Abstract: A heatsink comprising a heat exchange device having a plurality of heat exchange elements each having a surface boundary with respect to a heat transfer fluid, having successive elements or regions having varying size scales. According to one embodiment, an accumulation of dust or particles on a surface of the heatsink is reduced by a removal mechanism. The mechanism can be thermal pyrolysis, vibration, blowing, etc. In the case of vibration, adverse effects on the system to be cooled may be minimized by an active or passive vibration suppression system.

Abstract: The present invention generally relates to a modular microjet cooler. The modular microjet cooler may be attached to a packaged heat generating device that is mounted on a printed circuit board. The modular microjet cooler has an inlet allowing supply fluid to be directed through microjet nozzles toward an impingement surface on the packaged device. The modular microjet cooler also has one or more outlets that allow exhaust fluid to be removed. The modular microjet cooler is attached to the device after it has been packaged. Further, the modular microjet cooler may be attached to the packaged device either before or after it is mounted to the printed circuit board.

Abstract: A cold plate having a manifold includes a recess extending from a first side to a second side of the manifold, where the recess includes openings to the recess positioned lengthwise along the first side and a single opening to the recess on the second side, an inlet and an outlet fluidly coupled to the recess, a plurality of plates fastened to the first side enclosing the openings, a heat sink fastened to the second side enclosing the single opening on the second side, and a plurality of fluid cores one of each positioned between each of the plurality of plates and the heat sink. The plurality of fluid cores include a flow distribution insert, a first plate fin positioned between the flow distribution insert and the heat sink fastened to the second side, and a second plate fin positioned between the flow distribution insert and the heat sink.

Abstract: Obtained is a power conversion device that suppresses size increase thereof while improving cooling performance for a smoothing capacitor. The power conversion device includes: a cooler having a cooling surface on an outer side thereof and a flow path on an inner side thereof, the flow path being formed such that a coolant flows through the flow path; and a smoothing capacitor fixed to the cooler, the smoothing capacitor being thermally connected to the cooling surface with a heat transfer member therebetween and configured to smooth DC power. A thickness of the heat transfer member between the smoothing capacitor and a portion, of the cooling surface, to which the smoothing capacitor is thermally connected is set to be smaller than a wall thickness of the cooler between the flow path and the portion, of the cooling surface, to which the smoothing capacitor is thermally connected.

Abstract: Described herein is a hybrid cooling device and a cooling method that use a combination of phase change cooling and air cooling. The hybrid cooling device includes a closed loop two phase system, one or more fans, and an assembly clamp. The two phase system further includes a cold plate, an integrated channel, and a radiator, and a pressure sensor. The cold plate can include phase change fluid for extracting heat from electronics on a printed circuit board sandwiched between the cold plate and the assembly clamp. The one or more fans can be used to create airflows for cooling both the cold plate and the radiator. The pressure sensor can be used to control the operation of the hybrid cooling device, which can be deployed in different system environments and server configurations.

Abstract: A server rack with a plurality of compute nodes is positioned in a facility that includes a spine and the server rack includes a middle of rack (MOR) switch located near the middle of the server rack, vertically speaking. The MOR switch includes a plurality of ports that are connected via passive cables to the compute nodes provided in the server rack. In an embodiment the passive cables are configured to function at 56 Gbps using non-return to zero (NRZ) encoding and each cable may be about or less than 1.5 meters long. An electrical to optical panel (EOP) can be positioned adjacent a top of the server rack and the EOP includes connections to the MOR switch and to the spine, thus the EOP helps connect the MOR switch to the spine. Connections between adjacent server racks can provide for additional compute bandwidth when needed.

Abstract: A cold plate includes an outer housing, and a fluid circuit within the outer housing. The fluid circuit includes a fluid inlet located on a first sidewall of the outer housing, a fluid outlet located on the first sidewall of the outer housing, and a primary channel disposed between and fluidly connecting the fluid inlet and the fluid outlet. The primary channel includes an inlet leg downstream of the fluid inlet, an outlet leg upstream of the fluid outlet, and a connecting portion fluidly connecting the inlet leg and the outlet leg. The fluid circuit further includes a first secondary channel branching from the inlet leg of the primary channel, and a second secondary channel branching from the outlet leg of the primary channel.

Abstract: A system that may include a rigid bus bar body portion having one or more first conductive pathways, and a flexible bus bar body portion extending from the rigid bus bar body portion and having a lower modulus of elasticity than the rigid bus bar body portion, the flexible bus bar body portion including one or more second conductive pathways. The one or more first conductive pathways and the one or more second conductive pathways may be configured to be conductively coupled with a first electronic device to form a conductive connection between the first electronic device and at least a second electronic device.

Abstract: A heat exchange ribbon includes a base portion to be attached to a spacer to be mounted to a circuit board, a tail portion substantially parallel to the base portion, and a leg connecting the tail portion to the base portion. A height of the leg extends in the same direction as a height of the base portion and the tail portion so as to create an opening at least partially surrounded by the base portion, the leg, and the tail portion. The base portion, the tail portion, and the leg portion have a one-piece construction. The leg extends below a lower edge of the base portion such that at least a portion of the tail portion is located below a lower edge of the base portion, and at least a portion of an inner surface of the tail portion does not oppose the outer surface of the base portion.

Abstract: The present invention discloses heat sinks comprising a base and a plurality of fins protruding from one surface of the base, wherein the base and the fins are independently composed of one or more anisotropic thermal conductive films. Said anisotropic thermal conductive film is electric insulative with low Dk and Df values. Also disclosed are methods for manufacturing the heat sinks and methods for dissipating heat of electronic devices having at least one heat generating component.

Abstract: Embodiments of the disclosure relate to active cooling devices for cooling an electronic assembly positioned downstream in a computing system. In one embodiment, an electronic assembly positioned downstream of the computing system is disclosed. The electronic assembly includes a printed circuit board electrically connected to the computing system; an air duct disposed over the printed circuit board; and an active cooling device thermally coupled to the printed circuit board. The printed circuit board includes a transceiver socket configured to receive at least one optical transceiver and one or more heat-generating components disposed thereon. The at least one optical transceiver is configured to mate with an active optical cable.

Abstract: A cooling device includes a cooling plate with a bottom wall portion with a lower surface which contacts a heat-generating component, a top wall portion which covers an upper surface of the bottom wall portion, a side wall portion which couples the bottom wall portion and the top wall portion, and an internal space which is surrounded by the bottom wall portion, the top wall portion, and the side wall portion to define a first cooling medium flow passage. The bottom wall portion includes blades on the upper surface. An inlet port or an outlet port is on one end side of the first cooling medium flow passage. An inner peripheral wall of the side wall portion includes a first bent portion which is bent convex inward between ends of the blades and the at least one of the inlet port and the outlet port.

Abstract: A system includes an enclosure having an air inlet end and an air outlet end, air movers positioned near the air outlet end, a first data connector positioned near the air outlet end between the air movers, a heat-generating electrical component positioned immediately between the data connector and the air inlet end, a first heat sink positioned immediately between at least one of the air movers and the air inlet end, and a first conductive pipe thermally coupled between the heat-generating electrical component and the first heat sink.

Abstract: A fan-equipped heatsink includes: a heat receiving substrate made of metal; a centrifugal fan disposed on an upper surface side of the heat receiving substrate; a plate-shaped wall that is made of metal, is provided so as to stand at a position, on the upper surface of the heat receiving substrate, which is around and opposed to an outer peripheral portion having an air discharge opening of the centrifugal fan, and are provided with a plurality of through-holes that are open in a plate surface opposed to the centrifugal fan; and a lid member fixed to an upper end of the plate-shaped wall 4 and configured to close a space on the inner side of the plate-shaped wall.

Abstract: A display module and a display device are provided. The display module is used in the display device having a camera lens, and the display module includes a display panel and a cover plate. A camera hole is defined in a position of the display panel corresponding to the camera lens. The cover plate is disposed on the display panel. A recess is defined in a side surface of the display panel to form a receiving hole which is disposed correspondingly to the camera hole. A ring-shaped blocking layer is disposed in the receiving hole to block a periphery of the camera hole.

Abstract: A device for cooling a processor which comprises a chamber which is bottomless and having a perimeter sealably mounted directly on a surface of a processor; a microgap plate, separate from the chamber, which is installed at a bottom of the chamber and forms a microgap with the surface of a processor; and a lid, separate from the chamber, which is installed onto the chamber to close a top of the chamber, the lid comprising downward projections to urge the microgap plate to the bottom of the chamber during installation. Walls forming the downward projections of the lid form a lining conforming to an inner surface of walls of the chamber, wherein the lid and the downward projections thereof together form a bottomless enclosure that defines an inlet plenum volume for receiving the coolant. The microgap comprises a central inlet through the microgap plate for coolant flow into the microgap.

Abstract: A display device includes: a flexible display panel having a display area and a non-display area disposed adjacent to the display area; a supporting member provided at a predetermined area of the flexible display panel adjacent to one side of the flexible display panel, wherein the non-display area of the flexible display panel contacts the supporting member and surrounds the supporting member while being bent at a bend angle, and the bend angle of the non-display area is variously adjusted by the supporting member.

Abstract: A refrigerant channel of a heatsink includes an upwardly inclined channel formed by a side wall for downstream side of a first protruding portion and a side wall for upstream side of a second protruding portion. The upwardly inclined channel directs a flow of the refrigerant toward a base portion of the fin and causes the refrigerant to flow into the fin region, because of which more refrigerant flows to the base portion than to a leading end portion of the fin, and a high heat dissipating performance is obtained. Also, the fin is a columnar body whose sectional form perpendicular to a central axis is a regular hexagon, has rounded portions in corner portions, and has tapers on side faces. Six fins are disposed neighboring one fin, and a distance between fins is constant. Because of this, the heat dissipating performance further improves, and pressure loss can be reduced.

Abstract: A compute device includes a printed circuit board, at least three compute subassemblies disposed on the printed circuit board, and a liquid loop. The compute subassemblies disposed on the printed circuit board and each of the three compute subassemblies includes a thermal control plate defining a respective internal conduit therethrough. A temperature controlled liquid circuit circulates through the liquid loop through to control the temperature of each of compute subassemblies in series during operation, the liquid loop including each of the internal conduits in each of the thermal control plates in each of the compute subassemblies.

Abstract: An assembled circuit board has a topology that defines positions, dimensions and power dissipation of components mounted to the circuit board, including a high power component and one or more low power components. A cold plate makes thermal contact to the high power component through a thermal interface material. A thermally conductive sheet overlays the circuit board and is formed to match the topology of the low power component or components. The sheet has a first portion that makes thermal contact with the cold plate and a second portion that overlays the low power component or components. The cold plate removes heat directly from the high power component and indirectly through the thermally conductive sheet from the low power component or components. The thermally conductive sheet conforms to the topology of the low power components either by preforming or by flexibility.