Abstract: An apparatus is provided for improving the cooling of a heat source. The apparatus includes a deflector mounted in a space between a first heat source and a second heat source. The deflector has a first face at a first angle that is greater than perpendicular from a first plane and a second face at a second angle that is less than perpendicular from a second plane. The apparatus further includes a plurality of vanes that extend from the first face of the deflector and are rotated inwardly with respect to the first face. When the first and second heat sources are immersed in a fluid and oriented with the second heat source above the first heat source, as fluid heated by the first heat source rises, the heated fluid is directed by the deflector away from the second plane and is directed by the plurality of vanes toward a center of the deflector.

Abstract: A battery pack has a fuse box bracket for short circuit prevention, and more particularly a battery pack configured such that two or more unit modules are electrically connected to each other, the battery pack including a fuse interposed between connection terminals extending from the unit modules; and a fuse box bracket located under the fuse, wherein the fuse includes a central portion made of a nonconductor and an edge portion made of a conductor.

Abstract: A semiconductor module includes a substrate, a semiconductor package disposed to the substrate, a housing to which the substrate is fixed, and a Y capacitor. A front-surface wiring in the substrate includes a front-surface ground wiring electrically connected to the housing, and a front-surface main wiring connected to a rear-surface wiring that is connected to the semiconductor package. The Y capacitor is disposed on a front surface of the substrate at a position facing the semiconductor package and between the front-surface ground wiring and the front-surface main wiring. The semiconductor package and the Y capacitor are disposed in such a manner that a direction of electric current flowing in the semiconductor package and a direction of electric current flowing in the Y capacitor are opposite to each other.

Abstract: The electronic device includes a display including a first area and a second area, a first housing configured to support the first area and to form a first space, a second housing configured to support the second area and to form a second space, a hinge structure configured to foldably connect the first housing and the second housing based on a folding axis to be in a first state in which the first and second areas form substantially a same plane or in a second state in which the first and second areas face each other, and a heat transfer member provided to extend from the first space to the second space through the hinge structure and configured to perform a heat transfer between the first space and the second space.

Abstract: An actuator usable in a cooling system is described. The actuator includes an anchored region and a cantilevered arm. The cantilevered arm extends outward from the anchored region. The cantilevered arm includes a step region, an extension region and an outer region. The step region extends outward from the anchored region and has a step thickness. The extension region extends outward from the step region and has an extension thickness less than the step thickness. The outer region extends outward from the extension region and has an outer thickness greater than the extension thickness.

Abstract: Electrically controlled solid-state thermal switches and methods of controlling heat flow. An electrostrictive material is electromagnetically coupled to first and second electrodes that provide an electric field to the electrostrictive material. Different portions of the electrostrictive material are thermally coupled to each of a heat sink and a thermal load so that heat flowing from one into the other passes through the electrostrictive material. A control voltage is applied to the electrodes to selectively generate the electric field, thereby selectively altering the thermal conductivity of the electrostrictive material. The heat sink and thermal load are thereby selectively thermally coupled to each other in dependence on the control voltage.

Abstract: An electronic device cover is configured to accommodate an electronic device. A first air intake window and a first air exhaust window are disposed on the electronic device cover. The first air intake window is configured to communicate with an air intake vent of the electronic device to form an air intake channel, and the first air exhaust window is configured to communicate with an air exhaust vent of the electronic device to form an air exhaust channel. An air return channel is disposed inside the electronic device, and the air return channel is configured to communicate the air exhaust channel and the air intake channel.

Abstract: A temperature control assembly that enables precise temperature control for radiation detectors, such as positron emission tomography (“PET”) detectors and other densely packed electronics is described. The temperature control assembly includes a liquid cooling assembly that generally includes a cold plate having formed therein one or more channels through which a liquid coolant is able to flow. The channels are enclosed by the cold plate, such that the liquid coolant does not come into contact with sensitive electronic components used in the radiation detectors. When a liquid coolant is flowing through the channels, a sufficiently low humidity level is maintained external the cold plate. The liquid cooling assembly is removable and can be arranged between layers of printed circuit boards in an array of radiation detectors. Heating elements can be coupled the liquid cooling assembly and operated to increase the temperature as necessary to maintain a precisely controlled temperature environment.

Abstract: A mechanism for a circuit breaker to rack in and out of a cabinet enclosure has a long, threaded screw rod on the circuit breaker captured into a stationary nut at the back of the cabinet. Racking inwardly is limited by the selective release of the nut when the maximum extent of racking in is reached. When a cross beam of the circuit breaker reaches its predetermined limit, further racking in is prevented as, at that point, the nut is no longer held in place. Racking out of the circuit breaker from the cabinet is still allowed, if desired. Non-rotative square rods and rotative round rods, along with paddles of the rotative round rods interact with protrusions on the outside of the nut to ensure racking in, racking out, preventing cross threading and limiting the racking in, all as desired.

Abstract: An object is to provide a power conversion device that enables a capacitor element to be efficiently cooled, thus suppressing deterioration of the capacitor element due to heat. The power conversion device includes: a power module including a module body portion storing a semiconductor element, and a power terminal protruding from the module body portion; a capacitor module including a capacitor body portion storing a capacitor element, and a capacitor busbar protruding from the capacitor body portion and connected to the power terminal; and a housing storing the power module and the capacitor module. The housing has a first surface to which the power module is thermally connected, and a second surface to which the capacitor module is thermally connected. A coolant path for cooling the first surface is provided on a back side of the first surface. The capacitor busbar is thermally connected to the first surface.

Abstract: A power conversion circuit energization unit includes a bus bar module and a conductive fixing bolt. The bus bar module includes conductive P and N bus bars connected to a switch element in a power conversion device and an insulative terminal block on which the bus bars are located. The fixing bolt fixes the terminal block to a housing in which the switch element is housed. A head of the fixing bolt and the P bus bar are separated from each other in an axial direction along which a shaft of the fixing bolt extends while facing each other.

Abstract: Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a package substrate including a first conductive pathway electrically coupled to a power source; a mold material on the package substrate including a first microelectronic component embedded in the mold material, a second microelectronic component embedded in the mold material, and a TMV, between the first and second microelectronic components, the TMV electrically coupled to the first conductive pathway; a redistribution layer (RDL) on the mold material including a second conductive pathway electrically coupled to the TMV; and a third microelectronic component on the RDL and electrically coupled to the second conductive pathway, wherein the second conductive pathway electrically couples the TMV, the first microelectronic component, and the third microelectronic component.

Abstract: A motor integrated inverter apparatus includes a drive motor on which a decelerator is installed, and an inverter installed to be directly connected to the drive motor. The inverter includes an inverter cover installed on a side of the drive motor and having an installation space defined therein, a capacitor having the installation space defined in the inverter cover so that an end of the drive shaft is inserted into the installation space, a control board installed on a side of the capacitor, and a cooling part installed between the control board and the capacitor.

Abstract: An electronic device includes an arithmetic unit layer and a power supply. The arithmetic unit layer comprises at least one arithmetic unit. Each arithmetic unit comprises a first housing in a shape of cuboid. A first side direction of the first housing extends in a first direction. The first housing is provided with first and second openings at both ends in the first side direction thereof to form a coolant passage extending in the first direction. The power supply is stacked with arithmetic unit layer in a second or a third direction. A first side direction of the power supply is aligned with the first side direction of each arithmetic unit. The power supply is provided with third and fourth openings at both ends in the first side direction thereof to form a coolant passage extending in the first side direction of the power supply.

Abstract: This breaker device includes: a casing; an igniter configured to generate gas; a pusher located inside the casing and positioned below the igniter; a conductor including a separating portion positioned below the pusher; and an elastic member disposed to be positioned between the casing and the pusher to press the outer side surface of the pusher. In the state where the pusher is stationary after the pusher moves the separating portion downward under the pressure of the gas generated by the igniter, the pusher is located at a level below the elastic member, and the inner surface of the elastic member overlaps the pusher as viewed from above.

Abstract: A fusible disconnect switch device is provided. The disconnect switch includes a switch actuator, an actuator bias element, and a slider assembly. The switch actuator is selectively positioned between an opened position and a closed position. The actuator bias element includes a first end acting on the switch actuator and a second end coupled to the switch housing. The slider assembly is linked to the switch actuator. The slider assembly includes a first slider and a second slider each slidably movable with respect to the switch housing along a linear axis. The first slider is independently movable relative to the second slider. The actuator bias element and the slider assembly are responsive to the position of the switch actuator to effect a switch closing operation and a switch opening operation.

Abstract: A graphic card assembly includes a bracket, a graphic card module, a first fin set, a centrifugal fan, a second fin set, a heat pipe set and an axial flow fan. The graphic card module is assembled to the bracket and has at least one heat source. The first fin set and the second fin set are assembled to the bracket and the first fin set thermally contacts the heat source. The centrifugal fan is disposed beside the first fin set to generate a first air flow dissipating heat from the first fin set. The heat pipe set contacts the heat source. The axial flow fan is disposed on the second fin set to generate a second air flow dissipating heat from the second fin set. The first air flow and the second air flow are separated from each other, and the second air flow passes through the bracket and the graphic card module.

Abstract: A power distribution panel for distributing power to a plurality of components. A modular frame may removably attach in an aperture of a side of a chassis. A first module may be removably attached in an opening of the modular frame. A second module, different from the first module, may be removably attached in the opening of the modular frame.

Abstract: Provided is a stretchable circuit board including a stretchable insulating layer, and a wiring, in which the wiring is formed of a combination of a metal wiring portion that forms a main portion of the wiring, and a conductive stretchable portion disposed ancillary to the metal wiring portion.

Abstract: The invention provides a heat dissipating device comprising: a heat generating unit, which generates heat when under operation and is placed at a first side of the heat dissipating device; a heat sensitive object, which is placed at a second side of the heat dissipating device; and an air layer, which is arranged in between the heat generating unit and the heat sensitive object. The heat generated by the heat generating unit is isolated by the air layer.