Patents Examined by Benny Lee
  • Patent number: 10135109
    Abstract: Provided are coaxial transmission line microstructures formed by a sequential build process, and methods of forming such microstructures. The microstructures include a transition structure for transitioning between the coaxial transmission line and an electrical connector. The microstructures have particular applicability to devices for transmitting electromagnetic energy and other electronic signals.
    Type: Grant
    Filed: January 13, 2017
    Date of Patent: November 20, 2018
    Assignee: NUVOTRONICS, INC
    Inventor: David Sherrer
  • Patent number: 10135104
    Abstract: The present disclosure relates to a waveguide gasket (1) arranged for electrically sealing a waveguide interface (2) between a first contact end (7) and second contact end (8) of the waveguide gasket. The waveguide gasket (1) comprises a plurality of electrically conducting members (3) that are positioned along a circumference (4) along which the waveguide gasket (1) extends. Each electrically conducting member (3) has a first end (5) and a second end (6) compressibly separable by a variable first height (h1) along a first direction (d1). Each first end (5) faces the first contact end (7) and each second end (6) faces the second side contact end (8), where each first contact end (7) and each second contact end (8) are separated by a variable second height (h2) along the first direction (d1), At least one electrically conducting member (3) is arranged to expand only along said circumference (4) when compressed.
    Type: Grant
    Filed: December 15, 2015
    Date of Patent: November 20, 2018
    Assignee: TELEFONAKTIEBOLAGET LM ERICSSON (PUBL)
    Inventors: Lars Bolander, Ove Persson
  • Patent number: 10128555
    Abstract: A digital system has a substrate having a top surface on which a waveguide is formed on the top surface of the substrate. The waveguide is formed by a conformal base layer formed on the top surface of the substrate, two spaced apart sidewalls, and a top conformal layer connected to the base layer to form a longitudinal core region. The waveguide may be a metallic or otherwise conductive waveguide, a dielectric waveguide, a micro-coax, etc.
    Type: Grant
    Filed: December 9, 2016
    Date of Patent: November 13, 2018
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Benjamin S. Cook, Juan Alejandro Herbsommer
  • Patent number: 10128557
    Abstract: The present invention relates to a microstrip circuit and a chip-to-chip interface apparatus comprising the same. According to one aspect of the invention, there is provided a microstrip circuit. The microstrip circuit includes a feeding line providing a signal, a probe being connected to one end of the feeding line, and a patch emitting the signal to a waveguide. The patch is disposed in a layer opposite to a layer in which the feeding line and the probe are disposed, with a core substrate being positioned therebetween. At least one of length of the probe, thickness of the core substrate, and permittivity of the core substrate is determined based on bandwidth of a transition between the microstrip circuit and the waveguide.
    Type: Grant
    Filed: November 3, 2016
    Date of Patent: November 13, 2018
    Assignee: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Hyeon Min Bae, Ha II Song, HuXian Jin, Joon Yeong Lee, Hyo Sup Won, Tae Hoon Yoon
  • Patent number: 10123407
    Abstract: A structure of transmission line includes a first transmission line, a second transmission line and an interlayer via. The first transmission line includes a first line segment, a second segment and a first signal via. The second transmission line includes a third line segment, a fourth segment and a second signal via. Both of the first line segment and the third line segment are disposed in a first signal transmission layer and extend along a first direction. Both of the second line segment and the fourth line segment are disposed in a second signal transmission layer and extend along a second direction. The first signal via is connected to the first line segment and the second line segment. The second signal via is connected to the third line segment and the fourth line segment. The interlayer via is adjacent to the first line segment or the second line segment.
    Type: Grant
    Filed: October 13, 2016
    Date of Patent: November 6, 2018
    Assignee: CHUNG YUAN CHRISTIAN UNIVERSITY
    Inventor: Guang-Hwa Shiue
  • Patent number: 10122062
    Abstract: A metamaterial resonator structure having a size for resonating a predetermined frequency band. The resonator structure includes one or more dielectric slabs each having a top surface and a bottom surface. A conductive resonator element is configured on the top surface of each dielectric slab and has a crescent shape including a center portion and opposing rounded end portions defining a gap therebetween, where the center portion has a wider dimension then the end portions so that a width of the element gradually tapers from the center portion to the end portions, and where the conductive element has a diameter that is a fraction of a wavelength of the frequency band. Several dielectric slabs can be stacked on top of each other, where each slab has a different size and each conductive resonator element is a different size so that each resonator resonates a different portion of the frequency band.
    Type: Grant
    Filed: November 7, 2016
    Date of Patent: November 6, 2018
    Assignee: Northrop Grumman Systems Corporation
    Inventors: Scott R. Sorbel, Vincent M. Ortiz
  • Patent number: 10122339
    Abstract: A composite electronic component includes a composite body in which a common mode filter and a multilayer ceramic capacitor array are coupled to each other, the common mode filter including a first body in which a common mode choke coil is disposed, and the multilayer ceramic capacitor array including a second body in which a plurality of dielectric layers are stacked.
    Type: Grant
    Filed: October 8, 2015
    Date of Patent: November 6, 2018
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Won Sik Chong, Jae Young Park, Jong Young Kim, Woo Jin Choi
  • Patent number: 10116284
    Abstract: A branching device (10) includes a switch (SW1), a fixed filter circuit (11), and a tunable filter (TF1). The switch (SW1) includes a common terminal (Ps11) and individual terminals (Ps12, Ps13). The fixed filter circuit (11) is connected to the individual terminal (Ps12) and has a fixed pass band. The tunable filter (TF1) is connected to the individual terminal (Ps13) and has a tunable pass band. The fixed filter circuit (11) includes filters (FIL1, FIL2) having different pass bands. The pass bands of the filters (FIL1, FIL2) correspond to frequency bands to be used in carrier aggregation.
    Type: Grant
    Filed: June 17, 2016
    Date of Patent: October 30, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Katsuhiro Ikada
  • Patent number: 10116026
    Abstract: A microwave filter has a housing defining an inner cavity. A first resonator is positioned in a first portion of the inner cavity. A second resonator is positioned in a second portion of the inner cavity. A third resonator is positioned in a third portion of the inner cavity. The first resonator and the third resonator are cross-coupled via an iris. The second resonator is elongated and is coupled to the first resonator and the third resonator. The resulting microwave filter has a frequency response having a transmission zero in the lower stopband. A high-pass filter is realized without the use of a cross-coupling probe.
    Type: Grant
    Filed: October 21, 2016
    Date of Patent: October 30, 2018
    Assignee: COM DEV LTD.
    Inventors: Qiang Shi, Ming Yu
  • Patent number: 10117325
    Abstract: A circuit structure and a mobile terminal having a circuit structure are disclosed. The circuit structure may include two transmission lines that extend in a first direction to transmit a signal, and a guard pattern provided between the two transmission lines. The guard pattern may include a plurality of slots each having an open end and a closed end in a second direction. The guard pattern arranged between the transmission lines may lower cross talk by adjusting mutual capacitance so as to improve signal quality.
    Type: Grant
    Filed: June 10, 2016
    Date of Patent: October 30, 2018
    Assignee: LG ELECTRONICS INC.
    Inventors: Inmu Kim, Youngmin Cho, Kipyoung Kim
  • Patent number: 10116280
    Abstract: A coil component includes a magnetic body having a plurality of filter parts disposed on a substrate and spaced apart from each other in a thickness direction. A plurality of input terminals and output terminals are disposed on outer surfaces of the magnetic body. Each of the filter parts includes upper and lower coils disposed in the magnetic body and spaced apart from each other in the thickness direction. In one example, a number of turns of the upper and lower coils of one filter part is different from a number of turns of the upper and lower coils of another filter part adjacent thereto. In another example, the number of turns of the upper and lower coils of the one and the other filter parts are the same, but capacitances of the one and the other filter parts are different.
    Type: Grant
    Filed: April 7, 2016
    Date of Patent: October 30, 2018
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Won Chul Sim, Dong Hwan Lee, Young Ghyu Ahn
  • Patent number: 10116031
    Abstract: A vertical-transition structure comprises a microstrip line and a combination of a coaxial connector and a metallic ring underneath the microstrip line. A first through hole is created next to the microstrip line and near one end of its signal line. The metallic ring has a second through hole. The coaxial connector has a center conductor including an extended portion to be inserted into the second through hole via its center, and subsequently through the first through hole to connect to the signal line vertically. Specially, the extended portion is not inserted through the center of the first through hole. The present structure can improve the high-frequency insertion loss of the vertical transition caused by the sudden change of electromagnetic field distributions from a coaxial line to a microstrip line and the resonant response of the coaxial connector, and therefore, increase the 1-dB transmission passband of the vertical transition substantially.
    Type: Grant
    Filed: June 7, 2016
    Date of Patent: October 30, 2018
    Assignee: NATIONAL TAIPEI UNIVERSITY OF TECHNOLOGY
    Inventors: Eric S. Li, Hong-Wei Huang
  • Patent number: 10116024
    Abstract: A notch filter includes a dielectric substrate, a microstrip transmission line on the dielectric substrate, and a fork-shaped open-circuited stub embedded in the microstrip transmission line.
    Type: Grant
    Filed: May 11, 2016
    Date of Patent: October 30, 2018
    Assignee: KING ABDULAZIZ CITY FOR SCIENCE AND TECHNOLOGY
    Inventors: Hussein N. Shaman, Abdulrahman S. Alarifi
  • Patent number: 10116027
    Abstract: An automatic RF filter tuning system and a method for manufacturing a filter using the same are disclosed. An RF filter tuning system for tuning an RF filter that includes a plurality of cavities having resonance elements and a cover having tuning areas that are positioned correspondingly to the resonance elements, includes a measuring unit configured to measure resonance characteristics of the cavity of the RF filter, a control unit configured to calculate a tuning value of the RF filter based on the resonance characteristics, and a tuning unit configured to tune the RF filter based on the tuning value calculated by the control unit. The tuning unit includes a striking unit configured to strike the tuning area of the cover of the RF filter, thereby adjusting the resonance value and tuning the RF filter.
    Type: Grant
    Filed: June 7, 2016
    Date of Patent: October 30, 2018
    Assignee: KMW INC.
    Inventors: Nam-Shin Park, Joung-Hoe Kim, Don-Yong Lee, Kang-Hui Suh, Jong-Youn Jung, Sang-Hwan Cho, Dong-Cheon Kim, Sang-Yoong Kim, Yong-Jin Park, Oh-Kwon Kim
  • Patent number: 10110191
    Abstract: A laminate defining a high-frequency laminated component includes a ground electrode on a bottom surface of a lowermost insulating layer. A second insulating layer includes an inner-layer ground electrode arranged over substantially the entire surface thereof. A portion from a third insulating layer to a fifth insulating layer is provided with a capacitor electrode defining a series capacitor of a ground impedance adjustment circuit and capacitor electrodes defining a first parallel capacitor and a second parallel capacitor. A sixth insulating layer has an inner-layer ground electrode provided over substantially the entire surface thereof. The inner-layer ground electrodes are arranged in electrical continuity with the ground electrode by via holes.
    Type: Grant
    Filed: September 29, 2015
    Date of Patent: October 23, 2018
    Assignee: MURATA MANUFACTURING CO., LTD.
    Inventor: Tetsuo Taniguchi
  • Patent number: 10103419
    Abstract: The present disclosure enhances flexibility, enables the transmission of power, and improves reliability using a simple, low-cost, easy-to-manufacture configuration by disposing a pair of power supplying lines on the outside in the longitudinal direction of the rectangular cross-section of a dielectric. Here, a waveguide is provided with a solid dielectric, a pair of power supplying lines and an external conductor surrounding the dielectric. The solid dielectric has a rectangular cross-section. The pair of power supplying lines are disposed on the outside in the longitudinal direction of the cross-section of the dielectric. The outer surface of the dielectric is slidably in close contact with the inner surface of the external conductor.
    Type: Grant
    Filed: May 26, 2015
    Date of Patent: October 16, 2018
    Assignee: Molex, LLC
    Inventors: Takeshi Tsukahara, Shigeyuki Hoshikawa, Mio Tanaka
  • Patent number: 10103418
    Abstract: Disclosed is a printed-circuit board (PCB) structure having an electromagnetic-tunnel-embedded architecture, the PCB structure including a PCB, and an EM-tunnel-embedded in the PCB, wherein the EM-tunnel includes a dielectric core and a metal clad which surrounds the dielectric core and has at least one port exposed to a surface of the PCB.
    Type: Grant
    Filed: February 12, 2016
    Date of Patent: October 16, 2018
    Assignee: Korea Advanced Institute of Science and Technology
    Inventors: Hyo Hoon Park, Hyeon Min Bae, Tae Woo Lee
  • Patent number: 10096876
    Abstract: Methods, systems, and devices are described that include one or more sidewall features to improve performance of a waveguide device. In particular, the sidewall features may be utilized within a polarizer section of a polarizer device such as a septum polarizers. The sidewall feature(s) may include recesses and/or protrusions. When a plurality of sidewall features are employed, the size, shape, spacing and kind (e.g., recess or protrusion) may vary according to a particular design.
    Type: Grant
    Filed: November 13, 2015
    Date of Patent: October 9, 2018
    Assignee: ViaSat, Inc.
    Inventor: Anders Jensen
  • Patent number: 10096884
    Abstract: A resonator, a filter, a duplexer, and a multiplexer are disclosed. In an embodiment a resonator includes a resonant cavity casing having a resonant cavity and an open end, a cover covering the open end and being connected to the resonant cavity casing and a resonance tube located inside the resonant cavity. The resonator further includes a tuning rod disposed inside the resonance tube and a dielectric material located in the resonant cavity, wherein the dielectric material is located in a capacitance area formed between a top of the resonance tube and the cover, wherein the tuning rod is rotatable relative to the dielectric material, and wherein surfaces of the tuning rod and the dielectric material face each other and comprise non-circular structures so that an overlapping of the surfaces is changeable to adjust a frequency when the tuning rod is rotated relative to the dielectric material.
    Type: Grant
    Filed: May 16, 2016
    Date of Patent: October 9, 2018
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Zhen Shen, Dan Liang, Xiaoyi Deng
  • Patent number: 10096881
    Abstract: A dielectric waveguide coupling system for launching and extracting guided wave communication transmissions from a wire. At millimeter-wave frequencies, wherein the wavelength is small compared to the macroscopic size of the equipment, transmissions can propagate as guided waves guided by a strip of dielectric material. Unlike conventional waveguides, the electromagnetic field associated with the dielectric waveguide is primarily outside of the waveguide. When this dielectric waveguide strip is brought into close proximity to a wire, the guided waves decouple from the dielectric waveguide and couple to the wire, and continue to propagate as guided waves about the surface of the wire.
    Type: Grant
    Filed: May 17, 2016
    Date of Patent: October 9, 2018
    Assignee: AT&T INTELLECTUAL PROPERTY I, L.P.
    Inventors: Paul Shala Henry, Donald J Barnickel, Farhad Barzegar, Robert Bennett, Irwin Gerszberg, Thomas M. Willis, III