Abstract: The disclosure provides a display module and a wearable device. The display module includes a flexible display screen and a flexible printed circuit board. The flexible display screen includes a first side in a first direction and a second side in a second direction, the first side and the second side being each electrically connected to the flexible printed circuit board; and the flexible printed circuit board includes a first functional circuit and a second functional circuit, the first side being connected to the first functional circuit, and the second side being connected to the second functional circuit. The first direction is different from the second direction.

Abstract: A semiconductor package includes a VLSI semiconductor die and one or more output circuits connected to supply power to the die mounted to a package substrate. The output circuit(s), which include a transformer and rectification circuitry, provide current multiplication at an essentially fixed conversion ratio, K, in the semiconductor package, receiving AC power at a relatively high voltage and delivering DC power at a relatively low voltage to the die. The output circuits may be connected in series or parallel as needed. A driver circuit may be provided outside the semiconductor package for receiving power from a source and driving the transformer in the output circuit(s), preferably with sinusoidal currents. The driver circuit may drive a plurality of output circuits. The semiconductor package may require far fewer interface connections for supplying power to the die.

Abstract: A wiring base includes an insulation base having a first surface, a first differential-wiring channel, and a second differential-wiring channel. The first and the second differential-wiring channels are on the first surface and arranged side by side in a first direction. The first differential-wiring channel includes a pair of first signal conductors extending in a second direction intersecting the first direction and a pair of first grounding conductors extending along the first signal conductors with the first signal conductors being interposed therebetween. The second differential-wiring channel includes a pair of second signal conductors extending in the second direction and a pair of second grounding conductors extending along the second signal conductors with the second signal conductors being interposed therebetween.

Abstract: An electronic package is provided and includes an electronic element connected to a plurality of inductor circuits embedded in an insulator of a package substrate by fan-out conductive copper pillars, and at least one shielding layer non-electrically connected to the inductor circuits, where the shielding layer includes a plurality of line segments not connected to each other, such that the shielding layer shields the inductor circuits, thereby achieving the electrical requirements of high-current products while improving the inductance value and quality factor.

Abstract: The present disclosure describes a power module having a substrate, first and second pluralities of vertical power devices, and first and second terminal assemblies. The substrate has a top surface with a first trace and a second trace. The first plurality of vertical power devices and the second plurality of vertical power devices are electrically coupled to form part of a power circuit. The first plurality of vertical power devices is electrically and mechanically directly coupled between the first trace and a bottom of a first elongated bar of the first terminal assembly. The second plurality of vertical power devices are electrically and mechanically directly coupled between the second trace and a bottom of a second elongated bar of the second terminal assembly.

Abstract: A radio communication module is provided that includes a circuit board, a first radiation conductor, and an insulating resin. In the circuit board, a first main surface and a second main surface are included, and a second radiation conductor is provided on the second main surface of the circuit board. The first radiation conductor is flat and is provided near the first main surface. The insulating resin is provided near the first main surface side. The thickness of the first radiation conductor is larger than the thickness of the second radiation conductor.

Abstract: An electronic component (1) is connected to a conductive track (2) on a flexible substrate (3). A connection layer (4) of a composition comprising a thermoplastic material (TPM1) is provided on the conductive track (2). The connection layer (4) has at least one cutout (5) aligned to overlap the conductive track (2). A thermosetting material (TSM1) in liquid state is used to fill the cutout (5). The electronic component (1) is provided on top of the connection layer (4). By applying heat, a temperature of the connection layer (4) is raised to above a softening temperature of the thermoplastic material (TPM1). Pressure is applied to form a mechanical connection. By the application of heat (H) a temperature of the thermosetting material (TSM1) is raised above its thermosetting temperature for solidifying the thermosetting material (TSM1) and forming an electrical connection (E).

Abstract: Provided is a conformal electromagnetic interference (EMI) shielding film including a thermal-forming film layer and an electrically conductive film layer. The thermal-forming film layer is configured to conformally coat over one or more electronic components mounted on a substrate with application of heat. The electrically conductive film layer is formed on an opposite side of the thermal-forming film layer from the substrate and has a plurality of voids that are configured to deform during the application of heat and allow the electrically conductive film layer to conform together with the thermal-forming film layer.

Abstract: A circuit board and an electronic device, the circuit board includes a first wiring board including a first substrate and a first wiring layer disposed on a first side surface of the first substrate, and the first wiring layer includes a first ground wiring; the circuit board further includes a first protective layer and a first electromagnetic interference shielding layer sequentially stacked on a side of the first wiring layer away from the first substrate; the first protective layer has a first opening exposing at least a portion of a first ground wiring, the first opening is filled with a first conductive material, height difference between a surface of the first conductive material and a surface of the first protective layer away from the first substrate ranges from 0 to 2 microns, and the first conductive material connects the first electromagnetic interference shielding layer to the first grounding wiring.

Abstract: A control unit for a motor vehicle is provided. The control unit includes a printed circuit board having a first side and an edge. The first side is delimited by the edge. At least one electronic component is arranged on the first side of the printed circuit board and is electrically conductively connected to the printed circuit board. At least one first conductor loop is arranged on the first side of the printed circuit board and at least one second conductor loop is arranged at a distance from the first conductor loop. The first conductor loop is arranged between the edge and the second conductor loop, and the second conductor loop is arranged between the first conductor loop and the at least one electronic component. An encapsulation surrounds at least the first side, the at least one electronic component, the first conductor loop and the second conductor loop.

Abstract: A guiding device includes a first telescopic member, a second telescopic member, and an elastic member. The first telescopic member includes a main body with a sliding cavity. The second telescopic member includes a connecting portion and a guiding portion connected to the connecting portion. The guiding portion is slidably inserted into the sliding cavity. Opposite ends of the elastic member are respectively connected to the connecting portion and the main body. The elastic member pushes the main body in a direction away from the connecting portion. The disclosure also provides a mainboard connection structure having the above guiding device.

Abstract: A wiring board according to the present disclosure includes a core insulating layer, a first laminated body located on an upper surface of the core insulating layer, and a second laminated body located on a lower surface of the core insulating layer. Each of the first laminated body and the second laminated body has a structure in which at least four electrical conductor layers and at least three build-up insulating layers are alternately located. The electrical conductor layers include two types, that are a first electrical conductor layer and a second electrical conductor layer. In the electrical conductor layers in the first laminated body, at least a first outermost layer and a first innermost layer are the first electrical conductor layers, and a first intermediate layer located farther from the core insulating layer than the first innermost layer includes at least two or more of the second electrical conductor layers.

Abstract: An electronic device includes a first interposer, a first integrated circuit (IC) device affixed to the first interposer, a second interposer, and a second IC device affixed to the second interposer. he second interposer is bonded to the first interposer. The first interposer includes first interposer circuitry and a first connection element electrically connected to the first interposer circuitry. The second interposer includes second interposer circuitry and a second connection element electrically connected to the second interposer circuitry. The second connection element is bonded to the first connection element to define a connection element pair. The connection element pair provides an electrical connection between the first interposer circuitry and the second interposer circuitry.

Abstract: A component carrier includes a stack with at least one electrically conductive layer structure and a plurality of electrically insulating layer structure, a first component, a second component, a central core in which both the first component and the second component are embedded. A first electrically insulating structure encapsulates the first component. A second electrically insulating structure encapsulates the second component. The first component and the second component are electrically connected to an external electrically conductive structure through at least one electrically conductive contact passing through the first electrically insulating structure and/or the second electrically insulating structure.

Abstract: A display device and a manufacturing method thereof are provided. The display device includes a display panel (20) and a flexible circuit board electrically connected with the display panel (20). The flexible circuit board includes a first circuit board (11), a second circuit board (22) and a conductive portion; the first circuit board (11) includes a first substrate (100), and a main contact pad, a first wire (501) and a second wire (502) provided on the first substrate (100); the second circuit board (22) includes a second substrate (200), a relay contact pad and a third wire (210) provided on the second substrate (200); and the conductive portion is configured for electrically connecting the main contact pad and the relay contact pad.

Abstract: Disclosed are a display panel, a display device, and a terminal apparatus. The display panel comprises a display substrate having a backlight surface and a main flexible circuit board. The main flexible circuit board comprises a connection section, a fixed section and a test section. The connection section is arranged on the backlight surface, and has an outer peripheral surface comprising a first side and a second side opposite to each other. The fixed section is attached and fixed onto the backlight surface, and having one end connected to the first side and another end extending towards an end of the first side away from the second side. The test section has one end connected to the first side, and another end comprising a connection port.

Abstract: A flexible electronic device is provided in this disclosure. The flexible electronic device includes a base layer, an electronic unit, and a cover layer. The electronic unit is disposed on the base layer, and the cover layer is disposed on the electronic unit. The base layer has a thickness T1 and a Young's modulus E1, and the cover layer has a thickness T2 and a Young's modulus E2, wherein the thickness T1, the thickness T2, the Young's modulus E1, and the Young's modulus E2 comply with following expression: E2/E1?156.21×(T2/T1)?4.28.

Abstract: A power connector assembly transferring power between a supply connector assembly and a tap connector assembly includes a front interface module mated with the supply connector assembly and a rear interface module mounted to a host circuit board. The power connector assembly includes a power tap module between the front interface module and the rear interface module having power tap contacts each electrically connected to corresponding front and rear power contacts. Each power tap contact includes a tap interface exterior of the front housing and exterior of the rear housing configured to be terminated to the tap connector assembly. The power tap contact electrically connecting the front power contact and the tap connector assembly to transfer power from the supply connector assembly to the tap connector assembly.

Abstract: A wearable product includes a display system, a rear housing, a middle frame, a printed circuit board, and a conductive component. The rear housing is located on a non-light-emitting side of the display system. The middle frame is located between the display system and the rear housing, and is a hollow frame structure. The middle frame includes a metal frame and a plastic frame nested in the metal frame and connected to the metal frame. The plastic frame is connected to the display system and the rear housing in a sealing manner to form an accommodation cavity. The printed circuit board is located in the accommodation cavity. A part of the conductive component is located in the accommodation cavity and electrically connected to the printed circuit board, and the other part of the conductive component passes through the plastic frame to be electrically connected to the metal frame.

Abstract: A power semiconductor system includes: a power stage module having one or more power transistor dies attached to or embedded in a first printed circuit board; and an inductor module attached to the power stage module and having an inductor electrically connected to an output node of the power stage module. The inductor includes windings patterned into a second printed circuit board of the inductor module.