Abstract: An electronic module 10 includes: a circuit board 12 having a first surface and a second surface opposite the first surface; and a plurality of electronic components 14 mounted thereon. The electronic components 14 are sealed at the first surface of the circuit board 12, with a mold body 16 composed of a resin composition. A shield layer 28 is formed on the surface of the mold body 16. The glass transition temperature of a resin included in the mold body 16 is higher than the glass transition temperatures of resins included in the circuit board 12 and the shield layer 28, respectively. The modulus of elasticity of the mold body at 25° C. is 10 to 18 GPa, and the thickness of the circuit board is 0.3 to 1.0 mm.

Abstract: An efficient electronics package comprising an integrated circuit, a transistor case packaging, a power supply, an actuation segment and a sensor segment, wherein engagement of the integrated circuit causes the actuation segment to be activated. The integrated circuit may be engaged, for example, by a level-hold trigger or the sensor segment.

Abstract: An electronics package includes one or more insulating layers and an electrically conductive transmission line. The electrically conductive transmission line includes a signal trace disposed substantially parallel to the one or more insulating layers. The electrically conductive transmission line further includes one or more signal vias electrically coupled to the signal trace. The one or more signal vias are configured to pass through at least a portion of the one or more insulating layers. The electronics package further includes one or more electrically conductive ground planes substantially parallel to the one or more insulating layers. The ground planes include one or more signal via ground cuts. The one or more signal via ground cuts provide clearance between the one or more signal vias and the one or more ground planes.

Abstract: In a first conductive layer and a third conductive layer that are respectively closest to a core layer having a storage portion that penetrates therethrough, four first penetrating holes and four first penetrating holes are formed so as to overlap part of an opening edge of the storage portion that is projected onto the first conductive layer and the third conductive layer, respectively.

Abstract: Provided are a vehicle card key and a method of manufacturing the same. The vehicle card key is used to lock/unlock a vehicle door or start an engine in wireless communication with a vehicle. The vehicle card key includes a lower cover, a circuit board stacked on and coupled to a top of the lower cover, and an upper cover coupled to the lower cover as one body to cover an upper side of the circuit board. The lower cover and the upper cover are formed of a thermo-hardening resin.

Abstract: An electronic component package has a first sealing member main surface with mounted electronic element, and a second sealing member. An outer circumference portion of a second sealing member is molded into a tapered shape, providing a tapered area in at least part of the outer circumference. A flat area adjacent to the tapered area is provided in at least part of a flat portion inward of the outer circumference portion of the surface of the second sealing member. A first area corresponding to the tapered area and a second area corresponding to the flat area are provided adjacent to each other on a first main surface of the first sealing member with mounted electronic component element. A width W2 of the second area is 0.66 to 1.2 times a width W4 of the flat area. First and second bonding layers are formed and bonded with each other by heating.

Abstract: A component assembly that can be easily built in a main substrate with high accuracy is formed such that a glass transition temperature of a built-in-component layer of an assembly substrate in which multiple capacitors are embedded is higher than a glass transition temperature of a built-in-component layer of a built-in-component substrate. Thus, thermal deformation of the component assembly is prevented when the built-in-component substrate in which the component assembly is built is heated during reflow, for example. The component assembly can thus be highly accurately built in the built-in-component substrate. Moreover, when the component assembly in which the multiple capacitors are embedded is built in the built-in-component substrate, electrode pads of the component assembly in which the multiple capacitors are embedded can be electrically connected to wiring layers of the built-in-component substrate by soldering despite the variation in height among the capacitors.

Abstract: The present invention has an objective to provide a circuit board for a peripheral circuit which can transmit outside heat which generates from a high exothermic element, such as a power semiconductor element, while attaining reduction in size and weight, reduction in surge, and reduction in a loss, in high-capacity modules including power modules, such as an inverter. [Solution Means] In a high-capacity module, by laminating a peripheral circuit using a ceramic circuit board with electrode(s) constituted by thick conductor and embedded therein on a highly exothermic element, overheating of the module is prevented by effective heat dissipation via the circuit board while attaining reduction in size and weight, reduction in surge, and reduction in a loss in the module.

Abstract: A high voltage stator bar includes a substantially quadrangular conductive element made of a plurality of interwoven strands, and an electric insulation applied around the conductive element. The permittivity at the corners of the electric insulation decreases by less than 60% from an inner insulation zone facing the conductive element towards an outer insulation zone.

Abstract: A conformal electro-magnetic (EM) detector and a method of applying such a detector are provided herein as well as variations thereof Variations include, but are not limited to, single-element, area detectors; an array of multiple active elements.

Abstract: In a first conductive layer and a third conductive layer that are respectively closest to a core layer having a storage portion that penetrates therethrough, four first penetrating holes and four first penetrating holes are formed so as to overlap part of an opening edge of the storage portion that is projected onto the first conductive layer and the third conductive layer, respectively.

Abstract: A multilayer printed circuit board includes an insulating substrate, circuit layers arranged in the insulating substrate, an electronic component, an electrode disposed on the circuit layer exposed from a surface of the insulating substrate and including a soldered portion at which a terminal of the electronic component is soldered, an internal layer conductor disposed on the circuit layer located inside the insulating substrate and defining through holes in a radial manner centering on the soldered portion, a heat releasing conductor disposed on the circuit layer next to the circuit layer on which the internal layer conductor is disposed, and connection vias inserted in the through holes and coupling the electrode and the heat releasing conductor so as to enable a heat transfer between the electrode and the heat releasing conductor. The internal layer conductor and the heat releasing conductor overlap a whole area of the soldered portion.

Abstract: A portable electronic apparatus includes coupled first and second casings with respective image display surfaces, and including a full-closed state where both casings are overlaid on each other, a tilt state where the second casing has been moved from the full-closed state so that the image display surfaces in both casings are exposed and, also, the image display surface in the second casing is inclined with respect to the image display surface in the first casing at an angle of opening which is equal to or more than 90 degrees but less than 180 degrees, and a full-open state where the image display surfaces in both casings are flushed with each other in the same plane, and the portable electronic apparatus being capable of holding the second casing, in attitude, with respect to the first casing in the full-closed state, in the tilt state and in the full-open state.

Abstract: Disclosed is a braided wire processing method. An operation is carried out wherein a braided wire is folded over with an end portion of a first ring member, forming a braided wire fold over portion; and the outer circumference portion and a cutout portion of the first ring member, as well as a conductor of a grounding line, are covered with the braided wire fold over part. Next, an operation is carried out wherein the exterior side of the braided wire fold over portion passes through a second ring member from the wire axial direction. As the second ring member passes thereupon, the second ring member compresses the first ring member in the circumferential direction thereof. The gap of the cutout part of the first ring member is thus contracted, and the conductor that projects therein is clasped.

Abstract: An electronic apparatus includes a housing, an electronic device and an electronic device fixing module. The electronic device includes at least one protrusion. The electronic device fixing module includes at least one fixing structure and at least one positioning element. The fixing structure is integrally connected with the housing. The positioning element is fixed to the fixing structure and contacts the electronic device to prevent movement of the electronic device relative to the housing along a first axis. The positioning element includes a concave portion in which the protrusion is positioned to prevent movements of the electronic device relative to the housing along a second axis and a third axis. The second axis is perpendicular to the first axis. The third axis is perpendicular to the first axis and the second axis. The material of the positioning element is a resilient material. The positioning element is an integrally formed structure.

Abstract: In a high-frequency module, a laminate including a plurality of dielectric layers each including an electrode pattern located thereon, and a switch element which includes a test terminal arranged to output a negative voltage applied to the switch element and which is mounted on the laminate, are integrally formed. A test external terminal for external connection which outputs a signal to the outside is provided on a back surface of the laminate. The laminate includes a voltage transmission path electrically connecting the test terminal to the test external terminal.

Abstract: An electronic module with excellent electrical characteristics includes an electronic component, a mount board, signal electrodes, a ground electrode, and an insulating layer. The electronic component is mounted on a first main surface of the mount board. The signal electrodes and the ground electrode are located on a second main surface of the mount board. The insulating layer is arranged so as to cover a portion of the second main surface of the mount board. The insulating layer is arranged so as not to cover end portions of the signal electrodes that face the ground electrode.

Abstract: There is provided a wiring board including a first stiffener, one face of which is bonded to a circuit board, a second stiffener having a disposition hole in which an electronic component is disposed, and a laminate that is formed by laminating a plurality of insulating layers and a plurality of wiring layers between the other face of the first stiffener and one face of the second stiffener, and includes a terminal connection part that is connected to the wiring layers, positioned in the disposition hole, and connected to a terminal part of the electronic component.

Abstract: A tire inside information acquiring device (100) attached inside a tire-wheel assembly, includes a housing body (10) configured to house a receiving antenna for receiving a radio signal and an electronic circuit unit connected to the receiving antenna, the electronic circuit unit constitutes the tire inside information acquiring device (100), and a substrate (40) on which the housing body (10) and a component constituting the tire inside information acquiring device (100) are disposed. The housing body (10) is formed of a nonmetallic inorganic material. The component is only formed of parts having water resistance.

Abstract: The invention includes a substrate with a visible area and a shielded area, a touch panel overlapped on the substrate and having touch sensor units overlapping with the visible area and a bridging layer with an insulating film. The touch sensor units are connected with signal wires to electric contacts corresponding to the shielded area. The insulating film cloaks the signal wires and electric contacts. The insulating film is formed with through holes corresponding to the electric contacts and is provided with bridging wires between every two adjacent through holes for connecting all of the electric contacts.