Abstract: A mounting base or a riser base for a switchgear is provided with side interior openings to provide an internal arc pathway through which arc gasses or plasma are safely discharged to an outside air. The mounting base includes a front wall having a first end and a second end, a rear wall having a first end and a second end, a first side channel connecting the first end of the front wall to the first end of the rear wall, a second side channel connecting the second end of the front wall to the second end of the rear wall, and forming the mounting base having a central open area in a first section of a switchgear that is adjacent a second section of the switchgear. The mounting base further includes at least one opening in the first side channel for the passage of an arc from the first section of the switchgear to the second section of the switchgear, and thereby forming the mounting base with the internal arc pathway.

Abstract: An assembly includes a lower sub-assembly containing a first fan, a middle sub-assembly supported above the lower sub-assembly, a bottom air flow control plane supported in the middle sub-assembly and having openings sized to fit multiple computers having vertical cooling air paths, and a top air flow control plane supported in the middle sub-assembly above the bottom air flow control plane and having openings sized to fit the multiple computers such that air is forced through the vertical cooling air paths.

Abstract: An electronic device comprising: a first case in which a groove is arranged along an outer circumference; a second case that overlaps with the first case and that has a rib extending toward a bottom face of the groove; and a seal member that is sandwiched between the bottom face and the rib, wherein the groove includes: a first side wall that is arranged on one end portion of the bottom face; and a second side wall that is arranged on other end portion of the bottom face, a height of the first side wall from the bottom face is lower than a height of the second side wall, and the first side wall does not come into contact with the second case.

Abstract: A thermal management assembly may implement cooling techniques to cool at least a portion of a computer system with one or more cooling systems. The techniques may include using a thermal management assembly in fluid communication with the cooling system(s) to supply fluid from at least one of the cooling systems to at least a portion of the computer system. The techniques may also or instead include using a first thermal coupling to transfer thermal energy between the first cooling system and the computer system and a second thermal coupling to transfer thermal energy between the second cooling system and the computer system. Cooling a computer system using the cooling techniques described herein lowers an operating temperature of the computer system thereby mitigating heat related computer failure.

Abstract: A protective element includes an insulating substrate, a plurality of electrodes provided on the insulating substrate, a fuse element electrically connected to any electrode of the plurality of electrodes, and a heat generation element provided on the insulating substrate for heating and fusing the fuse element. The fuse element contains a composite metal material in which a first fusible metal and a second fusible metal are stacked, some of a component of the first fusible metal being dissolved at a joint working temperature, the second fusible metal being lower in melt temperature than the first fusible metal, at least some of a component of the second fusible metal being molten at the joint working temperature.

Abstract: Devices, systems, and methods for managing server chassis are disclosed. The server chassis may be managed thermally by controlling a flow of gas through an opening in the server chassis. The server chassis may be managed for security by controlling physical access to various portions of the server chassis, and, for example, to a portion of the server chassis proximate to an opening in the server chassis through which gas flows for thermal management purposes. The server chassis may also be managed electromagnetically by controlling a flow of electromagnetic radiation into and out of the server chassis and, for example, through an opening in the server chassis through which gas flows for thermal management purposes. The server chassis may also be managed structurally by physically reinforcing various portions of the server chassis.

Abstract: A thermal fuse may comprise an electrode and a conductor separated by a phase change material. The electrode may be formed from a conductive material that generates hydrogen when exposed to water or hydrogen peroxide. The phase change material may release water or hydrogen peroxide at or above an activation temperature.

Abstract: A power module includes a power source module and a metallic heat-dissipation substrate. The power source module has an input pin and an output pin soldered on and electrically connected with a system board and includes a printed circuit board. The printed circuit board has a first surface and a second surface. At least a heat-generating component is disposed on the second surface. The metallic heat-dissipation substrate has a first surface and a second surface opposite to each other. The first surface has at least a fixing position and at least a heat-dissipating position. The fixing position is directly or indirectly connected with the second surface. A gap accumulated by tolerances is existed between the heat-dissipating position and the heat-generating component. A gap-filling material is filled into the gap. The second surface and the system board are soldered with each other. Therefore, the heat-dissipation efficiency is enhanced.

Abstract: A sealing method for a server includes: surrounding a part of a component by a frame; coating a first colloid on the part of the component and an inner surface of the frame; filling a second colloid between the part of the component and the inner surface of the frame and covering the first colloid, in which the first colloid and the second colloid have different coefficients of viscosity; fixing the frame on a housing; and sealing a gap between the frame and the housing.

Abstract: A wearable electronic device is disclosed. The device can include a support structure and an electronic component disposed in or on the support structure. A heat exchanger element can be thermally coupled with the electronic component, the heat exchanger element comprising a fluid inlet port and a fluid outlet port. A first conduit can be fluidly connected to the fluid inlet port of the heat exchanger, the first conduit configured to convey, to the heat exchanger, liquid at a first temperature. A second conduit can be fluidly connected to the fluid outlet port of the heat exchanger, the second conduit configured to convey, away from the heat exchanger, liquid at a second temperature different from the first temperature.

Abstract: A current cut-off device includes a plate-shaped terminal piece having a contact, a movable piece including an elastic portion formed in a plate shape so as to be elastically deformed and a movable contact arranged at one end portion of the elastic portion and having the movable contact so as to be pressed against and in contact with the contact, and a thermally actuated element which biases the movable piece by deforming in accordance with a temperature change and causes a state of the movable piece to be shifted from a conductive state in which the movable contact is in contact with the contact to a cut-off state in which the movable contact is separated from the contact. When the state of the movable piece is shifted from the conductive state to the cut-off state, as the movable contact moves, it gets over the contact.

Abstract: According to one embodiment, a cooling system includes a primary condenser, a primary supply line and a primary return line that couples the primary condenser to a cold plate that is arranged to be used for electronics cooling to create a primary heat-transfer loop in which the condenser supplies liquid coolant to the cold plate and receives vapor produced by the cold plate, a secondary condenser, a secondary supply line that couples the secondary condenser to the primary supply line, a secondary return line that couples the secondary condenser to the primary return line, and a primary valve that is coupled to the secondary return line, where, in response to vapor pressure exceeding a pressure threshold, the valve at least partially opens to create a secondary heat-transfer loop in which the secondary condenser condense vapor back into liquid coolant that is supplied to the primary supply line.

Abstract: A thermal management system may cool at least a portion of a computer system with one or more cooling systems. The thermal management system can include one or more modular heatsink assemblies. The modular heatsink assemblies can include scalable heat spreader panels that are thermally coupled to a portion of the one or more cooling systems. The modular heatsink assembly can be positioned above and/or adjacent to a computer component, such as a dual in-line memory module. The scalable heat spreader panels are shaped to fit in between and to the sides of the computing component to draw heat away from the computing component.

Abstract: The described embodiments relate generally to computing devices including liquid crystal displays (LCDs) and more particularly to methods for attaching a cover glass layer to a structural housing while minimizing an amount of stress transferred through the cover glass layer to the LCD module. A continuous and compliant foam adhesive can be used to bond the cover glass layer to a structural. The compliant bond can absorb and distribute local stress concentrations caused by structural loads, mismatched surfaces and differing thermal expansion rates between various structures and cover glass layer. This can reduce stress concentrations in the cover glass layer that can lead to stress induced birefringence in the LCD cell. In other embodiments, the cover glass layer can be attached using magnets or a tongue and groove design.

Abstract: The invention relates to a structure (1) for housing electronic apparatuses (10) such as boards (11) and the like, wherein the apparatuses are arranged in a container with a drawer (40) insertable and extractable with respect to a frame (20) of the structure (1). On the back wall of the drawer (40) and on the frame (20) connectors (53, 54) are provided which are coupled directly and automatically when the drawer is inserted.

Abstract: Systems and methods are disclosed for a liquid cooling module for an information handling system that may include a mounting card configured to mount the liquid cooling module to a card slot proximate to a graphics card; a radiator inlet configured to receive a heated liquid from a pump of the graphics card; a radiator inlet tube configured to transfer the heated liquid from the graphics card to the liquid cooling module; a radiator configured to receive the heated liquid via a radiator inlet; a blower configured to direct a surrounding air flow across the radiator to cool the heated liquid; a radiator outlet configured to receive the cooled liquid from the radiator; and a radiator outlet tube configured to transfer the cooled liquid from the liquid cooling module to the graphics card.

Abstract: Systems and methods for cooling an electronic device via interface of a heat-transfer conduit of the electronic device to a cold plate assembly are disclosed. According to an aspect, a system includes an electronic device including one or more electronic components. Further, the electronic device includes a heat-transfer conduit including a first end and a second end. The first end of the heat-transfer conduit is positioned to receive heat from the electronic component(s). The heat-transfer conduit is configured to conduct heat from the first end to the second end. Further, the system includes a cold plate assembly including a cold plate and a mechanism configured to permit movement of the cold plate. At the first position, the cold plate may contact the second end for receipt of heat from the heat-transfer conduit at the second end. At the second position, the cold plate is apart from the second end.

Abstract: An electrical assembly comprising a housing forming a liquid tank inside thereof, dielectric liquid in the liquid tank, at least one fuse, and a blown fuse indication system. Each of the fuses is immersed in the dielectric liquid, and is provided with a striker pin. The blown fuse indication system is adapted to indicate a blowout of any one of the fuses by an indication signal. The blown fuse indication system comprises a first indication member and a second indication member. The first indication member is movable by the striker pins. The second indication member is immovably connected to the housing, and adapted to generate the indication signal as a response to relative movement between the first indication member and the second indication member.

Abstract: An equipment enclosure (1) for electromagnetically isolating an electronic device, the equipment enclosure 1 comprising a conductive housing (3) and a plurality of conductive sheets (5). Each sheet (5) includes an aperture (7). The sheets (5) are stacked in a spaced-apart relationship within the housing (3) thereby defining a plurality of electromagnetically-isolated cavities (9) each within a respective Faraday cage formed by the conductive housing (3) and the conductive sheets (5). The apertures (7) form a channel (11) that extends through the enclosure (1) providing a route for connections between the cavities (9).

Abstract: A modular server design includes a server chassis, a cooling module within the server chassis housing at least one cooling unit, an electronics module within the server chassis holding a motherboard, and a cooling connecting panel. The cooling connecting panel includes a number of cooling channels to fluidly connect the at least one cooling unit of the cooling module with a cooling device on the motherboard. The cooling module includes components to enable proper heat and fluid transfer.