Patents Examined by Adam B Dravininkas
  • Patent number: 11991868
    Abstract: An electrical appliance that can be fastened to a support element, in particular a wall, includes a heat sink, circuit boards, and a housing. The circuit boards are fastened to the heat sink in each case and the heat sink is able to be fastened or is fastened to the support element. The housing surrounds the circuit boards and is fastened to the heat sink.
    Type: Grant
    Filed: February 15, 2019
    Date of Patent: May 21, 2024
    Assignee: SEW-EURODRIVE GMBH & CO. KG
    Inventors: Martin Schörner, Joachim Nikola, Hans Jürgen Kollar
  • Patent number: 11985797
    Abstract: A cooling device for dissipating heat from an object. The cooling device comprises a base part arranged for contact with the object, and fins attached to and protruding from the base part in a direction substantially away from the object when in use. The fins are arranged in a first configuration adapted for heat dissipation by natural convection of air and in a second configuration adapted for heat dissipation by forced convection of ambient air movement such as wind. Thereby, the cooling device can provide ample or at least adequate cooling effect on the object both when there is more or less ambient air movement chiefly using the second configuration, and when the ambient air is not moving chiefly using the first configuration.
    Type: Grant
    Filed: February 2, 2018
    Date of Patent: May 14, 2024
    Assignee: Telefonaktiebolaget LM Ericsson (publ)
    Inventors: Stevin Van Wyk, Mikkel Myhre
  • Patent number: 11974414
    Abstract: A circuit board cooling apparatus is disclosed having a heat spreader device to be thermally coupled with a surface of the circuit board to be cooled. Also, a conforming heat transfer device is disclosed that is thermally and physically coupled with the heat spreader device to conform to a surface contour of the heat spreader device on a first side of the heat transfer device. The cooling apparatus also includes a heat transport device physically attached and thermally coupled with a second side of the heat transfer device.
    Type: Grant
    Filed: August 23, 2019
    Date of Patent: April 30, 2024
    Assignee: Hewlett Packard Enterprise Development LP
    Inventors: Ernesto Ferrer Medina, Harvey J. Lunsman, Tahir Cader, John Franz
  • Patent number: 11956920
    Abstract: A liquid-cooled plate radiator is disclosed. The liquid-cooled plate radiator includes a radiator body. A coolant liquid runner for circulating a coolant liquid is formed inside the radiator body. The coolant liquid runner includes a plurality of radiating sub-runners. Then, a plurality of fin units are arranged on the radiating sub-runners along a flow direction of the coolant liquid. The fin unit has a plurality of fins extending side by side along the flow direction of the coolant liquid. Moreover, the fins of the front and rear adjacent fin units on the radiating sub-runners are staggered, thereby increasing the radiating area, enhancing the disturbance of the coolant liquid when flowing inside the radiating sub-runners, and improving the radiating efficiency. Thus, the technical problems of limited radiating area and low radiating efficiency caused by a single linear coolant liquid runner are solved.
    Type: Grant
    Filed: December 31, 2021
    Date of Patent: April 9, 2024
    Assignee: SHENZHEN MICROBT ELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Qian Chen, Fangyu Liu, Yang Gao, Yuefeng Wu, Hongyan Ning
  • Patent number: 11924996
    Abstract: A heat exchanger for a liquid cooling system has an enclosure defining an internal chamber and a wall defining an external major surface of the enclosure. The enclosure extends from a first open end to an opposed second open end and an inlet passage extends from the first open end to the internal chamber. An outlet passage extends from the internal chamber to the second open end. A plurality of corrugated fins are conductively coupled with the wall defining the external major surface and positioned in the internal chamber. A liquid cooling system can include such a heat exchanger. And, an electronic device can include one or more multichip modules cooled by such a cooling system.
    Type: Grant
    Filed: March 15, 2021
    Date of Patent: March 5, 2024
    Inventors: Brad Zakaib, Kamal Mostafavi, Jarod Domingo, Yixuan Gao
  • Patent number: 11917790
    Abstract: The present disclosure is directed to systems and methods of improving the thermal performance of processor-based devices. Such thermal performance improvement may include limiting the degree of tilt experienced by a semiconductor device as a thermal solution coupled to the semiconductor device is tightened to the substrate. Such thermal performance improvements may include increasing the available heat transfer area associated with a particular heat producing semiconductor device. Such thermal performance improvements may include thermally coupling one or more cool blocks thermally coupled to one or more remote heat-producing devices to a central cool block that may be cooled using a cooling medium or coupled to a central heat-producing semiconductor device.
    Type: Grant
    Filed: April 27, 2020
    Date of Patent: February 27, 2024
    Assignee: Intel Corporation
    Inventors: Prabhakar Subrahmanyam, Casey Winkel, Yingqiong Bu, Ming Zhang, Yuehong Fan, Yi Xia, Ying-Feng Pang
  • Patent number: 11913737
    Abstract: A heatsink comprising a heat exchange device having a plurality of heat exchange elements each having a surface boundary with respect to a heat transfer fluid, having successive elements or regions having varying size scales. According to one embodiment, an accumulation of dust or particles on a surface of the heatsink is reduced by a removal mechanism. The mechanism can be thermal pyrolysis, vibration, blowing, etc. In the case of vibration, adverse effects on the system to be cooled may be minimized by an active or passive vibration suppression system.
    Type: Grant
    Filed: March 20, 2023
    Date of Patent: February 27, 2024
    Assignee: Fractal Heatsink Technologies LLC
    Inventor: Alexander I Poltorak
  • Patent number: 11910516
    Abstract: Disclosed is an electronic device including a heat dissipation structure that includes a first printed circuit board; a thermal diffusion member arranged in parallel to the first printed circuit board; a second printed circuit board which is arranged to be separated from the first printed circuit board and which is electrically connected with the first printed circuit board; and a heat transfer member of which at least a partial area faces a heat dissipation member, and of which at least another partial area, formed to be bent, is arranged to face one surface of the second printed circuit, and additional other various embodiments are possible.
    Type: Grant
    Filed: November 8, 2019
    Date of Patent: February 20, 2024
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Hongki Moon, Yoonsun Park, Seunghoon Kang, Kyungha Koo, Seyoung Jang, Woojune Jung
  • Patent number: 11910573
    Abstract: A mechanical device for cooling an electronic component may include a surface including an aperture, and a first support protruding from the surface and a second support protruding from the surface. In some embodiments, the device may include disposed within the aperture a thermal interface material (TIM).
    Type: Grant
    Filed: October 25, 2021
    Date of Patent: February 20, 2024
    Assignee: MELLANOX TECHNOLOGIES LTD.
    Inventors: Alon Rokach, Ayal Shabtay, David Fischer, Nimer Hazin, Jamal Mousa
  • Patent number: 11895802
    Abstract: A computational heat dissipation structure includes a circuit board including a plurality of heating components; and a radiator provided corresponding to the circuit board; wherein a space between the adjacent heating components is negatively correlated with heat dissipation efficiency of a region where the adjacent heating components are located. Since the space between the adjacent heating components of the disclosure is negatively correlated with the heat dissipation efficiency of the region where the adjacent heating components are located, i.e., the higher the heat dissipation efficiency of the region where the adjacent heating components are located is, the smaller the space between the adjacent heating components in the region will be, the heat dissipation efficiencies corresponding to the heating components are balanced, and load of a fan is reduced.
    Type: Grant
    Filed: July 25, 2022
    Date of Patent: February 6, 2024
    Assignee: Canaan Creative Co., LTD.
    Inventors: Ning Zhang, Nangeng Zhang
  • Patent number: 11889666
    Abstract: Disclosed herein are apparatus and methods for a power electronics assembly includes a cold plate assembly and one or more power device assemblies. The cold plate assembly includes a manifold including a heat sink cavity in a first surface and a heat sink. The heat sink includes one or more substrate cavities and the heat sink is positioned in the heat sink cavity. The one or more power device assemblies are positioned within the one or more substrate cavities. Each power device assembly of the one or more power assemblies includes a direct bonded metal (DBM) substrate including a first metal layer directly bonded to an insulator layer and a power device. The DBM substrate includes a power device cavity. The power device is positioned in the power device cavity and the power device is electronically coupled to the first metal layer.
    Type: Grant
    Filed: November 3, 2021
    Date of Patent: January 30, 2024
    Assignee: TOYOTA MOTOR ENGINEERING & MANUFACTURING NORTH AMERICA, INC.
    Inventors: Feng Zhou, Yanghe Liu, Hiroshi Ukegawa
  • Patent number: 11882669
    Abstract: A computational heat dissipation structure includes a circuit board including a plurality of heating components; and a radiator provided corresponding to the circuit board; wherein a space between the adjacent heating components is negatively correlated with heat dissipation efficiency of a region where the adjacent heating components are located. Since the space between the adjacent heating components of the disclosure is negatively correlated with the heat dissipation efficiency of the region where the adjacent heating components are located, i.e., the higher the heat dissipation efficiency of the region where the adjacent heating components are located is, the smaller the space between the adjacent heating components in the region will be, the heat dissipation efficiencies corresponding to the heating components are balanced, and load of a fan is reduced.
    Type: Grant
    Filed: April 17, 2023
    Date of Patent: January 23, 2024
    Assignee: Canaan Creative Co., LTD.
    Inventors: Ning Zhang, Nangeng Zhang
  • Patent number: 11876036
    Abstract: Fluid cooling systems are discussed herein. The system may include a top portion including a first surface receiving package(s) generating heat during operation, a second surface positioned opposite the first surface, and a plurality of embedded channels formed on the second surface. The system may also include a bottom portion positioned adjacent the top portion. The bottom portion may include inlet section(s) receiving a coolant and a plurality of inlet fluid conduits formed adjacent to and in fluid communication with the inlet section(s). The bottom portion may also include a plurality of outlet fluid conduits formed adjacent to the plurality of inlet fluid conduits. Each outlet fluid conduit may be in fluid communication with at least one of the inlet fluid conduits. The bottom portion may further include an outlet section(s) in fluid communication with the plurality of outlet fluid conduits and the inlet section(s).
    Type: Grant
    Filed: June 18, 2021
    Date of Patent: January 16, 2024
    Assignee: The Research Foundation for the State University of New York
    Inventors: Leila Choobineh, Bahgat Sammakia
  • Patent number: 11864348
    Abstract: A thermal management unit includes a heat sink, which includes a base portion having a first side and a second side opposite the first side. The heat sink also includes a first protrusion structure and a second protrusion structure. The first protrusion structure protrudes from the first side of the base portion, and the first protrusion structure includes a plurality of fins. The second protrusion structure protrudes from the second side of the base portion, and the second protrusion structure includes a plurality of ribs.
    Type: Grant
    Filed: July 28, 2022
    Date of Patent: January 2, 2024
    Inventor: Gerald Ho Kim
  • Patent number: 11853133
    Abstract: A siphon-based heat sink for a server comprises a heat absorbing mechanism, a siphon mechanism, and a heat sink. The heat absorbing mechanism comprises a base plate and a cover plate. The base plate comprises a bottom plate and multiple sets of heat dissipating fins, and is in contact with the central processing unit. The heat sink comprises a cooling cavity and cooling fins. The evaporation cavity is communicated with the cooling cavity via two siphon tubes to enable heat transfer and circulation of a thermal conductive medium. Lower ends of the two fin plates are positioned close to and fixed to the bottom plate, while upper ends thereof are bent outward to form a curved mechanism, and an included angle between the two fin plates continuously increases from bottom to top.
    Type: Grant
    Filed: May 30, 2019
    Date of Patent: December 26, 2023
    Assignee: ZHENGZHOU YUNHAI INFORMATION TECHNOLOGY CO., LTD.
    Inventor: Bin Zong
  • Patent number: 11844195
    Abstract: An information handling system includes a heatsink interface component, a printed circuit board assembly, and an upstream heatsink. The heatsink interface component aligns the upstream heatsink on the printed circuit board assembly. The heatsink interface component includes first, second, third, and fourth sides. The heatsink interface component also includes multiple posts. Each of a first set of the posts is located on a top surface of the second side, and each of a second set of the posts is located on a top surface of the fourth side. The heatsink interface component also includes recesses located within the second and fourth sides. Each of a first set of the recesses extends from a bottom surface to the top surface of the second side, and each of a second set of the recesses extends from a bottom surface to the top surface of the fourth side.
    Type: Grant
    Filed: July 20, 2021
    Date of Patent: December 12, 2023
    Assignee: Dell Products L.P.
    Inventor: Tung-Yu Chien
  • Patent number: 11844193
    Abstract: A fluid delivery module that produces direct fluid-contact cooling of a computer processor, while mating with common processor accessory mounting specifications. Computer processors are commonly packaged and installed on printed circuit boards. The fluid module delivers cooling fluid directly to at least a surface of the processor package. The fluid module forms a fluid-tight seal against the surface of the processor package. By delivering fluid to the surface of the processor package, the module cools the computer processor. The module does not mechanically fasten to the processor. Instead, the module fastens to a variety of processor accessory mounting patterns commonly found on printed circuit boards. The printed circuit board typically carries the processor. This minimizes stress on the processor package, and allows greater modularity between different processors. In one embodiment, the fluid delivery is done with integral microjets, producing very high heat transfer cooling of the computer processor.
    Type: Grant
    Filed: November 24, 2021
    Date of Patent: December 12, 2023
    Assignee: JetCool Technologies, Inc.
    Inventors: Jordan Mizerak, Bernard Malouin
  • Patent number: 11839056
    Abstract: An optical transceiver includes a housing, an optical communication module and a heat dissipation component. The optical communication module is disposed in the housing. The heat dissipation component is disposed in the housing and in thermal contact with the housing and the optical communication module, and the heat dissipation component is a stamped metal plate.
    Type: Grant
    Filed: April 15, 2021
    Date of Patent: December 5, 2023
    Assignee: Global Technology Inc.
    Inventors: Jiandong Mao, Qilin Hong, Gaofei Yao, Taotao Ye
  • Patent number: 11832396
    Abstract: A server tray package includes a motherboard assembly that includes a plurality of data center electronic devices, the plurality of data center electronic devices including at least one heat generating processor device; and a liquid cold plate assembly. The liquid cold plate assembly includes a base portion mounted to the motherboard assembly, the base portion and motherboard assembly defining a volume that at least partially encloses the plurality of data center electronic devices; and a top portion mounted to the base portion and including a heat transfer member shaped to thermally contact the heat generating processor device, the heat transfer member including an inlet port and an outlet port that are in fluid communication with a cooling liquid flow path defined through the heat transfer member.
    Type: Grant
    Filed: June 2, 2020
    Date of Patent: November 28, 2023
    Assignee: Google LLC
    Inventors: Madhusudan Krishnan Iyengar, Christopher Gregory Malone, Yuan Li, Jorge Padilla, Woon-Seong Kwon, Teckgyu Kang, Norman Paul Jouppi
  • Patent number: 11812592
    Abstract: A modular liquid cooling block is described for cooling high current devices deployed in power flow control systems. The liquid cooling blocks may have separate shower heads which may be configured for direct impingement, indirect impingement, or parallel flow cooling configurations. Voltage isolation of liquid cooling blocks from an enclosure of the power flow control system and from associated equipment enables serial or parallel connected power flow control units to inject substantial reactive power that may be configurable into a power transmission line. Associated power flow control systems are monitored for temperature, flow rate and pressure gradient. Redundant pumps and fan radiators contribute to reliable operation. Automatic shutdown and alarm may be provided.
    Type: Grant
    Filed: October 7, 2022
    Date of Patent: November 7, 2023
    Assignee: Smart Wires Inc.
    Inventors: Haroon Inam, Ali Farahani