Abstract: A stacked capacitor includes a dielectric member, a plurality of internal electrodes, and a plurality of extraction electrodes. The dielectric member is a stacked member formed of a plurality of sheet-like stacked dielectric layers and has at least one side surface. The internal electrodes fit within the surface area of the dielectric layers and are stacked alternately with the dielectric layers. Further, the internal electrodes have first edges positioned near the side surface. Each extraction electrode has an overlapping portion A overlapping another extraction electrode at the side surface in a direction orthogonal to the mounting direction.

Abstract: A capacitor includes a dielectric layer, a manganese dioxide layer, an organic solid electrolyte layer, and a carbon paste layer that are stacked in this order between a first electrode, which serves as an anode, and a second electrode, which serves as a cathode. Between the first electrode and the second electrode, an insulating resin layer is formed in the shape of a rectangular frame so as to surround the organic solid electrolyte layer. A lower end portion of the resin layer is fixed to the manganese dioxide layer while an upper end portion of the resin layer is fixed to the second electrode 16. Therefore, complete sealing is established between the first electrode and the second electrode in the outer peripheral end face of the capacitor.

Abstract: A multilayer capacitor includes: a dielectric element; a pair of first internal conductors with same polarity disposed in the dielectric element to be adjacent to each other while being separated from each other by the dielectric layer; first leadout portions led out from the pair of first internal conductors respectively, one being provided for each of the first internal conductors; a pair of second internal conductors with same polarity disposed in the dielectric element to be adjacent to each other while being separated from each other by the dielectric layer; and second leadout portions led out from the pair of second internal conductors respectively, one being provided for each of the second internal conductors, wherein the first leadout portion and the second leadout portion led out respectively from the first internal conductor and the second internal conductor disposed adjacent to each other are led out to substantially the same positions in side faces facing each other of the dielectric element, resp

Abstract: A high voltage sign ballast capacitor assembly is disclosed. The assembly includes two components for the sign ballast operation, namely a main capacitor element for power factor correction and up to six starting capacitors for aiding in starting under cold weather conditions. The main capacitor element is arranged and configured to divide the necessary capacitance into several capacitors connected in series. By doing so, the voltage is divided across each of the series capacitors resulting in reduced voltage stress and a reduction in the risk of corona arcing. The assembly is preferably constructed as a modular printed circuit board and a sleeve that houses the circuit board. The circuit board allows for the incorporation of multiple lead configurations, multiple start capacitors, and bleed resistors.

Abstract: Internal electrodes A1 to D1 and A2 to D2 are laid in layers at spaces in the direction of thickness of a ceramic body 1. Lead electrodes a1 to d1 and a2 to d2 are led out to a side face to form lead portions. Dummy electrodes 51 to 58 have one-side ends led out to a side face to form lead portions in layers provided with the internal electrodes A1 to D1 and A2 to D2. The lead portion of a lead electrode a1 to d1 or a2 to d2 of each layer is superposed over the lead portion of a dummy electrode 51 to 58 belonging to another layer in the direction of thickness.

Abstract: An ultracapacitor formed on a semiconductor substrate includes a plurality conductive layers with intervening dielectric layers. These layers form a plurality of capacitors which may be connected in parallel to store a charge for powering an electronic circuit or for performing a variety of integrated circuit applications. A plurality of ultracapacitors of this type may be connected in series or may be designed in stacked configuration for attaining a specific charge distribution profile.

Abstract: A sensor with a carrier board which is arranged in a housing is at least partly produced by an injection molding process and fitted with electronic, optical, electromechanical and/or opto-electronic components. A region of the carrier board and at least some of the components disposed thereon are arranged in a hollow space formed inside the at least partly injection molded housing.

Abstract: A feedthrough device includes a conductive ferrule having an outer peripheral surface defining the outermost boundary of the feedthrough device, an insulator, a lead wire electrically isolated from the ferrule extending through the insulator, a filter capacitor adjacent the insulator through which the lead wire extends in conductive relation therewith, and a ground wire coupled to the ferrule and to the insulator within the outermost boundary of the feedthrough device. The ferrule has an inner peripheral surface defining an opening therethrough and each of the insulator and the filter capacitor has an outer peripheral surface proximate the inner peripheral surface, a counterbore in the outer peripheral surface of each of the insulator and filter capacitor, an end of the ground wire being received in the counterbore and brazed to the ferrule and insulator. Alternatively, an end of the ground wire is welded to the inner peripheral surface of the ferrule.

Abstract: A multilayer ceramic capacitor having an internal electrode layer and a dielectric layer having a thickness of less than 2 ?m is provided, wherein the dielectric layer contains a plurality of dielectric particles, and when it is assumed that standard deviation of a particle distribution of the entire dielectric particles in the dielectric layer is ? (no unit), an average particle diameter of the entire dielectric particles in the dielectric layer is D50 (unit: ?m), and a rate that dielectric particles (coarse particles) having an average particle diameter of 2.25 times of the D50 exist in the entire dielectric particles is p (unit: %), the ? and p satisfy ?<0.130 and p<12%; by which a TC bias characteristic can be expected to be improved while maintaining various electric characteristics, particularly a sufficient permittivity, even when the interlayer dielectric layer is made thin.

Abstract: The present invention relates to a solid electrolytic capacitor having a masking structure in which the insulation between the anode part and the cathode part can be ensured without fail, to its production method, to a method for coating a masking agent on a solid electrolytic capacitor substrate, and to apparatus therefore. According to the present invention, the masking material covers the dielectric film on the metal material having valve action and sufficiently infiltrates into the core metal made of a metal having valve action while the solid electrolyte is masked by the masking material without fail, so that a solid electrolytic capacitor can be produced that has a reduced leakage current and a reduced stress generated at the reflow treatment or the like.

Abstract: A multilayer ceramic capacitor having internal electrode layers and dielectric layers, wherein a thickness of said dielectric layer is 2.0 ?m or less, and an average particle number per one dielectric layer obtained by dividing the thickness of said dielectric layer by an average particle diameter of dielectric particles composing said dielectric layer is 3 or more and 6 or less.

Abstract: An energy conditioning structure comprised of any combination of multilayer or monolithic energy conditioners with operable conductors, all selectively arranged and shielded for attachment to at least a conductive substrate.

Abstract: A MEMS tunable capacitor and method of fabricating the same, includes a plurality of fixed charge plates on a substrate, the plurality of fixed charge plates having a same height, being arranged in a shape of comb-teeth and being electrically connected to one another, a capacitor dielectric layer covering the plurality of fixed charge plates, a movable charge plate structure spaced apart from the capacitor dielectric layer, and arranged on the plurality of fixed charge plates, wherein the movable charge plate structure includes a plurality of movable charge plates arranged corresponding the plurality of fixed charge plates, and an actuator connected to the movable charge plate structure allowing the movable charge plate structure to move in a horizontal direction.

Abstract: A solid electrolytic capacitor is provided with: an anode employing tantalum; a dielectric layer formed on said anode; and a cathode layer formed on said dielectric layer. The dielectric layer contains tantalum oxide and fluorine.

Abstract: A fixing and protecting arrangement for a capacitor may include a cooling element, one or more recesses arranged in the cooling element, and a capacitor intended to be fixed into each recess. The capacitor may be arranged in the recess in such a way that a lower surface of the capacitor is in contact with the cooling element for transferring heat from the capacitor to the cooling element.

Abstract: An electrode assembly in embodiments of the invention can include a unitary member formed from an electrically conductive material having a central portion, and tab and plate portions extending radially outward from the central portion. The unitary member can be folded to configure the plate portions in a stacked configuration, thereby providing an electrically connected support structure for a cathode and/or anode assembly without individual connections/welds of plates to a common connection. The elimination of multiple welds lowers the internal resistance of the electrode assembly, and improves the structural integrity. Embodiments of the invention include batteries and implantable medical devices (IMDs) which incorporate the design flexibility in the shape and contour of the electrode assembly and hence, the overall shape and design of batteries and IMDs.

Abstract: An insulative shield is co-bonded to the top of a ceramic capacitor in a feedthrough terminal assembly on an active implantable medical device. The insulative shield is a thin substrate that provides protection against damage and degradation of the feedthrough capacitor and/or its conformal coating from heat, splatter or debris resulting from the electromechanical connection of components during construction of the assembly. Laser welding, thermal or ultrasonic bonding, soldering, brazing or related lead attachment techniques can create such heat, splatter or debris. In a preferred embodiment, the insulative shield is co-bonded using the capacitor's own conformal coating.

Abstract: A structure and method for manufacturing multi-electrode capacitor within a PCB is used to form a multi-electrode capacitor with a plurality of metal laminates coupled each other and employing the characteristics of the edge-coupled effect therein. the present invention can provide efficient capacitance from the capacitor with the smallest area. The present invention is applied to promote the capability of noise-restraint of the capacitive substrate in a high-frequency/speed system, and further achieves the purpose of regular circuit design with the smallest area in the future development.

Abstract: The invention provides an electric double layer capacitor which has a container made from a resin in a substantially rectangular parallelepipedal form by joining a first container half segment and a second container half segment each in the form of a box. The second container segment is provided at one end thereof with an extension extending along an outer side surface of the first container segment to the bottom outer surface thereof. A first lead member has a portion closer to one end thereof, embedded in the first container segment, the first lead member portion, bent as embedded in the first container segment and led out of the container to outside thereof. A second lead member has a portion closer to one end thereof, embedded in the second container segment, bent as embedded in the second container segment and extending through the extension to outside of the container.

Abstract: Extending high k material of a second dielectric layer to surround at least one thru-via designed to provide a signal other than a power signal to a die may eliminate discrete AC coupling capacitors to reduce cost and improve performance of the package.