Abstract: A power module includes a power source module and a metallic heat-dissipation substrate. The power source module has an input pin and an output pin soldered on and electrically connected with a system board and includes a printed circuit board. The printed circuit board has a first surface and a second surface. At least a heat-generating component is disposed on the second surface. The metallic heat-dissipation substrate has a first surface and a second surface opposite to each other. The first surface has at least a fixing position and at least a heat-dissipating position. The fixing position is directly or indirectly connected with the second surface. A gap accumulated by tolerances is existed between the heat-dissipating position and the heat-generating component. A gap-filling material is filled into the gap. The second surface and the system board are soldered with each other. Therefore, the heat-dissipation efficiency is enhanced.

Abstract: A wearable electronic device is disclosed. The device can include a support structure and an electronic component disposed in or on the support structure. A heat exchanger element can be thermally coupled with the electronic component, the heat exchanger element comprising a fluid inlet port and a fluid outlet port. A first conduit can be fluidly connected to the fluid inlet port of the heat exchanger, the first conduit configured to convey, to the heat exchanger, liquid at a first temperature. A second conduit can be fluidly connected to the fluid outlet port of the heat exchanger, the second conduit configured to convey, away from the heat exchanger, liquid at a second temperature different from the first temperature.

Abstract: A current cut-off device includes a plate-shaped terminal piece having a contact, a movable piece including an elastic portion formed in a plate shape so as to be elastically deformed and a movable contact arranged at one end portion of the elastic portion and having the movable contact so as to be pressed against and in contact with the contact, and a thermally actuated element which biases the movable piece by deforming in accordance with a temperature change and causes a state of the movable piece to be shifted from a conductive state in which the movable contact is in contact with the contact to a cut-off state in which the movable contact is separated from the contact. When the state of the movable piece is shifted from the conductive state to the cut-off state, as the movable contact moves, it gets over the contact.

Abstract: According to one embodiment, a cooling system includes a primary condenser, a primary supply line and a primary return line that couples the primary condenser to a cold plate that is arranged to be used for electronics cooling to create a primary heat-transfer loop in which the condenser supplies liquid coolant to the cold plate and receives vapor produced by the cold plate, a secondary condenser, a secondary supply line that couples the secondary condenser to the primary supply line, a secondary return line that couples the secondary condenser to the primary return line, and a primary valve that is coupled to the secondary return line, where, in response to vapor pressure exceeding a pressure threshold, the valve at least partially opens to create a secondary heat-transfer loop in which the secondary condenser condense vapor back into liquid coolant that is supplied to the primary supply line.

Abstract: A thermal management system may cool at least a portion of a computer system with one or more cooling systems. The thermal management system can include one or more modular heatsink assemblies. The modular heatsink assemblies can include scalable heat spreader panels that are thermally coupled to a portion of the one or more cooling systems. The modular heatsink assembly can be positioned above and/or adjacent to a computer component, such as a dual in-line memory module. The scalable heat spreader panels are shaped to fit in between and to the sides of the computing component to draw heat away from the computing component.

Abstract: The described embodiments relate generally to computing devices including liquid crystal displays (LCDs) and more particularly to methods for attaching a cover glass layer to a structural housing while minimizing an amount of stress transferred through the cover glass layer to the LCD module. A continuous and compliant foam adhesive can be used to bond the cover glass layer to a structural. The compliant bond can absorb and distribute local stress concentrations caused by structural loads, mismatched surfaces and differing thermal expansion rates between various structures and cover glass layer. This can reduce stress concentrations in the cover glass layer that can lead to stress induced birefringence in the LCD cell. In other embodiments, the cover glass layer can be attached using magnets or a tongue and groove design.

Abstract: The invention relates to a structure (1) for housing electronic apparatuses (10) such as boards (11) and the like, wherein the apparatuses are arranged in a container with a drawer (40) insertable and extractable with respect to a frame (20) of the structure (1). On the back wall of the drawer (40) and on the frame (20) connectors (53, 54) are provided which are coupled directly and automatically when the drawer is inserted.

Abstract: Systems and methods are disclosed for a liquid cooling module for an information handling system that may include a mounting card configured to mount the liquid cooling module to a card slot proximate to a graphics card; a radiator inlet configured to receive a heated liquid from a pump of the graphics card; a radiator inlet tube configured to transfer the heated liquid from the graphics card to the liquid cooling module; a radiator configured to receive the heated liquid via a radiator inlet; a blower configured to direct a surrounding air flow across the radiator to cool the heated liquid; a radiator outlet configured to receive the cooled liquid from the radiator; and a radiator outlet tube configured to transfer the cooled liquid from the liquid cooling module to the graphics card.

Abstract: Systems and methods for cooling an electronic device via interface of a heat-transfer conduit of the electronic device to a cold plate assembly are disclosed. According to an aspect, a system includes an electronic device including one or more electronic components. Further, the electronic device includes a heat-transfer conduit including a first end and a second end. The first end of the heat-transfer conduit is positioned to receive heat from the electronic component(s). The heat-transfer conduit is configured to conduct heat from the first end to the second end. Further, the system includes a cold plate assembly including a cold plate and a mechanism configured to permit movement of the cold plate. At the first position, the cold plate may contact the second end for receipt of heat from the heat-transfer conduit at the second end. At the second position, the cold plate is apart from the second end.

Abstract: An electrical assembly comprising a housing forming a liquid tank inside thereof, dielectric liquid in the liquid tank, at least one fuse, and a blown fuse indication system. Each of the fuses is immersed in the dielectric liquid, and is provided with a striker pin. The blown fuse indication system is adapted to indicate a blowout of any one of the fuses by an indication signal. The blown fuse indication system comprises a first indication member and a second indication member. The first indication member is movable by the striker pins. The second indication member is immovably connected to the housing, and adapted to generate the indication signal as a response to relative movement between the first indication member and the second indication member.

Abstract: A modular server design includes a server chassis, a cooling module within the server chassis housing at least one cooling unit, an electronics module within the server chassis holding a motherboard, and a cooling connecting panel. The cooling connecting panel includes a number of cooling channels to fluidly connect the at least one cooling unit of the cooling module with a cooling device on the motherboard. The cooling module includes components to enable proper heat and fluid transfer.

Abstract: A reversible fuse support block includes a molding, a terminal, and a fuser interface. The molding may be installed within a housing in a first position and a second position, wherein the second position is rotated 180 degrees relative to the first position. The terminal couples to the molding and includes a plurality of apertures disposed in a pattern. The fuse interface receives a first end of a fuse. The fuse interface couples to the terminal in a first arrangement and a second arrangement such that when the fuse interface is installed in the first arrangement and the molding is installed in the first position, the fuse interface is disposed in substantially the same position relative to a corresponding fuse interface on a fuse support block as when the fuse interface is installed in the second arrangement and the molding is installed in the second position.

Abstract: An equipment enclosure (1) for electromagnetically isolating an electronic device, the equipment enclosure 1 comprising a conductive housing (3) and a plurality of conductive sheets (5). Each sheet (5) includes an aperture (7). The sheets (5) are stacked in a spaced-apart relationship within the housing (3) thereby defining a plurality of electromagnetically-isolated cavities (9) each within a respective Faraday cage formed by the conductive housing (3) and the conductive sheets (5). The apertures (7) form a channel (11) that extends through the enclosure (1) providing a route for connections between the cavities (9).

Abstract: A system and method for cooling an electronic datacenter component using a two-phase thermal management system with dynamic thermoelectric regulation. The system includes a thermoelectric cooler to transfer heat to a hot conduit of the thermal management system and initialize or maintain a natural convective flow of working fluid by maintaining a temperature difference between a hot and cold conduit.

Abstract: A busbar connector includes an insulator body, a positive power delivery contact, a negative power delivery contact, and a side band contact. The insulator body has first prong and a second prong oriented in a longitudinal direction and proximate one another with a gap therebetween. The positive power delivery contact is on a first inner surface of the first prong adjacent the gap, and the negative power delivery contact is on a second inner surface of the second prong adjacent the gap. The side band contact is positioned on the insulator body and insulated from the positive power delivery contact and the negative power delivery contact by the insulator body.

Abstract: In one embodiment, an apparatus is provided. The apparatus includes a printed circuit board. The apparatus also includes a first connector coupled to the printed circuit board. The first connector is configured to couple the apparatus to a computing device. The apparatus further includes a second connector coupled to the printed circuit board. The second connector is configured to couple the apparatus to a data storage device. The apparatus further includes a securement mechanism comprising a first portion and a second portion. The securement mechanism is movable about the apparatus between a first position and a second position. The first portion is configured to maintain the securement mechanism at the first position. The second portion is configured to secure the data storage device to the apparatus when the securement mechanism is in the first position.

Abstract: An electronic device is provided. The electronic device includes a housing, a printed circuit board disposed inside the housing and including a first face and a second face that faces away from the first face, a connection member disposed on the first face and electrically connected to the printed circuit board, a switch member disposed on the first face and at least partially overlaps the connection member when viewed from above the first face, and a button member including an electrically conductive member, and disposed to be capable of operating the switch member. The electrically conductive member is electrically connected to the connection member.

Abstract: A zero-power plasmonic microelectromechanical system (MEMS) device is capable of specifically sensing electromagnetic radiation and performing signal processing operations. Such devices are highly sensitive relays that consume no more than 10 nW of power, utilizing the energy in detected electromagnetic radiation to detect and discriminate a target without the need of any additional power source. The devices can continuously monitor an environment and wake up an electronic circuit upon detection of a specific trigger signature of electromagnetic radiation, such as vehicular exhaust, gunfire, an explosion, a fire, a human or animal, and a variety of sources of radiation from the ultraviolet to visible light, to infrared, to terahertz radiation.

Abstract: A microprocessor heat sink fastener assembly, comprising a base to couple to a heat sink a retention nut to be received by a cavity of the base, and a retention clip to be attached to the base and to be cantilevered therefrom. The retention clip is to engage with a latching structure extending from a latching structure of a retention plate.

Abstract: A fusible switch disconnect device includes a housing adapted to receive at least one fuse therein, and a switchable contact for connecting the fuse to circuitry. A tripping mechanism and control circuitry are provided to move the switchable contact to an open position in response to a predetermined electrical condition.