Abstract: Systems and apparatus providing a carrier head for chemical mechanical polishing are described. The carrier head includes a base, a support structure attached to the base, a retaining structure attached to the base, and a connector attached to the base and the retaining structure. The support structure includes a receiving surface for contacting a substrate. The retaining structure prevents the substrate from moving along the receiving surface. The base and the retaining structure can thermally expand at different rates of expansion without causing distortion to one another.
Abstract: Apparatus for removing a burr from an aperture in a workpiece, using a rotating deburring tool having a flexible or partly flexible shaft, an abrasive mechanism that rotates on the shaft and a collar that protects the workpiece from abrasion when the abrasive mechanism is being positioned for deburring. Optionally, the shaft and abrasive mechanism move laterally as they rotate. Optionally, a shaft holder includes a protective surrounding sleeve to catch or deflect any fragment of the shaft holder that might fly off. Optionally, the shaft and the workpiece rotate independently of each other. Two or more different abrasive mechanisms can be simultaneously attached to the shaft. The cross-sectional shape of the abrasive mechanism may be curvilinear and/or polygonal, depending upon shape of the workpiece surface. Optionally, a shaft restrictor receives the shaft and limits lateral motion of the rotating shaft.
Abstract: A multiple pass machining method for removing excess flash from a formed part to approximate a desired, curved profile on the formed part includes moving the part relative to a grinder in p straight passes, wherein a first pass removes a portion of flash is at an angle E relative to a stack axis of the part and each remaining straight pass is at an incremental angle F. A portion of the flash is thereby removed to approximate a master profile on an abraded edge of the part.
Type:
Grant
Filed:
May 26, 2005
Date of Patent:
August 29, 2006
Assignee:
General Electric Company
Inventors:
Philip John Gosinski, Mark Stephen Krautheim, Kendra Lyn Anderson, Carl Grant
Abstract: This invention discloses a three-in-one combination wrench. A preferred embodiment features an easily assembled ratchet wrench in the middle of the wrench body, suitable for operation in confined spaces. The combination wrench terminates at one end in a pair of opening jaws for engaging fasteners of various sizes that fit into the jaws; and at the other, in an adjustable mortise-tenon pivotal wrench for approaching fasteners from an optimal angle to maximize torque with least effort. Furthermore, a substantially symmetrical streamlined dual-handle is ergonomically configured for a comfortable holding gesture.
Abstract: A wire stripper having at least two resiliently flexible blades each of which terminate in an insulator stripper disposed in opposed relation operably responsive to a slidly engaged insulated wire to release the insulator from the wire.
Type:
Grant
Filed:
June 14, 2005
Date of Patent:
August 1, 2006
Assignee:
E5 Products, Inc.
Inventors:
Kenneth Brian Eastwood, Sondra Kay Eastwood
Abstract: A protective sheath for tools to prevent marring of finished surfaces when the tool is being used. The sheath is integrally formed as a one-piece elastomeric body that is applied to the exterior surface of the tool, with at least one end of the sheath projecting slightly beyond an end of the tool. In one embodiment the sheath projects at both ends beyond the ends of the tool. One of the projecting ends functions to contact the finished surface and prevent contact between the tool and finished surface, and the other projecting end functions to span the coupling between the tool and another tool. The elastomeric body is freely rotatable relative to the tool and fixed axially relative thereto, and provides a non-rotating surface that may be grasped by a user to support and guide the tool.
Abstract: An apparatus for polishing a wafer comprises a supporting portion having an abrasive pad disposed thereon, and a polishing head disposed over the abrasive pad. The polishing head comprises a carrier having at least two fluid passages, a retainer ring disposed on a lower edge of the carrier, forming a space for receiving the wafer, a supporter disposed in the carrier, and a flexible membrane disposed to be in contact with the wafer. The supporter has an upper surface portion, a lower surface portion, a plurality of first holes, a plurality of second holes, and a first chamber. The upper surface portion of the supporter forms a second chamber along with an inner surface of the carrier. The second chamber is in communication with one of the two fluid passages of the carrier and the second holes are formed in a lower surface portion of the supporter to communicate with the second chamber.
Type:
Grant
Filed:
February 7, 2005
Date of Patent:
July 25, 2006
Assignee:
Samsung Electronics Co., Ltd.
Inventors:
Jae-Phil Boo, Jun-Gyu Ryu, Sang-Seon Lee, Sun-Wung Lee
Abstract: A set of pliers that have a plurality of pins on the forward parts of the plier arms and removable blocks which have apertures that can be placed on selected ones of the pins. The blocks have teeth that can engage the teeth on a timing gear.
Abstract: A ratchet open-end wrench has a handle with a head portion at an end thereof. The head portion has two jaw, between which is a gap to receive a bolt therein. The jaw has a recess, wherein a space formed from the gap and the recess allows the bolt for free rotation. The jaw is provided with a stepped bore, in which a holding assembly is received, and a hole, in which a restriction assembly is received. The bolt is held by the jaw and a shaft of the holding assembly to be rotated. While the handle is turned with the reacting force of the bolt aligned with a radial direction, the bolt is rotated by the shaft and the jaw. While the handle is turned to a reverse direction, the reacting force of the bolt move the shaft inwards to keep the bolt still.
Abstract: Carrier assemblies, polishing machines with carrier assemblies, and methods for mechanical and/or chemical-mechanical polishing of micro-device workpieces are disclosed herein. In one embodiment, a carrier assembly includes a head having a chamber, a magnetic field source carried by the head, and a magnetic fluid in the chamber. The magnetic field source is configured to generate a magnetic field in the head. The magnetic fluid changes viscosity within the chamber under the influence of the magnetic field to exert a force against at least a portion of the micro-device workpiece. The magnetic fluid can be a magnetorheological fluid. The magnetic field source can include an electrically conductive coil and/or a magnet, such as an electromagnet. The carrier assembly can also include a fluid cell with a cavity to receive the magnetic fluid.
Abstract: The present invention a combination screwdriver and bit holder for use with a drill chuck includes a shaft adapted at one end for releasably mounting to the drill chuck, and at the other end for releasably mounting tool bits therein; and, a housing connected operably to said shaft, said housing defining bit compartments for releasably receiving tool bits therein. Preferably the bit holder used in combination with a handle adapted at one end for releasably receiving said bit holder such that said handle mated together with said bit holder can be used as manual combination screwdriver.
Abstract: A method for measuring conductance of a sample using an eddy current probe with a sensing coil. The method includes N repetitions of measuring first and second voltage pairs including in-phase and quadrature components of an induced AC voltage in the sensing coil, calibrating the first signal based on the measured second signal at a different separation from the sample and reference material, determining a conductance function relating conductance with location along the selected curve, processing the calibrated first voltage pairs to generate a lift-off curve, determining an intersection voltage pair representing intersection of the lift-off curve with a selected curve, and determining the conductance of the sample from the intersection voltage pair and the conductance function.
Type:
Grant
Filed:
April 26, 2005
Date of Patent:
July 4, 2006
Assignee:
KLA-Tencor Corporation
Inventors:
Kurt R. Lehman, Shing M. Lee, Walter Halmer Johnson, III, John Fielden
Abstract: A corkscrew comprising a body and a handle, the body including a socket adapted to receive the neck of a bottle sealed by a cork, an actuation lever, an axially rotatable worm spiral mounted on a carriage within the body and arranged to rotate and penetrate the cork as the lever is lowered, the spiral being further arranged to cease rotation as the lever is raised to withdraw the cork from the bottle, the corkscrew being further arranged to discharge the cork from the screw by lowering and raising the lever after the neck of the bottle has been removed from the socket.
Abstract: A substrate delivery mechanism comprises a top ring, a substrate loader for loading a substrate, and a pusher mechanism, wherein the substrate loader comprises a top ring guide and the pusher mechanism comprises a top ring guide lifting table, in which the top ring guide and the top ring guide lifting table together form a sealed space below the substrate held by the top ring in a condition where the substrate loader is moved up by the pusher mechanism, wherein the substrate is detached from the top ring by exhausting the sealed space while at the same time injecting a fluid from through-holes provided in a substrate holding surface of the top ring.
Abstract: A method of honing a cutting edge of a rotary cutting tool comprising inserting the cutting tool into a liquid bath having an abrasive media therein such that at least the cutting edges are immersed, and providing a relative displacement of the cutting tool and the liquid bath such that the abrasive media flows over the cutting edges.
Abstract: An internal magnetic-force polishing system is disclosed for finishing a interior metal surface of a material. The system comprises a magnetic electrolysis-polishing which is adapted for finishing the interior metal surface of the material. A cathode terminal is provided for contacting pre-finished material and a transfer unit is also provided for transferring material from the cathode terminal to the magnetic electrolysis-polishing unit. The system has an electrolyte feeding unit which stores electrolytes and supplies the electrolyte to the magnetic electrolysis-polishing unit. A control unit is provided for controlling the transfer unit, the magnetic electrolysis-polishing unit and the electrolyte feeding unit.
Type:
Grant
Filed:
January 19, 2005
Date of Patent:
June 20, 2006
Assignees:
Sejong University Industry-Academy Cooperation Foundation
Abstract: A pipe joint between welded exposed metal end sections of coated pipe being formed into a pipeline is cleaned before a corrosion resistant film is applied. A cleaning head of a cleaning mechanism is placed with a mounting frame on the pipe in the area of the pipe ends to be cleaned. The cleaning head moves in a succession of longitudinal cleaning passes in the direction of the longitudinal axis of the pipe area being cleaned. The frame also moves the cleaning head rotatably with respect to the pipe joint to positions for the longitudinal cleaning passes. A control mechanism defines the extent of the longitudinal cleaning passes, and also controls movement of the cleaning head to successive cleaning passes until the pipe joint is cleaned. The control is programmed and automatic, and there is no need for contact with the mechanism while it is in operation. The number of cleaning heads and cleaning material supply and exhaust hoses or tubes, as well as the number of crew required, is reduced.
Abstract: The present invention is directed, in general, to a chemical mechanical polishing pad comprising a polishing body and a backing material coupled to the polishing body. The polishing body comprising a compacted thermoplastic foam substrate, wherein the compacted thermoplastic foam substrate has a density that is as at least about 1.1 times greater than an uncompacted thermoplastic foam substrate density. Other aspects of the invention comprise a method for manufacturing the above-described chemical mechanical polishing pad and chemical mechanical polishing apparatus comprising the chemical mechanical polishing pad.
Type:
Grant
Filed:
April 20, 2005
Date of Patent:
June 13, 2006
Assignee:
PsiloQuest Inc.
Inventors:
Yaw S. Obeng, Peter A. Thomas, Patrick J. Kelly
Abstract: A polishing composition comprising an improver of a ratio of a polishing rate of an insulating film to that of a stopper film, wherein the polishing rate of the stopper film is selectively decreased, comprising one or more compounds selected from the group consisting of a monoamine or diamine compound; a polyamine having three or more amino groups in its molecule; an ether group-containing amine; and a heterocyclic compound having nitrogen atom. The polishing composition can be used for removing an insulating film which has been embedded for isolation into a trench formed on a silicon substrate and sedimented outside the trench, thereby planing a surface of the silicon substrate.