Patents Examined by Adam B Dravininkas
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Patent number: 11792957Abstract: A system for cooling of computing components of an information handling system. The information handling system can include a computing card that is coupled to a computing card connector. The computing card connector can include mounting features for coupling of a thermal plate.Type: GrantFiled: August 10, 2021Date of Patent: October 17, 2023Assignee: Dell Products L.P.Inventors: Qinghong He, David Grunow, Michael Kotson
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Patent number: 11791239Abstract: The present disclosure provides for a heatshield that can be actively cooled during a rework process. The heatshield may include a backer plate, a metal plate, and/or a package pedestal. The backer plate may include one or more air inlet ports configured to be connected to an air compressor. Air inlet ducts may extend from the air inlet ports through at least a portion of the backer plate. A plurality of vents may extend from the air inlet ducts to a top surface of the backer plate such that the plurality of vents directs cooling gas forced into the heatshield towards the metal plate and a first BGA. The cooling gas may maintain the solder joint temperature of the first BGA package below the reflow temperature and below the solidus temperature of the solder joints to prevent reflow-related solder joint defects from occurring in the first BGA package during rework of a second BGA package.Type: GrantFiled: March 16, 2021Date of Patent: October 17, 2023Assignee: Google LLCInventor: Sue Yun Teng
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Patent number: 11785744Abstract: This document describes a reinforced graphite heat-spreader for a surface of a housing component of an electronic device. The reinforced graphite heat-spreader includes a heat-spreader material stack having a layer of graphite material to spread heat. The reinforced graphite heat-spreader also includes an interface material stack that joins the heat-spreader material stack to the housing surface of an electronic device. The interface material stack, which may be formed using embossing techniques, includes protuberances that may be formed from an adhesive material.Type: GrantFiled: April 25, 2022Date of Patent: October 10, 2023Assignee: Google LLCInventors: Ihab A. Ali, Duen Hsing Hsieh
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Patent number: 11785740Abstract: An electronic module is provided with a housing with a base and walls extending transversely from the base. The housing comprises an inlet port and an outlet port formed through the walls. A circuit board assembly is supported by the housing and includes electronics that generate heat during operation. A cold plate is mounted to the walls of the housing to define a manifold. The housing and the cold plate are in thermal communication with the circuit board assembly for transferring heat generated by the electronics. A baffle is disposed within the manifold for directing coolant flow. Elastic material is disposed over a distal end of the baffle and adapted to engage a lower surface of the cold plate in an interference fit to block coolant leakage.Type: GrantFiled: May 24, 2021Date of Patent: October 10, 2023Assignee: LEAR CORPORATIONInventors: Parminder Brar, Ajmal Ansari, Jared Pieknik, Michael Scott Duco, Kevin J. Foldvary
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Patent number: 11782482Abstract: A display device includes: a flexible display panel having a display area and a non-display area disposed adjacent to the display area; a supporting member provided at a predetermined area of the flexible display panel adjacent to one side of the flexible display panel, wherein the non-display area of the flexible display panel contacts the supporting member and surrounds the supporting member while being bent at a bend angle, and the bend angle of the non-display area is variously adjusted by the supporting member.Type: GrantFiled: October 14, 2022Date of Patent: October 10, 2023Assignee: Samsung Display Co., Ltd.Inventor: Tae Wook Kang
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Patent number: 11778746Abstract: An assembly structure of a transformer and a circuit board includes: a circuit board, a packaging chip, a transformer, a first conductive plate, a second conductive plate and a first heat sink. The packaging chip is disposed on the circuit board. The transformer has at least one first output electrode and at least one second output electrode connected to the first output electrode. The first conductive plate is disposed on the transformer and connected to the at least one first output electrode. The second conductive plate is disposed on the transformer and connected to the at least one second output electrode and the circuit board. The first heat sink is connected to the packaging chip and the first conductive plate, is disposed on the circuit board, and is connected to the circuit board and the first conductive plate.Type: GrantFiled: April 9, 2021Date of Patent: October 3, 2023Assignees: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED, LITE-ON TECHNOLOGY CORPORATIONInventors: Tsung-Po Hsu, Yung-Chou Li, Yu-Jen Wei, Chih-Chun Yang
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Patent number: 11778722Abstract: Various technologies described herein pertain to an autonomous vehicle computing device for an autonomous vehicle. The autonomous vehicle computing device includes a printed circuit board, a heat sink, and a thermal interface material layer between the printed circuit board and the heat sink. The autonomous vehicle computing device further includes a barrier layer between the thermal interface material layer and the printed circuit board. The thermal interface material layer can be formed of a two-part thermal interface material that cures in place. The barrier layer between the thermal interface material layer and the printed circuit board enables separation of the printed circuit board from the thermal interface material layer if reworking or modification of the autonomous vehicle computing device is desired. The barrier layer can enable the printed circuit board to be separated from the thermal interface material layer in a manner that mitigates damage to the printed circuit board.Type: GrantFiled: May 4, 2021Date of Patent: October 3, 2023Assignee: GM CRUISE HOLDINGS LLCInventors: Reza Azizian, Jameson Tai, Brian Schlotterbeck, Yung Chang Ko, Srinivasa Rao Damaraju, Zoran Stefanoski
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Patent number: 11778784Abstract: A heat dissipation device with a function of communication includes a conductive substrate, a first conductive sidewall, a second conductive sidewall, a plurality of heat sink elements, and a feeding element. The heat sink elements have different lengths, and they are positioned between the first conductive sidewall and the second conductive sidewall. The first conductive sidewall, the heat sink elements, and the second conductive sidewall are respectively coupled to the conductive substrate. The feeding element is coupled to a signal source. An antenna structure is formed by the feeding element, the conductive substrate, and the heat sink elements.Type: GrantFiled: March 19, 2021Date of Patent: October 3, 2023Assignee: HTC CORPORATIONInventors: Ta-Chun Pu, Chun-Yih Wu
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Patent number: 11770914Abstract: A cooling device for cooling electronic components mounted on a circuit board. The device comprises a hollow body defining a coolant transport circuit for circulating coolant fluid there thorough. The hollow body comprises a plurality of flattened regions linked by duct regions, wherein the flattened regions and duct regions are formed as continuous regions of the body. When the body is secured to the circuit board, each flattened region is configured to align with one or more electronic components for transferring heat away.Type: GrantFiled: August 12, 2021Date of Patent: September 26, 2023Assignee: Aptiv Technologies LimitedInventors: Frank H. Adam, Klaus Kaufmann
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Patent number: 11755080Abstract: There is disclosed a computing apparatus, including: a first chassis including primary operational circuitry of the computing apparatus; a second chassis hingeably coupled to the second chassis, the second chassis having substantially less operational circuitry than the first chassis whereby the operational circuitry of the second chassis generates substantially less heat than the operational circuitry of the first chassis; and a heat spreader between the first chassis and second chassis and disposed to dissipate generated heat from the first chassis into the second chassis.Type: GrantFiled: December 23, 2021Date of Patent: September 12, 2023Assignee: Intel CorporationInventors: Prakash Kurma Raju, Babu Triplicane Gopikrishnan, Bijendra Singh, Prasanna Pichumani, Raghavendra Doddi, Harish Jagadish, Gopinath Kandasamy, David Pidwerbecki
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Patent number: 11751361Abstract: A thermal management system for cooling a computing device includes a cold aisle, a hot aisle, a radiator, and a plurality of source heat sinks thermally conductively connected to the radiator. The radiator connects the cold aisle to the hot aisle and flows a cooling fluid through an interior volume of the radiator. Each source heat sink is configured to connect to a heat-generating electronic component to thermally conductively connect the heat-generating component to a surface of the radiator.Type: GrantFiled: June 2, 2021Date of Patent: September 5, 2023Assignee: Microsoft Technology Licensing, LLCInventors: Ashish Arvind Kulkarni, Prajakta Ashish Kulkarni
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Patent number: 11733749Abstract: An electronic device that includes a first device portion, a second device portion coupled to the first device portion, and a uni-directional thermally conductive connector coupled to the first device portion and the second device portion. The first device portion comprises a region that includes a component configured to generate heat. The uni-directional thermally conductive connector is configured to dissipate heat away from the first device portion and towards the second device portion. The uni-directional thermally conductive connector includes a thermally conductive material that primarily dissipates heat along a first direction of the thermally conductive material.Type: GrantFiled: November 10, 2020Date of Patent: August 22, 2023Assignee: QUALCOMM INCORPORATEDInventors: Hung-Wen Lin, Sin-Shong Wang, Keith Wang, Ajit Kumar Vallabhaneni, Jen-Chun Chang
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Patent number: 11737242Abstract: A heat dissipation apparatus includes a heat dissipation substrate, a heat dissipation component, and a plurality of heat dissipation fins disposed on a first side of the heat dissipation substrate. The heat dissipation fins are configured to dissipate heat on the heat dissipation substrate. A first surface of the heat dissipation component is fastened on a second side of the heat dissipation substrate. There is a gap between a side surface of the heat dissipation component and the heat dissipation substrate, and a second surface of the heat dissipation component is used to be attached to a first to-be-heat-dissipated component, to dissipate heat on the first to-be-heat-dissipated component. An area that is on the second side of the heat dissipation substrate is used to be attached to another to-be-heat-dissipated component. Heating power of the first to-be-heat-dissipated component is greater than heating power of the another to-be-heat-dissipated component.Type: GrantFiled: September 21, 2022Date of Patent: August 22, 2023Assignee: HUAWEI TECHNOLOGIES CO., LTD.Inventors: Lei Cao, Shoubiao Xu, Shanjiu Chi
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Patent number: 11729943Abstract: Example implementations relate to an electronic system providing thermal management of a removable device when connected to a host device of the electronic system including a receptacle, and a heat transfer device having first and second portions. The host device has a cooling component. The removable device having a heat spreader, is detachably coupled to the host device. The receptacle having spring fingers, is coupled to one of the cooling component or the heat spreader. The first portion is coupled to one of the cooling component or the heat spreader, and the second portion is protruded outwards. When the removable device is connected to the host device, the second portion extends through the receptacle such that the spring fingers establish direct thermal interface with the second portion to allow waste-heat to transfer between the heat transfer device and one of the cooling component or the heat spreader via the receptacle.Type: GrantFiled: January 22, 2021Date of Patent: August 15, 2023Assignee: Hewlett Packard Enterprise Patent Department LPInventors: Harvey J. Lunsman, Ernesto Ferrer, John Franz
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Patent number: 11728627Abstract: Embodiments of the presently disclosed invention may enable electrical components and connections to be monitored within electrical distribution equipment cabinets having a blanking panel. Such an IR/UV-permitting panel may replace the pre-existing blanking panel in order to monitor the adjacent area having the targeted components and connections to be monitored. NFC tags may be utilized in connection with an IR/UV-permitting panel to enable data acquisition and management systems for the monitoring of electrical components in a cabinet.Type: GrantFiled: July 18, 2022Date of Patent: August 15, 2023Assignee: IRISS Holdings, Inc.Inventor: Martin Robinson
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Patent number: 11716829Abstract: A head-mountable device can provide a cooling module that effectively manages heat while also minimizing noise, vibration, leakage, power consumption, size, and weight. To dissipate heat, the cooling module with a fan can be operated to move air through a chamber within the head-mountable device. An integrated heat sink can provide heat dissipation properties by drawing heat away from heat-generating components and into the chamber. The integrated heat sink can include a base plate that defines at least a portion of the chamber in which the blades of the fan are positioned. The integrated heat sink can further include fins between the chamber and an outlet. The fins can be integrated with the base plate to maximize heat dissipation and reduce the number of interfaces between separate parts.Type: GrantFiled: February 2, 2021Date of Patent: August 1, 2023Assignee: Apple Inc.Inventors: Cheng P. Tan, Sivesh Selvakumar, Jesse T. Dybenko, Enoch Mylabathula, Jason C. Sauers, Phil M. Hobson, Laura M. Campo, Dragos Moroianu
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Patent number: 11698233Abstract: A cold plate apparatus that has an outlet plenum leading to an outlet opening includes an outlet transition that connects the outlet opening to the outlet plenum. The outlet transition defines a smoothly curving flow path from a direction along a long dimension of the outlet plenum, which is parallel to a plane defined by the outlet opening, to a direction along a centerline of the outlet opening, which is at an angle from the plane defined by the outlet opening. The outlet transition provides a smooth variation of cross-sectional area from the outlet plenum to the outlet opening.Type: GrantFiled: December 26, 2020Date of Patent: July 11, 2023Assignee: International Business Machines CorporationInventor: Mark D. Schultz
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Patent number: 11696423Abstract: An immersion cooling system includes an electronic component, a thermally conductive dielectric liquid, and a tank defining a tank interior configured to receive the electronic component and the thermally conductive dielectric liquid for cooling the electronic component. The immersion cooling system also includes a wall positioned external to the tank to coordinate with the tank to define an overflow gap extending between the tank and the wall. The overflow gap is configured to receive an overflow of the thermally conductive dielectric liquid from the tank interior.Type: GrantFiled: September 30, 2021Date of Patent: July 4, 2023Assignee: TYCO FIRE & SECURITY GMBHInventors: Michael J Sweeney, David Patrick Selmser, John Bernard Zwicker, Shahreen Beente Haider
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Patent number: 11681340Abstract: A graphics subsystem includes a printed circuit board (PCB), a set of one or more fans, and a heat sink. A graphics processing unit (GPU) is integrated into the PCB. The PCB is shortened to occupy a portion of the width of the graphics subsystem. The heat sink is coupled to the PCB and/or GPU and configured to extend beyond an edge of the PCB, thereby occupying a larger portion of the width of the graphics subsystem compared to the PCB. A first fan is disposed partially or fully beyond the edge of the PCB and is configured to direct air through the portion of the heat sink that extends beyond the edge of the PCB, along a first airflow path, and out of the graphics subsystem. A second fan is configured to direct air through the heat sink, along a second airflow path, towards the GPU.Type: GrantFiled: December 14, 2020Date of Patent: June 20, 2023Assignee: NVIDIA CORPORATIONInventors: David Haley, Xiang Sun, Gabriele Gorla, Andrew Bell, Boris Landwehr
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Patent number: 11683918Abstract: A power electronics module for an industrial or vehicle battery charger system or the like is provided. The power electronics module utilizes a chassis housing including a heatsink surface and a plurality of sidewalls. A main power section printed circuit board is disposed adjacent to the heatsink surface of the chassis housing a. A low voltage, low power printed circuit board is disposed adjacent to the main power section printed circuit board opposite the heatsink surface of the chassis housing. An alternating current input filter portion printed circuit board including electromagnetics is disposed along one of the plurality of sidewalls of the chassis housing and separated from the low voltage, low power printed circuit board within the chassis housing.Type: GrantFiled: October 29, 2020Date of Patent: June 20, 2023Assignee: Rivian IP Holdings, LLCInventors: Young Doo, Jason Huang, Yang Liu