Abstract: A fuse element assembly has been disclosed. The fuse element assembly includes a fuse element having a pair of side edges and at least one weak spot between the side edges. The fuse element assembly also includes an arc-quenching material attached locally to the fuse element adjacent the weak spot.

Abstract: An integrated circuit assembly may be formed comprising an electronic substrate, at least one integrated circuit device electrically attached to the electronic substrate, a heat dissipation device comprising a main body portion and a resilient portion extending from the main body portion, wherein the resilient portion has a plurality of extensions, a thermal interface material between the at least one integrated circuit device and the heat dissipation device, and a stiffener attached to the electronic substrate, wherein at least a portion of the plurality of extensions of the resilient portion of the heat dissipation device are biased against the stiffener.

Abstract: A rack and system for cooling computing devices such as in a data center is disclosed. In one embodiment, the rack supports a plurality of computing devices and comprises a plurality of planar annular sector or trapezoidal shelves, each having one or more positions for holding computing devices. A number of vertical supports may hold the shelves in a vertically spaced arrangement, and an air barrier may be affixed to the rack. The air barrier may have openings for the computing devices to permit exhaust air to flow through the air barrier into a hot aisle. The rack maybe configured to be connected to other similar racks to form a vertical annular hyperboloid or a vertical hyperbolic annular paraboloid, and the computing devices may be installed to discharge exhaust at an angle relative to a centerline of the vertical annular hyperboloid or a vertical hyperbolic annular paraboloid to improve airflow.

Abstract: Technologies for dynamic cooling include a computing device having a multi-chip package including multiple dies and a cold plate coupled to the multi-chip package. Micro nozzle valves are coupled to fluid passage zones of the cold plate positioned adjacent to the dies, and are configured to control fluid flow into the fluid passage zones. The computing device reads a predetermined die junction temperature for each die, determines a current die junction temperature for each die, compares the predetermined die junction temperature to the current die junction temperature for each die, and determines a fluid flow rate for each die based on that comparison. The computing device controls the micro nozzle valves adjacent to each die based on the respective fluid flow rate. The dies may include processor cores, field-programmable gate arrays, memory devices, or other computer chips. Other embodiments are described and claimed.

Abstract: The present invention relates to a method for manufacturing composite solder balls that are metallized on the surface and calibrated, these balls comprising a core consisting of a spherical support particle of diameter D0 made of expanded polystyrene and having an intergranular porosity of at least 50%, and a shell covering said support particle and formed by a plurality of metallic surface layers. The present invention also relates to balls that can be obtained by the method according to the invention, as well as to the use thereof for the assembly of electronic boards.

Abstract: A system including an active cooling system is described. The active cooling system includes a cooling element in communication with a fluid and configured to use vibrational motion to direct a fluid toward a surface of heat-generating structure(s). Heat is transferred from the heat-generating structure to the fluid. The system is configured such that the fluid follows a path from the surface of the heat-generating structure(s) past a structure having a lower temperature than the surface of the heat-generating structure. The structure absorbs heat from the fluid. The structure is within the system and distal from the active cooling system.

Abstract: An electronic device includes an interface unit including a connection portion attachable to an external device by being connected with an interface terminal disposed in the external device, a heat transfer unit, and a heat dissipation unit, wherein the heat transfer unit and the heat dissipation unit are connected with the interface unit, and are in a direction opposite the external device when the interface unit is connected with the external device.

Abstract: An extensible and contractible mounting board that includes an extensible and contractible substrate; an extensible and contractible wiring line on one main surface of the extensible and contractible substrate; an electronic component electrically connected to the extensible and contractible wiring line; and a resin portion in contact with the extensible and contractible wiring line and overlapping an end portion of a connection region between the extensible and contractible wiring line and the electronic component in a plan view of the extensible and contractible mounting board, the resin portion having a cutout portion that overlaps the extensible and contractible wiring line. A Young's modulus of the resin portion is higher than a Young's modulus of the extensible and contractible substrate.

Abstract: A flexible display device is described, including: a flexible display panel; a flexible battery arranged at a side of the flexible display panel away from a light emitting surface; and a heat dissipation assembly including a first heat dissipation sheet, the first heat dissipation sheet being arranged at a side of the flexible battery facing or away from the flexible display panel, and the first heat dissipation sheet having a bendable area.

Abstract: The present disclosure relates to a directional heat transfer using thermal control devices, including a dual phase change thermal diode and an active contact-based thermal switch. The thermal diode includes a positive temperature coefficient switching material and a negative temperature coefficient switching material arranged in series. The thermal switch includes two thermally conducting surfaces which may be moved to contact (i.e., having a distance between them of substantially zero) creating minimal thermal contact resistance. Both thermal control devices may be used to control heat flow into and/or out of a building.

Abstract: An electric circuit breaker comprising a switch, an arc extinguishing chamber and a fuse configured to be electrically connected between first and second terminals after the switch has tripped, further comprises a connection device comprising a gate configured to be broken after the switch has tripped only when at least one of the temperature, the pressure inside the arc extinguishing chamber or the intensity of an electrical arc present in the arc extinguishing chamber passes a predefined threshold, the connection device being configured to connect an electrode of the fuse to one of the terminals of the electrical conductor only once the gate is broken.

Abstract: The present disclosure provides an excitation fuse with a conductor and a fusant being sequentially broken, the excitation fuse comprising a housing and a cavity in the housing, wherein at least one conductor is provided to be inserted in the housing and the cavity and has two ends connected with an external circuit; at least one fusant is provided in parallel on the conductor; an excitation device and a breaking device are mounted in the cavity at one side of the conductor; the excitation device may receive an external excitation signal to act to drive the breaking device to sequentially form at least one fracture on the conductor and the fusant respectively; and at least one fracture on the conductor is connected in parallel with the fusant.

Abstract: A thermal breaker having a push rod positioned in a base of the thermal breaker between a first terminal and a second terminal and beneath an electrical conducting element. A first end of the electrical conducting element is fixed to and makes electrical contact with the first terminal and a second opposite end extends to the second terminal and is constructed to make reversible electrical contact with the second terminal. A spacer extends from the push rod and is positioned in between the second end and the second terminal when the push rod is pushed manually towards a rear end of the base, preventing electrical conductivity between the first terminal and the second terminal. Releasing the push rod restores electrical conductivity between the first terminal and the second terminal as a spring pushes the push rod towards a front end of the base.

Abstract: An electrical mains plug having a body formed of an electrically insulating material is described. Two contact pins are arranged parallel to one another and which project out of the body at a first side thereof, and inside the body are connected or can be connected in each case to an electrical conductor which leads out or can be led out of the body at a second side thereof. The thermal bimetallic element is provided as a temperature sensor, said thermal bimetallic element being a constituent part of the thermal bimetallic switch which is associated with at least one of two contact pins. An electrical connection cable suitable therefor and an electrical device connected thereto are also described.

Abstract: A portable information handling system structure located between housing hinges along one side of the housing has first and second antenna disposed at opposing ends with a cooling fan between the first and second antenna and over the antenna structure to isolate the first and second antenna. In one embodiment, a parasitic element disposed between the first and second antenna and under the cooling fan has resonance tuned to isolate wireless signals of a frequency supported by the first and second antenna.

Abstract: A mold includes a pair of first mold parts, a pair of second mold parts, and a pair of third mold parts that define six surfaces of a molded body substantially having a rectangular parallelepiped shape. At least one of the pair of third mold parts includes an upper mold part and a lower mold part. The upper mold part defines an upper space of a molding space, and the lower mold part defines a lower space of the molding space. The upper mold part and the lower mold part are individually slidable. The lower mold part protrudes toward the molding space with respect to the upper mold part so that a step portion is formed. The upper mold part is slidable in cooperation with the lower mold part in a state in which the step portion is formed or absent.

Abstract: Systems and methods of providing a three-dimensional electronic module having high component density are disclosed. In some cases, the module has improved heat dissipation, reduced weight and size, and increased protection against electromagnetic radiation. In some cases, the module includes a printed circuit board configured to be folded into a convex polyhedron, with the polyhedron's faces formed by sections of the printed circuit board. In some cases, the electronic components face the interior of the circuit board and fall into gaps between the components installed on the other sections.

Abstract: A disconnect device includes: a conductor connectable to an external conductive path; a housing that has an internal space and accommodates at least a part of the conductor; and a cooling body that is disposed in the internal space and cools an arc generated in the internal space. The cooling body includes a porous body configured with at least one of a metal oxide and an inorganic oxide.

Abstract: A cooling plate includes an inlet port to receive two-phase fluid, a base plate to be attached to server electronics for cooling, a number of heat spreading structures disposed and spaced apart on the base plate to extend a heat exchange area from the base plate, and a number of fluid channels disposed on the base plate, where each of the fluid channels is situated between a pair of adjacent heat spreading structures. Each of the fluid channels include a channel inlet to receive at least a portion of the two-phase fluid from the inlet port, a channel outlet to allow the received portion of the two-phase fluid to flow through and exit the corresponding fluid channel, and one or more intermediate outlets disposed between the channel inlet and the channel outlet to allow at least a portion of the received two-phase fluid to exit in vapor or liquid form.

Abstract: A cable connection structure includes: cables, each including a jacket and a core wire exposed at an end portion by removing the jacket; a first fixing member configured to fix distal end portions of exposed core wires while holding the cables at predetermined intervals; a second fixing member configured to fix proximal end portions of the exposed core wires while holding the cables at predetermined intervals; and a substrate including a core wire connection electrode configured to electrically connect the core wire at a position between the first fixing member and the second fixing member, wherein the first fixing member and the second fixing member are different members.