Patents Examined by Anatoly Vortman
  • Patent number: 10978267
    Abstract: A power fuse includes a housing, first and second conductive terminals extending from the housing, and at least one fatigue resistant fuse element assembly connected between the first and second terminals. The fuse element assembly includes at least a first conductive plate and a second conductive plate respectively connecting the first and second conductive terminals, and a plurality of separately provided wire bonded weak spots interconnecting the first conductive plate and the second conductive plate.
    Type: Grant
    Filed: June 20, 2016
    Date of Patent: April 13, 2021
    Assignee: EATON INTELLIGENT POWER LIMITED
    Inventors: Robert Stephen Douglass, Ramdev Kanapady
  • Patent number: 10974671
    Abstract: A vehicular circuit body includes a trunk line that extends in a front-and-rear direction of a vehicle, a plurality of control boxes that are provided on the trunk line, and a branch line that connects the control box to an accessory. The trunk line and the branch line each includes a power line having a predetermined current capacity and a communication line having a predetermined communication capacity. The vehicle is divided into a plurality of regions. At least two control boxes are disposed in the regions which are different from each other, each of which includes a gateway conversing communication methods for the communication line of the branch line and the communication line of the trunk line. A plurality of the gateways are able to communicate with each other via the communication line of the trunk line.
    Type: Grant
    Filed: December 21, 2018
    Date of Patent: April 13, 2021
    Assignee: YAZAKI CORPORATION
    Inventors: Masahiro Takamatsu, Koichi Uezono, Kousuke Kinoshita, Atsushi Nakata, Yasuyuki Saito, Kazuyuki Oiwa, Terumitsu Sugimoto, Taku Furuta, Noriaki Sasaki, Yukinari Naganishi, Sadaharu Okuda, Kunihiko Yamada
  • Patent number: 10973149
    Abstract: A streamlined air baffle for efficiently directing air flow from a fan unit to a heat sink is disclosed. The streamlined air baffle has a top cover plate and a pair of side walls. The side walls are connected to the top cover plate. The top cover plate and one end of the side walls define an inlet. A curved surface of the top cover plate defines the outlet with the opposite ends of the side walls. The cross section area of the outlet is smaller than the cross section area of the inlet.
    Type: Grant
    Filed: February 13, 2018
    Date of Patent: April 6, 2021
    Assignee: QUANTA COMPUTER INC.
    Inventors: Chao-Jung Chen, Yu-Nien Huang, Herman Tan, Chih-Wei Lin
  • Patent number: 10969840
    Abstract: Disclosed herein are embodiments of heat spreaders with interlocked inserts, and related devices and methods. In some embodiments, a heat spreader may include: a frame formed of a first material, wherein the frame includes an opening, a projection of the frame extends into the opening, and the projection has a top surface, a side surface, and a bottom surface; a recess having at least one sidewall formed by the frame; and an insert formed of a second material different from the first material, wherein the insert is disposed in the frame and in contact with the top surface, the side surface, and the bottom surface of the projection.
    Type: Grant
    Filed: November 16, 2015
    Date of Patent: April 6, 2021
    Assignee: Intel Corporation
    Inventors: Aravindha R. Antoniswamy, Syadwad Jain, Zhizhong Tang, Wei Hu
  • Patent number: 10955882
    Abstract: A solid-state drive device includes a memory module in which at least one non-volatile memory device is mounted, a first heat storage unit and a second heat storage unit covering upper and lower parts of the memory module, respectively, to store heat emitted by the memory module, and having at least portions connected to each other, respectively, a cover having a space in which the memory module and the first and second heat storage units are received and arranged with a spacing distance from the first and second heat storage units, respectively, and an inner frame arranged between the cover and at least one of the first and second heat storage units, to provide the spacing distance.
    Type: Grant
    Filed: August 7, 2018
    Date of Patent: March 23, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yusuf Cinar, Jae Hong Park, Han Hong Lee, Jung Hoon Kim, Ki Taek Lee
  • Patent number: 10955881
    Abstract: An electronic memory module can be cooled by a cooling assembly that consists of at least a printed circuit board connected to at least one data storage component. The memory module may be housed within, and in physical contact with, a cooling frame that surrounds a periphery of the printed circuit board. The cooling frame can have a seating tab that is separated from the memory module, spans the memory module, and supports a heatsink in contact with the at least one data storage component.
    Type: Grant
    Filed: May 2, 2017
    Date of Patent: March 23, 2021
    Assignee: Seagate Technology LLC
    Inventors: Shankar Gopalakrishna, Vivekananda Avvaru, Saju Cheeran Verhgese Francis
  • Patent number: 10952353
    Abstract: A thermal buffering module is used in a combined equipment and cooling unit including a housing defining an interior configured to receive electronic equipment, with the electronic equipment being supported by the housing. The combined equipment and cooling unit further includes a cooling unit supported by the housing. The thermal buffering module includes at least one heat exchanger. The thermal buffering module is configured to selectively receive chilled air from the cooling unit to cool the at least one heat exchanger and to selectively receive warm IT air from the electronic equipment to cool the warm IT air as it travels over the at least one heat exchanger.
    Type: Grant
    Filed: August 21, 2019
    Date of Patent: March 16, 2021
    Assignee: SCHNEIDER ELECTRIC IT CORPORATION
    Inventors: John H. Bean, Jr., James William VanGilder, Roy L. Grantham
  • Patent number: 10945331
    Abstract: Embodiments of the disclosure relate to the technical field of display, and in particular, to a mobile display device, comprising: a housing; a battery and a circuit board both provided within the housing, the battery being interposed between the circuit board and the housing, or alternatively, the battery and the circuit board being arranged side by side; a chip provided on the circuit board; a heat dissipation unit which is also provided on the circuit board and is configured to dissipate heat from the chip; and a first thermally-conductive connector which connects the heat dissipation unit with the housing.
    Type: Grant
    Filed: May 10, 2017
    Date of Patent: March 9, 2021
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Yongda Ma, Yong Qiao, Jianbo Xian
  • Patent number: 10934936
    Abstract: A cooling system is provided in a hybrid electric propulsion gas turbine engine for cooling electrical components therein. The cooling system includes an electrical component disposed in proximity to a power generation component in the hybrid electric propulsion gas turbine engine. The cooling system further includes a vapor chamber having an evaporator portion and a condenser portion, wherein the evaporator portion is disposed adjacent to and in thermal communication with the electrical component to transfer heat away from the electrical component. The vapor chamber includes biphasic working fluid therein that transitions between liquid and gaseous states as the working fluid flows proximal to the condenser portion and the evaporator portion respectively.
    Type: Grant
    Filed: July 10, 2017
    Date of Patent: March 2, 2021
    Assignee: Rolls-Royce North American Technologies, Inc.
    Inventors: Douglas J. Snyder, Andrew M. Bollman
  • Patent number: 10939586
    Abstract: Heat exchanger structure for a rack assembly formed by a shaped body of thermally conductive material. The heat exchanger structure comprises a first heat exchanging portion adapted to provide a mechanical support for one or more power electronic components of said rack assembly and adapted to absorb and dissipate heat generated by said power electronic components. The heat exchanger structure comprises a second heat exchanging portion adapted to provide a mechanical support for one or more power electromagnetic components of said rack assembly and adapted to absorb and dissipate heat generated by said power electromagnetic components.
    Type: Grant
    Filed: June 13, 2018
    Date of Patent: March 2, 2021
    Assignee: ABB Schweiz AG
    Inventors: Clemens Christiaan Van Der Veer, Fabio Tombelli, Filippo Chimento, Mauro Piazzesi, Daniel Gerber
  • Patent number: 10939578
    Abstract: A fan tray system includes a fan tray base that couples to a chassis and that includes fan system connector(s) for connecting to a fan system. A fan tray side wall includes fan system guide member(s) that align the fan system for connection to the fan system connector(s), and is connected to the fan tray base by a moveable coupling that allows relative movement between the fan tray side wall and the fan tray base. That relative movement allows the fan tray side wall to be positioned in a first orientation when the fan tray base is coupled to the chassis such that the fan tray side wall is positioned adjacent a chassis wall of the chassis and impedes access component(s) in the chassis. That relative movement also allows the fan tray side wall to be moved to a second orientation that allows access to the component(s) in the chassis.
    Type: Grant
    Filed: August 30, 2017
    Date of Patent: March 2, 2021
    Assignee: Dell Products L.P.
    Inventors: Darren Burke Pav, Jake Hill Lavallo
  • Patent number: 10939585
    Abstract: An electronic component unit includes a heatsink, a substrate on which electronic component is installed, a fixing metal fitting that fixes the electronic component and the substrate to the heatsink, and a fastening member that fixes the fixing metal fitting to the heatsink, and the heatsink includes a body portion, and a fixing portion that is projecting from the body portion toward the substrate side and to which the fixing metal fitting is fixed, and the substrate includes a through-hole that the fixing portion penetrates through, and the fixing metal fitting includes a base portion that contacts the fixing portion and is fixed to the fixing portion by the fastening member, and a pressing portion that extends from one end of the base portion, elastically deforms with respect to the base portion, and presses the electronic component toward the substrate side.
    Type: Grant
    Filed: April 24, 2018
    Date of Patent: March 2, 2021
    Assignee: YAZAKI CORPORATION
    Inventors: Chiaki Chida, Michito Enomoto
  • Patent number: 10928868
    Abstract: A heat dissipating assembly suited for an electronic device is provided. The electronic device has at least one heat source. The heat dissipating assembly includes a first tube, a second tube, and a fluid. The first tube has an inlet and an outlet, wherein a bore size of the inlet is smaller than a bore size of the outlet. Heat generated from the heat source is transferred to the first tube. Two opposite ends of the second tube are connected to the inlet and the outlet such that the first and the second tubes are formed into a closed loop. The fluid is filled in the closed loop. The fluid in the first tube transferred from the inlet toward the outlet absorbs the heat and is transferred to the second tube for heat dissipating. An electronic device is also provided.
    Type: Grant
    Filed: April 18, 2018
    Date of Patent: February 23, 2021
    Assignee: Acer Incorporated
    Inventors: Cheng-Wen Hsieh, Wen-Neng Liao
  • Patent number: 10928855
    Abstract: Embodiments of a dock with an actively controlled heatsink for a multi-form factor Information Handling System (IHS) are described. In some embodiments, a dock may include: a base, a plateau configured to receive an IHS, and an arm coupling a distal edge of the base to a proximal edge of the plateau, where the plateau comprises a heatsink configured to cool a heatpipe disposed within the IHS via a bottom surface of the IHS.
    Type: Grant
    Filed: December 20, 2018
    Date of Patent: February 23, 2021
    Assignee: Dell Products, L.P.
    Inventor: Michiel Sebastiaan Emanuel Petrus Knoppert
  • Patent number: 10925148
    Abstract: A printed circuit board assembly is provided. A printed circuit board assembly includes a printed circuit board; an electronic component mounted on the printed circuit board; a heat radiating member which contacts the electronic component and is configured to receive and conduct heat generated by the electronic component; and at least one connection part connecting the printed circuit board and the heat radiating member to each other and configured to transfer the heat conducted through the heat radiating member to the printed circuit board.
    Type: Grant
    Filed: July 31, 2017
    Date of Patent: February 16, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Seok-hun Kang, In-beom Kim, Bo-ram Kim, Soo-hong Kim
  • Patent number: 10916367
    Abstract: A printed circuit board includes at least one of a first coil pattern disposed on a first main surface and a second coil pattern disposed on a second main surface. The first coil pattern includes a first portion arranged between a first core portion and a second core portion. The second coil pattern includes a third portion arranged between the first core portion and the second core portion. A first heat transfer member is mounted on at least one of the first portion and the third portion. Therefore, temperature increase of at least one of the first portion and the third portion can be suppressed.
    Type: Grant
    Filed: January 10, 2017
    Date of Patent: February 9, 2021
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Kazuaki Fukui, Koji Nakajima, Shota Sato, Kenta Fujii
  • Patent number: 10916934
    Abstract: A power distribution panel for distributing power to a plurality of components. A modular frame may removably attach in an aperture of a side of a chassis. A first module may be removably attached in an opening of the modular frame. A second module, different from the first module, may be removably attached in the opening of the modular frame.
    Type: Grant
    Filed: July 30, 2018
    Date of Patent: February 9, 2021
    Assignee: Telect, Inc.
    Inventors: Steven Kyle Witkoe, Timothy Andrew Meyer, Timothy McBrien Turpin
  • Patent number: 10910706
    Abstract: Various examples pertaining to a sensor housing design for millimeter wave (mmWave) sensors are described. A sensor housing may include a radar sensor, a printed circuit board (PCB), a radome and a PCB holder. The radar sensor may be capable of emitting a radio wave. The PCB may have a first side and a second side opposite the first side with the radar sensor mounted on the first side thereof to form a PCB assembly (PCBA). The radome may include a cavity in which the PCBA is disposed. The PCB holder may be disposed along a circumference of an inner wall of the radome, and the PCB holder may be configured to hold the PCBA such that a distance between an inner surface of the radome and a side of the radar sensor facing the inner surface of the radome is proportional to half wavelength of the radio wave.
    Type: Grant
    Filed: January 16, 2019
    Date of Patent: February 2, 2021
    Inventors: Chih-Ming Hung, Yu Chun Lu, Yen-Ju Lu, ChiaYu Lin
  • Patent number: 10912232
    Abstract: In an electronic circuit board of a power conversion device or the like, heat interference between parts mounted on a multi-layer printed circuit board is suppressed in order to place the mounted parts close to each other. The mounted parts include a semiconductor element and a magnetic part formed by a coil pattern, which is made from a copper foil of the printed circuit board, and by a magnetic core. A screw fixing portions is placed in the surroundings of the semiconductor element and the coil pattern. A heat radiation pattern connected to the screw fixing portion is provided between and around the semiconductor element and the coil pattern when viewed from a direction perpendicular to a principal surface of the multi-layer printed circuit board. The screw fixing portion is connected to a cooler in a manner that gives the screw fixing portion heat conductance and electrical conductance.
    Type: Grant
    Filed: November 29, 2017
    Date of Patent: February 2, 2021
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Koji Nakajima, Yuji Shirakata, Kenta Fujii, Shota Sato
  • Patent number: 10905033
    Abstract: A liquid-cooled electric drive component for a powertrain of a vehicle includes a first housing part and a second housing part. The first and second housing parts are joined to one another by a fluid-tight welded joint and configured such as to form at least a segment of a cooling duct. The vehicle can be a hybrid vehicle or an electric vehicle.
    Type: Grant
    Filed: December 16, 2016
    Date of Patent: January 26, 2021
    Assignee: SIEMENS AKTIENGELLSCHAFT
    Inventor: Matthias Schmitt