Abstract: A battery-operated screwdriver (10) with a housing (12, 18) with a grip (14), in particular with a fixedly built-in battery (40), and with charging contact tongues (37) for charging the battery (40), is designed as especially compact and lightweight because instead of a boxlike, standard ON/OFF switch, counterpart contacts (34) fixed to the tool are provided, to which a contact plate (32) that is movable by means of an ON/OFF trigger (26) and in the process is coupleable to the counterpart contacts (34) and upon their release is easily releasable, is assigned.

Abstract: An apparatus and method of using a in situ finishing information for finishing semiconductor wafers is described. The method uses operative sensors such as friction sensors for detecting and improving control during finishing. The method can aid control of finishing while using in situ finishing information and cost of manufacture information. The method can aid control of finishing while using organic lubricants, lubricating films, and lubricating boundary layers in the operative finishing interface. The method can generally aid control of differential finishing such as when using differential lubricating films such as lubricating boundary layers. Control can generally aid improvement of differential finishing of semiconductor wafers. Planarization and localized finishing can used with in situ finishing information such as differential lubricating boundary layer for finishing. Defects can generally be reduced using the in situ friction finishing information method.

Abstract: Planarizing machines and methods for accurately planarizing microelectronic workpieces. Several embodiments of the planarizing machines produce a planar surface at a desired endpoint in the microelectronic workpieces by (a) quickly reducing variances on the surface of the workpiece using a planarizing medium that removes topographical features but has a low polishing rate on planar surfaces; and (b) subsequently planarizing the wafer on a planarizing medium that has a higher polishing rate on planar surfaces than the first polishing medium.

Abstract: A screw (10) has a threaded shank (12) and a head (14). The head has a recess (18) that comprises three lobes (18a, b, c). Each lobe is separated by a curved drive flange (20a, b, c). A driver (100) has a drive tip (114) that fits the recess of the screw.

Abstract: A glass grinding bit includes a monolithic plastic body having a first end, a second end and a central longitudinal axis. A central bore formed as part of the body in alignment with the longitudinal axis for receiving a drive shaft. An outer surface is formed as part of the body in alignment with the longitudinal axis and in concentric relationship with the central bore. A grinding sleeve has an inner surface in permanent interfacial contact with the body outer surface and an abrasive outer grinding surface. A threaded bore in the body extends transversely from the body outer surface to the central bore. A set screw in the transverse bore allows the grinding bit to be secured to a drive shaft.

Abstract: A ratchet wrench including a head section formed with two slots and two pawls each having a post slidably fitted through the slots. The ratchet wrench further includes a shift member formed with two slots respectively intersecting the slots of the head section. The posts of the pawls are slidably inlaid in the slots of the head section and the slots of the shift member. By means of shifting the shift member, the pawls can be directly driven to slide along the slots, whereby one of the pawls is engaged with the ratchet wheel, while the other of the pawls is disengaged from the ratchet wheel.

Abstract: Planarizing machines and methods for accurately planarizing microelectronic workpieces. Several embodiments of the planarizing machines produce a planar surface at a desired endpoint in the microelectronic workpieces by (a) quickly reducing variances on the surface of the workpiece using a planarizing medium that removes topographical features but has a low polishing rate on planar surfaces; and (b) subsequently planarizing the wafer on a planarizing medium that has a higher polishing rate on planar surfaces than the first polishing medium.

Abstract: An improved design for a retaining ring for a chemical mechanical poling machine is described which provides superior flexibility and instantaneous in-situ control of the polishing rate in the edge region of a wafer. The design has a plurality of straight slurry delivery groves, angled in the direction of rotation of said ring wherein each alternate channel is recessed away from the inner circumference of the bottom, pad contacting, surface, of said retaining ring by a recess which extends upward from the bottom surface only sufficiently to prevent contact of the retaining ring with the polishing pad in the area of the recess. Each recess curves outwardly towards the inner circumference of the retaining ring in a manner to form a symmetrical segmented tab with a rounded edge, tangent to the inner circumference of the retaining ring, and meeting the inner circumference at the exit end of an adjacent non-recessed slurry channel. For a 200 mm.

Abstract: A dual position sharpening device can be set up so that the abrasive wheel is either vertical or horizontal. A guard retains cooling water in either position.

Abstract: A tool for installing threaded parts with lock nuts onto a machine is disclosed. The tool includes an outer tube and an inner mechanism that rotate together or independently using cogs. When the outer tube and inner mechanism rotate together, the threaded part is tightened onto a machine. When the outer tube and inner mechanism rotated independently, the lock nut is tightened onto the threaded part.

Abstract: A floor sanding vacuum is designed to be used in conjunction with floor sanding machines to provide a near dust free process for sanding floors. A displacement blower is driven by a gasoline or electric motor which creates a high vacuum that draws air through the sanding machine via a flexible hose connected to a cyclone separator where the sanding debris drops into an integral hopper. After the cyclone, the air is drawn through an air filter to the blower where the cleaned air is discharged through either an optional integral silencer built into the base of the vacuum or a commercially available silencer for noise reduction.

Abstract: An abrasive device may include first ring-shaped container filled with a liquid abrasive medium. A second container may be arranged next to the first container and filled with a second liquid abrasive medium. A pivoting arm may be arranged between and above the containers and can be pivoted along a pivoting direction. A drag device may be arranged on the pivoting arm. The drag device may lead a gas turbine blade on a carrier arm through the abrasive medium.

Abstract: Methods are provided for controlling adjustable pressure zones of a CMP carrier. A method comprises determining a first thickness of a layer on a wafer underlying a first zone of the carrier. A first portion of the layer underlying the first zone is removed. The first zone is configured to exert a first pressure against the second surface of the wafer. A second thickness of the layer underlying the first zone is determined and a target thickness corresponding to a predetermined thickness profile is selected. A second pressure for the first zone is calculated using the first thickness, the second thickness, the first pressure, and the target thickness. The pressure exerted by the first zone against the second surface of the wafer is adjusted to the second pressure and the steps are repeated for a second zone.

Abstract: The present invention is to provide a method and device for polishing a glass substrate, suitable for polishing a large-sized glass substrate. The device for polishing a substrate is adapted so that a substrate is attached to a film stretched on a frame; the frame is installed on a carrier; the carrier and a polishing surface-plate are brought closer relative to each other to polish a surface to be polished of the substrate attached to the film by pressing the substrate to the polishing surface-plate; the frame is removed from the carrier after the completion of the polishing, and the polished substrate is removed from the frame.

Abstract: A multistage abrasive-liquid jet cutting head comprising at least a first and a second mixing stage. Within the first mixing stage is a first mixing chamber arranged to accept a first flow of accelerated abrasive particles from a first abrasive feed tube and a pressurized liquid flow from an orifice and produce a pressurized slurry-like flow that is introduced to the second mixing stage. Within the second mixing stage is a second mixing chamber arranged to accept and mix is second flow of accelerated abrasive particles from a second abrasive feed tube with the pressurized slurry-like flow from the first mixing stage. An exit nozzle in fluid communication with the second mixing chamber that focuses the combination of the second flow of accelerated abrasive particles from the second abrasive feed tube with the pressurized slurry-like flow from the first mixing stage into an abrasive jet.

Abstract: The invention relates to a method for removing material from a semiconductor wafer by machining, in which a semiconductor wafer held on a wafer holder and a grinding wheel lying opposite it are rotated independently of one another, the grinding wheel being arranged laterally offset with respect to the semiconductor wafer and being positioned in such a way that an axial center of the semiconductor wafer passes into a working range of the grinding wheel, the grinding wheel being moved in the direction of the semiconductor wafer at an infeed rate, with the result that grinding wheel and semiconductor wafer are advanced toward one another while the semiconductor wafer and grinding wheel are rotating about parallel axes, so that a surface of the semiconductor wafer is ground, with the grinding wheel being moved back at a return rate after a defined amount of material has been removed, wherein the grinding wheel and semiconductor wafer are advanced toward one another by a distance of 0.03–0.

Abstract: A polishing machine uses a polishing head having a movable pad to press a polishing tape for polishing beveled and edge parts of a disk-shaped object. A rotary shaft is connected to the polishing head in a direction of contact surface between the polishing tape and the object. A rotary-and-reciprocating motion device rotates the polishing head around the axial line of the rotary shaft and moves it reciprocatingly along its axial line. A moving device undergoes a reciprocating motion perpendicularly to the object surface while supporting the object. When in use, the polishing head is rotated while the pad causes the polishing tape to protrude from it while the object is rotated.

Abstract: A chemical mechanical polishing (CMP) apparatus and method for polishing semiconductor wafers utilizes multiple wafer carriers that are transferred to different positions about a polishing pad to polish at least one semiconductor wafer while another semiconductor wafer is being loaded onto or unloaded from one of the wafer carriers. The different positions include multiple polishing positions and one or more loading/unloading positions. In some embodiments, the CMP apparatus is configured such that a semiconductor wafer is polished at a loading/unloading position. The CMP apparatus may also be configured to continuously polish one or more semiconductor wafers while the wafer carriers are being transferred to different positions. Thus, the CMP apparatus can continuously process the semiconductor wafers without significant idle periods. Consequently, in these embodiments, the efficiency of the CMP apparatus is significantly increased.

Abstract: The present invention relates to a quill to be used to superabrasively machine complex shapes, such as airfoil shapes, into a substrate. The quill has a shaft portion, an enlarged head portion adjacent the shaft portion, and a tapered grinding portion adjacent the enlarged head portion. The tapered grinding portion has a layer of grit material selected from the group consisting of diamonds and cubic boron nitride thereon. In a preferred embodiment, the quill is a vitrified or plated cubic boron nitride quill on the grinding portion. A method of using the tool is also disclosed.

Abstract: A socket for easily connecting and disconnecting a standard camlock fitting, such as those used in flanges on marine vessels, includes four drive lugs, or tangs, for mating with recesses on the camlock. The socket is adapted for connection to a standard ratchet wrench for providing torque to tighten or loosen the camlocks.