb a portion of kinetic energy imparted to the lidless integrated circuit by an impact to the processing unit.

Abstract: An electronic assembly having a multi-slot card assembly and a chassis is provided. The chassis has two or more chassis mounting slots, each including three walls. The multi-slot card assembly is mountable into the chassis and has two or more protrusions. The card assembly comprises at least one heat frame, at least one circuit card module mounted to the at least one heat frame, and at least one expandable fastener. When the card assembly is mounted into the chassis and the at least one fastener is expanded, the at least one fastener applies force against both of one of the walls of the slot and a surface of the at least one heat frame.

Abstract: Information handling system (IHS) heatsinking systems and methods may employ a thermally conductive compression attached memory module (CAMM) bolster plate affixed to one surface of a circuit board of the CAMM, between a central processing unit (CPU) of the IHS and memory devices mounted on the CAMM, to provide compression between the CAMM and a z-axis compression connector and to capture and dissipate heat from the CPU and the memory devices. Spacing between the CPU and the DIMM may enable this capture and dissipation of heat from the CPU. The bolster plate may be configured to receive at least one conductive fastener that bears on the bolster plate and presses the CAMM to the z-axis compression connector, and to conductively thermally couple the CAMM and bolster plate to a ground plane of a system printed circuit board (PCB) mounting the CPU and the CAMM.

Abstract: Example implementations relate to a cooling module, and a method of cooling an electronic circuit module. The cooling module includes first and second cooling components fluidically connected to each other. The first cooling component includes a first fluid channel having supply, return, and body sections, and a second fluid channel. The second cooling component includes an intermediate fluid channel. The body section is bifurcated into first and second body sections, and the first and second body sections are further merged into a third body section. The supply section is connected to the first and second body sections. The return section is connected to the third body section and the intermediate fluid channel via an inlet fluid-flow path established between the first and second cooling components. The second fluid channel is connected to the intermediate fluid channel via an outlet fluid-flow path established between the first and second cooling components.

Abstract: A display device according to the present technology includes: a plurality of linear portions that, when three directions orthogonal to each other are a first direction, a second direction, and a third direction, extends in the first direction and is positioned apart from each other in the second direction; and a connecting portion that connects respective parts of two linear portions adjacent to each other in the second direction. The linear portion and the connecting portion are integrally formed by injection molding, the linear portion has a base extending in the first direction and a pair of protrusions protruding in the third direction from both end portions of the base in the second direction, and both end portions of the connecting portion are continuous to respective tip portions of the protrusions of the two adjacent linear portions.

Abstract: The present disclosure provides for cooling systems, assemblies and methods (e.g., for semiconductor devices; for refrigerant cooling; for cryogenic cooling). More particularly, the present disclosure provides for mini-channel cold plate cooling assemblies, systems and methods for semiconductor devices (e.g., wide-bandgap (WBG) power semiconductor devices), with the cooling assemblies, systems and methods utilizing three-dimensional adaptive flow-paths using bi-metal fins. The present disclosure provides for mini-channel cold plate cooling assemblies, systems and methods that may improve cooling performance and/or enable local cooling control. The present disclosure provides for bi-metal strips that operate as both the surface-temperature sensors and actuators without input energy. The bi-metal strips guide the coolant flow to a low-drag channel when the surface temperature is low, and guide the coolant flow to the near-surface channel when the surface temperature is high.

Abstract: This power conversion device includes a magnetic core which has a gap formed by cutting out a part of an annular shape, a resin primary molded body configured to hold the magnetic core by covering a first end portion and a second end portion of the magnetic core that are arranged opposite to each other with the gap therebetween from outside of the magnetic core in a radial direction, and a resin secondary molded body which has an exposed portion in which a surface of a portion of the primary molded body that covers the first end portion and the second end portion is exposed, and contains the primary molded body.

Abstract: The present disclosure relates to the technical field of heat dissipation for electronic devices, and discloses a manifold microchannel heat sink based on directional optimization of hotspot areas, including a power module, a heat dissipation substrate, a cold source device, and a diverter manifold; the heat dissipation substrate is arranged on the power module, a microchannel is provided on a side of the heat dissipation substrate away from the power module and on a back of a heat generating area of the power module for carrying the power module and dissipating heat from the power module. According to the manifold microchannel heat sink based on the directional optimization of hotspot areas, the local heat dissipation performance of the power module may be preliminarily changed by optimizing the microchannel on the heat dissipation substrate, which avoids poor heat dissipation temperature uniformity in a multi-heat source system.