Patents Examined by Benny Lee
  • Patent number: 9948264
    Abstract: An electronic component includes a spiral or substantially spiral first inductor extending along a stacking direction while turning around a ring-shaped or substantially ring-shaped path. The first inductor includes first inductor conductors and a first interlayer connecting conductor connected to each other. The first interlayer connecting conductor passes through some insulating layers. A second interlayer connecting conductor passes through some insulating layers, and is connected in series and is located within the ring-shaped path. A first capacitor conductor is disposed closer to one side of the stacking direction than the first inductor is. The first capacitor conductor is at least partially superposed on the ring-shaped path to define a first capacitor between the first capacitor conductor and the first inductor, and is superposed on a portion of a region surrounded by the ring-shaped path to be connected to the second interlayer connecting conductor.
    Type: Grant
    Filed: November 17, 2015
    Date of Patent: April 17, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Tetsuo Taniguchi
  • Patent number: 9948354
    Abstract: Aspects of the subject disclosure may include, for example, a coupling device including a receiving portion that receives a radio frequency signal conveying data from a transmitting device. A magnetic coupler magnetically couples the radio frequency signal to a transmission medium as a guided electromagnetic wave that is bound by an outer surface of the transmission medium. A cap includes a dielectric portion that secures the transmission medium adjacent to the magnetic coupler and a reflective plate that reduces electromagnetic emissions from the magnetic coupler. Other embodiments are disclosed.
    Type: Grant
    Filed: September 22, 2016
    Date of Patent: April 17, 2018
    Assignee: AT&T INTELLECTUAL PROPERTY I, L.P.
    Inventors: Robert Bennett, Irwin Gerszberg, Paul Shala Henry, Farhad Barzegar, Donald J Barnickel, Thomas M. Willis, III
  • Patent number: 9947981
    Abstract: The various technologies presented herein relate to utilizing a sealing layer of malleable material to seal gaps, etc., at a joint between edges of a waveguide channel formed in a first plate and a surface of a clamping plate. A compression pad is included in the surface of the clamping plate and is dimensioned such that the upper surface of the pad is less than the area of the waveguide channel opening on the first plate. The sealing layer is placed between the waveguide plate and the clamping plate, and during assembly of the waveguide module, the compression pad deforms a portion of the sealing layer such that it ingresses into the waveguide channel opening. Deformation of the sealing layer results in the gaps, etc., to be filled, improving the operational integrity of the joint.
    Type: Grant
    Filed: May 19, 2016
    Date of Patent: April 17, 2018
    Assignee: National Technology & Engineering Solutions of Sandian, LLC
    Inventors: Bernd H. Strassner, II, Richard Liedtke, Jacob Jeremiah McDonald, Matthew Halligan
  • Patent number: 9948263
    Abstract: A multilayer electronic component includes a body including a dielectric layer and/or a magnetic layer, a terminal part including an input terminal, an output terminal, and a ground terminal connected to the body, and a filter part including a coil part disposed in the body and a capacitor part connected to the coil part and filtering a high frequency component of an input signal input to the input terminal. The capacitor part includes a plurality of first internal electrodes connected to the coil part and a plurality of second internal electrodes exposed to an exterior of the body.
    Type: Grant
    Filed: September 25, 2015
    Date of Patent: April 17, 2018
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Young Ghyu Ahn, Min Cheol Park, Byoung Hwa Lee, Dong Hwan Lee
  • Patent number: 9941563
    Abstract: Disclosed are embodiments of ceramic radiofrequency filters advantageous as RF components. The ceramic filters can include a ceramic stepped impedance resonator, wherein the inner diameter of the ceramic stepped impedance resonator can vary from one end to another end. The inner diameter can be, for example, tapered, sectioned, or stair-stepped in order to provide different impedances in the ceramic resonator.
    Type: Grant
    Filed: July 20, 2015
    Date of Patent: April 10, 2018
    Assignee: Skyworks Solutions, Inc.
    Inventor: John Kenneth Darling
  • Patent number: 9941561
    Abstract: A switch is disclosed for selecting a port. The switch includes a dielectric layer, a first circuit, and a second circuit. The first and second circuits are disposed on the dielectric layer and electrically coupled to each other through the dielectric layer. The first circuit includes a set of ports. The switch further includes a control port for receiving a control signal and a plurality of switching elements. The control signal selects at least one of the set of ports to be connected to the second circuit by setting operational states of the plurality of switching elements.
    Type: Grant
    Filed: May 20, 2016
    Date of Patent: April 10, 2018
    Assignee: Technology Service Corporation
    Inventors: Brandon Joseph Wolfson, Douglas Don Fitzpatrick
  • Patent number: 9941564
    Abstract: A dielectric resonator includes: two dielectric resonant cylinders and a metal cavity, wherein the dielectric resonant cylinders are located within the metal cavity; and it also includes: a fastener and a connector, wherein bottoms of the dielectric resonant cylinders are connected via the connector to form a U-shaped structure, and the connector is fixed on the metal cavity via the fastener. With the dielectric resonator of the embodiments of the present invention, a good close contact between the dielectric resonant cylinders and the metal cavity can be guaranteed, thereby improving the resonant performance of the dielectric resonator.
    Type: Grant
    Filed: September 18, 2013
    Date of Patent: April 10, 2018
    Assignee: ZTE Corporation
    Inventors: Yulong Kang, Wanli Yu, Xiaowen Dai
  • Patent number: 9941568
    Abstract: The invention relates to a transition device between a printed transmission line on a dielectric substrate and a rectangular waveguide including a front face forming an inlet of the waveguide, a rear face parallel to the front face and forming an outlet of the waveguide, a lower face, an upper face parallel to the lower face, the upper and lower faces extending between the front and rear faces, the waveguide being a block of dielectric material whereof the faces are fully metallized except for the front face and the rear face, the transition device including: a three-dimensional cavity formed in the volume of the waveguide between the inlet of the waveguide, further forming the inlet of the cavity, and the rear face widening, the cavity being at an inlet height of the lower face of the waveguide and ending at a distance from the inlet of the cavity at an outlet height greater than the inlet height; an electrical connection extending from the transmission line along the front face of the waveguide up to the in
    Type: Grant
    Filed: September 19, 2014
    Date of Patent: April 10, 2018
    Assignee: INSTITUT MINES TELECOM/TELECOM BRETAGNE
    Inventors: Jean-Philippe Coupez, Sylvain Chenu
  • Patent number: 9941861
    Abstract: [Object] To propose a wireless communication apparatus capable of realizing separation of transmission signals and reception signals with a low power consumption and a small size. [Solution] Provided is a wireless communication apparatus including: a gyrator that includes at least four terminals; a single-phase differential converter that mutually converts single-phase signals and differential signals; a low-noise differential amplifier that amplifies reception signals that the gyrator outputs; and a differential power amplifier that amplifies transmission signals to be output to the gyrator. The gyrator transmits signals from a first terminal and a second terminal in the direction of a third terminal and a fourth terminal.
    Type: Grant
    Filed: August 5, 2014
    Date of Patent: April 10, 2018
    Assignee: SONY CORPORATION
    Inventor: Sachio Iida
  • Patent number: 9936570
    Abstract: An interconnect topology is disclosed that includes a plurality of interconnections, each of which is coupled together using a via, where at least two of the vias are staggered with respect to each other. In one embodiment, the interconnect topology comprises a substrate, multiple signal traces routed through the substrate on multiple layers, and a plurality of vias, where each via couples a pair of the signal traces to form an interconnection between different ones of the multiple layers, and where a pair of vias comprise a first via to carry a positive differential signal via and a second via to carry a negative differential signal that are coupled to signal traces to form a differential signal pair. The differential first and second vias are staggered with respect to each other.
    Type: Grant
    Filed: December 15, 2014
    Date of Patent: April 3, 2018
    Assignee: INTEL CORPORATION
    Inventors: Min Wang, Russell N. Shryock
  • Patent number: 9935353
    Abstract: A conductor in a laminar structure, such as a printed circuit board or thin-film stack, is closely flanked by at least one open trench filled with an ambient medium (e.g., air, another gas, vacuum) of a lower dielectric loss than the conductor's surrounding dielectric. The trench may be made by any suitably precise method such as laser scribing, chemical etching or mechanical displacement. A thin layer of dielectric may be left on the sides of the conductor to prevent oxidation or other reactions that may reduce conductivity. When the conductor carries a signal, part of an electric and/or magnetic field that would ordinarily travel through the surrounding dielectric encounters the low-loss ambient medium (e.g. air) in the trench. The effective dielectric loss surrounding the conductor is lowered, reducing signal attenuation and crosstalk, particularly at high frequencies.
    Type: Grant
    Filed: September 23, 2015
    Date of Patent: April 3, 2018
    Assignee: Intel Corporation
    Inventors: Gong Ouyang, Shaowu Huang, Kai Xiao
  • Patent number: 9936571
    Abstract: A PCB includes a PCB body at least including a first metal layer, a second metal layer, and a first ground layer sandwiched therebetween; and a pair of transmission lines including a first transmission line conductor and a second transmission line conductor. The first transmission line conductor is located in the first metal layer which has two straight line sections at its two ends and a curved line section at its middle, the second transmission line conductor has two straight line sections at its two ends which are located in the first metal layer and a cross-via structure at the middle which has a buried trace buried in the second metal layer, and the curved line section and the buried trace are isolated by the first ground layer. Skew effect of the differential transmission circuit is reduced, thereby improving the signal transmission quality and improve signal transmission speed.
    Type: Grant
    Filed: September 2, 2015
    Date of Patent: April 3, 2018
    Assignee: SAE MAGNETICS (H.K.) LTD.
    Inventor: Fuk Ming Lam
  • Patent number: 9935348
    Abstract: A method for implementing a TM dielectric resonator is provided, which includes: a dielectric resonant column component with a metal connecting plate is machined; a metal cavity with an opening at one end is machined; the metal connection plate of the dielectric resonant column component is fastened to the inner wall of the metal cavity by a screw; the opening of the metal cavity is covered with a prefabricated cover plate; and a prefabricated tuning screw is screwed from the cover plate into the metal cavity.
    Type: Grant
    Filed: October 10, 2013
    Date of Patent: April 3, 2018
    Assignee: ZTE CORPORATION
    Inventors: Wanli Yu, Yulong Kang, Xiaowen Dai
  • Patent number: 9935347
    Abstract: An electronic circuit assembly comprising: i) a circuit card assembly (CCA) having circuits integrated on a circuit surface; ii) a housing having an upper surface and a lower surface disposed on the CCA circuit surface, the housing comprising a via extending from the lower surface to the upper surface; and iii) a waveguide assembly disposed in the via. The waveguide assembly comprises: a) a first waveguide having a first dielectric value, a contact end of the first waveguide configured to make contact with the CCA circuit surface; b) a second waveguide having a second dielectric value, wherein the first dielectric value is greater than the second dielectric value; and c) a carrier for holding the first waveguide in contact with the second waveguide. The electronic circuit assembly further comprises: iv) a wave washer disposed in the via on a support surface of the carrier; and v) a third waveguide having a third dielectric value that is less than the second dielectric value.
    Type: Grant
    Filed: November 23, 2015
    Date of Patent: April 3, 2018
    Assignee: L-3 Communications Corporation
    Inventor: Matthew J. Spitzner
  • Patent number: 9923257
    Abstract: The present disclosure is directed to a balun circuit adapted to operate at a frequency of between about 5 GHz to about 110 GHz. The balun circuit includes first and second output striplines and an input stripline formed on a first surface of the substrate, and a slotline formed on a second surface of the substrate opposite the first surface. The slotline has first and second ends, the first end overlapping the first output stripline and the second end overlapping the second output stripline, and the input stripline overlapping the slotline midway between the first end and the second end.
    Type: Grant
    Filed: April 7, 2015
    Date of Patent: March 20, 2018
    Assignee: Synergy Microwave Corporation
    Inventors: Ajay Kumar Poddar, Ulrich Rohde, Shiban K. Koul
  • Patent number: 9917342
    Abstract: A wave cable transceiver system is disclosed incorporating an air-core or noble gas filled hollow plastic waveguide. The system may include a transmitter receiver, in-antennas and a tubular plastic waveguide with the inner air-core. The hollow plastic waveguide is a low loss and low dispersion guiding channel for the electromagnetic radiation.
    Type: Grant
    Filed: September 10, 2015
    Date of Patent: March 13, 2018
    Assignee: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
    Inventors: Mau-Chung Frank Chang, Lan Nan, Yanghyo Kim
  • Patent number: 9917343
    Abstract: A coaxial to waveguide transition includes a first rigid portion comprising an inverted hollow cone, a second rigid portion comprising a hollow tube, and a third rigid portion comprising a hollow cone. The first rigid portion has a first end and a second end, and tapers inward at a first angle from its first end towards its second end. The second rigid portion has a first end and a second end, with the first end being partially disposed within the second end of the first rigid portion. The third rigid portion has a first end and a second end, with the first end of the third rigid portion being partially disposed within the second end of the second rigid portion. The third rigid portion tapers outward at a second angle from its first end towards its second end, where the second angle is less than the first angle.
    Type: Grant
    Filed: June 15, 2016
    Date of Patent: March 13, 2018
    Assignee: THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE NAVY
    Inventors: Jia-Chi S. Chieh, Aaron Clawson, Michael Civerolo
  • Patent number: 9917341
    Abstract: Aspects of the subject disclosure may include, for example, a system for receiving a communication signal, generating an electromagnetic wave from the communication signal, and inducing the electromagnetic wave on a portion of a transmission medium having an insulation layer with a tapered end covering at least part of a conductor. Other embodiments are disclosed.
    Type: Grant
    Filed: May 27, 2015
    Date of Patent: March 13, 2018
    Assignee: AT&T Intellectual Property I, L.P.
    Inventors: Paul Shala Henry, Robert Bennett, Farhad Barzegar, Irwin Gerszberg, Donald J. Barnickel, Thomas M. Willis, III
  • Patent number: 9912032
    Abstract: A waveguide assembly for propagating electromagnetic signals along a defined path includes a conductive waveguide and a dielectric waveguide. The conductive waveguide includes two side walls that extend parallel to each other between first and second ends of the conductive waveguide. A channel is defined between the two side walls. The dielectric waveguide includes a cladding formed of a first dielectric material. The cladding defines a core region therethrough that is filled with a second dielectric material different than the first dielectric material. A mating end of the dielectric waveguide is received in the channel at the first end of the conductive waveguide to electromagnetically connect the dielectric waveguide to the conductive waveguide. A remainder of the dielectric waveguide is exterior of the conductive waveguide and extends away from the conductive waveguide.
    Type: Grant
    Filed: January 21, 2016
    Date of Patent: March 6, 2018
    Assignees: TE CONNECTIVITY CORPORATION, TYCO ELECTRONICS (SHANGHAI) CO., LTD.
    Inventors: Chad William Morgan, Liang Huang
  • Patent number: 9912029
    Abstract: A waveguide assembly for propagating electromagnetic signals includes first and second dielectric waveguides and a shield. Each of the first and second dielectric waveguides includes a cladding formed of a first dielectric material. The cladding defines a core region therethrough that is filled with a second dielectric material different than the first dielectric material. The shield is disposed between the first dielectric waveguide and the second dielectric waveguide. The shield is electrically conductive. The shield does not surround an entire perimeter of either of the first dielectric waveguide or the second dielectric waveguide.
    Type: Grant
    Filed: January 21, 2016
    Date of Patent: March 6, 2018
    Assignees: TE CONNECTIVITY CORPORATION, TYCO ELECTRONICS (SHANGHAI) CO., LTD.
    Inventors: Chad William Morgan, Liang Huang