Patents Examined by Alan Wong
  • Patent number: 12166466
    Abstract: Trim layers that are configured to adjust one or more operating parameters for surface acoustic wave (SAW) devices are disclosed. A SAW device may include an interdigital transducer (IDT) and a piezoelectric material that are configured to generate an acoustic wave and a trim layer that has an acoustic velocity and a density that correspond to a velocity of the acoustic wave. In this manner, the trim layer may be configured to adjust an electromechanical coupling of the SAW device without significantly impacting a resonance frequency of the SAW device. The SAW device may also include an additional trim layer that is configured to adjust a coupling percentage and the resonance frequency of the SAW device. A SAW device may include a trim layer that is configured to adjust certain operating parameters by greater amounts than other operating parameters.
    Type: Grant
    Filed: December 7, 2018
    Date of Patent: December 10, 2024
    Assignee: Qorvo US, Inc.
    Inventor: Sebastian Huebner
  • Patent number: 12155368
    Abstract: Devices and processes for preparing devices are described for a bulk acoustic wave resonator. A stack formed over a substrate includes a piezoelectric film element, a first (e.g., bottom) electrode coupled to a first side of the piezoelectric film element, and a second (e.g., top) electrode that is coupled to a second side of the piezoelectric film element. A cavity is positioned between the stack and the substrate. The resonator includes one or more planarizing layers, including a first planarizing layer around the cavity, wherein a first portion of the first electrode is adjacent the cavity and a second portion of the first electrode is adjacent the first planarizing layer. The resonator optionally includes an air reflector around the perimeter of the piezoelectric film element. The stack is configured to resonate in response to an electrical signal applied between the first electrode and the second electrode.
    Type: Grant
    Filed: April 26, 2021
    Date of Patent: November 26, 2024
    Assignee: GLOBAL COMMUNICATION SEMICONDUCTORS, LLC
    Inventors: Liping D. Hou, Kun-Mao Pan, Shing-Kuo Wang, Yuefei Yang
  • Patent number: 12149229
    Abstract: Acoustic filters are disclosed. A substrate includes a base and an intermediate layer. A piezoelectric plate is attached to the intermediate layer, portions of the piezoelectric plate forming one or more diaphragms spanning respective cavities in the intermediate layer. A conductor pattern on a front surface of the piezoelectric plate includes interdigital transducers (IDTs) of a plurality of resonators, interleaved fingers of each of the IDTs disposed on a respective diaphragm of the one or more diaphragms. A first frequency setting dielectric layer having a first thickness is disposed over the fingers of the IDTs of a first subset of the plurality of resonators. A second frequency setting dielectric layer having a second thickness greater than the first thickness is disposed over the fingers of the IDTs of a second subset of the plurality of resonators, wherein the first subset and the second subset are not identical.
    Type: Grant
    Filed: December 22, 2020
    Date of Patent: November 19, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Ventsislav Yantchev
  • Patent number: 12143096
    Abstract: A filter device includes a first substrate, a first input electrode and a first output electrode on the first substrate, a first ground electrode on the first substrate and receiving a ground potential, an electrically open portion in or on the first substrate, a second substrate mounted on the first substrate, a second input electrode on a surface of the second substrate and connected to the first input electrode, a second output electrode on the surface of the second substrate and connected to the first output electrode, a second ground electrode on the surface of the second substrate and connected to the first ground electrode, and at least one first functional electrode on the second substrate and disposed on a first connecting path connecting the second input electrode and the second output electrode. The open portion is connected to the first connecting path.
    Type: Grant
    Filed: March 2, 2021
    Date of Patent: November 12, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Kota Okubo, Takayuki Okude
  • Patent number: 12136911
    Abstract: An acoustic wave device includes an acoustic wave filter configured to filter a radio frequency signal and a loop circuit coupled to the acoustic wave filter. The loop circuit is configured to generate an anti-phase signal to a target signal at a particular frequency. The loop circuit includes a Lamb wave resonator having a piezoelectric layer and an interdigital transducer electrode disposed on the piezoelectric layer. The piezoelectric layer includes free edges. An edge of the piezoelectric layer is configured to one of suppress or scatter reflections of acoustic waves generated by the interdigital transducer electrode from the edge of the piezoelectric layer.
    Type: Grant
    Filed: April 5, 2021
    Date of Patent: November 5, 2024
    Assignee: SKYWORKS SOLUTIONS, INC.
    Inventor: Joshua James Caron
  • Patent number: 12107563
    Abstract: An acoustic wave filter includes a longitudinally coupled resonator including IDT electrodes and a reflector. A standard deviation of a pitch deviation rate of at least one of the reflector and the IDT electrodes is greater than or equal to about 1.4%.
    Type: Grant
    Filed: January 13, 2022
    Date of Patent: October 1, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Akira Noguchi
  • Patent number: 12081188
    Abstract: Acoustic wave devices and related methods are disclosed. In some embodiments, an acoustic wave device can include a quartz substrate having a first surface, and a piezoelectric plate formed from LiTaO3 or LiNbO3 and having a first surface configured to support a surface acoustic wave and a second surface in engagement with the first surface of the quartz substrate. The second surface of the piezoelectric plate is a minus surface resulting from crystal structure orientation of the piezoelectric plate. The acoustic wave device can further include an interdigital transducer electrode formed on the first surface of the piezoelectric plate and configured to provide transducer functionality associated with the surface acoustic wave.
    Type: Grant
    Filed: October 15, 2019
    Date of Patent: September 3, 2024
    Assignee: Skyworks Solutions, Inc.
    Inventors: Michio Kadota, Shuji Tanaka, Yoshimi Ishii
  • Patent number: 12047052
    Abstract: An acoustic wave device in which a cavity defining an acoustic reflector is formed on a first main surface side of a substrate, an excitation portion is structured above the cavity in a manner that a first electrode, a piezoelectric thin film, and a second electrode are laminated, and a periodic pattern is provided in a normal direction of a side of the excitation portion on at least one of a first extraction electrode and a second extraction electrode.
    Type: Grant
    Filed: July 20, 2021
    Date of Patent: July 23, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Shou Nagatomo
  • Patent number: 12015383
    Abstract: A system includes a plurality of superconducting wires connected in parallel with one another. The plurality of superconducting wires includes a first superconducting wire and a second superconducting wire. The plurality of superconducting wires are configured to, while receiving a bias current provided to the parallel combination of the plurality of superconducting wires, operate in a superconducting state in the absence of a trigger current. The first superconducting wire is configured to, while receiving the bias current, transition to a non-superconducting state in response to receiving the trigger current. The second superconducting wire is configured to, while receiving the bias current, transition to a non-superconducting state in response to the first superconducting wire transitioning to the non-superconducting state.
    Type: Grant
    Filed: January 15, 2021
    Date of Patent: June 18, 2024
    Assignee: PSIQUANTUM CORP.
    Inventors: Faraz Najafi, Syrus Ziai, Qiaodan Jin Stone
  • Patent number: 12009800
    Abstract: An elastic wave device includes a substrate, a multilayer film located on the substrate, a piezoelectric layer located on the multilayer film, and an IDT electrode located on the piezoelectric layer. The IDT electrode includes electrode fingers each having a large width from a portion connected to a busbar to a position overlapping tip ends of the other electrode fingers when viewed in an arrangement direction of the electrode fingers.
    Type: Grant
    Filed: November 13, 2019
    Date of Patent: June 11, 2024
    Assignee: Kyocera Corporation
    Inventor: Soichiro Nozoe
  • Patent number: 11990891
    Abstract: A surface acoustic wave resonator structure and a method of forming the resonator structure and a filter are provided.
    Type: Grant
    Filed: April 4, 2023
    Date of Patent: May 21, 2024
    Assignee: Shenzhen Newsonic Technologies Co., Ltd.
    Inventors: Guojun Weng, Gongbin Tang, Jingyong Liu
  • Patent number: 11962285
    Abstract: An acoustic wave device includes an antenna terminal, a signal terminal, and a plurality of resonators that are provided on a piezoelectric substrate. The plurality of resonators include a plurality of series arm resonators on a series arm, and the duty of an IDT electrode of the series arm resonator closest to the antenna terminal among the plurality of series arm resonators is smaller than the duty of an IDT electrode of at least one series arm resonator among the other series arm resonators.
    Type: Grant
    Filed: December 30, 2020
    Date of Patent: April 16, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Junpei Yasuda
  • Patent number: 11955685
    Abstract: Embodiments of the present disclosure provide a radio frequency (RF) conductive medium for reducing the undesirable insertion loss of all RF hardware components and improving the Q factor or “quality factor” of RF resonant cavities. The RF conductive medium decreases the insertion loss of the RF device by including one or more conductive pathways in a transverse electromagnetic axis that are immune to skin effect loss and, by extension, are substantially free from resistance to the conduction of RF energy.
    Type: Grant
    Filed: December 11, 2020
    Date of Patent: April 9, 2024
    Assignee: Nanoton, Inc.
    Inventor: John Aldrich Dooley
  • Patent number: 11942924
    Abstract: A filter is provided that includes a set of cascaded resonator stages coupled between a filter input and a first filter output, wherein the filter includes a second filter output coupled to an output of a first or an intermediate one of the set of cascaded resonator stages. Another filter includes a set of cascaded resonator stages coupled between a first filter input and a filter output, wherein the filter includes a second filter input coupled to an input of an intermediate or a last one of the set of cascaded resonator stages. Both filters are configured to apply a first filter frequency response to a first signal propagating via the set of cascaded resonator stages, and apply a second filter frequency response to a second signal propagating via a subset of one or more of the set of cascaded resonator stages.
    Type: Grant
    Filed: November 23, 2020
    Date of Patent: March 26, 2024
    Assignee: RF360 Singapore Pte. Ltd.
    Inventor: Lasse Jalmari Toivanen
  • Patent number: 11936366
    Abstract: An elastic wave device includes a piezoelectric substrate, and elastic wave elements on the piezoelectric substrate and including IDT electrodes, respectively. The IDT electrode of a first of the elastic wave elements includes first and second busbars, and the IDT electrode of a second of the elastic wave elements includes third and fourth busbars. The second busbar and the third busbar extend parallel or substantially parallel to each other, and are spaced by a gap in a direction perpendicular or substantially perpendicular to an elastic-wave propagating direction. Each of the second and third busbars includes first and second electrode layers at least a portion of which is laminated on the first electrode layer. The second electrode layer of the second busbar is cut in at least one location in a direction crossing the elastic-wave propagating direction.
    Type: Grant
    Filed: February 26, 2021
    Date of Patent: March 19, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Yoshinori Kameoka
  • Patent number: 11923823
    Abstract: An acoustic wave device includes a piezoelectric substrate, interdigital transducer electrodes including a predetermined number of electrode fingers disposed on an upper surface of the substrate, and a dielectric material layer having a first portion and a second portion. The first portion is disposed on the upper surface of the substrate and between the interdigital transducer electrode fingers. The second portion is disposed above the interdigital transducer electrode fingers. The acoustic wave device further includes at least one thermally conductive bridge disposed within the dielectric material layer and contacting upper surfaces of at least two adjacent interdigital transducer electrode fingers to dissipate heat therefrom.
    Type: Grant
    Filed: April 7, 2021
    Date of Patent: March 5, 2024
    Assignee: SKYWORKS SOLUTIONS, INC.
    Inventors: Hironori Fukuhara, Keiichi Maki, Rei Goto
  • Patent number: 11923829
    Abstract: An electronic filter includes a plurality of series arm acoustic wave resonators electrically connected in series between an input port and an output port, a plurality of parallel arm acoustic wave resonators electrically connected in parallel and electrically connected on first sides between respective ones of the plurality of series arm acoustic wave resonators and electrically connected on second sides to ground, and at least one additional acoustic wave resonator electrically connected in parallel to one of one of the plurality of series arm acoustic wave resonators or one of the plurality of parallel arm acoustic wave resonators and having a temperature coefficient of frequency (TCF) lower than a TCF of the acoustic wave resonator to which it is electrically connected in parallel.
    Type: Grant
    Filed: April 6, 2021
    Date of Patent: March 5, 2024
    Assignee: SKYWORKS SOLUTIONS, INC.
    Inventors: Tomoya Komatsu, Joji Fujiwara
  • Patent number: 11916542
    Abstract: An acoustic wave filter device includes first and second terminals, an inductor connected to the first terminal, and a longitudinally coupled resonator coupled between the inductor and the second terminal. The longitudinally coupled resonator includes at least one first IDT electrode coupled to the first terminal, and at least one second IDT electrode connected to the second terminal. A total capacitance value of the at least one first IDT electrode is greater than a total capacitance value of the at least one second IDT electrode.
    Type: Grant
    Filed: February 18, 2021
    Date of Patent: February 27, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Kenichi Uesaka
  • Patent number: 11909378
    Abstract: Aspects of this disclosure relate to a surface acoustic wave device that includes a first reflector over a piezoelectric layer, a second reflector over the piezoelectric layer, and an interdigital transducer electrode structure over the piezoelectric layer and positioned between the first reflector and the second reflector. The surface acoustic wave device includes a velocity adjustment layer arranged to adjust acoustic velocity in a region of the surface acoustic wave device. The velocity adjustment layer can be a high speed layer or a low speed layer.
    Type: Grant
    Filed: November 16, 2020
    Date of Patent: February 20, 2024
    Assignee: Skyworks Solutions, Inc.
    Inventors: Joshua James Caron, Rei Goto, Benjamin Paul Abbott, Hiroyuki Nakamura
  • Patent number: 11909377
    Abstract: Aspects of this disclosure relate to a surface acoustic wave filter with an acoustic velocity adjustment structure. The surface acoustic wave filter can include a first interdigital transducer electrode disposed on a piezoelectric layer, an acoustic reflector disposed on the piezoelectric layer, and a second interdigital transducer electrode disposed on the piezoelectric layer. The second interdigital transducer electrode is longitudinally coupled to the first interdigital transducer electrode and positioned between the first interdigital transducer electrode and the acoustic reflector. The acoustic velocity adjustment structure can be positioned over at least a gap between the first interdigital transducer electrode and the second interdigital transducer electrode.
    Type: Grant
    Filed: November 16, 2020
    Date of Patent: February 20, 2024
    Assignee: Skyworks Solutions, Inc.
    Inventors: Joshua James Caron, Rei Goto, Benjamin Paul Abbott, Hiroyuki Nakamura