Abstract: A cooling system for cooling electronic equipment is disclosed herein. The cooling system includes geothermal wells including internal pumps. A cold plate thermal exchanger is in fluid communication with the geothermal wells. A fluid circuit is configured to direct cooling fluid from the geothermal wells to enclosures housing the electronic equipment. The system disclosed herein is environmentally responsible and utilizes renewable sources of energy. The system disclosed herein takes advantage of subterranean thermal recharging of cooling fluid, and is also configured to direct cooled fluid back into geothermal wells under certain conditions.

Abstract: A power module and a power device are provided. The power device includes two screws, a heat dissipation components and a power module. The power module includes a substrate, a package body and two fixing structures. Each fixing structure includes a first through hole, two second through holes, an annular structure and two sinking structures. When the power module is fixed to the heat dissipation component, each sinking structure is bent toward the heat dissipation component, and each annular structure is fixed to the flat surface of the heat dissipation component by the screws. The heat dissipation surface of the substrate can be flatly attached to the flat surface of the heat dissipation component through the two fixed structures, so that the heat energy generated during the operation of the power module can be transferred out through the heat dissipation component.

Abstract: Thermal spreaders for targeted heat dissipation of an electronic component are disclosed. One thermal spreader includes a thermally conductive composition configured to function in conjunction with an electrically insulator material to dissipate heat away from a heat-generating electronic component of a computing device while electrically insulating the electronic component. The thermally conductive composition is malleable to target placement of the thermally conductive material on the electrically insulator material such that the thermally conductive composition is in thermal communication with a targeted area of the electronic component over which the electrically insulator material is positioned for targeted heat dissipation of the electronic component. Apparatus and systems including one or more of the thermal spreaders for targeted heat dissipation of one or more electronic components included therein are also disclosed.

Abstract: An electronic device includes: a circuit board including a substrate and at least one first electronic element disposed on one side of the substrate; a first heat dissipation component; and a first heat conduction component including a first heat conduction plate and at least one first heat conduction member disposed on the first heat conduction plate and corresponding to the at least one first electronic element. A material of the first heat conduction component is different from that of the first heat dissipation component, and the first heat conduction component is disposed between the first heat dissipation component and the circuit board.

Abstract: A heat dissipation apparatus is provided. The heat dissipation apparatus includes a thermally conductive housing. The heat dissipation apparatus is connectable to a chip so that the chip is arrangeable on a chip placement region of the thermally conductive housing. A capillary structure is disposed on the thermally conductive housing and a working medium is placed in the capillary structure. The capillary structure includes a first capillary structure and a second capillary structure that are connected, and a maximum thickness of the first capillary structure is less than a minimum thickness of the second capillary structure.

Abstract: An assembly of an electrical device includes: at least one electrical functional assembly which has a supporting element and electrical or electronic functional components arranged on the supporting element; a fastening device for fastening the electrical device to a higher-level assembly; a heat sink core element having at least one face wall; and an external element connectable to the heat sink core element. The heat sink core element forms a supporting structure of the electrical device on which supporting structure the fastening device is arranged. The external element is connectable to the heat sink core element such that the at least one electrical functional assembly is accommodated between the at least one face wall of the heat sink core element and the external element.

Abstract: A fastening arrangement includes a tray having an outwardly extending tray flange with a first hole therein, a cover having a generally U-shaped portion and a cover flange extending outward therefrom with a second hole therein. The cover is disposed atop the tray with the generally U-shaped portion disposed in contact with the tray flange and the cover flange disposed a predetermined height above the tray flange with the first and second holes aligned with each other. A spacer having a third hole therethrough is disposed between the tray flange and the cover flange with the third hole aligned with the first and second holes. A fastener arrangement has a shaft extending through the first, second and third holes, a head formed on a first shaft end, a threaded portion on a second shaft end, and a nut engaged with the threaded portion.

Abstract: An electronic media case includes an electronic display device powered by a battery that includes a display screen. The electronic media case also includes a display housing that has a first flap and a first plurality of foldable tabs surrounding the electronic display device. A viewing window is cut into the first flap, exposing the display screen through the first flap. The electronic media case also includes a folding case that has a second flap to which the foldable tabs of the first plurality of foldable tabs are connected. The folding case also has a third flap connected to the second flap at a first folding interface. The electronic media case includes a media sleeve that is connected to the third flap.

Abstract: An electrical appliance that can be fastened to a support element, in particular a wall, includes a heat sink, circuit boards, and a housing. The circuit boards are fastened to the heat sink in each case and the heat sink is able to be fastened or is fastened to the support element. The housing surrounds the circuit boards and is fastened to the heat sink.

Abstract: A cooling device for dissipating heat from an object. The cooling device comprises a base part arranged for contact with the object, and fins attached to and protruding from the base part in a direction substantially away from the object when in use. The fins are arranged in a first configuration adapted for heat dissipation by natural convection of air and in a second configuration adapted for heat dissipation by forced convection of ambient air movement such as wind. Thereby, the cooling device can provide ample or at least adequate cooling effect on the object both when there is more or less ambient air movement chiefly using the second configuration, and when the ambient air is not moving chiefly using the first configuration.

Abstract: A circuit board cooling apparatus is disclosed having a heat spreader device to be thermally coupled with a surface of the circuit board to be cooled. Also, a conforming heat transfer device is disclosed that is thermally and physically coupled with the heat spreader device to conform to a surface contour of the heat spreader device on a first side of the heat transfer device. The cooling apparatus also includes a heat transport device physically attached and thermally coupled with a second side of the heat transfer device.

Abstract: A liquid-cooled plate radiator is disclosed. The liquid-cooled plate radiator includes a radiator body. A coolant liquid runner for circulating a coolant liquid is formed inside the radiator body. The coolant liquid runner includes a plurality of radiating sub-runners. Then, a plurality of fin units are arranged on the radiating sub-runners along a flow direction of the coolant liquid. The fin unit has a plurality of fins extending side by side along the flow direction of the coolant liquid. Moreover, the fins of the front and rear adjacent fin units on the radiating sub-runners are staggered, thereby increasing the radiating area, enhancing the disturbance of the coolant liquid when flowing inside the radiating sub-runners, and improving the radiating efficiency. Thus, the technical problems of limited radiating area and low radiating efficiency caused by a single linear coolant liquid runner are solved.

Abstract: A heat exchanger for a liquid cooling system has an enclosure defining an internal chamber and a wall defining an external major surface of the enclosure. The enclosure extends from a first open end to an opposed second open end and an inlet passage extends from the first open end to the internal chamber. An outlet passage extends from the internal chamber to the second open end. A plurality of corrugated fins are conductively coupled with the wall defining the external major surface and positioned in the internal chamber. A liquid cooling system can include such a heat exchanger. And, an electronic device can include one or more multichip modules cooled by such a cooling system.

Abstract: The present disclosure is directed to systems and methods of improving the thermal performance of processor-based devices. Such thermal performance improvement may include limiting the degree of tilt experienced by a semiconductor device as a thermal solution coupled to the semiconductor device is tightened to the substrate. Such thermal performance improvements may include increasing the available heat transfer area associated with a particular heat producing semiconductor device. Such thermal performance improvements may include thermally coupling one or more cool blocks thermally coupled to one or more remote heat-producing devices to a central cool block that may be cooled using a cooling medium or coupled to a central heat-producing semiconductor device.

Abstract: A heatsink comprising a heat exchange device having a plurality of heat exchange elements each having a surface boundary with respect to a heat transfer fluid, having successive elements or regions having varying size scales. According to one embodiment, an accumulation of dust or particles on a surface of the heatsink is reduced by a removal mechanism. The mechanism can be thermal pyrolysis, vibration, blowing, etc. In the case of vibration, adverse effects on the system to be cooled may be minimized by an active or passive vibration suppression system.

Abstract: Disclosed is an electronic device including a heat dissipation structure that includes a first printed circuit board; a thermal diffusion member arranged in parallel to the first printed circuit board; a second printed circuit board which is arranged to be separated from the first printed circuit board and which is electrically connected with the first printed circuit board; and a heat transfer member of which at least a partial area faces a heat dissipation member, and of which at least another partial area, formed to be bent, is arranged to face one surface of the second printed circuit, and additional other various embodiments are possible.

Abstract: A mechanical device for cooling an electronic component may include a surface including an aperture, and a first support protruding from the surface and a second support protruding from the surface. In some embodiments, the device may include disposed within the aperture a thermal interface material (TIM).

Abstract: A computational heat dissipation structure includes a circuit board including a plurality of heating components; and a radiator provided corresponding to the circuit board; wherein a space between the adjacent heating components is negatively correlated with heat dissipation efficiency of a region where the adjacent heating components are located. Since the space between the adjacent heating components of the disclosure is negatively correlated with the heat dissipation efficiency of the region where the adjacent heating components are located, i.e., the higher the heat dissipation efficiency of the region where the adjacent heating components are located is, the smaller the space between the adjacent heating components in the region will be, the heat dissipation efficiencies corresponding to the heating components are balanced, and load of a fan is reduced.

Abstract: Disclosed herein are apparatus and methods for a power electronics assembly includes a cold plate assembly and one or more power device assemblies. The cold plate assembly includes a manifold including a heat sink cavity in a first surface and a heat sink. The heat sink includes one or more substrate cavities and the heat sink is positioned in the heat sink cavity. The one or more power device assemblies are positioned within the one or more substrate cavities. Each power device assembly of the one or more power assemblies includes a direct bonded metal (DBM) substrate including a first metal layer directly bonded to an insulator layer and a power device. The DBM substrate includes a power device cavity. The power device is positioned in the power device cavity and the power device is electronically coupled to the first metal layer.

Abstract: A computational heat dissipation structure includes a circuit board including a plurality of heating components; and a radiator provided corresponding to the circuit board; wherein a space between the adjacent heating components is negatively correlated with heat dissipation efficiency of a region where the adjacent heating components are located. Since the space between the adjacent heating components of the disclosure is negatively correlated with the heat dissipation efficiency of the region where the adjacent heating components are located, i.e., the higher the heat dissipation efficiency of the region where the adjacent heating components are located is, the smaller the space between the adjacent heating components in the region will be, the heat dissipation efficiencies corresponding to the heating components are balanced, and load of a fan is reduced.