Abstract: A liquid-cooled plate radiator is disclosed. The liquid-cooled plate radiator includes a radiator body. A coolant liquid runner for circulating a coolant liquid is formed inside the radiator body. The coolant liquid runner includes a plurality of radiating sub-runners. Then, a plurality of fin units are arranged on the radiating sub-runners along a flow direction of the coolant liquid. The fin unit has a plurality of fins extending side by side along the flow direction of the coolant liquid. Moreover, the fins of the front and rear adjacent fin units on the radiating sub-runners are staggered, thereby increasing the radiating area, enhancing the disturbance of the coolant liquid when flowing inside the radiating sub-runners, and improving the radiating efficiency. Thus, the technical problems of limited radiating area and low radiating efficiency caused by a single linear coolant liquid runner are solved.

Abstract: A heat exchanger for a liquid cooling system has an enclosure defining an internal chamber and a wall defining an external major surface of the enclosure. The enclosure extends from a first open end to an opposed second open end and an inlet passage extends from the first open end to the internal chamber. An outlet passage extends from the internal chamber to the second open end. A plurality of corrugated fins are conductively coupled with the wall defining the external major surface and positioned in the internal chamber. A liquid cooling system can include such a heat exchanger. And, an electronic device can include one or more multichip modules cooled by such a cooling system.

Abstract: A heatsink comprising a heat exchange device having a plurality of heat exchange elements each having a surface boundary with respect to a heat transfer fluid, having successive elements or regions having varying size scales. According to one embodiment, an accumulation of dust or particles on a surface of the heatsink is reduced by a removal mechanism. The mechanism can be thermal pyrolysis, vibration, blowing, etc. In the case of vibration, adverse effects on the system to be cooled may be minimized by an active or passive vibration suppression system.

Abstract: The present disclosure is directed to systems and methods of improving the thermal performance of processor-based devices. Such thermal performance improvement may include limiting the degree of tilt experienced by a semiconductor device as a thermal solution coupled to the semiconductor device is tightened to the substrate. Such thermal performance improvements may include increasing the available heat transfer area associated with a particular heat producing semiconductor device. Such thermal performance improvements may include thermally coupling one or more cool blocks thermally coupled to one or more remote heat-producing devices to a central cool block that may be cooled using a cooling medium or coupled to a central heat-producing semiconductor device.

Abstract: Disclosed is an electronic device including a heat dissipation structure that includes a first printed circuit board; a thermal diffusion member arranged in parallel to the first printed circuit board; a second printed circuit board which is arranged to be separated from the first printed circuit board and which is electrically connected with the first printed circuit board; and a heat transfer member of which at least a partial area faces a heat dissipation member, and of which at least another partial area, formed to be bent, is arranged to face one surface of the second printed circuit, and additional other various embodiments are possible.

Abstract: A mechanical device for cooling an electronic component may include a surface including an aperture, and a first support protruding from the surface and a second support protruding from the surface. In some embodiments, the device may include disposed within the aperture a thermal interface material (TIM).

Abstract: A computational heat dissipation structure includes a circuit board including a plurality of heating components; and a radiator provided corresponding to the circuit board; wherein a space between the adjacent heating components is negatively correlated with heat dissipation efficiency of a region where the adjacent heating components are located. Since the space between the adjacent heating components of the disclosure is negatively correlated with the heat dissipation efficiency of the region where the adjacent heating components are located, i.e., the higher the heat dissipation efficiency of the region where the adjacent heating components are located is, the smaller the space between the adjacent heating components in the region will be, the heat dissipation efficiencies corresponding to the heating components are balanced, and load of a fan is reduced.

Abstract: Disclosed herein are apparatus and methods for a power electronics assembly includes a cold plate assembly and one or more power device assemblies. The cold plate assembly includes a manifold including a heat sink cavity in a first surface and a heat sink. The heat sink includes one or more substrate cavities and the heat sink is positioned in the heat sink cavity. The one or more power device assemblies are positioned within the one or more substrate cavities. Each power device assembly of the one or more power assemblies includes a direct bonded metal (DBM) substrate including a first metal layer directly bonded to an insulator layer and a power device. The DBM substrate includes a power device cavity. The power device is positioned in the power device cavity and the power device is electronically coupled to the first metal layer.

Abstract: A computational heat dissipation structure includes a circuit board including a plurality of heating components; and a radiator provided corresponding to the circuit board; wherein a space between the adjacent heating components is negatively correlated with heat dissipation efficiency of a region where the adjacent heating components are located. Since the space between the adjacent heating components of the disclosure is negatively correlated with the heat dissipation efficiency of the region where the adjacent heating components are located, i.e., the higher the heat dissipation efficiency of the region where the adjacent heating components are located is, the smaller the space between the adjacent heating components in the region will be, the heat dissipation efficiencies corresponding to the heating components are balanced, and load of a fan is reduced.

Abstract: Fluid cooling systems are discussed herein. The system may include a top portion including a first surface receiving package(s) generating heat during operation, a second surface positioned opposite the first surface, and a plurality of embedded channels formed on the second surface. The system may also include a bottom portion positioned adjacent the top portion. The bottom portion may include inlet section(s) receiving a coolant and a plurality of inlet fluid conduits formed adjacent to and in fluid communication with the inlet section(s). The bottom portion may also include a plurality of outlet fluid conduits formed adjacent to the plurality of inlet fluid conduits. Each outlet fluid conduit may be in fluid communication with at least one of the inlet fluid conduits. The bottom portion may further include an outlet section(s) in fluid communication with the plurality of outlet fluid conduits and the inlet section(s).

Abstract: A thermal management unit includes a heat sink, which includes a base portion having a first side and a second side opposite the first side. The heat sink also includes a first protrusion structure and a second protrusion structure. The first protrusion structure protrudes from the first side of the base portion, and the first protrusion structure includes a plurality of fins. The second protrusion structure protrudes from the second side of the base portion, and the second protrusion structure includes a plurality of ribs.

Abstract: A siphon-based heat sink for a server comprises a heat absorbing mechanism, a siphon mechanism, and a heat sink. The heat absorbing mechanism comprises a base plate and a cover plate. The base plate comprises a bottom plate and multiple sets of heat dissipating fins, and is in contact with the central processing unit. The heat sink comprises a cooling cavity and cooling fins. The evaporation cavity is communicated with the cooling cavity via two siphon tubes to enable heat transfer and circulation of a thermal conductive medium. Lower ends of the two fin plates are positioned close to and fixed to the bottom plate, while upper ends thereof are bent outward to form a curved mechanism, and an included angle between the two fin plates continuously increases from bottom to top.

Abstract: An information handling system includes a heatsink interface component, a printed circuit board assembly, and an upstream heatsink. The heatsink interface component aligns the upstream heatsink on the printed circuit board assembly. The heatsink interface component includes first, second, third, and fourth sides. The heatsink interface component also includes multiple posts. Each of a first set of the posts is located on a top surface of the second side, and each of a second set of the posts is located on a top surface of the fourth side. The heatsink interface component also includes recesses located within the second and fourth sides. Each of a first set of the recesses extends from a bottom surface to the top surface of the second side, and each of a second set of the recesses extends from a bottom surface to the top surface of the fourth side.

Abstract: A fluid delivery module that produces direct fluid-contact cooling of a computer processor, while mating with common processor accessory mounting specifications. Computer processors are commonly packaged and installed on printed circuit boards. The fluid module delivers cooling fluid directly to at least a surface of the processor package. The fluid module forms a fluid-tight seal against the surface of the processor package. By delivering fluid to the surface of the processor package, the module cools the computer processor. The module does not mechanically fasten to the processor. Instead, the module fastens to a variety of processor accessory mounting patterns commonly found on printed circuit boards. The printed circuit board typically carries the processor. This minimizes stress on the processor package, and allows greater modularity between different processors. In one embodiment, the fluid delivery is done with integral microjets, producing very high heat transfer cooling of the computer processor.

Abstract: An optical transceiver includes a housing, an optical communication module and a heat dissipation component. The optical communication module is disposed in the housing. The heat dissipation component is disposed in the housing and in thermal contact with the housing and the optical communication module, and the heat dissipation component is a stamped metal plate.

Abstract: A server tray package includes a motherboard assembly that includes a plurality of data center electronic devices, the plurality of data center electronic devices including at least one heat generating processor device; and a liquid cold plate assembly. The liquid cold plate assembly includes a base portion mounted to the motherboard assembly, the base portion and motherboard assembly defining a volume that at least partially encloses the plurality of data center electronic devices; and a top portion mounted to the base portion and including a heat transfer member shaped to thermally contact the heat generating processor device, the heat transfer member including an inlet port and an outlet port that are in fluid communication with a cooling liquid flow path defined through the heat transfer member.

Abstract: A modular liquid cooling block is described for cooling high current devices deployed in power flow control systems. The liquid cooling blocks may have separate shower heads which may be configured for direct impingement, indirect impingement, or parallel flow cooling configurations. Voltage isolation of liquid cooling blocks from an enclosure of the power flow control system and from associated equipment enables serial or parallel connected power flow control units to inject substantial reactive power that may be configurable into a power transmission line. Associated power flow control systems are monitored for temperature, flow rate and pressure gradient. Redundant pumps and fan radiators contribute to reliable operation. Automatic shutdown and alarm may be provided.

Abstract: A power conversion device includes a connector and a sealing member. The connector is connected to a lead-in pipe of a cooling device on the outside of a case. The sealing member makes a watertight seal between a refrigerant flow pipe, which is the lead-in pipe, and the connector. The sealing member includes a connector-side tubular portion, a first watertight seal projection, and a second watertight seal projection. The connector-side tubular portion is located between an inner peripheral surface of the connector and an outer peripheral surface of the lead-in pipe. The first watertight seal projection projects radially outward in an annular shape from the connector-side tubular portion toward the inner peripheral surface of the connector. The second watertight seal projection projects radially inward in an annular shape from the connector-side tubular portion toward the outer peripheral surface of the lead-in pipe.

Abstract: A vertical architecture for incorporating cooling devices onto a baseboard. The architecture forms four layers: baseboard, electronic device layer, contact layer, and cooling layer. In the electronic device layer multiple electronic chips of different characteristics are mounted onto the baseboard. In the contact layer multiple contact devices are attached to the electronic chips to match the form factor of the chips to the respective cooling device and to function to transfer heat from the chip to the respective cooling device. In the cooling layer multiple cooling devices are used to extract the heat using passive or active air cooling, liquid cooling, or hybrid and/or phase change cooling.

Abstract: A system for cooling of computing components of an information handling system. The information handling system can include a computing card that is coupled to a computing card connector. The computing card connector can include mounting features for coupling of a thermal plate.