Abstract: A cleaning wafer or substrate for use in cleaning, or in combination with, components of, for example, integrated chip manufacturing apparatus. The cleaning substrate can include a substrate having varying predetermined surface features, such as one or more predetermined adhesive, non-tacky, electrostatic, projection, depression, or other physical sections. The predetermined features can provide for more effective cleaning of the components with which they are used, such as an integrated chip manufacturing apparatus in the place of the integrated chip wafer. The cleaning substrate can be urged into cleaning or other position by vacuum, mechanical, electrostatic, or other forces. The cleaning substrate can adapted to accomplish a variety of functions, including abrading or polishing. The cleaning substrate may be made by a novel method of making, and it may then be used in a novel method of use I combination with chip manufacturing apparatus.

Abstract: A cleaning and sanitizing kit for use in a defined region of a hospital and a method employing the same.

Abstract: Disclosed is a liquid processing method of drying a substrate held horizontally after supplying deionized water to the substrate. The liquid processing method includes: supplying the deionized water to a front surface of the substrate; supplying a first solvent to the front surface of the substrate after supplying the deionized water; supplying a water-repellent agent to the front surface of the substrate to impart water-repellency to the front surface of the substrate; supplying a second solvent to the front surface of the substrate to which water-repellency is imparted; and removing the second solvent from the front surface of the substrate. A specific gravity of the first solvent is smaller than a specific gravity of the water-repellent agent, and a specific gravity of the second solvent is larger than the specific gravity of the water-repellent agent.

Abstract: A method for cleaning magnetic sliders. One embodiment of the method includes dislodging particulate debris from a surface of a magnetic slider by contacting the surface of the slider with an oscillating brush, enveloping the dislodged particulate debris in a foam, and removing the enveloped particulate debris by removing the foam from the magnetic slider.

Abstract: A method includes inserting a flexible cable into a cleaning region of a channel of a component via a cleaning port, rotating the flexible cable about an axis within the channel to interact a tip with deposits disposed within the cleaning region of the channel, moving the flexible cable within the cleaning region of the channel along a length of the channel, and removing portions of the deposits from the cleaning region of the channel via a second port. The flexible cable includes the axis and the tip. A diameter of the tip is different than a diameter of the flexible cable. The tip is configured to loosen the portions of the deposits.

Abstract: It is an object to prevent adhesion of a processing liquid to a non-processing region of a substrate. In order to achieve the object, a substrate processing apparatus includes a substrate rotating mechanism, a discharging portion for discharging a processing liquid to a substrate, a moving portion for moving a discharging portion, and a controller. The discharging portion starts to discharge the processing liquid at a first position and is moved to a second position. The first position is a position of the discharging portion where a section of a passage of the discharging portion is projected onto a first region, and the second position is a position of the discharging portion where the section of the passage is projected onto a second region. The first region is a region on the peripheral edge side of the substrate from the second region.

Abstract: Systems and methods for cleaning a substrate include a combined treatment of hydrogen peroxide and ultraviolet (UV) irradiation. Specific embodiments include the direct irradiation with 185/254 nm UV of a spinning substrate immersed under a liquid film of dilute hydrogen peroxide solution. Such a cleaning treatment can result in about a 100% improvement of TiN strip rate compared to processing with the same hydrogen peroxide solution without UV exposure. Such method can also be executed at room temperature and still provide improved cleaning efficiency.

Abstract: Disclosed is a substrate processing apparatus including: a holding unit that holds a substrate; a processing liquid supply unit that supplies a processing liquid to the substrate; a cup that includes a bottom portion, a tubular peripheral wall portion erected on the bottom portion, a liquid receiving portion provided above the peripheral wall portion and configured to receive the processing liquid scattered from the substrate, and a groove portion formed in a circumferential direction on an upper surface of the peripheral wall portion, and surrounds the holding unit; and a cleaning liquid supply unit that supplies a cleaning liquid to the upper surface of the peripheral wall portion.

Abstract: A microelectronic module for cleaning a surface is described. The microelectronic module comprises at least one voltage converter for converting a provided first voltage into a higher, lower, or identical second voltage. The module also comprises at least one actuator. The actuator comprises at least one generator for generating an ionic current, an electrical plasma, harmonic components and/or an electrostatic field from the second voltage which is provided by the voltage converter. At least the voltage converter and the actuator are disposed on a thin-film, planar substrate. At least most of at least one object adhering to the surface is removed by the actuator.

Abstract: A surface treatment machine, comprising a frame configured to translate with respect to a surface to treat, a surface treatment element connected to said frame and configured to treat with liquid a surface, a reservoir connected to the frame arranged to provide liquid to the surface treatment element through a delivery mouth; an adjustment element arranged to feed adjustably the liquid supplied from the reservoir to the delivery mouth. It is then provided a sensor configured to measure the speed of the frame with respect to the surface to treat. A control unit receives from the sensor a signal proportional to a speed for adjusting the adjustment element responsive to this value, in order to deliver the liquid with optimization of the flow-rate. It is possible then to maximize the range of the machine, and to optimize the working time of the operator.

Abstract: A substrate processing apparatus removes foreign substances from a substrate at high removal efficiency. The substrate processing apparatus includes: a scrubber to perform surface processing of the substrate by bringing a scrubbing member into sliding contact with a first surface of the substrate, a hydrostatic support mechanism for supporting a second surface of the substrate via fluid pressure without contacting the substrate, the second surface being an opposite surface of the first surface, a cleaner to clean the processed substrate, and a dryer to dry the cleaned substrate. The scrubber brings the scrubbing member into sliding contact with the first surface while rotating the scrubbing member about a central axis of the scrubber.

Abstract: A method for cleaning vehicles by means of which the formation of marks caused by drying is prevented. The method comprises a rinsing step using water. In the method, the anions forming poorly soluble salts with alkaline earth metals dissolved in water are removed from the water, while cations causing the water hardness are retained. Furthermore, a vehicle washing system includes: at least one application device for applying rinsing fluid to a vehicle to be cleaned; and an ion-exchange device for removing anions from the rinsing fluid prior to the application to the vehicle.

Abstract: A substrate processing method includes a replacing step of replacing the processing liquid with a low surface tension liquid, a liquid film forming step of forming a liquid film of the low surface tension liquid on the upper surface of the substrate, by continuing supplying the low surface tension liquid to the upper surface of the substrate after the replacing step, an opening forming step of forming an opening at a central region of the liquid film, an enlarging removing step of removing the liquid film from the upper surface of the substrate by enlarging the opening toward a peripheral edge of the substrate, and a liquid film contact step of bringing a proximity member into contact with the liquid film, by bringing the proximity member close to the peripheral edge of the substrate after starting the opening forming step.

Abstract: A substrate processing method includes a chemical liquid supplying step of supplying a chemical liquid to a substrate, an elapsed period measuring step of measuring an after-the-end elapsed period, a recovery step of controlling the switching unit to be in a recovery guiding state, when, at a start of the chemical liquid supplying step, the after-the-end elapsed period is less than a predetermined first period, and a draining step of controlling the switching unit to be in a drain guiding state, in which the liquid led to the recovery space is led to the drain line, when, at the start of the chemical liquid supplying step, the after-the-end elapsed period is not less than the predetermined first period and then switching to the recovery guiding state based on establishment of a predetermined draining ending condition.

Abstract: According to the present invention, a substrate processing apparatus has a chamber (1), a stage (4) for holding a substrate (W) to be processed in the chamber (1), and a nozzle part (13) from which a gas cluster is blasted onto the substrate (W) to be processed, and has a function for processing the substrate (W) to be processed by the gas cluster. Cleaning of the inside of the chamber (1) is performed by: placing a prescribed reflecting member (dW, 60) in the chamber (1), blasting a gas cluster (C) onto the reflecting member (dW, 60), and applying the gas-cluster flow reflected by the reflecting member (dW, 60) onto a wall section of the chamber (1) to remove particles (P) adhered to the wall section of the chamber (1).

Abstract: In some embodiments, a method for cleaning a processing chamber is provided. The method may be performed by introducing a processing gas into a processing chamber that has a by-product disposed along sidewalls of the processing chamber. A plasma is generated from the processing gas using a radio frequency signal. A lower electrode is connected to a first electric potential. Concurrently, a bias voltage having a second electric potential is applied to a sidewall electrode to induce ion bombardment of the by-product, in which the second electric potential has a larger magnitude than the first electric potential. The processing gas is evacuated from the processing chamber.

Abstract: Mobile apparatuses move within contaminated fluid to create fluid flows against structures that remove and prevent contaminant deposition on structure surfaces immersed in the fluid. Unsettling flows in water may exceed approximately 2 m/s for radionuclide particles and solutes found in nuclear power plants. Mobile apparatuses include pressurized liquid from a pump or pressurized source that can be chemically and thermally treated to maximize deposition removal. When spraying the pressurized liquid to create the deposition-removing flow, mobile apparatuses may be self-propelled within the fluid about an entire surface to be cleaned. Mobile apparatuses include filters keyed to remove the contaminants moved into the coolant by the flow, and by taking in ambient fluid, enable such filtering of the ambient fluid along with a larger flow volume and propulsion. Propulsion and the pressurized liquid in turn enhance intake of ambient fluid.

Abstract: A method of cleaning a floor near a vertical surface with a mobile robot. The robot includes a cleaning assembly and a drive assembly having a first wheel and a second wheel. The method includes aligning the robot such that the first wheel and second wheel are configured to roll in a direction substantially parallel to the surface. The method includes driving the robot forward in a direction substantially parallel to the surface. The method further includes: i) turning the first wheel, proximate to the surface, with a first angular velocity, and ii) turning the second wheel, further from the surface, with a second angular velocity. The second angular velocity is greater than the first angular velocity. The robot pushes against the surface while sliding along the same surface.

Abstract: A device for cleaning an optical communication device includes a hollow outer stem, an inner stem core, a locking handle, a flexible base, at least one ring seal, and a flexible cover. The inner stem core, fits within a length of the hollow outer stem and is slidable along the length of the hollow outer stem. The locking handle is coupled to a top end of the inner stem core, and is movable between a released position and a locked position, where moving the locking handle to the locked position from the released position slides the inner stem core within the hollow outer stem. The flexible base is coupled to a bottom end of the hollow outer stem, and is transformable between a contracted position when the locking handle is in the released position and an expanded position when the locking handle is in the locked position. The at least one ring seal is coupled to the flexible base. The flexible cover is wrapped around the flexible base and the at least one ring seal.

Abstract: A cleaning wafer or substrate for use in cleaning, or in combination with, components of, for example, integrated chip manufacturing apparatus. The cleaning substrate can include a substrate having varying predetermined surface features, such as one or more predetermined adhesive, non-tacky, electrostatic, projection, depression, or other physical sections. The predetermined features can provide for more effective cleaning of the components with which they are used, such as an integrated chip manufacturing apparatus in the place of the integrated chip wafer. The cleaning substrate can be urged into cleaning or other position by vacuum, mechanical, electrostatic, or other forces. The cleaning substrate can adapted to accomplish a variety of functions, including abrading or polishing. The cleaning substrate may be made by a novel method of making, and it may then be used in a novel method of use I combination with chip manufacturing apparatus.