Abstract: An electronics system packaging/enclosure can include an external chassis, an internal chassis housed within the external chassis, and a condenser chassis housed within the external chassis, where the condensing chassis is situated on top of the internal chassis. The electronics system packaging can include a condenser unit housed in the condensing chassis to condense a vapor into a two-phase liquid coolant, and IT electronics housed within the internal chassis, where the internal chassis is at least partially submerged within the two-phase liquid coolant, where, heat generated within the internal chassis is transferred to the two-phase liquid coolant thereby causing at least some of the two-phase liquid coolant to turn into a vapor.

Abstract: A MEMS/NEMS actuator based on a phase change material is described in which the volumetric change observed when the phase change material changes from a crystalline phase to an amorphous phase is used to effectuate motion in the device. The phase change material may be changed from crystalline phase to amorphous phase by heating with a heater or by passing current directly through the phase change material, and thereafter quenched quickly by dissipating heat into a substrate. The phase change material may be changed from the amorphous phase to a crystalline phase by heating at a lower temperature. An application of the actuator is described to fabricate a phase change nano relay in which the volumetric expansion of the actuator is used to push a contact across an airgap to bring it into contact with a source/drain.

Abstract: A fusible disconnect switch device is provided. The disconnect switch a switch actuator, an actuator bias element, and a slider assembly. The switch actuator is selectively positionable between an opened position and a closed position. The actuator bias element includes a first end acting on the switch actuator and a second end coupled to the switch housing. The slider assembly is linked to the switch actuator. The slider assembly includes a first slider and a second slider each slidably movable with respect to the switch housing along a linear axis. The first slider is independently movable relative to the second slider. The actuator bias element and the slider assembly are responsive to the position of the switch actuator to effect the switch closing operation and a switch opening operation.

Abstract: A heatsink shield with thermal-contact dimples can improve thermal-energy distribution in a radar assembly. The radar assembly includes a printed circuit board (PCB), the heatsink shield, a radome, and a housing. The PCB can include integrated circuits and other components, along with a thermally-conductive material that covers at least a portion of the PCB surfaces. The heatsink shield includes multiple dimples that thermally contact the thermally-conductive material. The heatsink shield is configured to distribute thermal energy produced at least in part by the PCB components to the housing. In this way, the described techniques and systems permit the radar assembly to better distribute thermal energy away from the PCB components to the rest of the PCB and through the housing.

Abstract: A cooling assembly includes a panel defining an opening, a cooling unit including an output and coupled to the panel such that the output at least partially covers the opening of the panel, and spring-loaded latch assemblies coupled to the panel and configured to couple the cooling assembly to an enclosure.

Abstract: An apparatus includes at least one heat pipe that is adapted to be thermally coupled to an integrated circuit and has an evaporator portion and a first condenser portion, wherein the first condenser portion extends away from the evaporator portion; a first plurality of cooling fins that is attached to the first condenser portion; a first movable support that is thermally coupled to the first condenser portion and is configured to move a second plurality of cooling fins relative to the first plurality of cooling fins; and the second plurality of cooling fins, which is attached to the first movable support.

Abstract: A power semiconductor module contains a power semiconductor assembly, a housing which in a housing side with an outer surface has a recess with a direction of passage in the normal direction of the outer surface, having an internal contact device which has an electrically conducting contact inside the housing to an external connection element, designed as a load terminal element, with one section in the recess and having a spring element. The connection element is designed as a rigid metallic shaped body with an inner and an outer contact surface, and the outer contact surface is accessible from the outside, and the connection element is connected to the housing via an electrically insulating and mechanically elastic retaining device such that the connection element is moveable in the direction of passage, and wherein the spring element is arranged and designed in such a way that the spring action thereof acts directly or indirectly on the connection element in the direction of passage.

Abstract: An apparatus for grounding a heatsink utilizing an EMC spring press-fit pin includes a printed circuit board, a logic chip, a heatsink, and a grounding member, where the grounding member includes an integrated spring and a first terminal pin at a first end of the grounding member. The logic chip is electrically coupled to the printed circuit board and the heatsink is disposed on a top surface of the logic chip. The first terminal pin at the first end of the grounding member is disposed in a plated-through hole of the printed circuit, where the grounding member is configured to electrically couple the heatsink to the printed circuit board.

Abstract: The power conversion device includes: a housing; an electric wiring board stored in the housing; a first heat generating component provided on the one surface of the electric wiring board; a second heat generating component which has a lower heat generation density than the first heat generating component and of which a protruding height from the electric wiring board is equal to or smaller than a protruding height of the first heat generating component, the second heat generating component being provided on the one surface of the electric wiring board; and a third heat generating component which has a lower heat generation density than the first heat generating component and of which a protruding height from the electric wiring board is greater than the protruding height of the first heat generating component, the third heat generating component being provided on another surface of the electric wiring board.

Abstract: A cooling device for use with circuit interrupters includes a housing structured to be coupled to a terminal of the circuit interrupter and formed with several ventilation openings, as well as a permanent magnet, a torque converter and a fan blade all contained within the housing. When the cooling device is coupled to a terminal of a circuit interrupter and current flows through the terminals of the circuit interrupter, parasitic magnetic fields are generated and induce oscillatory motion of the permanent magnet. The torque converter is coupled to the permanent magnet and converts the oscillatory motion of the magnet to rotational motion that rotates the fan blade. The fan blade is disposed near the ventilation openings of the housing so that air flow produced by rotation of the fan blade travels across the surface of the circuit interrupter terminal nearest the ventilation openings to increase convection.

Abstract: A coolant distribution unit providing reliant circulation of coolant in a liquid cooling system for a heat-generating component such as a computer server is disclosed. The coolant distribution unit includes a manifold unit having a supply connector to supply coolant to the heat-generating component and a collection connector to collect coolant from a heat exchanger. A first pump has an inlet coupled to the manifold unit and an outlet coupled to the manifold unit. The first pump circulates coolant from the inlet to the outlet. A second pump has an inlet coupled to the manifold unit and an outlet coupled to the manifold. The second pump circulates coolant from the inlet to the outlet. The second pump may be disconnected from the manifold unit, while the first pump continues to circulate coolant through the manifold unit.

Abstract: A fan tray system includes a fan tray base that couples to a chassis and that includes fan system connector(s) for connecting to a fan system. A fan tray side wall includes fan system guide member(s) that align the fan system for connection to the fan system connector(s), and is connected to the fan tray base by a moveable coupling that allows relative movement between the fan tray side wall and the fan tray base. That relative movement allows the fan tray side wall to be positioned in a first orientation when the fan tray base is coupled to the chassis such that the fan tray side wall is positioned adjacent a chassis wall of the chassis and impedes access component(s) in the chassis. That relative movement also allows the fan tray side wall to be moved to a second orientation that allows access to the component(s) in the chassis.

Abstract: A thermal management assembly may implement cooling techniques to cool at least a portion of a computer system with one or more cooling systems. The techniques may include using a thermal management assembly in fluid communication with the cooling system(s) to supply fluid from at least one of the cooling systems to at least a portion of the computer system. The techniques may also or instead include using a first thermal coupling to transfer thermal energy between the first cooling system and the computer system and a second thermal coupling to transfer thermal energy between the second cooling system and the computer system. Cooling a computer system using the cooling techniques described herein lowers an operating temperature of the computer system thereby mitigating heat related computer failure.

Abstract: An assembly includes a lower sub-assembly containing a first fan, a middle sub-assembly supported above the lower sub-assembly, a bottom air flow control plane supported in the middle sub-assembly and having openings sized to fit multiple computers having vertical cooling air paths, and a top air flow control plane supported in the middle sub-assembly above the bottom air flow control plane and having openings sized to fit the multiple computers such that air is forced through the vertical cooling air paths.

Abstract: An electronic device comprising: a first case in which a groove is arranged along an outer circumference; a second case that overlaps with the first case and that has a rib extending toward a bottom face of the groove; and a seal member that is sandwiched between the bottom face and the rib, wherein the groove includes: a first side wall that is arranged on one end portion of the bottom face; and a second side wall that is arranged on other end portion of the bottom face, a height of the first side wall from the bottom face is lower than a height of the second side wall, and the first side wall does not come into contact with the second case.

Abstract: A mounting base or a riser base for a switchgear is provided with side interior openings to provide an internal arc pathway through which arc gasses or plasma are safely discharged to an outside air. The mounting base includes a front wall having a first end and a second end, a rear wall having a first end and a second end, a first side channel connecting the first end of the front wall to the first end of the rear wall, a second side channel connecting the second end of the front wall to the second end of the rear wall, and forming the mounting base having a central open area in a first section of a switchgear that is adjacent a second section of the switchgear. The mounting base further includes at least one opening in the first side channel for the passage of an arc from the first section of the switchgear to the second section of the switchgear, and thereby forming the mounting base with the internal arc pathway.

Abstract: A protective element includes an insulating substrate, a plurality of electrodes provided on the insulating substrate, a fuse element electrically connected to any electrode of the plurality of electrodes, and a heat generation element provided on the insulating substrate for heating and fusing the fuse element. The fuse element contains a composite metal material in which a first fusible metal and a second fusible metal are stacked, some of a component of the first fusible metal being dissolved at a joint working temperature, the second fusible metal being lower in melt temperature than the first fusible metal, at least some of a component of the second fusible metal being molten at the joint working temperature.

Abstract: A thermal fuse may comprise an electrode and a conductor separated by a phase change material. The electrode may be formed from a conductive material that generates hydrogen when exposed to water or hydrogen peroxide. The phase change material may release water or hydrogen peroxide at or above an activation temperature.

Abstract: Devices, systems, and methods for managing server chassis are disclosed. The server chassis may be managed thermally by controlling a flow of gas through an opening in the server chassis. The server chassis may be managed for security by controlling physical access to various portions of the server chassis, and, for example, to a portion of the server chassis proximate to an opening in the server chassis through which gas flows for thermal management purposes. The server chassis may also be managed electromagnetically by controlling a flow of electromagnetic radiation into and out of the server chassis and, for example, through an opening in the server chassis through which gas flows for thermal management purposes. The server chassis may also be managed structurally by physically reinforcing various portions of the server chassis.

Abstract: A sealing method for a server includes: surrounding a part of a component by a frame; coating a first colloid on the part of the component and an inner surface of the frame; filling a second colloid between the part of the component and the inner surface of the frame and covering the first colloid, in which the first colloid and the second colloid have different coefficients of viscosity; fixing the frame on a housing; and sealing a gap between the frame and the housing.