Abstract: Example implementations relate to an electronic system providing thermal management of a removable device when connected to a host device of the electronic system including a receptacle, and a heat transfer device having first and second portions. The host device has a cooling component. The removable device having a heat spreader, is detachably coupled to the host device. The receptacle having spring fingers, is coupled to one of the cooling component or the heat spreader. The first portion is coupled to one of the cooling component or the heat spreader, and the second portion is protruded outwards. When the removable device is connected to the host device, the second portion extends through the receptacle such that the spring fingers establish direct thermal interface with the second portion to allow waste-heat to transfer between the heat transfer device and one of the cooling component or the heat spreader via the receptacle.

Abstract: Embodiments of the presently disclosed invention may enable electrical components and connections to be monitored within electrical distribution equipment cabinets having a blanking panel. Such an IR/UV-permitting panel may replace the pre-existing blanking panel in order to monitor the adjacent area having the targeted components and connections to be monitored. NFC tags may be utilized in connection with an IR/UV-permitting panel to enable data acquisition and management systems for the monitoring of electrical components in a cabinet.

Abstract: A head-mountable device can provide a cooling module that effectively manages heat while also minimizing noise, vibration, leakage, power consumption, size, and weight. To dissipate heat, the cooling module with a fan can be operated to move air through a chamber within the head-mountable device. An integrated heat sink can provide heat dissipation properties by drawing heat away from heat-generating components and into the chamber. The integrated heat sink can include a base plate that defines at least a portion of the chamber in which the blades of the fan are positioned. The integrated heat sink can further include fins between the chamber and an outlet. The fins can be integrated with the base plate to maximize heat dissipation and reduce the number of interfaces between separate parts.

Abstract: A cold plate apparatus that has an outlet plenum leading to an outlet opening includes an outlet transition that connects the outlet opening to the outlet plenum. The outlet transition defines a smoothly curving flow path from a direction along a long dimension of the outlet plenum, which is parallel to a plane defined by the outlet opening, to a direction along a centerline of the outlet opening, which is at an angle from the plane defined by the outlet opening. The outlet transition provides a smooth variation of cross-sectional area from the outlet plenum to the outlet opening.

Abstract: An immersion cooling system includes an electronic component, a thermally conductive dielectric liquid, and a tank defining a tank interior configured to receive the electronic component and the thermally conductive dielectric liquid for cooling the electronic component. The immersion cooling system also includes a wall positioned external to the tank to coordinate with the tank to define an overflow gap extending between the tank and the wall. The overflow gap is configured to receive an overflow of the thermally conductive dielectric liquid from the tank interior.

Abstract: A graphics subsystem includes a printed circuit board (PCB), a set of one or more fans, and a heat sink. A graphics processing unit (GPU) is integrated into the PCB. The PCB is shortened to occupy a portion of the width of the graphics subsystem. The heat sink is coupled to the PCB and/or GPU and configured to extend beyond an edge of the PCB, thereby occupying a larger portion of the width of the graphics subsystem compared to the PCB. A first fan is disposed partially or fully beyond the edge of the PCB and is configured to direct air through the portion of the heat sink that extends beyond the edge of the PCB, along a first airflow path, and out of the graphics subsystem. A second fan is configured to direct air through the heat sink, along a second airflow path, towards the GPU.

Abstract: A power electronics module for an industrial or vehicle battery charger system or the like is provided. The power electronics module utilizes a chassis housing including a heatsink surface and a plurality of sidewalls. A main power section printed circuit board is disposed adjacent to the heatsink surface of the chassis housing a. A low voltage, low power printed circuit board is disposed adjacent to the main power section printed circuit board opposite the heatsink surface of the chassis housing. An alternating current input filter portion printed circuit board including electromagnetics is disposed along one of the plurality of sidewalls of the chassis housing and separated from the low voltage, low power printed circuit board within the chassis housing.

Abstract: In one embodiment, an apparatus includes a heat sink for attachment to an optical module cage configured for receiving an optical module, a thermal interface material attached to a surface of the heat sink for thermal contact with the optical module, and a plurality of lifting elements extending from the surface of the heat sink. The lifting elements are configured to create a gap between the thermal interface material and the optical module during insertion of the optical module into the optical module cage or removal of the optical module from the optical module cage, the plurality of lifting elements positioned for insertion into aligned recesses in the optical module when the optical module is fully inserted into the optical module cage to eliminate the gap and provide contact between the optical module and the thermal interface material.

Abstract: In some embodiments, an apparatus comprises an integrated circuit module comprising two layers of thermal interface material, a printed circuit assembly disposed between the two layers of thermal interface material and comprising a plurality of integrated circuits disposed on both sides of a circuit board, wherein at least one of the integrated circuits is thermally coupled with one of the layers of thermal interface material, and two heat spreaders adapted to removably retain one another, and when retaining one another to enclose and become thermally coupled with the two layers of thermal interface material; and a printed circuit board having a connector disposed thereon, wherein a connector edge of the printed circuit assembly is disposed within the connector. In other embodiments, a frame is adapted to retain the two heat spreaders.

Abstract: A rack-mountable computer system enables an airflow that cools components in an upstream portion of the computer system interior to be cooled through mixing with a bypass airflow downstream of the components in the upstream portion. The mixed airflow can cool components in a downstream portion of the interior. The bypass airflow is directed by a bypass plenum that is unencompassed by the separate plenum that directs the airflow to cool the upstream portion components. The bypass plenum can be at least partially established by an external surface the computer system and one or more external structures, including an external surface of an adjacently mounted computer system. Relative flow rates through the separate plenums can be adjusted, via flow control elements, to separately control heat removal from components upstream and downstream of the air mixing, based at least in part upon air temperatures in the separate interior portions.

Abstract: An energy management unit (EMU) is disclosed. The EMU including: a cold plate sandwiched between a first printed circuit board (PCB) and a second PCB, the cold plate comprising one or more magnetics; wherein the cold plate is configured to cool both the first PCB and the second PCB.

Abstract: An electronics cooling system includes a printed circuit board (PCB) assembly having a heat generating component connected to a base. A plurality of thermally conductive microtubes are connected to the PCB assembly with a first spatial density. The plurality of thermally conductive microtubes are connected to a heat plate of a cooling system with a second spatial density to evenly spread the heat flux of the PCB assembly over the heat plate.

Abstract: Printed circuit board (PCB) substrates include at least one pre-preg layer interposed between one or more electrically conductive layers, power device stacks, each having a power device embedded within the PCB substrate in a vertical stack configuration, and a flat heat pipe positioned between the power device stacks within the at least one pre-preg layer, one surface of the flat heat pipe directly bonded to a first one of the power device stacks and an opposite surface of the flat heat pipe thermally coupled to a second one of the power device stacks.

Abstract: A multisided heat spreader includes a base, a first wall, and a second wall. A proximal end of the first wall is connected to a first end of the base. A proximal end of the second wall is connected to a second end of the base which is opposite to the first end of the base. A space is defined adjacent to a first surface of the base and between the first wall and the second wall such that the multisided heat spreader is open between a distal end of the first wall and a distal end of the second wall. The first wall and the second wall are configured to receive an electronic component in the space therebetween. A second surface of the base is configured to be attached to a heat generation component. The first surface of the base is opposite to the second surface of the base.

Abstract: An information handling system includes two or more heat-generating devices and a liquid-assisted air cooling (LAAC) assembly to cool at least some of the devices. The LAAC assembly includes a radiator, first and second pumps connected in series with the radiator. The LAAC assembly further includes first and second cold plates enclosing first and second CPUs or another suitable heat generating device. The first and second cold plates are connected in parallel between an inlet of the first pump and an outlet of the second pump. In this configuration, the serial connected pumps in combination with the parallel connected cold plates provide 1+1 pump redundancy while delivering cold coolant from the radiator outlet to both heat generating devices such that neither heat cold plate receives pre-heated coolant from the other cold plate.

Abstract: Examples described herein relate to cooling system for an electronic circuit module. The cooling system includes a frame disposable on the electronic circuit module and comprising a plurality of compartments defined by compartment walls. The cooling system further includes a plurality of cold plates disposed in the plurality of compartments of the frame and in thermal contact with the electronic circuit module, wherein the plurality of cold plates includes one or more passages to allow flow of a coolant there-through to conduct heat away from the electronic circuit module. Further, the one or more cold plates of the plurality cold plates include a guide feature to allow vertical movement of the one or more cold plates in respective compartments.

Abstract: The present disclosure discloses a heat dissipation plate for chip heat dissipation, a server heat dissipation system, and a heating device. One end of the heat dissipation plate may be blocked. Another end of the heat dissipation plate may be provided with a water inlet and a water outlet. A pipeline assembly in the heat dissipation plate may include a plurality of branch water inlet pipelines and a plurality of branch outlet pipelines. One end of the plurality of branch water inlet pipelines may operably connect to the water inlet. One end of the plurality of branch water outlet pipelines may operably connect to the water outlet. Another end of the plurality of branch water inlet pipelines may be operably connected to another end of the plurality of branch water outlet pipelines through a connection pipeline.

Abstract: Heat dissipation systems may include a base, a vapor chamber, and a plurality of cooling fins. The base may contact a top surface of a chip on a printed circuit board to be cooled. The vapor chamber may be planar and be coupled to and extend from the base so that the planar vapor chamber is perpendicular relative to the top surface of the chip. The vapor chamber is coupled to the base so that a first portion of the vapor chamber extends along the base in a first direction, and a second portion of the vapor chamber, adjacent to the first portion of the vapor chamber, extends in the first direction past an edge of the base in order to overhang the printed circuit board. Both the first portion and the second portion of the vapor chamber include the plurality of cooling fins.

Abstract: A liquid-cooling radiator module includes a first reservoir, a second reservoir, a heat dissipation stacked structure, a radiator inlet and a radiator outlet. The first reservoir includes a first chamber and a second chamber. The second reservoir includes a third chamber and a fourth chamber. A fin tube layer of the heat dissipation stacked structure is sandwiched between the first reservoir and the second reservoir. The radiator inlet is connected to the first reservoir and the first chamber. The radiator outlet is connected to the second reservoir and the fourth chamber. A part of fin tubes of the fin tube layer communicates with the first chamber and the third chamber, another part of the fin tubes communicates with the third chamber and the second chamber, and one another part of the fin tubes communicates with the second chamber and the fourth chamber.

Abstract: A heatsink comprising a heat exchange device having a plurality of heat exchange elements each having a surface boundary with respect to a heat transfer fluid, having successive elements or regions having varying size scales. According to one embodiment, an accumulation of dust or particles on a surface of the heatsink is reduced by a removal mechanism. The mechanism can be thermal pyrolysis, vibration, blowing, etc. In the case of vibration, adverse effects on the system to be cooled may be minimized by an active or passive vibration suppression system.