Abstract: A method for manufacturing a combined wiring board includes preparing wiring boards, preparing a metal frame having opening portions formed to accommodate the wiring boards, respectively, positioning the wiring boards in the opening portions in the metal frame, and forming crimped portions in the metal frame by plastic deformation such that sidewalls of the metal frame in the opening portions bond sidewalls of each of the wiring boards. The crimped portions are formed such that the crimped portions in the metal frame have amounts of the plastic deformation which are set different for positions of the crimped portions in the metal frame.

Abstract: A method and a system for a mounting device are provided. The mounting device includes at least two shells, each shell having an inner surface and an outer surface wherein the outer surface includes a first banding zone, a second banding zone, and a clamping zone extending between the first banding zone and the second banding zone and a pair of shoulders bounding each of the first banding zone and second banding zone. The mounting device also includes an intermediary material circumscribing the wire bundle including at least one of a substantially non-porous material, a vulcanizing tape, and a silicone material. The mounting device further includes at least one fastener configured to engage the first banding zone or second banding zone to couple the first shell and the second shell to the wire bundle and the intermediary material.

Abstract: A faceted dome assembly for airborne optical sensors to enhance EMI shielding and lightning protection is disclosed. In one embodiment, the faceted dome assembly includes a faceted dome. An optical sensor and a gimbal are housed in the faceted dome. Further, a conductor is disposed substantially in the facets of the faceted dome to provide the enhanced electromagnetic shielding and lightning protection.

Abstract: Certain embodiments relate to routing structures and their formation. In one embodiment a routing structure includes a first region including a first layer comprising alternating signal traces and ground traces separated by a dielectric. The first region also includes a second layer including alternating signal traces and ground traces separated by a dielectric, wherein the second layer signal positioned over the first layer ground traces, and the second layer ground traces positioned over the first layer signal traces. The first region may also include additional layers of alternating signal and ground traces. The first region may also be formed with the ground traces having a width that is larger than that of the signal traces. The routing structure may also include a second region including pads to which the traces are coupled. Other embodiments are described and claimed.

Abstract: A display device, comprising a base cover with a base plate, a sidewall portion extended from the base plate and a first coupling hole; a display panel with a first display portion configured to display an image and a second display portion outside and along the first display portion, a top cover with a bezel portion sized to be laid over the second display portion, and a sidewall portion extended from the bezel portion, the top cover including a second coupling hole; and a fixing element with a first coupling portion having a third coupling hole, a contact portion extended from the first coupling portion and configured to maintain contact with a portion of the top cover. A coupling element can be inserted through the first through third coupling holes so as to press the contact portion against a portion of the top cover.

Abstract: The present invention provides a method for manufacturing a conductive pattern, comprising the steps of: a) forming a conductive film on a substrate; b) forming an etching resist pattern on the conductive film; and c) forming a conductive pattern having a smaller line width than a width of the etching resist pattern by over-etching the conductive film by using the etching resist pattern, and a conductive pattern manufactured by using the same. According to the exemplary embodiment of the present invention, it is possible to effectively and economically provide a conductive pattern having a ultrafine line width.

Abstract: Disclosed is an apparatus for holding an electronic device that includes an interface surface, a central electrical contact on the interface surface, a first radial electrical contact on the interface surface, a first magnetic member near the first radial electrical contact, and a second magnetic member near the central electrical contact.

Abstract: A mobile terminal is provided. The mobile terminal a case having an inner space where electronic components are mounted, a display arranged in the inner space of the case, the display being exposed at a front surface of the case, an audio output module arranged in the inner space of the case to output sound, a circuit board arranged in the inner space of the case, the circuit board having a circuit pattern to transmit an electric signal, a bracket coupled to a back surface of the display, the bracket including a metallic plate and an injection mold configured to partially cover the metallic plate and an electric current carrying structure configured to electrically connect the metal plate to at least one of the display, the audio output module and the circuit board.

Abstract: A display device is provided, including a display panel, a back frame, a circuit board and a cover film. The display panel includes a first substrate and a second substrate, wherein the first substrate includes an upper surface. The back frame supports the display panel and includes an outer surface. The cover film includes a film base, a first adhesive and a second adhesive. The film base includes a first portion, a second portion and an intermediate portion located therebetween, wherein the film base covers an edge of the upper surface and a portion of the outer surface. The first adhesive is disposed on the first portion and is attached to the edge of the upper surface. The second adhesive is disposed on the second portion and is attached to the outer surface, wherein the intermediate portion and the outer surface define a receiving space receiving the circuit board.

Abstract: An enclosure for thermally stabilizing a temperature sensitive component on a circuit board is provided. The enclosure comprises a first cover section configured to be mounted over a portion of a first side of the circuit board where at least one temperature sensitive component is mounted. The first cover section includes a first lid, and at least one sidewall that extends from a perimeter of the first lid. The enclosure also comprises a second cover section configured to be mounted over a portion of a second side of the circuit board opposite from the first cover section. The second cover section includes a second lid, and at least one sidewall that extends from a perimeter of the second lid. The first and second cover sections are configured to releasably connect with the circuit board.

Abstract: An electrical bus assembly includes a frame and a plurality of bus bar carriers connected to the frame. The bus bars are supported by the bus bar carriers in parallel spaced-apart relation. A first retainer cap is secured to a first one of the plurality of bus bar carriers located adjacent a first end of the frame. A second retainer cap is secured to a second one of the plurality of bus bar carriers located adjacent a second end of the frame. The first and second retainer caps limit axial movement of the bus bars relative to the plurality of carriers sufficiently to prevent escape of the bus bars from the carriers. A bus bar connector is also disclosed for supplying power to or from the bus bars. An electrical bus system includes a first and second bus bar assemblies and a jumper connector assembly.

Abstract: An interconnection system includes a first board group, a second board group orthogonal to the first board group, and a center backplane arranged between the first board group and the second board group. The first board group includes a number of first boards parallel to each other and the second board group includes a number of second boards parallel to each other. Curved male connectors re arranged on each of the first boards and curved female connectors are arranged on each of the second boards. The curved male connectors and the curved female connectors directly cooperate and are connected in one-to-one correspondence.

Abstract: A bonding structure of a touch panel and a flexible circuit board includes a touch panel, a flexible circuit board and a conductive adhesive film. The touch panel includes a shielding layer and multiple transmission wires disposed on the shielding layer. The flexible circuit board is under the touch panel and includes a substrate and multiple connection wires on the substrate. Each the connection wire includes a first connection portion and a second connection portion, and the two connection portions are separated from each other by an interval and electrically insulated from each other. The conductive adhesive film is between the transmission wires of the touch panel and the connection wires of the flexible circuit board, in which the first connection portions and the second connection portions of the connection wires are electrically connected to the transmission wires via the conductive adhesive film so as to form an electric loop.

Abstract: In one embodiment, a stack device comprising a film interposer of a polyimide film material, for example, is assembled. In accordance with one embodiment of the present description, a front side of the film interposer is attached to a first element of the stack device, which may be an integrated circuit package, an integrated circuit die, a substrate such as a printed circuit board, or other structure used to fabricate electronic devices. In addition, a back side of the film interposer is attached to a second element which like the first element, may be an integrated circuit package, an integrated circuit die, a substrate such as a printed circuit board, or other structure used to fabricate electronic devices. Other aspects are described.

Abstract: A high frequency device includes a base plate having a main surface, a dielectric on the main surface, along a first side of the base plate, a signal line on the dielectric and extending from the first side toward a central portion of the main surface, an island pattern of a metal on the dielectric, a metal frame having a contact portion contacting the main surface and a bridge portion on the signal line and the island pattern, together enclosing the central portion, a lead frame connected to an outside signal line of the signal line and which is located outside the metal frame, a semiconductor chip secured to the central portion, and a wire connecting the semiconductor chip to an inside signal line of the signal line and which is enclosed within the metal frame.

Abstract: A coil-integrated printed circuit board includes: a first outer layer which includes a first outer thick electric conductor made of a thick metallic foil and a first outer thin electric conductor made of a thin metallic foil having a thickness smaller than that of the first outer thick electric conductor, and which is exposed to an outside; and a first inner layer which includes an inner thick electric conductor made of a thick metallic foil, and which is not exposed to the outside. Coil patterns are respectively formed by the first outer thick electric conductor and the inner thick electric conductor. A first electronic component is surface-mounted on the first outer thin electric conductor provided on the outer layer.

Abstract: An electronic device includes wiring substrates stacked upon one another with a connection member arranged between adjacent wiring substrates, in which the connection member electrically connects the adjacent wiring substrates, and each wiring substrate includes a solder resist layer as a lowermost layer, electronic components mounted on the wiring substrates so that at least one of the electronic components is mounted on each wiring substrate, a first magnetic thin film covering a lower surface of the solder resist layer of an upper one of the adjacent wiring substrates, a first encapsulation resin formed on an upper surface of the uppermost wiring substrate and encapsulates the electronic component mounted on the uppermost wiring substrate, and a second magnetic thin film that entirely covers an upper surface of the first encapsulation resin and covers a lower surface of the solder resist layer on the lowermost wiring substrates.

Abstract: A USB male connector and its companion electronic product are disclosed. The USB male connector includes an insulating body, a slot installed in the insulating body, and a reinforcement structure fixed in the slot. The strength of the reinforcement structure is greater than the strength of the insulating body. The USB male connector has an open end and a tail end that is opposite to the open end. A socket of the slot is located in the tail end of the USB male connector. The electronic product includes an electronic product body and the USB male connector. The USB male connector is fixedly connected to the electronic product body.

Abstract: A geothermal system with earth grounding component for providing electrical grounding is introduced. The geothermal system includes: a geothermal component configured to perform heat exchange; wherein the geothermal component comprises at least one heat exchange tube configured to extend into an underground environment; and an earth grounding component configured to provide earth grounding for electronic equipment; wherein the earth grounding component includes at least one conductive rod coupled to and extended along the at least one heat exchange tube, and the at least one conductive rod is configured to electrically couple to a grounding interface of the electronic equipment.

Abstract: The present invention relates to a composite assembly of plastic (1, 3) and metal films (2.1, 2.2) which can be used for the interconnection and connection of light-emitting diodes (LEDs) (5). For this purpose, a flexible printed circuit board is provided, to which at least one radiation source is applied and which consists of a film system. The flexible printed circuit board has a thermal connection (6) to a heat sink (4) and the film system is composed at least of an insulating carrier layer and a metal film. The insulating carrier layer is opened at the locations at which the thermal connection to the heat sink is produced, and the metal film is subdivided into different sections.