Patents Examined by Anthony Ojini
  • Patent number: 7314402
    Abstract: A method and apparatus for ‘through-the-pad’ delivery of slurry polishing agents directly to the land areas of a polishing pad is disclosed. The present invention further provides for improved control of the chemical composition of the slurry to address loss of chemical reactivity of the slurry during the polishing cycle. Additionally, various groove modifications to the polishing surface of the pad are also disclosed for improved slurry retention over substantially the entire surface of the polishing pad and reduction of the slow band effect. The present invention thus provides for a higher degree of planarization and uniformity of material removed from the surface of a processed workpiece in order to eliminate, or otherwise reduce, small-scale roughness and large-scale topographic differentials as well as to reduce the Cost-of-Ownership associated with slurry costs.
    Type: Grant
    Filed: November 15, 2001
    Date of Patent: January 1, 2008
    Assignee: SpeedFam-IPEC Corporation
    Inventors: Thomas Laursen, Guangying Zhang
  • Patent number: 7313986
    Abstract: An apparatus for rotating a tubular with respect to a drill bit, e.g., for making or breaking a connection between a tubular and a drill bit, the apparatus, in at least certain aspects including a frame, gripper apparatus connected to the frame for gripping and rotating a primary tubular, and a torquing frame with plate apparatus for holding the drill bit.
    Type: Grant
    Filed: March 10, 2007
    Date of Patent: January 1, 2008
    Assignee: Varco I/P, Inc.
    Inventors: Neil Edward West, Preston R. Fox
  • Patent number: 7313988
    Abstract: A tool for removal of inner tie rods having a generally cylindrical end includes a hollow tube with a butt plate at one end and an annular collar at the opposite end for attachment to the tie rod by means of three set screws arranged within an angular range of approximately 90°, wherein the tool collar is designed to provide for ease of assembly of the tool by joining the tube to the annular collar.
    Type: Grant
    Filed: April 20, 2006
    Date of Patent: January 1, 2008
    Assignee: Lisle Corporation
    Inventors: Danny L. Williams, Eduardo Llamas Montes
  • Patent number: 7311129
    Abstract: A portable universal apparatus for seating a bead of a wide range of tire sizes onto a rim. An upright support frame includes a rim support surface and a rim retainer for securing the rim in a generally horizontal position atop the rim support surface. A tubular air ring includes an air inlet port connectable to an air tank and is vertically adjustably supportable on the support frame. A plurality of inwardly oriented air discharge tubes connectable to the air ring and selectable from different sets of lengths thereof cooperate with the vertical adjustability of the air ring to position the distal end of each of discharge tube in close proximity between a lower rim seal and a lower sealing bead of the tire to force the lower sealing downwardly into sealing engagement with the lower rim seal when compressed air is released from the air tank into the air ring and air discharge tubes.
    Type: Grant
    Filed: April 10, 2007
    Date of Patent: December 25, 2007
    Inventor: William D White
  • Patent number: 7311100
    Abstract: The invention relates to a tool, in particular an abrasive cutting-off machine (1), having a cutting tool (7) and a protective hood (8), partly covering the cutting tool (7) and [lacuna] in its relative position to the cutting tool (7), and an adjusting handle arranged on the outside of the protective hood (8), by which the position of the protective hood (8) can be adjusted by the user, and an injection device for water, which is arranged on the protective hood (8) and directed towards the cutting tool (7) and by which flying dust and chips arising during the cutting operation can be averted, the injection device and the adjusting handle being comprised by an injection and adjusting handle (6).
    Type: Grant
    Filed: November 3, 2006
    Date of Patent: December 25, 2007
    Inventor: Knut Siewers
  • Patent number: 7300338
    Abstract: A method of making and the resulting non-metallic CMP conditioning pad comprising a non-metallic substrate and a single layer of abrasive particles bonded to the substrate by a non-metallic bonding medium. Preferred substrates include aluminum oxide and graphite. A bonding system employing finely powdered aluminum oxide particles mixed with a suitable adhesive is employed to bond the abrasive layer to the aluminum oxide substrate. Silicon carbide particles mixed into a compatible adhesive carrier including a polymer composition is preferred for bonding the abrasive particle layer to a graphite or carbide substrate.
    Type: Grant
    Filed: August 23, 2006
    Date of Patent: November 27, 2007
    Assignee: Abrasive Technology, Inc.
    Inventors: Roy F. Wielonski, Loyal M. Peterman, Jr.
  • Patent number: 7294047
    Abstract: A sander device includes a housing pivotally attached to a supporting base and rotatable between a horizontal position and a vertical position, a driven roller and an idle roller rotatably disposed in the housing, and an endless driving belt engaged over the driven roller and the idle roller and also rotatable between the horizontal position and the vertical position together with the housing, a table is used for supporting the work piece, and a moving device may support and move the table and the work piece to the sanding belt when the driving belt is located at either the horizontal position or the vertical position. An actuating device is attached the housing for selectively forcing the driving belt to sand the work piece.
    Type: Grant
    Filed: October 31, 2006
    Date of Patent: November 13, 2007
    Inventor: Kun Yi Lin
  • Patent number: 7294041
    Abstract: Disclosed herein is a moving head for a semiconductor wafer polishing apparatus. The semiconductor wafer polishing apparatus has a table on which a polishing pad is formed, and the moving head mounted via a support unit to hold a wafer relative to a polishing surface of the table. In this case, the moving head includes a sensing means having a load cell and a piezoelectric sensor to measure pressing force and frictional force acting on the wafer provided in the moving head. The present invention relates to the polishing of a semiconductor wafer material from which an integrated circuit is made.
    Type: Grant
    Filed: September 15, 2006
    Date of Patent: November 13, 2007
    Assignee: Inha-Industry Partnership Institute
    Inventors: Eun Sang Lee, Jong Goo Won, Jung Talk Lee
  • Patent number: 7281536
    Abstract: A cutting apparatus that positions a wire saw driving device movably and appropriately at the desired site by freely moving an arm of a backhoe provided with a boom, which arm carries the wire saw driving device and is turnable and movable in upward, downward, leftward, rightward, forward, and backward directions, thus enabling cutting at sites too narrow in which to use a conventional machine. Cutting by use of a wire saw and by use of a disk blade can be alternately performed as needed.
    Type: Grant
    Filed: March 29, 2006
    Date of Patent: October 16, 2007
    Assignee: Shibushou Construction Co., Ltd.
    Inventor: Shouichi Shibuya
  • Patent number: 7275979
    Abstract: An apparatus for treating edge surfaces of panels, comprises conveyor tables to displace panels in sequence, two of the conveyor tables being configured such that panels are sequentially displaced in longitudinal alignment between the two conveyor tables with a longitudinal edge first. Two other of the conveyor tables are configured such that panels are sequentially displaced in lateral alignment between the two other conveyor tables with a lateral edge first. A first tool is positioned between the two conveyor tables. A second tool is positioned between the two other conveyor tables.
    Type: Grant
    Filed: October 24, 2006
    Date of Patent: October 2, 2007
    Assignee: Bromer Inc.
    Inventor: Roger Raynauld
  • Patent number: 7273407
    Abstract: The present invention relates to a polishing pad useful for planarizing a substrate in a CMP process using a polishing composition. The polishing pad is transparent and allows for the use of an in-situ optical end-point detection apparatus without the need for a separate aperture or window in the polishing pad.
    Type: Grant
    Filed: July 27, 2006
    Date of Patent: September 25, 2007
    Assignee: Rohm and Haas Electronic Materials CMP Holdings, Inc.
    Inventor: Alan H. Saikin
  • Patent number: 7263776
    Abstract: A fruit seed removing device includes a body, a sleeve, a button, a positioning block, a toggle, a pull rod, a connecting block and a knife. By pulling a hand of a pull rod, the pull rod will drive the knife to move inwards or expand outwards. Then the button is rotate through an angle to drive the positioning block to rotate. Then the pull rod is tightened and positioned. Therefore, the size of a ring for removing seeds is set. The adjustment of the size of the ring can be performed quickly and easily according to the range of the seeds in a fruit. Thereby no pulp will adhere to the user's hand. The operation is retained in clean state and can be performed easily and conveniently.
    Type: Grant
    Filed: May 1, 2006
    Date of Patent: September 4, 2007
    Assignee: Hausco Enterprises Co., Ltd.
    Inventor: Jaw-Chyi Shieh
  • Patent number: 7264537
    Abstract: Methods are provided for monitoring a CMP process. An exemplary method comprises generating a plurality of thickness measurements of a metal layer using an in-situ eddy current measuring system. The thickness measurements are analyzed to derive a plurality of work piece metrics and the work piece metrics are assessed to determine if a predetermined number is within a predetermined specification. A signal is generated if the predetermined number of the work piece metrics is outside the predetermined specification.
    Type: Grant
    Filed: August 4, 2006
    Date of Patent: September 4, 2007
    Assignee: Novellus Systems, Inc.
    Inventors: Thomas Laursen, Karl Kasprzyk, Steven Reynolds, Paul Franzen, Justin Quarantello
  • Patent number: 7258115
    Abstract: A skid plate for a concrete saw is integrally cast having two end mounting portions and a middle portion with a slot in the middle portion. A horizontal slot in a leading end mounting portion cooperates and a vertical slot in the trailing end portion releasably engage pins on the saw to allow the skid plate to be easily fastened to and removed from the saw. A spring loaded latch mechanism holds the pins in the slots. A replaceable insert is press fit or otherwise held in the skid plate, with the insert replacing portions of the skid plate adjacent an up-cutting edge of the cutting blade.
    Type: Grant
    Filed: June 8, 2006
    Date of Patent: August 21, 2007
    Assignee: Soff-Cut International, Inc.
    Inventors: Charles E. Markley, Deo M. Magakat
  • Patent number: 7255630
    Abstract: Carrier assemblies, polishing machines with carrier assemblies, and methods for mechanical and/or chemical-mechanical polishing of micro-device workpieces are disclosed herein. In one embodiment, a carrier assembly includes a head having a chamber, a magnetic field source carried by the head, and a magnetic fluid in the chamber. The magnetic field source is configured to generate a magnetic field in the head. The magnetic fluid changes viscosity within the chamber under the influence of the magnetic field to exert a force against at least a portion of the micro-device workpiece. The magnetic fluid can be a magnetorheological fluid. The magnetic field source can include an electrically conductive coil and/or a magnet, such as an electromagnet. The carrier assembly can also include a fluid cell with a cavity to receive the magnetic fluid.
    Type: Grant
    Filed: July 22, 2005
    Date of Patent: August 14, 2007
    Assignee: Micron Technology, Inc.
    Inventor: Jason B. Elledge
  • Patent number: 7247082
    Abstract: A polishing composition comprising an improver of a ratio of a polishing rate of an insulating film to that of a stopper film, wherein the polishing rate of the stopper film is selectively decreased, comprising one or more compounds selected from the group consisting of a monoamine or diamine compound; a polyamine having three or more amino groups in its molecule; an ether group-containing amine; and a heterocyclic compound having nitrogen atom. The polishing composition can be used for removing an insulating film which has been embedded for isolation into a trench formed on a silicon substrate and sedimented outside the trench, thereby planing a surface of the silicon substrate.
    Type: Grant
    Filed: January 10, 2006
    Date of Patent: July 24, 2007
    Assignee: Kao Corporation
    Inventors: Hiroyuki Yoshida, Toshiya Hagihara, Ryoichi Hashimoto, Yasuhiro Yoneda
  • Patent number: 7243580
    Abstract: A driver has components that are easily disassembled for cleaning and/or sterilization. Once disassembled, the limited number of components allows for easy reassembly. The driver utilizes a cam that rides on spring fingers for determining the level of producible torque that the driver can produce. The cam and spring fingers are contained in a housing. Particularly, the spring fingers are part of a finger housing that is key lockable with the housing when assembled for movement as one unit. The cam is integral with a driver shaft and is received within the finger housing. The cam and driver shaft are limitedly rotatable with respect to the finger housing. The level of producible torque may be changed by providing cams and/or spring fingers of various dimensions. The driver is torque-limiting in one direction (tightening) and essentially non torque-limiting in the opposite direction (loosening). The various components are also large enough to be easily handled reducing the chance of lost components.
    Type: Grant
    Filed: December 23, 2003
    Date of Patent: July 17, 2007
    Assignee: DePuy Products, Inc.
    Inventor: Edmund W. Frazee
  • Patent number: 7241204
    Abstract: A polishing pad has a resin sheet having a flat surface and abrading particles fixed inside and on the surface of this resin sheet. Its tensile strength is in the range of 30 MPa or greater and 70 MPa or less and preferably in the range of 40 MPa or greater and 60 MPa or less. Its tensile tear elongation is in the range of 50% or less, preferably 20% or less and more preferably 5% or less. The average diameter of the primary particles of the abrading particles is in the range of 0.005 ?m or greater and less than 0.5 ?m, and preferably in the range of 0.005 ?m or greater and 0.2 ?m or less. The content of the abrading particles fixed to the resin sheet is 10 volume % or greater and 50 volume % or less, or preferably 10 volume % or greater and 24 volume or less.
    Type: Grant
    Filed: September 7, 2006
    Date of Patent: July 10, 2007
    Assignee: Nihon Micro Coating Co., Ltd.
    Inventors: Jun Watanabe, Takuya Nagamine, Jun Tamura, Takashi Arahata
  • Patent number: 7238095
    Abstract: A pneumatic grinder with improved muffling structure primarily comprises a driving portion, a grinding wheel fixing portion provided at one end of the driving portion, a first housing connected to the other end of the driving portion by means of a combining portion, a second housing mounted onto the first housing, and a plurality of first and second exhaust openings arranged in staggered fashion respectively on the first and second housings. Said structure allows the pneumatic grinder to discharge waste air through foresaid two layers of exhaust openings in staggered fashion arranged in order to reduce noise during air exhaust.
    Type: Grant
    Filed: November 20, 2006
    Date of Patent: July 3, 2007
    Assignee: Storm Pneumtic Tool Co., Ltd.
    Inventors: Yung-yung Sun, Chuan-ching Cheng
  • Patent number: 7235001
    Abstract: The polishing apparatus is capable of transferring a work piece to a top ring without moving the work piece from the center and capable of precisely polishing the work piece. The polishing apparatus has a transfer unit for transferring the work piece to the top ring. The transfer unit comprises: a guide member having a receiving section, which centers the work piece; a mounting table vertically moving with respect to the guide member, the mounting table having a mounting section, which receives the centered work piece; and a supporting mechanism supporting the mounting table and allowing the mounting table to move downward. The mounting table is relatively moved close to the top ring and presses the work piece onto the top ring so as to transfer the work piece to the top ring.
    Type: Grant
    Filed: March 30, 2006
    Date of Patent: June 26, 2007
    Assignee: Fujikoshi Machinery Corp.
    Inventors: Tadakazu Miyashita, Yoshikazu Nakamura, Yoshiyuki Nomura