Abstract: In an example embodiment, an electronics package includes one or more insulating layers and an electrically conductive transmission line. The electrically conductive transmission line includes a signal trace disposed substantially parallel to the one or more insulating layers. The electrically conductive transmission line further includes one or more signal vias electrically coupled to the signal trace. The one or more signal vias are configured to pass through at least a portion of the one or more insulating layers. The electronics package further includes one or more electrically conductive ground planes substantially parallel to the one or more insulating layers. The ground planes include one or more signal via ground cuts. The one or more signal via ground cuts provide clearance between the one or more signal vias and the one or more ground planes.

Abstract: A mobile terminal having a case defining an external appearance thereof, and a method of manufacturing such a case, are provided. The case may include a base formed of a resin material and having a recessed portion, a sheet disposed within the recessed portion and formed of a material that is different from that of the base, the material of the sheet having greater rigidity than that of the base, and a reinforcing member filled between the base and the sheet to integrally couple the base and the sheet. The rigidity of the material of the reinforcing member may have an intermediate value between the rigidity of the base and the rigidity of the sheet.

Abstract: Provided is a substrate with built-in electronic component including a component storage layer and two buildup layers. The component storage layer includes an electronic component and a cover portion having an insulating property. The electronic component includes a terminal surface and a main body. The cover portion includes a first surface formed to be flush with the terminal surface, covers the main body of the electronic component, and has a first linear expansion coefficient. The two buildup layers each include an insulating layer and a via portion. The insulating layer is adjacent to the cover portion and has a second linear expansion coefficient larger than the first linear expansion coefficient. The via portion is provided in the insulating layer and connected to the terminal surface. The insulating layer of one of the two buildup layers is formed to be in contact with the terminal surface and the first surface.

Abstract: A photoelectric conversion module includes a circuit board including a plurality of first board-side electrodes and a plurality of second board-side electrodes that are alternately arranged on a mounting surface of the circuit board in an array direction and each extend into strips in a direction orthogonal to the array direction, a photoelectric conversion array element mounted on the circuit board and including, on a surface facing the mounting surface, a plurality of light receiving/emitting portions, first element-side electrodes connected to the first board-side electrodes and second element-side electrodes connected to the second board-side electrodes, and an IC chip mounted on the circuit board. The circuit board further includes, on the mounting surface, a connecting portion for connecting the first board-side electrodes to each other and a first electrode land portion connected to the first board-side electrode or the connecting portion to contact with a first test electrode probe.

Abstract: Intersection structures are provided to reduce a strain in a conformable electronic system that includes multi-level arrangements of stretchable interconnect structures. Bypass regions are formed in areas of the stretchable interconnect structures that may ordinarily cross or pass each other. The bypass regions of the stretchable interconnects are disposed relative to each other such that the intersection structure encompasses at least a portion of the bypass regions of each stretchable interconnect structure. The intersection structure has elastic properties that relieve a mechanical strain on the bypass regions during stretching at least one of the stretchable interconnect structures.

Abstract: In one embodiment, the conduit connector can comprise: a body comprising a hollow center capable of receiving a conduit in a receiving end, wherein the hollow center extends from the receiving end to the connecting end; a spring disposed within the hollow center and extending out of the connecting end, wherein the spring comprises engagement tangs extending into the hollow center, toward the connection end, and spring tangs extending past the connection end and spaced apart a distance greater than or equal to an opening diameter in a junction box; and an antishort bush located in the connecting end of the body, retaining the spring in the body.

Abstract: The described embodiments relate generally to electronic components and more specifically to a capacitor array that can increase component density on a printed circuit board and reduce a distance to a ground plane. An array of capacitors can be formed by coupling a group of capacitors on their sides interspersed with interposer boards. The resulting configuration can increase component density and reduce an amount of resistance and effective series inductance between a set of power decoupling capacitors and an integrated circuit.

Abstract: There is provided an electronic device includes a casing; a substrate which is arranged inside the casing, and provided with a fixation hole; a fixation member which is integrally formed with the casing, and inserted into the fixation hole of the casing, and positioned therein so that an outer periphery thereof is apart from an inner periphery of the fixation hole; and a first elastic body which is disposed in a surrounding area of the fixation hole, and sandwiched between the casing and a front surface of the substrate.

Abstract: A mobile terminal is provided. The mobile terminal includes a front case, a flat panel having a front side facing the front case and a back side, a main printed circuit board supported by the back side of the flat panel, the main circuit printed circuit board having a back side, a battery having a first surface located at a first side thereof and a second surface located at a second side thereof, the battery being located at the back side of the main printed circuit board to form a separation gap between the first curved surface and the back side of the main printed circuit board and at least a portion of an electronic component being mounted on the main printed circuit board and extending into the separation gap. An apparatus for forming a curved battery for the mobile terminal is also provided.

Abstract: Disclosed herein is an electric box for a vehicle including a box body and a cover wherein the box includes a storage space and cover is coupled to the box body to seal the storage space. The box body further includes a wire insertion passageway through which the wire is upwardly inserted into the box body.

Abstract: A multi-chip package has a substrate with electrical contacts for connection to an external device. A CPU die is disposed on the substrate and is in communication with the substrate. The CPU die has a plurality of processor cores occupying a first area of the CPU die, and an SRAM cache occupying a second area of the CPU die. A DRAM cache is disposed on the CPU die and is in communication with the CPU die. The DRAM cache has a plurality of stacked DRAM die. The plurality of stacked DRAM dies are substantially aligned with the second area of the CPU die, and substantially do not overlap the first area of the CPU die. A multi-chip package having a DRAM cache disposed on the substrate and a CPU die disposed on the DRAM cache is also disclosed.

Abstract: A computer system includes a desk, and a first display and a first keyboard arranged on a desk panel of the desk and flexibly connected to the desk panel. The panel board includes at least two layers; an edge of a top layer of the panel board is flexibly connected to a second layer of the panel board; a lower surface of the top layer of the panel board is used as a second display and an upper surface of a second layer of the panel board is used as a second keyboard; and the first display, the first key board, the second display, and the second keyboard are all connected to the computer. The computer system of the present disclosure effectively protects eye sights, reduces the probability of shortsightedness, greatly increases the amount of exercise, consumes unnecessary energy, reduces the storage of energy and production of fat, further results in loss of weight, and at the same time strengthens physical exercise and improves health states.

Abstract: A cover plate assembly is provided with a cover plate with a substrate adapted to be mounted upon a substrate of a subplate mounted to an electrical device for enclosing the electrical device. A rim extends from a periphery of the cover plate substrate. The fastener is engaged with the cover plate to engage the detent in a periphery of the subplate for fastening the cover plate to the subplate. The fastener is a separate component than the cover plate and the subplate. The fastener is concealed beneath the cover plate. In another embodiment, the cover plate is metallic and the fastener is formed integrally with the cover plate. In another embodiment, a first fastener fastens the subplate to the electrical device. A second fastener is engaged with the cover plate and the first fastener for fastening the cover plate to the first fastener.

Abstract: The present invention discloses a centralized power supply shielding structure of a cabinet-level server, where the structure includes multiple plug-in frames, a power supply copper bar which is configured to supply power to the multiple plug-in frames, and an inner container shielding can. Multiple plugs of the power supply copper bar are correspondingly inserted into the multiple plug-in frames to supply power to the multiple plug-in frames in a centralized way. The inner container shielding can wraps on a periphery of the power supply copper bar to shield the multiple plug-in frames from the power supply copper bar. The cabinet-level server and its centralized power supply shielding structure of the present invention implement a shielding structure for centralized power supply by a copper bar of integration of a frame and a cabinet, which can be applied in an application scene of an open rack and has a simple structural design.

Abstract: A hybrid circuit includes a high-voltage circuit and a low-voltage circuit having different power supply voltages, respectively, a board on which a connecting terminal for connecting an external element outside of the hybrid circuit is mounted; and a hybrid integrated circuit mounted on the board. The low-voltage circuit includes a control unit for controlling an operation of the high-voltage circuit. The control unit and the high-voltage circuit are integrated in the hybrid integrated circuit.

Abstract: A cable for high-voltage electronic devices including an inner semiconductive layer, a high-voltage insulator, an outer semiconductive layer, a shielding layer, and a sheath which are provided on an outer periphery of a cable core part in the order mentioned, wherein the high-voltage insulator is made of an insulating composition whose temperature dependence parameter DR found by the following expression is 1.0 or less: DR=log R23° C.?log R90° C. (where R23° C. is volume resistivity (?·cm) at 23° C. and R90° C. is volume resistivity (?·cm) at 90° C.). The cable for high-voltage electronic devices is small in diameter and has an excellent withstand voltage characteristic.

Abstract: An assembly apparatus is provided. The assembly apparatus includes a fixed apparatus that includes a body element, a first fixed element protruding from an outer curved surface of the body element in a radial direction of the body element, and a second fixed element extending in a first direction that is vertical to the radial direction of the body element, and a support apparatus that includes a first receiving element in which the first fixed element is inserted, rotated, and fixed, and a second receiving element in which the second fixed element is inserted, rotated, and fixed. An end of the second fixed element is connected to the body element. Another end of the second fixed element protrudes from a lower surface of the body element.

Abstract: There is provided a substrate with built-in component, including a metal core layer having a cavity for storing a component; a wiring layer that is laminated on the core layer and has a plurality of vias for an interlayer connection, the vias being formed at regions opposing to the cavity; and an electronic component including a plurality of terminals electrically connected to the plurality of vias, and a component body that is stored in the cavity and has a support surface for supporting the plurality of terminals, the plurality of terminals being disposed eccentrically from a center of the support surface to a first direction, and the component body being disposed eccentrically from a center of the cavity to a second direction opposite to the first direction.

Abstract: A plug and play control panel assembly having a circuit board with plug in sockets that receive a plurality of electrical components with the board seating in an enclosure having a cover attached that can help capture the components and board therebetween keeping the board seated and the components plugged in. The board includes at least one socket for a power receptacle having outwardly extending terminal blades received in socket slots. One preferred socket is configured for blades of a duplex 120 volt receptacle plugged into a board that preferably is an insert molded circuit board. A control panel module is produced having an insert molded board with plug in sockets on one side for receiving electrical components and at least one plug in socket on its opposite side defining a “plug and play” control panel module that is removably plugged into a larger apparatus during apparatus assembly.

Abstract: An electronic device is presented for electrical connection between a first pad contact of an integrated circuit component and a target contact positioned substantially in a first plane of a target platform. The electronic device includes a first surface substantially parallel to the first plane and a second surface below the first surface substantially parallel to the first plane. The first surface includes a first contact region configured to connect to the first pad contact when the electronic device is connected between the first pad contact and the target contact. The second surface includes a second contact region configured to connect to the target contact when the electronic device is connected between the first pad contact and the target contact. The electronic device further includes a multitude of electrically passive elements connected between the first and second contact regions.