Abstract: An apparatus for removing contaminants from a slide comprises a manifold including at least one input port and at least one output port in fluid communication with the at least one input port, the at least one output port being adapted to direct a flow of gas onto a surface of the slide such that the flow of gas removes contaminants from the slide; an aperture for receiving the slide; and an enclosure adapted to capture the contaminants removed from the slide.

Abstract: A substrate processing device includes a plurality of cleaning devices and a main robot. The main robot is configured to carry a substrate into and carrying the substrate out from each substrate cleaning device. The substrate cleaning device includes a processing chamber. In the processing chamber, a brush cleaner that brings a brush into contact with a lower surface of the substrate to clean the lower surface of the substrate is provided. Further, the substrate cleaning device has a cleaning nozzle that discharges a brush cleaning liquid to the brush. In a period during which the substrate carry-in operation and the substrate carry-out operation are performed with respect to the substrate cleaning device by a main robot, supply of the brush cleaning liquid to the cleaning nozzle is stopped.

Abstract: A method of cleaning a substrate for a blank mask including: a first cleaning including irradiating a cleaning target substrate with a pre-treatment light to prepare a substrate cleaned with light, and a second cleaning including applying a first cleaning solution and a post-treatment light to the substrate cleaned with light to prepare the substrate for the blank mask, is disclosed.

Abstract: A method of recycling plastic articles, such as bottles and labels affixed to bottles, that are printed with UV curable inks, wherein the inks and colorants from the inks are removed as solid particles upon treatment with a hot alkaline solution to provide colorless or nearly colorless plastic materials for recycling that are not contaminated by the inks or colorants.

Abstract: An abrasion detection device is provided, including: one or more sensors, outputting a measurement value in accordance with abrasion of a substrate cleaning tool; a pressing mechanism, pressing the substrate cleaning tool against the sensor; and a determination part, performing a determination on whether it is necessary to replace the substrate cleaning tool in accordance with the measurement value from the sensor.

Abstract: A tidying robot system is disclosed that includes a robot capable of moving aside or picking up and redepositing objects that obstruct areas the robot intends to vacuum. The robot includes a chassis, a robot vacuum system with a vacuum generating assembly and a dirt collector, a scoop, pusher pad arms with pusher pads, a robot charge connector, mobility system, a battery, a processor, and a memory storing instructions that, when executed by the processor, allow operation and control of the robot. The tidying robot system also includes a base station with a base station charge connector configured to couple with the robot charge connector. The tidying robot system also includes a robotic control system in at least one of the robot and a cloud server. The tidying robot system also includes logic to implement the operations and methods disclosed.

Abstract: Various techniques for controlling metal-containing contamination on a semiconductor substrate are provided herein. Such techniques may involve one or more of a post-development bake treatment, a chemical treatment, a plasma treatment, a light treatment, and a backside and bevel edge clean. The techniques may be combined as desired for a particular application. In many cases, the techniques are used to address metal-containing contamination that is generated during a photoresist development operation.

Abstract: The present disclosure provides three-dimensional (3D) printing systems, apparatuses, software, and methods for safe production of at least one requested 3D object, and for passivation of material accumulated on a filter of the 3D printing system.

Abstract: A substrate processing apparatus includes: a batch processor configured to collectively process a lot including plural substrates; a single-wafer processor configured to process the substrates included in the lot one by one; and a transport portion configured to deliver the substrates one by one between the batch processor and the single-wafer processor. The batch processor includes a processing tank configured to store a processing liquid including a rinsing liquid. The transport portion includes a fluid supplier configured to supply, after receiving the substrates included in the lot in the processing tank and until delivering the substrates to the single-wafer processor, a low surface tension fluid having a lower surface tension than the rinsing liquid to at least one of the processing tank and the substrates.

Abstract: The present invention provides a method for reprocessing single-use medical devices. The method can include removing a coating from a single-use medical device, validating the removal of the coating, cleaning the single-use medical device, and applying a new coating to the single-use medical device.

Abstract: A vacuum cleaner including a main body; a suction head including a suction port through which debris is sucked up; a brush configured to rotate in the suction head; a brush motor configured to rotate the brush; a suction motor configured to generate suction force so that debris is sucked up through the suction port; a pressure sensor configured to measure atmospheric pressure and pressure at the suction port; and at least one processor configured to determine suction pressure based on the measured atmospheric pressure and the measured pressure at the suction port, and determine cleaner state information, including at least one of operation state information and information of a type of surface to be cleaned, based on the determined suction pressure and a load of the brush motor.

Abstract: A cleaning device for a wafer-suction chuck mechanism capable of automatically and simply performing cleaning treatment on a chuck surface that suction-holds a wafer and cleaning treatment on a frame suction-holding section. The cleaning device is configured to include a scraper 17 and a brush 18 that press frame suction-holding section cleaning means 10B for removing a sludge on a frame suction-holding section 11B onto the frame suction-holding section 11B, and a water nozzle 19 that discharges and supplies water onto the frame suction-holding section 11B.

Abstract: A substrate processing apparatus includes a nozzle unit including a nozzle tip discharging liquid to a substrate; and a liquid supply line supplying the liquid to the nozzle unit, wherein the liquid supply line includes a liquid supply pipe connected to the nozzle tip; a supply valve installed in the liquid supply pipe; and a heater disposed between the nozzle tip and the supply valve in the liquid supply pipe.

Abstract: A substrate processing system includes a vacuum transfer module, a substrate processing module, an atmospheric transfer module, a load-lock module, at least one substrate transfer robot disposed in the vacuum transfer module and the atmospheric transfer module, and having at least one end effector, and a controller configured to control a particle removal operation. The particle removal operation includes transferring said at least one end effector in any one of the vacuum transfer module, the substrate processing module, the load-lock module, and the atmospheric transfer module in a state where at least one charging member that is charged is placed on said at least one end effector.

Abstract: A substrate processing method performed in a substrate processing apparatus configured to process a substrate by bringing the substrate into contact with a processing fluid in a supercritical state is provided. The substrate processing apparatus includes: a processing vessel having a processing space; a main supply line configured to supply the processing fluid to the processing space; a discharge line having a first opening/closing valve, the discharge line being configured to discharge the processing fluid from the processing space; and a bypass line branched off from the main supply line at a branch point, the bypass line joining the discharge line at a junction point downstream of the first opening/closing valve. The substrate processing method includes: increasing a pressure of the processing space up to a preset processing pressure; and maintaining, after the increasing of the pressure, the pressure of the processing space at the processing pressure.

Abstract: According to one embodiment, a wafer storage container processing apparatus that processes a wafer storage container including a body having a storage space connected to an opening and a door detachable from the opening, includes a stage having a disposition surface on which the wafer storage container is disposed; and a gas supply configured to supply an inert gas to the wafer storage container disposed on the stage. The stage disposes the wafer storage container such that the door is disposed on the disposition surface in a state where the door is attached to the body, and the gas supply supplies the inert gas through a gas supply port provided on an intersecting surface of the body that intersects a surface having the opening.

Abstract: A vehicle sensor cleaning apparatus and a control method of the vehicle sensor cleaning apparatus are disclosed. The vehicle sensor cleaning apparatus includes a liquid sprayer configured to spray washer fluid at at least one sensor located in a vehicle through a motor drive, an air sprayer configured to spray air at the at least one sensor, a liquid controller configured to control washer fluid spraying by the liquid sprayer according to a cleaning request signal received from a vehicle controller, and an air controller configured to control air spraying by the air sprayer according to a cleaning request signal received from the vehicle controller.

Abstract: A test base cleaning line and a method thereof are provided. The test base cleaning line includes a plurality of cleaning mechanisms, a scanning device, and a moving device. The scanning device is configured for scanning a barcode on a test base to identify a type of the test base, and the moving device is configured for moving the test base to any one of the plurality of cleaning mechanisms according to the type of the test base so that the cleaning mechanism can perform a cleaning operation to the test base.

Abstract: Systems and methods for automated cleaning and inspection of electric vehicles. The systems and methods for automated cleaning eliminate the need for human interaction with the vehicle and/or cleaning system. Vehicle cleaning is typically a heavily manual task that consumes operation personnel time and resources. Providing automated systems and methods for vehicle cleaning can reduce human resources used for cleaning. Additionally, automated cleaning systems and methods can increase vehicle utilization efficiency by decreasing downtime for cleaning. In various implementations, systems and methods are provided for automated vehicle inspections. In some examples, automated vehicle inspections can occur concurrently with automated vehicle cleaning.

Abstract: A method for controlling cleaning of a cooking appliance is discussed. The cooking appliance may include a cavity configured to accommodate food to be cooked, the cavity including a panel, a broil heater configured to apply radiant heat to the cavity, and a bake heater configured to heat the panel. Additionally, the method may include selecting a mode including selecting a self-clean mode of the cavity, increasing an internal temperature of the cavity to a set second temperature, and maintaining the internal temperature of the cavity at the second temperature. Further, the increasing the internal temperature may include controlling a temperature increase rate inside the cavity in the increasing the internal temperature by operating the broil heater and the bake heater alternately.