Abstract: A semiconductor device comprises: a package having a rectangular shape when viewed in plan and including a first side, a second side parallel to the first side, a third side orthogonal to the first side and the second side, and a fourth side parallel to the third side and orthogonal to the first side and the second side; a power supply terminal provided on the first side; a power ground terminal provided on the second side; a switch output terminal provided on the second side; an upper switch connected between the power supply terminal and the switch output terminal; and a lower switch 11L connected between the switch output terminal and the power ground terminal.

Abstract: A method of manufacturing a packaged acoustic wave component includes forming or providing a cap substrate. The method also includes forming a metal shield plate on a surface of the cap substrate. The cap substrate is attached to a device substrate that has an acoustic wave device on a surface thereof such that the metal shield plate is spaced from and faces the acoustic wave device and so that a peripheral metal wall extends between the device substrate and the metal plate. The metal shield plate and peripheral metal wall enclose and electrically shield the acoustic wave device.

Abstract: A disclosed semiconductor device includes a package substrate, a first semiconductor die coupled to the package substrate, a package lid attached to the package substrate and covering the semiconductor die, and a thermal interface material located between a top surface of the semiconductor die and an internal surface of the package lid. The semiconductor device may further include a dam formed on the internal surface of the package lid. The dam may constrain the thermal interface material on one or more sides of the first semiconductor die such that the thermal interface material is located within a predetermined volume between the top surface of the first semiconductor die and the internal surface of the package lid during a reflow operation. The package lid may include a metallic material and the dam may include an epoxy material formed as a single continuous structure or may be formed as several disconnected structures.

Abstract: A vehicle console includes a trim ring disposed over a periphery of a housing. The trim ring includes a polymeric material and is electrically conductive and grounded. A proximity switch assembly is retained in the housing. The proximity switch assembly includes a proximity sensor proximate a sensing pad for generating an activation field. The sensing pad is proximate the trim ring.

Abstract: A display device includes: a display panel including a plurality of pad electrodes arranged in a first direction; a printed circuit board including a plurality of lead electrodes facing the plurality of pad electrodes, respectively; a plurality of conductive particles disposed between the display panel and the printed circuit board at predetermined intervals; and a coating layer disposed on the plurality of conductive particles and having a thickness varying in the first direction from each of the plurality of lead electrodes toward each of the plurality of pad electrodes.

Abstract: A layer structure includes a first layer including at least one material selected from a first group consisting of nickel, copper, gold, silver, palladium, tin, zinc, platinum, and an alloy of any of these materials; a third layer including at least one material selected from a second group consisting of nickel, copper, gold, palladium, tin, silver, zinc, platinum, and an alloy of any of these materials; and a second layer between the first layer and the third layer. The second layer consists of or essentially consists of nickel and tin. The second layer includes an intermetallic phase of nickel and tin. Methods of forming the layer structure, a chip package and a chip arrangement are also described.

Abstract: A molded semiconductor package includes: a semiconductor die; a substrate attached to a first side of the semiconductor die; a plurality of leads electrically connected to a second side of the semiconductor die opposite the first side; a heat sink clip thermally coupled to a pad at the second side of the semiconductor die; and a molding compound encapsulating the die, part of the leads, part of the heat sink clip, and at least part of the substrate. The molding compound has a first main side, a second main side opposite the first main side and at which the substrate is disposed, and an edge extending between the first main side and the second main side. The leads protrude from opposing first and second faces of the edge of the molding compound. The heat sink clip protrudes from opposing third and fourth faces of the edge of the molding compound.

Abstract: An apparatus is provided which comprises: a substrate, a die site on the substrate to couple with a die, a die side component site on the substrate to couple with a die side component, and a raised barrier on the substrate between the die and die side component sites to contain underfill material disposed at the die site, wherein the raised barrier comprises electroplated metal. Other embodiments are also disclosed and claimed.

Abstract: Examples of devices for providing cooling solutions are described. One example device at least one printed circuit board (PCB) and at least one baffle cover positioned along an edge of the at least one PCB. The at least one PCB is immersed in a cooling fluid in a tank. The at least one PCB includes one or more integrated circuit (IC) chips with a thermal interface material (TIM) applied to surfaces of the one or more IC chips that are coupled to a boilerplate. The baffle cover includes one or more openings that are configured to control an agitation of the cooling fluid proximate to the edge of the at least one PCB.

Abstract: A display device may include a pixel circuit in a display area including a rounded corner portion, a scan driving circuit in a peripheral area surrounding the display area, and configured to provide a scan signal to the pixel circuit, a fan-out line between the pixel circuit and the scan driving circuit in the peripheral area adjacent to the corner portion, and configured to provide a pixel data signal to the pixel circuit, and a repair circuit between the scan driving circuit and the fan-out line in the peripheral area adjacent to the corner portion.

Abstract: Provided are a package structure and a method of forming the same. The package structure includes a first die, a second die group, an interposer, an underfill layer, a thermal interface material (TIM), and an adhesive pattern. The first die and the second die group are disposed side by side on the interposer. The underfill layer is disposed between the first die and the second die group. The adhesive pattern at least overlay the underfill layer between the first die and the second die group. The TIM has a bottom surface being in direct contact with the first die, the second die group, and the adhesive pattern. The adhesive pattern separates the underfill layer from the TIM.

Abstract: An electronic device includes a display panel in which a first area including an electronic module, a display area, a line area and a transmission area, and a second area adjacent to the first area are defined, where the display panel includes a base layer, a light blocking layer disposed on the base layer, a plurality of insulating layers disposed on the base layer, a first pixel disposed in the first area, and a second pixel disposed in the second area, and an input sensor disposed on the display panel, where the input sensor includes sensing insulating layers. The first area has a higher light transmittance than the second area, the light blocking layer overlaps the display area and the line area, and the light blocking layer does not overlap the transmission area.

Abstract: A light-emitting element extending in one direction includes: a semiconductor core including a main body extending in the one direction, a first end connected to one side of the main body and having an inclined side surface, and a second end connected to an other side of the main body and having a width less than that of the main body; and an insulation film around at least a portion of the outer surface of the semiconductor core, wherein the insulation film includes a first insulation film around the first end of the semiconductor core; and a second insulation film around the second end of the semiconductor core, wherein the diameter of an outer surface of the first insulation film is the same as a diameter of an outer surface of the second insulation film.

Abstract: A display device may include a pixel circuit in a display area including a rounded corner portion, a scan driving circuit in a peripheral area surrounding the display area, and configured to provide a scan signal to the pixel circuit, a fan-out line between the pixel circuit and the scan driving circuit in the peripheral area adjacent to the corner portion, and configured to provide a pixel data signal to the pixel circuit, and a repair circuit between the scan driving circuit and the fan-out line in the peripheral area adjacent to the corner portion.

Abstract: A thin semiconductor packaging unit includes a semiconductor die, a mold, two contact bulks, a first bridge layer, a second bride layer, and two insulation layers; the mold covers a side surface of the semiconductor die; the mold includes two sides, and each of the sides includes at least one first contact area; the two contact bulks are respectively mounted on the two sides of the mold; each of the contact bulks includes at least one second contact area connecting the at least one first contact area; the first bridge layer connects the top electrode of the semiconductor die to one of the contact bulks; the second bride layer connects the bottom electrode of the semiconductor die to the other one of the contact bulks; the two insulation layers respectively cover the first bridge layer and the second bridge layer; the present invention dissipates heat efficiently.

Abstract: An embodiment of the present application discloses an OLED display device manufacturing method and an OLED display device. The method includes a first pixel definition partitioning bar forming step, a second pixel definition partitioning bar forming step, and a color ink printing step. The first pixel definition partitioning bar forming step includes forming first pixel definition partitioning bars on substrate along a first direction. the second pixel definition partitioning bar forming step includes forming second pixel definition partitioning bars on the substrate along a second direction. An overflow drainage region is defined in each of the second pixel definition partitioning bars. The present application uses the overflow drainage region to perform an overflow drainage color inks printed on the substrate in the color ink printing step to prevent an issue of the overflowing color inks has color mixing and affect a quality of the OLED display device.

Abstract: The invention is that of an encapsulated electronic component assembly that may be incorporated into a textile or yarn. Electronic components is encapsulated in two flexible substrates forming a pod for housing the electronic components. A flexible substrate may be a flexible polymer film capable of compression in response to a bending force, protecting the internal electronic components. The components in the substrate may then be incorporated into a yarn or woven into a textile. The electronic components may comprise an antenna, data processor, light emitter, accelerometer, or other components.

Abstract: A method of manufacturing a semiconductor device includes applying a polymer mixture over a substrate, exposing and developing at least a portion of the polymer mixture to form a developed dielectric, and curing the developed dielectric to form a dielectric layer. The polymer mixture includes a polymer precursor, a photosensitizer, and a solvent. The polymer precursor may be a polyamic acid ester.

Abstract: A method for manufacturing optical unit, the method includes (a) obtaining an intermediate optical unit that comprises a semiconductor portion, a transparent organic layer, the array of organic microlenses and a protective layer; (b) depositing a protective mask above a first protective layer region; (c) removing, by applying a first etch process, the second protective layer region to expose a second region of the transparent organic layer; and (d) removing, by applying a second etch process, the second region of the transparent organic layer to expose the contact pads and removing the protective mask while maintaining the first protective layer portion.

Abstract: An optoelectronic module, including a substrate, a covering member, a light emitting element, and a light receiving element, is provided. The covering member is disposed on the substrate and includes an upper cover portion, a peripheral sidewall portion connected to the upper cover portion, and an inside partition delimiting a first cavity and a second cavity. The first cavity is separated from the second cavity. The light emitting element is disposed on the substrate as corresponding to the first cavity. The light receiving element is disposed on the substrate as corresponding to the second cavity. The inside partition has a first inner wall surface located in the first cavity and a second inner wall surface located in the second cavity. A first protruded-recessed structure is formed on the first inner wall surface.