Patents Examined by Andargie M Aychillhum
  • Patent number: 10884300
    Abstract: A display device is provided. The display device includes a display panel including a plurality of pixels, at least one flexible circuit board connected to one side of the display panel and including a first portion and a second portion around the first portion, a source driving chip on the first portion, and a plurality of adhesion patterns on the second portion and extending in a set or predetermined direction.
    Type: Grant
    Filed: May 3, 2019
    Date of Patent: January 5, 2021
    Assignee: Samsung Display Co., Ltd.
    Inventors: Sang-youn Kim, Yeunmo Yeon, Jaenam Moon, Seyoung Oh, Jinsung Choi
  • Patent number: 10888002
    Abstract: A component carrier includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, at least one first electrically conductive track extending from a vertical level defined by one of the layer structures up to a first height, at least one second electrically conductive track extending from the vertical level defined by the one of the layer structures up to a second height being larger than the first height, and at least one further electrically insulating layer structure in which the at least one first electrically conductive track and the at least one second electrically conductive track are embedded.
    Type: Grant
    Filed: March 28, 2019
    Date of Patent: January 5, 2021
    Assignee: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
    Inventor: Roland Wilfing
  • Patent number: 10887980
    Abstract: A coupled via structure includes a plate via penetrating through an board body and having first and second plates spaced apart from each other by a first gap distance, a contact pad connected to the plate via on a surface of the board body and having first and second contacts connected to the first and second plates, respectively, and a connection line connected to the contact pad on the surface of the board body and having first and second lines connected to the first and second contacts, respectively, and spaced apart from the first line by a second gap distance. Accordingly, the deviation of the characteristic impedance is reduced (or, alternatively, minimized) between the coupled via structure and the coupled signal line.
    Type: Grant
    Filed: February 11, 2020
    Date of Patent: January 5, 2021
    Assignees: SAMSUNG ELECTRONICS CO., LTD., RESEARCH & BUSINESS FOUNDATION SUNKYUNKWAN UNIVERSITY
    Inventors: Dong-Yoon Seo, Jea-Eun Lee, WanSoo Nah
  • Patent number: 10888001
    Abstract: A circuit carrier board structure includes a first substrate, a second substrate, an adhesive layer, and a plurality of contact pads. The first substrate includes a first surface and a second surface, and also includes a plurality of first build-up layers sequentially stacked. The first build-up layers include a first dielectric layer and a first circuit layer. The second substrate includes a third surface and a fourth surface, and also includes a plurality of second build-up layers sequentially stacked. The second build-up layers include a second dielectric layer and a second circuit layer. The second surface is combined to the third surface. The connection pads are on the first surface and electrically connected to the first circuit layer. The first substrate is electrically connected to the second substrate. A manufacturing method of the circuit carrier board structure is also provided.
    Type: Grant
    Filed: January 10, 2019
    Date of Patent: January 5, 2021
    Assignee: Unimicron Technology Corp.
    Inventors: Wei-Ti Lin, Chun-Hsien Chien, Chien-Chou Chen, Fu-Yang Chen, Ra-Min Tain
  • Patent number: 10877615
    Abstract: A circuit panel of an electronic device is disclosed. The circuit panel includes a substantially flat surface including an active area of the electronic device; a bent border area contiguous with and extending from the active area of the substantially flat surface; and a plurality of traces coupled to the active area and routed in the bent border area.
    Type: Grant
    Filed: November 6, 2019
    Date of Patent: December 29, 2020
    Assignee: Apple Inc.
    Inventor: Steven J. Martisauskas
  • Patent number: 10877328
    Abstract: According to one embodiment, a display device includes a display panel, a case including a bottom plate and a side plate provided on the bottom plate and attached to the display panel, and a flexible wring board including a first end joined to the display panel and extending from the display panel toward the bottom plate while being curved around the side plate. The flexible wring board includes a substrate, a conductive layer on a first surface of the substrate and constituting wires, and a protective layer overlaid on the conductive layer and the substrate and opposed to an outer surface of the case. The flexible wring board includes a curved portion curved along the side plate, and the substrate includes a concavity provided in the curved portion.
    Type: Grant
    Filed: February 7, 2019
    Date of Patent: December 29, 2020
    Assignee: Japan Display Inc.
    Inventors: Koji Hiramoto, Ken Sugiyama, Kosuke Matsubara, Tomoya Tezen
  • Patent number: 10873145
    Abstract: Aspects of the embodiments are directed to a printed circuit board (PCB) that includes a conductive layer extending from the printed circuit board to act as a heat sink for circuit components electrically and mechanically attached to the PCB. The conductive layer can be a copper ground layer of a multi-layered PCB. The PCB can include one or more circuit components, such as dynamic random access memory elements. In embodiments, the PCB is part of a dual inline memory module. The conductive layer can be fashioned such that it extends out from the PCB and returns over the circuit elements to define an air gap between the conductive layer and the surface of the PCB and/or the surface of the circuit elements. In embodiments, a connection adaptor can be used to accommodate various PCB thicknesses so that the PCB can be electrically connected to an edge connector.
    Type: Grant
    Filed: December 29, 2016
    Date of Patent: December 22, 2020
    Assignee: Intel Corporation
    Inventors: Guoliang Ying, Na Chen, Liguang Du
  • Patent number: 10856637
    Abstract: A touch device usable for a hair dressing apparatus is disclosed. The touch device includes a touch sensing shell, an FPC (Flexible Printed Circuit) board and a PCB (Printed Circuit Board), wherein the touch sensing shell is mounted on the surface of the hairdressing apparatus. The FPC board is attached to the touch sensing shell and mounted between the touch sensing shell and the hairdressing apparatus. The PCB is connected with the FPC circuit board by use of a lead and mounted inside the hairdressing apparatus. The touch sensing shell is capable of sensing actions provided by the fingers of a user and preventing the FPC board from having direct contact with the user, A touch sensing region and a functional control unit are arranged on the FPC board and connected with a central processing unit.
    Type: Grant
    Filed: October 14, 2016
    Date of Patent: December 8, 2020
    Inventors: Xiao Yong, Liu Jin
  • Patent number: 10856410
    Abstract: A stretchable structure comprises or is configured to receive a conductive path and an interface region. The interface region comprises a peripheral line comprising at least one inwardly curved portion, such as an “inverted teardrop” or a fjord like recess pointing essentially towards the center area of the interface region. The interface region is arranged to receive said stretchable conductive path via said inwardly curved portion of said peripheral line of said interface region. In this way the interface region minimizes strains or other twisting or stretching forces directed to the conductor entering into the opening of the inwardly curved portion of the interface region.
    Type: Grant
    Filed: September 25, 2017
    Date of Patent: December 1, 2020
    Assignee: Tampere University Foundation sr
    Inventors: Pekka Iso-Ketola, Jukka Vanhala, Matti Mäntysalo
  • Patent number: 10840625
    Abstract: An avionics power management panel and power panel controller assembly where the panel includes a cabinet including a set of walls at least partially defining an interior with a printed circuit board. The power panel controller assembly can be provided in the interior and can include a chassis housing one or more power panel control modules adapted to couple to the printed circuit board via one or more complementary PCB connectors.
    Type: Grant
    Filed: May 23, 2018
    Date of Patent: November 17, 2020
    Assignee: GE Aviation Systems Limited
    Inventors: Christopher Andrew Leivers, John Michael Brett
  • Patent number: 10842029
    Abstract: An electronic device includes a circuit board and an electronic element. The circuit board includes a plate body and multiple through holes extending through the plate body. Each of the through holes has a first diameter. The electronic element includes multiple pins, each of which is inserted into a respective one of the through holes, is secured to the circuit board by a soldering process, and has a second diameter smaller than the first diameter of the respective one of the through holes. For each of the pins, a difference between the second diameter of the pin and the first diameter of the respective one of the through holes ranges from 0.4 mm to 0.6 mm. A method for manufacturing the electronic device is also provided.
    Type: Grant
    Filed: September 3, 2019
    Date of Patent: November 17, 2020
    Assignee: Jabil Circuit (Guangzhou) Ltd.
    Inventors: Jiangang Tan, Jingmin Liang
  • Patent number: 10831235
    Abstract: Provided is an electronic device that suppresses an increase in internal pressure while suppressing entry of a foreign material. An electronic module according to the present embodiment has an electronic device, a substrate, a frame, and a cover, a hole portion having a first opening in a first main surface and a second opening in a second main surface and communicating the internal space and the external space, and a component is disposed to face the second opening.
    Type: Grant
    Filed: March 19, 2019
    Date of Patent: November 10, 2020
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Yu Katase, Tadashi Kosaka, Koichi Shimizu, Shuichi Chiba, Kazuya Notsu, Hisatane Komori, Satoru Hamasaki, Ikuto Kimura
  • Patent number: 10827626
    Abstract: A method of manufacturing a printed circuit board assembly includes providing a circuit board, positioning a plurality of components including at least one thermally-sensitive component having a maximum temperature threshold on the circuit board, positioning a customized protective heat shield on the thermally-sensitive component, exposing the circuit board (having the thermally-sensitive component disposed thereon and the customized protective heat shield disposed on the thermally-sensitive component) to a high-temperature environment wherein temperatures exceed the maximum temperature threshold of the thermally-sensitive component, and removing the customized protective heat shield from the thermally-sensitive component. Customized protective heat shields are also provided.
    Type: Grant
    Filed: November 8, 2017
    Date of Patent: November 3, 2020
    Assignee: FLEX LTD
    Inventors: Zohair Mehkri, Anwar Mohammed, Jesus Tan, David Geiger, Murad Kurwa
  • Patent number: 10817025
    Abstract: A narrow-bezel display module includes a display panel, a drive chip, and a flexible printed circuit board. The display panel includes a glass substrate and a TFT substrate. The glass substrate includes a bottom border. The drive chip is attached on the bottom border of the glass substrate. The drive chip includes an output end and an input end arranged opposite to each other and two side surfaces. The input end is connected to a first metal layer of the TFT substrate. The output end is connected to a second metal layer of the TFT substrate. The flexible printed circuit board includes conductive leads and a first connection portion and a second connection portion extended from one side of the conductive leads. The first connection portion and the second connection portion are connected to the input end from the two side surfaces respectively.
    Type: Grant
    Filed: March 6, 2019
    Date of Patent: October 27, 2020
    Inventors: Yantao Lu, Xin Zhang
  • Patent number: 10820422
    Abstract: A display device includes: a substrate including a first indented portion indented inward along one side of the substrate; a first pad group and a second pad group that are spaced apart from each other on the substrate along the one side; a display unit located on the substrate and having a shape indented inward between the first pad group and the second pad group; an encapsulation layer encapsulating the display unit; a first wiring film including a third pad group connected to the first pad group; and a second wiring film including a fourth pad group connected to the second pad group. The first wiring film and the second wiring film are bent from a first surface of the substrate to a second surface of the substrate that is opposite to the first surface of the substrate, and the second wiring film is spaced apart from the first wiring film.
    Type: Grant
    Filed: September 5, 2019
    Date of Patent: October 27, 2020
    Assignee: Samsung Display Co., Ltd.
    Inventors: Minjun Jang, Sunghoon Kim
  • Patent number: 10820417
    Abstract: A display apparatus includes a display panel bendable in a bending direction about a bending axis, pad units disposed on one side of the display panel and arranged in the bendable direction, printed circuit boards disposed below the display panel, and flexible printed circuit boards configured to connect the display panel to the printed circuit boards. The printed circuit boards are bendable in the bending direction about the bending axis, are arranged in the bendable direction, and extend in the bendable direction. Each of the flexible printed circuit boards has a first end connected to the display panel and a second end connected to one of the printed circuit boards. A second distance between the second ends of two of the flexible printed circuit boards respectively connected to two adjacent printed circuit boards is greater than a first distance between the first ends of the two flexible printed circuit boards.
    Type: Grant
    Filed: July 5, 2019
    Date of Patent: October 27, 2020
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Jinhyuk Park, Toru Tsunekawa
  • Patent number: 10818568
    Abstract: A charger comprises a housing, a first multi-layer printed circuit board (PCB), a second multi-layer PCB, and a third multi-layer PCB. The first PCB comprises at least a portion of a primary side circuit. The second PCB comprises at least a portion of a secondary side circuit. The third PCB is perpendicular to the first PCB and the second PCB. An isolation coupling element is disposed on the third PCB. The isolation coupling element comprises a multi-layer PCB. The first PCB comprises a high voltage (HV) semiconductor package. A surface of a die paddle of the HV semiconductor package is exposed from a molding encapsulation of the HV semiconductor package.
    Type: Grant
    Filed: June 28, 2019
    Date of Patent: October 27, 2020
    Assignee: ALPHA AND OMEGA SEMICONDUCTOR (CAYMAN) LTD.
    Inventors: Pei-Lun Huang, Yu-Ming Chen, Tien-Chi Lin, Jung-Pei Cheng, Yueh-Ping Yu, Zhi-Qiang Niu, Xiaotian Zhang, Long-Ching Wang
  • Patent number: 10820420
    Abstract: In at least one illustrative embodiment, a printed circuit board may comprise at least one insulating layer, first and second conductive layers separated from one another by the at least one insulating layer, and a conductive via extending through the at least one insulating layer and electrically coupling the first and second conductive layers. The conductive via may include an annular via sidewall having an average radial thickness of at least 2.5 mils (0.0025 inches) and a conductive pad having an average thickness of no more than 3.2 mils (0.0032 inches).
    Type: Grant
    Filed: July 15, 2019
    Date of Patent: October 27, 2020
    Assignee: ABB POWER ELECTRONICS INC.
    Inventor: Robert Joseph Roessler
  • Patent number: 10804016
    Abstract: One object is to provide an electronic component in which a standoff for filling solder is maintained. An electronic component according to an embodiment of the present invention is configured to be surface-mountable on a circuit board. The electronic component includes: an insulating base member; an internal conductor provided in the base member; a first external electrode provided on the mounting surface of the base member so as to be electrically connected to the internal conductor; and a second external electrode provided on the mounting surface of the base member so as to be electrically connected to the internal conductor. The first external electrode has a first protrusion, and the second external electrode has a second protrusion. The first protrusion and the second protrusion enables a standoff for filling solder to be maintained within a region defined by the mounting surface of the base member and the circuit board.
    Type: Grant
    Filed: April 9, 2020
    Date of Patent: October 13, 2020
    Assignee: Taiyo Yuden Co., Ltd.
    Inventors: Takayuki Sekiguchi, Tsuyoshi Ogino, Takao Shibuya
  • Patent number: 10806034
    Abstract: A circuit assembly 1 includes a semiconductor switching element, a main substrate, a plurality of bus bars and a sub-substrate that are overlaid on the main substrate, and a jumper wire. The main substrate includes a first insulating substrate and a first conductive path. The sub-substrate includes a second insulating substrate and a second conductive path, and is overlaid on the main substrate and arranged in the same layer as the bus bars. The jumper wire connects the first conductive path with the second conductive path. A plurality of terminals of the semiconductor switching element include a drain terminal 42 and a source terminal that are connected to the bus bar and a gate terminal connected to the second conductive path. A noise reduction element is mounted on the sub-substrate.
    Type: Grant
    Filed: December 5, 2017
    Date of Patent: October 13, 2020
    Assignees: AutoNetworks Technologies Ltd., Sumitomo Wiring Systems, Ltd., Sumitomo Electric Industries, Ltd.
    Inventors: Yukinori Kita, Kyungwoo Kim