Patents Examined by Anatoly Vortman
  • Patent number: 11990303
    Abstract: A thermal breaker having a push rod positioned in a base of the thermal breaker between a first terminal and a second terminal and beneath an electrical conducting element. A first end of the electrical conducting element is fixed to and makes electrical contact with the first terminal and a second opposite end extends to the second terminal and is constructed to make reversible electrical contact with the second terminal. A spacer extends from the push rod and is positioned in between the second end and the second terminal when the push rod is pushed manually towards a rear end of the base, preventing electrical conductivity between the first terminal and the second terminal. Releasing the push rod restores electrical conductivity between the first terminal and the second terminal as a spring pushes the push rod towards a front end of the base.
    Type: Grant
    Filed: December 6, 2022
    Date of Patent: May 21, 2024
    Inventor: David Worsham
  • Patent number: 11990304
    Abstract: The present disclosure provides an excitation fuse with a conductor and a fusant being sequentially broken, the excitation fuse comprising a housing and a cavity in the housing, wherein at least one conductor is provided to be inserted in the housing and the cavity and has two ends connected with an external circuit; at least one fusant is provided in parallel on the conductor; an excitation device and a breaking device are mounted in the cavity at one side of the conductor; the excitation device may receive an external excitation signal to act to drive the breaking device to sequentially form at least one fracture on the conductor and the fusant respectively; and at least one fracture on the conductor is connected in parallel with the fusant.
    Type: Grant
    Filed: August 17, 2021
    Date of Patent: May 21, 2024
    Assignee: XI' AN SINOFUSE ELECTRIC CO., LTD.
    Inventors: Xibin Ge, Shaobo Duan, Xiaoguang Shi, Rongrong Chen, Xin Wang, Wei Wang
  • Patent number: 11984270
    Abstract: A mold includes a pair of first mold parts, a pair of second mold parts, and a pair of third mold parts that define six surfaces of a molded body substantially having a rectangular parallelepiped shape. At least one of the pair of third mold parts includes an upper mold part and a lower mold part. The upper mold part defines an upper space of a molding space, and the lower mold part defines a lower space of the molding space. The upper mold part and the lower mold part are individually slidable. The lower mold part protrudes toward the molding space with respect to the upper mold part so that a step portion is formed. The upper mold part is slidable in cooperation with the lower mold part in a state in which the step portion is formed or absent.
    Type: Grant
    Filed: June 1, 2021
    Date of Patent: May 14, 2024
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Toru Tanaka, Takashi Sato, Hayato Kato, Kazuhito Odane
  • Patent number: 11983049
    Abstract: A portable information handling system structure located between housing hinges along one side of the housing has first and second antenna disposed at opposing ends with a cooling fan between the first and second antenna and over the antenna structure to isolate the first and second antenna. In one embodiment, a parasitic element disposed between the first and second antenna and under the cooling fan has resonance tuned to isolate wireless signals of a frequency supported by the first and second antenna.
    Type: Grant
    Filed: October 25, 2022
    Date of Patent: May 14, 2024
    Assignee: Dell Products L.P.
    Inventors: Ching Wei Chang, Suresh Ramasamy, Allen B. McKittrick, Jeffery D. Kane
  • Patent number: 11984275
    Abstract: An electrical mains plug having a body formed of an electrically insulating material is described. Two contact pins are arranged parallel to one another and which project out of the body at a first side thereof, and inside the body are connected or can be connected in each case to an electrical conductor which leads out or can be led out of the body at a second side thereof. The thermal bimetallic element is provided as a temperature sensor, said thermal bimetallic element being a constituent part of the thermal bimetallic switch which is associated with at least one of two contact pins. An electrical connection cable suitable therefor and an electrical device connected thereto are also described.
    Type: Grant
    Filed: October 2, 2018
    Date of Patent: May 14, 2024
    Assignee: TMC SENSORTECHNIK GMBH
    Inventors: Bruno Gengenbach, Michael Bucher
  • Patent number: 11974399
    Abstract: Systems and methods of providing a three-dimensional electronic module having high component density are disclosed. In some cases, the module has improved heat dissipation, reduced weight and size, and increased protection against electromagnetic radiation. In some cases, the module includes a printed circuit board configured to be folded into a convex polyhedron, with the polyhedron's faces formed by sections of the printed circuit board. In some cases, the electronic components face the interior of the circuit board and fall into gaps between the components installed on the other sections.
    Type: Grant
    Filed: March 4, 2019
    Date of Patent: April 30, 2024
    Inventor: Yuriy Borisovich Sokolov
  • Patent number: 11972917
    Abstract: A disconnect device includes: a conductor connectable to an external conductive path; a housing that has an internal space and accommodates at least a part of the conductor; and a cooling body that is disposed in the internal space and cools an arc generated in the internal space. The cooling body includes a porous body configured with at least one of a metal oxide and an inorganic oxide.
    Type: Grant
    Filed: September 24, 2020
    Date of Patent: April 30, 2024
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Masato Nakamura, Shun Ito, Shinya Kimoto, Katsuya Uruma
  • Patent number: 11968803
    Abstract: A cooling plate includes an inlet port to receive two-phase fluid, a base plate to be attached to server electronics for cooling, a number of heat spreading structures disposed and spaced apart on the base plate to extend a heat exchange area from the base plate, and a number of fluid channels disposed on the base plate, where each of the fluid channels is situated between a pair of adjacent heat spreading structures. Each of the fluid channels include a channel inlet to receive at least a portion of the two-phase fluid from the inlet port, a channel outlet to allow the received portion of the two-phase fluid to flow through and exit the corresponding fluid channel, and one or more intermediate outlets disposed between the channel inlet and the channel outlet to allow at least a portion of the received two-phase fluid to exit in vapor or liquid form.
    Type: Grant
    Filed: December 22, 2021
    Date of Patent: April 23, 2024
    Assignee: BAIDU USA LLC
    Inventor: Tianyi Gao
  • Patent number: 11963336
    Abstract: This application provides a film-like heat dissipation member, a bendable display apparatus, and a terminal device. The film-like heat dissipation member includes a heat dissipation layer. Composition and a structure of the heat dissipation layer are designed, so that a cutting-plane length of the heat dissipation layer changes in a surface bending process, can be bent repeatedly, and can implement uniform temperatures on two sides of the bendable display apparatus and the terminal device, thereby improving heat dissipation capabilities of the bendable display apparatus and the terminal device.
    Type: Grant
    Filed: July 7, 2022
    Date of Patent: April 16, 2024
    Assignee: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Huipeng Wu, Quanming Li, Guo Yang
  • Patent number: 11962103
    Abstract: A cable connection structure includes: cables, each including a jacket and a core wire exposed at an end portion by removing the jacket; a first fixing member configured to fix distal end portions of exposed core wires while holding the cables at predetermined intervals; a second fixing member configured to fix proximal end portions of the exposed core wires while holding the cables at predetermined intervals; and a substrate including a core wire connection electrode configured to electrically connect the core wire at a position between the first fixing member and the second fixing member, wherein the first fixing member and the second fixing member are different members.
    Type: Grant
    Filed: December 30, 2020
    Date of Patent: April 16, 2024
    Assignee: OLYMPUS CORPORATION
    Inventor: Takanori Sekido
  • Patent number: 11937409
    Abstract: Provided is an electronic module including a housing case for housing a relay, a heat transfer sheet placed on an inner surface of a bottom plate of the housing case, a terminal provided on one surface of the relay opposing a bottom plate, and a crank portion in which a first flat plate portion electrically connected to the terminal and a second flat plate portion that is in contact with the heat transfer sheet are coupled in a crank shape.
    Type: Grant
    Filed: December 9, 2019
    Date of Patent: March 19, 2024
    Assignee: Sumitomo Wiring Systems, Ltd.
    Inventor: Kazuya Komaki
  • Patent number: 11927398
    Abstract: A cooling apparatus for a medium voltage or high voltage switchgear includes an evaporator, a fluid conduit, and a condenser. The evaporator is configured to surround at least part of a current carrying contact. The fluid conduit fluidly connects the evaporator to the condenser. A section of the fluid conduit is formed within the evaporator and is electrically insulating and is configured such that fluid can contact an outer surface of the current carrying contact. The cooling apparatus is configured such that in use a working fluid in the evaporator is heated to a vapour state, and the vapour is transferred by the fluid conduit to the condenser. The vapour in the condenser is condensed to the working fluid. The condensed working fluid is passively returned via the fluid conduit to the evaporator.
    Type: Grant
    Filed: November 19, 2021
    Date of Patent: March 12, 2024
    Assignee: ABB Schweiz AG
    Inventors: Michael Kessler, Oleksandr Sologubenko, Jaroslav Hemrle, Andrzej Rybak, Adam Michalik
  • Patent number: 11920869
    Abstract: An energy-moving device (EMD) transfers heat between a low-temperature-rated device (LTRD) and a high-temperature-rated device (HTRD), wherein the LTRD is thermally separated from the HTRD such that the LTRD is not stacked above the HTRD. A temperature-controlling device (TCD) actively transfers heat between the LTRD and the EMD. An air-moving device (AMD) generates an air stream for transferring heat from the EMD to ambient air. A controller receives temperature information about the ambient air, the LTRD, and the HTRD; determines when heat should be removed from the LTRD, when heat should be added to the LTRD, and when no heat needs to be transferred to or from the LTRD; and determines a first voltage for the TCD and a second voltage for the AMD based on the received temperature information. And a neural network updates the voltage values based on how effectively the voltage values have performed.
    Type: Grant
    Filed: February 18, 2021
    Date of Patent: March 5, 2024
    Assignee: Continental Automotive Systems, Inc.
    Inventors: Robert Pozdal, Tony Asghari, Casey Szewc, Israel Cruz, Thomas Brey, James Snider
  • Patent number: 11923164
    Abstract: An arc flash mitigation system includes a main circuit protector such as a high amperage overcurrent protection fuse, and an arc flash mitigation network connected in parallel to the main circuit protector. The arc flash mitigation network includes at least one semiconductor switch operable to provide a shunt current path to a low amperage arc mitigation fuse for a faster response time to certain circuit conditions than the main circuit protector otherwise provides. The semiconductor switch may be a silicon controller rectifier operatively responsive to a voltage drop across the main circuit protector in use.
    Type: Grant
    Filed: June 25, 2021
    Date of Patent: March 5, 2024
    Assignee: Eaton Intelligent Power Limited
    Inventor: Michael Henricks
  • Patent number: 11910578
    Abstract: One general aspect includes a hybrid thermal management system for vehicle electronics. The hybrid thermal management system also includes a bottom piece being injection molded and may include of polymer, the bottom piece may include a plurality of coolant channels, an input port and an output port. The hybrid thermal management system also includes a thermal plate covering the bottom piece and the plurality of coolant channels and configured to dissipate thermal energy from a vehicle high performance computing (HPC) to a coolant within the plurality of coolant channels. The hybrid thermal management system also includes the input port configured to supply the coolant to the plurality of coolant channels. The hybrid thermal management system also includes the output port configured to collect coolant from the plurality of coolant channels and convey thermal energy away from the system.
    Type: Grant
    Filed: September 23, 2021
    Date of Patent: February 20, 2024
    Assignee: ContiTech Techno-Chemie GmbH
    Inventors: Vagner Pascualinotto Junior, Harald Kreidner, Ilja Makarenko
  • Patent number: 11901709
    Abstract: Provided is a gas-insulated switchgear having a circuit breaker tank with a reduced size. The gas-insulated switchgear includes: a connection conductor connected to two or more power cables, for each phase, inside the circuit breaker tank; a solid-insulated bus placed outside the circuit breaker tank and connected to the connection conductor via a connection bushing; and an instrument current transformer attached to the solid-insulated bus.
    Type: Grant
    Filed: March 24, 2020
    Date of Patent: February 13, 2024
    Assignee: MITSUBISHI ELECTRIC CORPORATION
    Inventors: Takayuki Fukuoka, Naoaki Inoue
  • Patent number: 11895806
    Abstract: An electronic assembly may include a chassis having electronic module mounting positions, each having a chassis cooling gas passageway and an electronic module received in each electronic module mounting position. A sealing retainer may be coupled between the chassis and each electronic module, and includes a cooling gas passageway aligned with the chassis cooling gas passageway and a module cooling gas passageway of a respective electronic module. The sealing retainer may include a retainer body, and a gas seal body coupled to the retainer body and movable between retracted and extended positions. The gas seal body in the retracted position permits insertion and removal of the electronic module, and in the extended position seals against the electronic module.
    Type: Grant
    Filed: April 27, 2022
    Date of Patent: February 6, 2024
    Assignee: EAGLE TECHNOLOGY, LLC
    Inventors: Voi Nguyen, Jason Thompson, Charles Weirick
  • Patent number: 11895769
    Abstract: A module according to the present disclosure includes a circuit board, an electronic component on one of two principal surfaces of the circuit board, a connection conductor on the principal surface of the circuit board, and sealing resin on the principal surface of the circuit board. The electronic component and the connection conductor are covered with the sealing resin. The connection conductor includes a plate-shaped conductor and terminal sections. The plate-shaped conductor is disposed upright on the principal surface of the circuit board. The terminal sections extend from the plate-shaped conductor and away from the principal surface of the circuit board and are arranged side by side. Tip portions of the terminal sections are exposed at a surface of the sealing resin.
    Type: Grant
    Filed: September 21, 2021
    Date of Patent: February 6, 2024
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventors: Kazuya Okamoto, Takashi Haga, Masayoshi Takagi, Kazushige Sato
  • Patent number: 11889667
    Abstract: A vehicle power module assembly including first and second power modules is provided. The first power module may include a first lock feature extending from a lower portion of a first minor side at a first central axis. The second power module may include a second lock feature at an upper portion of a second minor side at a second central axis. The lock features may be sized for interlock with one another to secure the power modules to one another. The first lock feature may be a loop element defining a through-hole and the second lock feature may be a wedge. The through-hole may be sized for the wedge to extend therein and to interlock the first power module and the second power module to one another. The first lock feature may be a flexible hook element and the second lock feature may be a slot.
    Type: Grant
    Filed: April 1, 2022
    Date of Patent: January 30, 2024
    Assignee: FORD GLOBAL TECHNOLOGIES, LLC
    Inventors: Akash Changarankumarath Pradeepkumar, Alfredo R. Munoz, Michael W. Degner, Edward Chan-Jiun Jih, Guangyin Lei
  • Patent number: 11881369
    Abstract: A temperature-dependent switch comprising first and second stationary contacts and a temperature-dependent switching mechanism having a movable contact member. The switching mechanism, in its first switching position, presses the contact member against the first contact and thereby produces an electrically conductive connection and, in its second switching position, keeps the contact member spaced apart from the first contact and thereby disconnects the electrically conductive connection. The switch further comprises a closing lock that, as soon as it is activated, prevents the switch once having opened from closing again. The closing lock comprises a locking element having a shape-memory alloy and an opening through which the movable contact member protrudes. The locking element is configured to change its shape upon exceeding a locking element switching temperature and activate the closing lock, which holds the switching mechanism in its second switching position.
    Type: Grant
    Filed: January 25, 2023
    Date of Patent: January 23, 2024
    Inventor: Marcel P. Hofsaess