Abstract: A polishing pad conditioner for a chemical mechanical polishing apparatus and real-time monitoring method thereof. A conditioning head is supported for rotation at one end of a transverse beam. A drive assembly is coupled to the conditioning head to drive downward force to the conditioning head, and at least one sensor disposed on the transverse beam detects deflection of the transverse beam.

Abstract: A system and method for treating (e.g. polishing to remove defects) the surface of a media, such as a magnetic hard disk, while in operation, such as during dynamic electrical testing is disclosed. Further, a method for manufacturing a head for treating the surface of a media is disclosed.

Abstract: Planarizing machines, carrier heads for planarizing machines and methods for planarizing microelectronic-device substrate assemblies in mechanical or chemical-mechanical planarizing processes. In one embodiment of the invention, a carrier head includes a backing plate, a bladder attached to the backing plate, and a retaining ring extending around the backing plate. The backing plate has a perimeter edge, a first surface, and a second surface opposite the first surface. The second surface of the backing plate can have a perimeter region extending inwardly from the perimeter edge and an interior region extending inwardly from the perimeter region. The perimeter region, for example, can have a curved section extending inwardly from the perimeter edge of the backing plate or from a flat rim at the perimeter edge. The curved section can curve toward and/or away from the first surface to influence the edge pressure exerted against the substrate assembly during planarization.

Abstract: Systems and methods are disclosed for polishing a semiconductor substrate having a polymer film surface deposited thereon by chemishearing the surface; and performing chemical mechanical polishing (CMP) on the chemisheared surface.

Abstract: A technique for in situ monitoring of polishing processes and other material removal processes employs a quartz crystal nanobalance embedded in a wafer carrier. Material removed from the wafer is deposited upon the surface of the crystal. The resulting frequency shift of the crystal gives an indication of the amount of material removed, allowing determination of an instantaneous removal rate as well as a process endpoint. The deposition on the quartz crystal nanobalance may be controlled by an applied bias. Multiple quartz crystal nanobalances may be used. In a further embodiment of the invention, the quartz crystal nanobalance is used to detect defect-causing events, such as a scratches, during the polishing process.

Abstract: In one embodiment, a CMP pad is conditioned by repeatedly cycling the CMP pad between a first temperature and a second temperature higher than the first temperature to eliminate at least one crystalline area in the CMP pad.

Abstract: A pressure control system is used for eliminating individual differences of a plurality of pressure controllers used for controlling pressures of a plurality of pressure-controlled sections. The pressure control system includes a plurality of pressure controllers for supplying a pressurized fluid to a plurality of pressure-controlled sections, a master pressure controller for supplying a pressurized fluid having a reference pressure, a plurality of calibration chambers corresponding to the pressure controllers.

Abstract: A glass substrate for use in an information recording medium is manufactured by polishing a surface of a disc-shaped glass substrate and then performing texture processing on the surface. The texture processing includes the steps of forming lines of texture on the surface of the glass substrate extending along a circumferential direction of the glass substrate by performing a mechanical texture formation method in which the surface of the glass substrate is supplied with an abrasive slurry while an abrasive member slidably contacts the surface, and correcting the shape of the texture by removing burrs formed on the texture during the formation of the texture. The correction of the shape of the texture is performed by using a correcting pad made of foam of a synthetic resin having a 100% modulus of 3 to 40 MPa and scrubbing the surface of the glass substrate with the correcting pad in a direction intersecting the direction in which the texture extends.

Abstract: A cutting mechanism minute adjustment device for a stone cutter includes a framed base having a hollow interior rectangular support arm on a front corner including a sustaining plate fixed therein inserted into a rectangular receiving spaced under a left portion of a cutting mechanism with a L-shaped adjustable plate engaged therebetween. The adjustable plate has a rectangular through holes for passing through the support arm and a pair of adjustable slots engaged with a pair of screw holes under the cutting mechanism and releasably secured by a pair screws. The cutting mechanism further has a circular blade on a right side actuated by a motor therein and a screw hole in a left wall communicating to the rectangular space and a U-shaped slit in a top of the support arm. A lock has a threaded shank on front engaged into the screw hole and the receiving space of the cutting mechanism through the U-shaped slit of the support arm.

Abstract: In a grinding machine grinding a workpiece W by a grinding wheel G to supply coolant to one of a grinding point P or the workpiece W by way of a relative movement between the grinding wheel W rotatably supported on a wheel slide 11 and the workpiece W supported by a work support device 17, air layer 36 flowing on a circumferential surface Gc of said grinding wheel G by blowing hydraulic jet 35 transversally from one side to the other side of the grinding wheel G along the circumferential surface Gc at an upper stream position of a rotational direction of the grinding wheel G from the grinding point P. Mist of coolant blown by the hydraulic jet 35 through a recovering port 37, 43, 53 mounted on a wheel guard 20 covering a part of the grinding wheel G.

Abstract: A power tool with a housing (12) and a tool (18, 22) located thereon such that it is capable of being driven in a rotating and/or oscillating manner, the tool being operable as directed using vacuum flow, in particular using a vacuum cleaner. The power tool is made particularly powerful by the fact that a radial turbine wheel (34) with forward-guiding and rearward-guiding vane rows (44, 48) functions as the drive.

Abstract: An abrasive jet apparatus is provided which includes an abrasive dispenser defining a compartment for storing a granular abrasive material and at least one metering orifice disposed in open communication therewith for dispensing the granular abrasive material. The apparatus also includes a shutter assembly disposed adjacent the metering orifice, which includes a shutter member angularly displaceable between first and second positions relative to the metering orifice. The shutter member has formed therethrough at least one shutter opening which in the first position is substantially fully aligned with the metering orifice, and in the second position is substantially fully offset therefrom. The apparatus further includes a position actuator operatively coupled to the shutter mechanism for reversibly displacing the shutter member to the first and second positions and a plurality of intermediate positions therebetween for occluding a selective portion of the metering orifice.

Abstract: An arrangement for performing a multi-step polishing process on a single stage chemical mechanical planarization (CMP) apparatus utilizes an in-situ conditioning operation to continuously clean and evacuate debris and spent polishing slurry from the surface of the polishing pad. By presenting a clean, virtually “new” polishing pad surface at the beginning of each planarization cycle, polishing agents of different chemistries, morphologies, temperatures, etc. may be used without the need to remove the wafer to change the polishing source or transfer the wafer to another CMP polishing station. A multi-positional valve may be used to control the introduction of various process fluids, including a variety of different polishing slurries and conditioning/flushing agents. The use of different conditioning materials allows for the surface of the polishing pad to be altered for different process conditions (e.g.

Abstract: A wrench includes a wrench body having a ring portion and a handle portion. A retainer that holds a plurality of wedge members is disposed inside the ring portion. Wedge guide grooves are formed on the inner circumferential surface of the ring portion. Each of the wedge guide grooves has a free region which maintains the corresponding wedge member in a free state, and left-hand and right-hand wedge regions each of which maintains the corresponding wedge member in a caught state. The wrench is provided with a changeover mechanism for moving the retainer to a position at which the wedge member faces the corresponding free region, a position at which the wedge member faces the corresponding left-hand wedge region, or a position at which the wedge member faces the corresponding right-hand wedge region.

Abstract: The invention provides an electronic wrench which includes means for measuring the instantaneous applied torque and means for measuring the instantaneous angle of rotation during tightening. The physical parameters of the screw connection for tightening and a setpoint value for the tightening are initially entered into the wrench via a keypad. During the tightening operation, the processor means calculate the instantaneous traction force on the screw fastener as a function of the measured instantaneous values of torque and angle and as a function of the recorded characteristics of the screw fastener.

Abstract: The invention includes a method for conditioning a surface of a polishing pad after chemical-mechanical polishing of a semiconductor substrate with the pad surface. The method includes exposing the pad surface to steam, and the steam can comprise ammonium citrate. The invention also includes an apparatus for conditioning a surface of a polishing pad after chemical-mechanical polishing of a semiconductor substrate with the pad surface. The apparatus includes a conditioning stone, and a steam outlet port proximate the conditioning stone. The steam outlet port is configured to jet steam onto the pad surface during the conditioning of the pad surface.

Abstract: Carrier assemblies, polishing machines with carrier assemblies, and methods for mechanical and/or chemical-mechanical polishing of micro-device workpieces are disclosed herein. In one embodiment, a carrier assembly includes a head having a chamber, a magnetic field source carried by the head, and a magnetic fluid in the chamber. The magnetic field source is configured to generate a magnetic field in the head. The magnetic fluid changes viscosity within the chamber under the influence of the magnetic field to exert a force against at least a portion of the micro-device workpieces. The magnetic fluid can be a magnetorheological fluid. The magnetic field source can include an electrically conductive coil and/or a magnet, such as an electromagnet. The carrier assembly can also include a fluid cell with a cavity to receive the magnetic fluid.

Abstract: The invention relates an electric sharpener, comprises a main frame, a main shaft, a motor, a transmission wheel, a grinding stone, and an electric control circuit. The motor is mounted on an angular frame which in turn is mounted on the main frame. The transmission wheel is fixed to an end of the main shaft, and the output shaft of the motor is tightly pressed against the periphery of the transmission wheel so as to drive it. A tool rest is fixed onto the main frame in a vertical or horizontal mounting orientation. A water vessel is fixed to the main frame, and the lower portion of the grinding stone dips into the water contained in the water vessel. Special clamps and attachments for grinding different tools are provided. The electric sharpener can be used for grinding various woodworking or household tools.

Abstract: A method for manufacturing a wafer holding plate for a wafer grinding apparatus wherein the plate includes a substrate having a wafer adhering surface to which a semiconductor wafer is adhered by an adhesive. The wafer adhering surface includes a mirror-like surface portion and a groove pattern, which anchors the adhesive. When the plate is used for grinding wafers, the quality and accuracy of the finished wafers is greatly improved.

Abstract: A power tool includes an annular recess adapted to be defined in the peripheral edge to receive therein a resilient loop, a slot adapted to be defined in a side face of the peripheral edge and a hole defined in a side face defining the slot to communicate with the annular recess so as to movably receive therein a ball such that engagement between the resilient loop and a first auxiliary tool mounted outside the driving end is secured because of engagement of the resilient loop to an inner face of the auxiliary tool.