Abstract: A polishing pad for use with a polishing composition is disclosed. The polishing pad includes a layer having a first material, and polishing structures having a second material, where the plurality of polishing structures form a temporary reservoir region for the polishing composition. The second material is harder than the first material.

Abstract: A driver has a tip that enables it to engage each one of a conventional hexagonal-head fastener and a conventional lobed-head fastener. The tip includes alternating flutes and crests. The crests are substantially flat to engage straight walls of a hexagonal-head. The flutes engage the lobed head of the fastener. A socket-type driver engages each type of conventional fastener. A fastener and a pair of socket-type fasteners have alternating flutes, which can be engaged by a conventional lobed-head driver, and crests or sidewall surfaces, which can be engaged by a conventional hexagonal-head driver.

Abstract: For manufacturing the laminated mold comprising the laminate (11) being formed of a plurality of thin sheets (11a) laminated on each other, laminate the thin sheets with the excess portions of respective thin sheets exceeding the profile of the tire crown portion on the side of contacting with the tire stepping face left, then remove the excess portions, form the sector mold by placing the laminate (11) with the excess portions removed in the holder, form the laminated mold having the annular read pattern by arranging a plurality of the sector mold in a peripheral direction of the tire so as to suppress formation of the stepped shape appearing on the tire profile comparing with the one as originally intended.

Abstract: An apparatus for polishing a wafer comprises a supporting portion having an abrasive pad disposed thereon, and a polishing head disposed over the abrasive pad. The polishing head comprises a carrier having at least two fluid passages, a retainer ring disposed on a lower edge of the carrier, forming a space for receiving the wafer, a supporter disposed in the carrier, and a flexible membrane disposed to be in contact with the wafer. The supporter has an upper surface portion, a lower surface portion, a plurality of first holes, a plurality of second holes, and a first chamber. The upper surface portion of the supporter forms a second chamber along with an inner surface of the carrier. The second chamber is in communication with one of the two fluid passages of the carrier and the second holes are formed in a lower surface portion of the supporter to communicate with the second chamber.

Abstract: An apparatus and method of using an in situ finishing information for finishing workpieces and semiconductor wafers are described. The method uses operative sensors such as friction sensors for detecting and improving control during finishing. The method can aid control of finishing while using in situ finishing information and cost of manufacture information. The method can aid control of finishing while using organic lubricants, lubricating films, and lubricating boundary layers in the operative finishing interface. The method can generally aid control of differential finishing such as when using differential lubricating films such as lubricating boundary layers. Control can generally aid improvement of differential finishing of workpieces such as semiconductor wafers. Planarization and localized finishing can be used with in situ finishing information such as differential lubricating boundary layer(s) for finishing.

Abstract: The present invention is an apparatus for polishing a precision screw. The apparatus uses abrasive in a sealed container for polishing. Hence, the present invention can do precise polishing to obtain smooth surface of thread by removing tiny burrs with the abrasive.

Abstract: Double-sided polishing equipment configured to polish a rectangular substrate, comprising a carrier having a pocket configured to accommodate a rectangular substrate, a lateral linear moving mechanism configured to move the carrier, first and second polishing pads with first and second rotational axes, respectively, offset from centers of the pads, the polishing surfaces of the first and second polishing pads being parallel. The equipment further includes at least one elevating mechanism coupled to at least one of the polishing pads, first and second rotary drive mechanisms coupled to each of the first and second polishing pads, respectively; and configured to rotate the first and second pads about the first and second rotational axes. A polishing-agent supplying device is present and configured to supply polishing agent to a plane where a substrate that is accommodated in the pocket to accommodate the substrate comes into contact with the polishing pads.

Abstract: A flexible layer is formed on a surface of a core, and a polishing layer mixed with abrasive particles is formed on a top of the flexible layer. The flexible layer is produced by applying an emulsion adhesive as a flexible layer onto a core and attaching abrasive particles onto the flexible layer, or by applying an emulsion adhesive mixed with abrasive particles onto a core. The flexible layer is then subjected to a heating and drying process. Thus obtained is an abrasive material which is easy to produce, needs no rigorous criteria in the selection of a core, and imparts, to a binder of abrasive particles, flexibility, conventionally required of the core, at no expense of surface finishing performance.

Abstract: A method and apparatus for processing a microelectronic substrate. In one embodiment, the method can include planarizing the microelectronic substrate with a planarizing liquid and rinsing the substrate with a rinsing liquid having a pH approximately the same as a pH of the planarizing liquid. The rinsing step can be completed while the substrate remains on a polishing pad of the apparatus, or, alternatively, the substrate can be removed to a rinsing chamber for rinsing. In another embodiment, the method can include conditioning the polishing pad by removing polishing pad material from the polishing pad and then cleaning the microelectronic substrate by engaging the substrate with the same polishing pad and moving at least one of the polishing pad and the substrate relative to the other of the polishing pad and the substrate after conditioning the polishing pad.

Abstract: A retainer ring configured to reduce heat generated during a polishing process may include a heat absorbing element, a thermoelectric element, and a heat dissipating element. A polishing head configured to polish a wafer may include a wafer carrier, a retainer ring, and a cooling element. A chemical mechanical polishing apparatus including a polishing pad formed on a platen and a polishing head including a retainer ring.

Abstract: The present invention is to provide a method and device for polishing a glass substrate, suitable for polishing a large-sized glass substrate. The device for polishing a substrate is adapted so that a substrate is attached to a film stretched on a frame; the frame is installed on a carrier; the carrier and a polishing surface-plate are brought closer relative to each other to polish a surface to be polished of the substrate attached to the film by pressing the substrate to the polishing surface-plate; the frame is removed from the carrier after the completion of the polishing, and the polished substrate is removed from the frame.

Abstract: A floor preparation machine that uses a number of vertical needles positioned in a tight rectangular pattern. The needles vibrate against the floor surface to prepare the floor surface. The needles are driven by a cam and cam follower. As the cam is turned by a motor, a number of ribs repeatedly contact the cam follower, which in turn repeatedly pushes the needles down. Under the top plate that supports the needles, is a rubber form that acts as a “spring” to force the needles up after they have been pushed down by the cam follower. In practice, the system produces a sustained vibration of the needles that breaks the surface to a depth of 1/16 to ? of an inch.

Abstract: A cutting apparatus jets, at a high pressure, water containing abrasive grains to cut a workpiece along cutting lines extending in intersecting directions. The cutting apparatus includes: a fixing table fixing the workpiece; groove portions provided in the fixing table at respective positions below the cutting lines; protruded portions provided in regions of the fixing table other than regions where the groove portions are provided, in a manner that the workpiece contacts the protruded portions; support portions provided to connect the protruded portions substantially in parallel with cutting lines extending the Y direction along the groove portions; a frame portion provided to connect the support portions to each other in at least a part of an outer periphery of the fixing table; and protection members attachably and detachably provided to cover the support portions.

Abstract: CMP pad dressers with increased pad dressing work loads on the centrally located abrasive particles during dressing of a CMP pad, and methods associated therewith are disclosed and described. The increase in work load on centralized particles improves pad dressing performance and also extends the service life of the pad dresser.

Abstract: A plurality of disks include a first disk and a second disk stacked upon the first disk. The first disk and the second disk are each formed from glass or glass-ceramic. A powder is disposed between the first disk and the second disk. The powder is selected from the group including calcium carbonate, calcium magnesium carbonate, calcium phosphate, magnesium carbonate, magnesium borate, magnesium oxide, magnesium phosphate, and clay.

Abstract: The present invention provides a method for extending diamond tool life in diamond machining of materials that chemically react with the diamond tool in which the surface electric potential of the workpiece is adjusted or tuned to be adequate to inhibit the chemical reaction between the diamond tool and the workpiece during the diamond machining operation. As the chemical reaction is inhibited, the chemical wear rate of the diamond tool is reduced and diamond tool life is extended. The surface electric potential of the workpiece can be adjusted by electrically charging the workpiece. In one embodiment, conduction charging is used to adjust the surface electric potential of the workpiece to inhibit the chemical reaction between the diamond tool and the workpiece. In another embodiment, induction charging is used to adjust the surface electric potential of the workpiece to inhibit the chemical reaction between the diamond tool and the workpiece.

Abstract: Polishing pads with a window, systems containing such polishing pads, and processes that use such polishing pads are disclosed.

Abstract: A cordless screwdriver, having a housing (12, 18) equipped with a handle (14), having an in particular permanently installed rechargeable battery (40), and having a transmission (72), is particularly compact, lightweight, and strong because the transmission (72), embodied in the form of a sun-and-planet gear, is simply inserted into a hollow, cylindrical transmission housing (18) and can be secured in position in it by an axial securing plate (62); the transmission housing (18) is also provided with an internal gearing and serves as the sun gear as well as being integrated into the reinforcing structure of the cordless screwdriver (10).

Abstract: A screwing tool with a device to adjust transmitted torque comprises a handle to introduce a torque to the device, which is borne in the hollow of the handle and a drive shaft as an output element of the torque. On the drive shaft inside the handle, two separate couplings are assembled, having between them a compression spring exerting a spring force against the two couplings. Each coupling comprises a first and a second socket engaging each other by gearings at their opposing faces. The maximum torque at which the torque transmission will be interrupted can be adjusted by an adjustment element wherein the distance between the couplings can be changed, thereby resulting in a change of the tension of the spring exerting a load on the couplings. The teeth of the gearings slide and the sockets rotate relatively to each other and interrupt the torque-transmission if a pre-adjusted torque is exceeded.

Abstract: A ratcheting torque wrench comprising a torsional shaft connected to a hex tip; a sleeve that fits over the torsional shaft; a sleeve dial having a hole and configured to fit around the sleeve such that the diameter of the sleeve dial hole accommodates the sleeve; a shaft dial connected to the sleeve dial; a nylon ring connected to a ratchet housing; a ratchet gear connected to the ratchet housing, the ratchet housing mating with the ratchet gear; a spring connected to the nylon ring and the ratchet gear; a ratchet cover that fits over the ratchet housing; a retaining ring connected to the ratchet cover and configured to engage the torsional shaft; a ratchet fitting connected to the ratchet housing, wherein the ratchet fitting accommodates a first handle, wherein the sleeve has a hole to accommodate a second handle.