Abstract: The invention concerns an electrical assembly comprising a cooling module, in particular an active cooling module comprising a network in which a cooling liquid flows and an electrical busbar, where the said electrical busbar is attached directly to a portion for receiving the cooling module, where the said electrical assembly is configured to be added in a frame of a first electrical device.

Abstract: A heat dissipation apparatus is provided, an electronic component is disposed on one side of an adjustable heat dissipation component, and a rotating shaft is disposed on another side of the adjustable heat dissipation component; and one end of a connecting component is connected to the adjustable heat dissipation component, another end of the connecting component is connected to a fixed substrate, and the connecting component drives the adjustable heat dissipation component to rotate by using the rotating shaft. The connecting component may be adjusted to rotate the electronic component together with the adjustable heat dissipation component, to reduce complexity in deploying the electronic component and the heat dissipation apparatus without affecting a heat dissipation effect, thereby improving convenience of operation.

Abstract: A thermal management unit includes a heat sink, which includes a base portion having a first side and a second side opposite the first side. The heat sink also includes a first protrusion structure and a second protrusion structure. The first protrusion structure protrudes from the first side of the base portion, and the first protrusion structure includes a plurality of fins. The second protrusion structure protrudes from the second side of the base portion, and the second protrusion structure includes a plurality of ribs.

Abstract: A computational heat dissipation structure includes a circuit board including a plurality of heating components; and a radiator provided corresponding to the circuit board; wherein a space between the adjacent heating components is negatively correlated with heat dissipation efficiency of a region where the adjacent heating components are located. The computing device of the disclosure includes a device housing enclosing an enclosed heat-dissipation air duct, and the computational heat dissipation structure; the computational heat dissipation structure is located in the enclosed heat-dissipation air duct. Since the space between the adjacent heating components of the disclosure is negatively correlated with the heat dissipation efficiency of the region where the adjacent heating components are located, i.e.

Abstract: A cooling system for an electronic device includes a central processing unit (CPU), a remote heat sink, and a heat-pipe module. The CPU is mounted on a base of the electronic device, and the remote heat sink receives heat generated by the CPU. The heat-pipe module has a plurality of heat pipes for transferring the heat generated by the CPU to the remote heat sink. Each heat pipe has a circular section extending between a first end and a second end. The first end has a flattened, non-circular shape, and is coupled to the base near the CPU. The second end is coupled to the remote heat sink. The first end of each heat pipe is in direct contact with at least another first end of an adjacent heat pipe.

Abstract: A fluid channel for a power semiconductor module includes a die carrier configured to carry a plurality of semiconductor dies on a first side, a plurality of cooling elements arranged on a second side of the die carrier opposite the first side, and a channel wall arranged opposite the second side of the die carrier and forming a cavity. The cooling elements are arranged in the cavity. The cooling elements are attached to the die carrier at attachment points. A majority of the attachment points are positioned vertically in alignment with positions of the semiconductor dies.

Abstract: A heat exchanger comprising a body part and a cooling fin system having an inlet end and an outlet end. The cooling fin system has a plurality of cooling fins, and is adapted to provide a flow path for a coolant flow through the cooling fin system in a longitudinal direction. The coolant flow is adapted to enter the cooling fin system through an inlet surface of the cooling fin system. The inlet surface of the cooling fin system is a non-planar surface.

Abstract: Embodiments of the presently disclosed invention may enable electrical components and connections to be monitored within electrical distribution equipment cabinets having a blanking panel. Such an IR/UV-permitting panel may replace the preexisting blanking panel in order to monitor the adjacent area having the targeted components and connections to be monitored. NFC tags may be utilized in connection with an IR/UV-permitting panel to enable data acquisition and management systems for the monitoring of electrical components in a cabinet.

Abstract: A cooling system comprises an information technology (IT) container including a plurality of IT chambers, a fluid supply channel disposed at a bottom of the IT container to receive the fluid from a cooling unit and to supply the fluid to the IT chambers, a fluid return channel disposed on a top of the IT chambers to return the fluid received from the IT chambers to the cooling unit, a fluid acceleration channel disposed separately from the fluid return channel to return at least some of the fluid to the cooling unit in an accelerated manner, and one or more pumps disposed between at least some of the IT chambers immerged in the fluid environment and the fluid acceleration channel to increase a flowrate of the fluid from the corresponding IT chambers to the cooling unit via the fluid acceleration channel. For example, each IT chamber to store fluid and to populate IT equipment submerged in the fluid for immersion cooling. In an embodiment, the IT chamber includes acceleration sections.

Abstract: The present technology relates to heat dissipation systems which may include vapor chambers. Vapor chambers may include top body portions and bottom body portions. A bottom body portion may include a first bottom side and a first perimeter wall extending from a perimeter of the first bottom side. The top body portion may be coupled to the first perimeter wall, and the bottom body portion may define an opening extending between a first inner surface and a first outer surface of the bottom side. Vapor chambers may also include an insert body formed separately from the bottom body portion. The insert body extends through the opening and is coupled to the bottom body portion. A sealed interior volume of the vapor chamber may comprise a first portion defined by the top body portion and the first bottom side; and a second portion defined by the opening and the insert body.

Abstract: A power electronics module includes a cold plate manifold, a heat sink base layer at least partially embedded in the cold plate manifold, an electrically-insulating layer in direct contact with the heat sink base layer, a conductive substrate positioned on the electrically-insulating layer, and a power electronics device coupled to and in direct contact with the conductive substrate.

Abstract: An electronic apparatus includes a first circuit board, a second circuit board, one or more electronic components, an enclosure portion, and a second housing. The electronic components are mounted on at least one of opposing surfaces of the first circuit board and the second circuit board that oppose each other. The enclosure portion supports a surface of each of the first circuit board and the second circuit board to oppose each other with a predetermined gap therebetween. The enclosure portion encloses a gap space that includes the one or more electronic components within a space between the first circuit board and the second circuit board. The second housing accommodates the first circuit board, the second circuit board, and the enclosure portion. The enclosure portion contacts the housing.

Abstract: A power module of the present invention includes a power device for converting and outputting a frequency of an input power source, and a housing accommodating the power device therein and forming flow paths for a cooling fluid on both sides of the power device such that the cooling fluid can contact both sides of the power device. Accordingly, both plate surfaces of the power device can be in direct contact with the cooling fluid so as to be quickly cooled.

Abstract: A heat exchanger includes: a baseplate having a first side and a second side opposite the first side, the first side being coupled to a thermosiphon, one or more electronic components being mounted on the second side. The baseplate has a two-phase heat spreading structure. In an embodiment, the heat exchanger includes a thermosiphon.

Abstract: A liquid cooling head device includes a base, a cover covering the base, an inlet portion disposed on the base, an outlet portion formed on the cover, and a fluid pump having a housing and a fan blade. The base includes a diversion channel, an opening and a first chamber connected to the diversion channel and the opening. A second chamber is formed between the cover and the base, and connected to the first chamber through the opening. The inlet portion is connected to the first chamber through the diversion channel. The housing covers one surface of the cover, so that a third chamber is collectively defined by the housing and the cover, and connected with the second chamber and the outlet portion. The fan blade is located in the third chamber, and the diversion channel is located between the fan blade and the first chamber.

Abstract: A heatsink comprising a heat exchange device having a plurality of heat exchange elements each having a surface boundary with respect to a heat transfer fluid, having successive elements or regions having varying size scales. According to one embodiment, an accumulation of dust or particles on a surface of the heatsink is reduced by a removal mechanism. The mechanism can be thermal pyrolysis, vibration, blowing, etc. In the case of vibration, adverse effects on the system to be cooled may be minimized by an active or passive vibration suppression system.

Abstract: An air mover board may include a cold-aisle power and cold-aisle signal connector located on a first edge of the air mover board and configured to couple to a corresponding connector of an information handling system when the air mover board is in a cold-aisle configuration, a hot-aisle power and hot-aisle signal connector located on a second edge of the air mover board opposite that of the first edge and configured to couple to the corresponding connector of an information handling system when the air mover board is in a hot-aisle configuration, and a plurality of mechanical features configured to align and maintain the air mover board in a fixed position relative to an air mover tray, including a feature permanently coupled to the air mover board and configured to mechanically couple to features of the air mover tray in the cold-aisle and hot-aisle configuration.

Abstract: The disclosed embodiments relate to an active coolant distribution device and an electronic apparatus, where the active coolant distribution device includes a manifold including a first and second primary pipes and branches. At least one of the first and second primary pipes is suitable for accommodating the flow generator. The second primary pipe includes a first hollow post and a first and second inner wall portions. The first hollow post has first liquid inlets. The first and second inner wall portions form a first channel, a second channel, and an accommodation space inside the first hollow post. The first inner wall portion has converging port, the second inner wall portion has ejecting port, the first channel is located between the first liquid inlets and the converging port and connected to the accommodation space, the ejecting port is connected to the accommodation space and the second channel.

Abstract: A temperature conditioning unit includes a first temperature conditioning unit part, a second temperature conditioning unit part, and a blower (centrifugal blower). The first temperature conditioning unit part includes a first housing, a first air hole part, a first air chamber, a first object to be temperature-conditioned, and a second air chamber. The second temperature conditioning unit part includes a second housing, a second object to be temperature-conditioned, a second air hole part, and a third air chamber.

Abstract: A rack-mountable computer system enables an airflow that cools components in an upstream portion of the computer system interior to be cooled through mixing with a bypass airflow downstream of the components in the upstream portion. The mixed airflow can cool components in a downstream portion of the interior. The bypass airflow is directed by a bypass plenum that is unencompassed by the separate plenum that directs the airflow to cool the upstream portion components. The bypass plenum can be at least partially established by an external surface the computer system and one or more external structures, including an external surface of an adjacently mounted computer system. Relative flow rates through the separate plenums can be adjusted, via flow control elements, to separately control heat removal from components upstream and downstream of the air mixing, based at least in part upon air temperatures in the separate interior portions.