Abstract: A layer of aluminum on a semiconductor substrate is covered by a layer of phospho-silicate glass. The surface of the semiconductor chip is covered with a positive photoresist film which is then heat treated. An upper surface of the photoresist film is covered with a polyimide resin which is heat treated, thereafter. If the semiconductor device is devoid of the layer of phospho-silicate glass, and the layer of aluminum is exposed, a positive photoresist film is interposed on the aluminum and the polyimide resin is applied to cover the upper surface of the interlayer, and is heat treated.

Abstract: The present invention relates to a coating apparatus comprising a coating vessel rotatably supported at one end and connected to a vacuum source by a coaxially arranged and co-rotatable tube containing a spray nozzle. The tube is supported separately from the coating vessel and is arranged for movement along the axis of rotation of the coating vessel. The coating vessel includes a discharge opening closable by a cover which is carried by the tube. The tube is preferably guided for movement along the axis of the coating vessel within a piece of pipe which is rotatably supported within a bearing box which is pivotable away from the coating vessel.

Abstract: A method of applying a paste through a hole in a printed circuit board. A mask is provided with a hole with an upper larger cross-section portion and a lower smaller cross-section portion, the junction between the portions forming a ring-shaped land. The lower hole portion has a cross-section larger than the cross-section of the hole in the printed circuit board. The printed circuit board is positioned adjacent the mask with the hole therein aligned with the hole in the mask, and paste is applied to the hole in the mask from the upper hole portion. This paste is pressed through the hole in the mask and fills the hole in the circuit board with paste and coats the surface of the circuit board which is toward the mask and/or the surface which is away from the mask in the area around and close to the hole with the paste.

Abstract: An integral graphite susceptor of the barrel type comprising a hollow polyhedron arranged to support one or more semiconductor substrates on its outer planar wall surfaces. The substrates are supported in a novel column and row array in which each wafer is mounted on a wall surface portion that is related to the other adjacent wall surface portions in an equilateral triangular configuration to provide an efficient substrate support susceptor. Wafer edges extending beyond corners of the susceptor cause a disturbance in the gas flow resulting in more uniform deposition of epitaxial material.

Abstract: Structure of the insulator--semiconductor type constituted by a semiconducting crystalline substrate formed from a III-V compound of formula (A.sup.III B.sup.V) coated with an insulating layer, wherein the substrate has a specific crystalline orientation and wherein the insulator is a sulphide in accordance with the formula (A.sup.III B.sup.V)S.sub.4.It also relates to a process for the preparation of such a structure.Applications of the invention occur in the fields of microelectronics and optoelectronics.

Abstract: A method for applying a dense, hard, adhesive and wear-resistant layer of cermets or cermic material on a metal object. A mixture of the hard cermet or ceramic material with a bonding metal is sprayed onto the metal object. A gas-tight metal foil is applied over the sprayed on coating and the metal foil and sprayed on coating are isostatically compressed onto the metal object. The metal foil is removed leaving a dense, hard, wear-resistant layer of cermets or ceramic material and bonding metal.

Abstract: A vapor phase deposition apparatus includes a coaxially mounted reactor tube, jacketed assembly tube, bearing/plug assembly, and rod/substrate holder. Gas inlets are provided in the reactor tube, and assembly tube and a vent is provided on the jacketed portion of the assembly tube, such that a double counterflow gas pattern can be established in the apparatus. The apparatus permits controllable deposition cycle and it can be readily disassembled for periodic maintenance.

Abstract: A high-pressure, high-temperature gaseous chemical apparatus particularly designed for oxidation of silicon wafers and providing for pressure equalization across the wall of the vessel providing the reaction chamber, for a water boiling enclosure within the reaction chamber and the injection of liquid water under pressure into the enclosure and for the continuous flow through of water vapor at high temperature and high pressure in the reaction chamber while maintaining the aforementioned pressure balance.

Abstract: Adjusting method and apparatus for a cylindrical article peripheral surface coating machine characterize in that a coating clearance between a coating roller and a cylindrical article fitted over each mandrel on a travelling mandrel conveyor, the coating clearance being formed for allowing the coating roller to be brought into rolling contact with the cylindrical article when the latter has entered the coating zone, a transfer clearance between the coating roller and a transfer roller formed for allowing the latter to be brought into rolling contact with the former, and a receiving clearance between the transfer roller and a fountain roller formed for allowing the latter to be brought into rolling contact with the former, are made adjustable each independently without affecting each other.

Abstract: A method for adhering a passivation layer to gold regions in a semiconductor device. The method comprises the steps of providing a semiconductor device having at least one gold region formed thereon. A layer of a metal reactive with the gold is then deposited over the gold region so as to form a gold-reactive metal interface region. The gold and metal are then reacted at the interface region. Any metal which does not react is removed so as to expose a reacted interface region. Finally, a layer of passivation material is deposited over the exposed reacted interface region. Because the passivation material is then in contact with reacted gold regions, its adherence thereto is substantially increased.

Abstract: A stratification mass for the production of top surfacing layers particularly through dipping, painting, filling or spraying on a carrier (especially for friction/slide layers of bearing laminates having metallic base members) of a matrix foundation substance of fluoride-held polymers which has admixed metal or metal-alloy particles and/or additive material with friction and/or slide-improving characteristics. The applied layer material is subjected to heat to melt the same, and the layer is then cooled and pressed. The synthetic substance of the matrix can contain a primer, such as chromium oxide.

Abstract: Apparatus for generating layers on a carrier film wherein a plurality of glow polymerization layers and intervening metal layers are applied to a carrier foil 3 on a continuous process. The carrier foil is passed over a drum 4 and conducted through a first vacuum system wherein glow polymerization electrodes apply glow polymerization layers to the foil then the foil passes through a vacuum lock into a second vacuum chamber wherein a metallization device 10 is situated so as to apply a metallization layer. Then the foil passes through a second vacuum lock to the first vacuum chamber wherein a second polymerization layer is applied over the metallization layer. A diaphragm strip 19 also passes over the foil and is continuously used during the polymerization and metallization steps.

Abstract: A method of manufacturing a printed wiring board completely free from trouble of solder bridging. The printed wiring board of the present invention is provided with a raised portion of solder resist ink in the form of a ridge around the periphery of the land to be printed or at an area between adjacent lands to be soldered, the said raised portion being an extension of a solder resist thin layer coated on the insulator base board exclusive the said land.

Abstract: An apparatus is disclosed for fluidizing and vaporizing particulate solid coating reactants by first establishing a fluidized bed of dispersed particulate solid coating reactants and thereafter drawing a volume of fluidizing gas and suspended particulate solid coating reactant to a vaporizer while mixing an additional volume of gas therewith and then vaporizing the dispersed particulate solid coating reactant in the reactant-gas mixture. The reactant-gas mixture is then directed into contact with a hot substrate to be coated in order to deposit a film thereon.

Abstract: This disclosure describes a vapor coating apparatus for the fabrication of transparent glass window structures of the type bearing a first coating of infra-red reflective material which is advantageously less than about 0.85 microns in thickness and wherein the observance of iridescence resulting from such a first coating is markedly reduced by provision of a layer of continuously varying refractive index between the glass and the coating, such that the refractive index increases continuously from the glass to the first coating, thereby preventing the observation of iridescence. A particular advantage of the invention is its efficacy with clear and lightly tinted glasses wherein the problem of iridescent color has had its greatest commercial impact. A heat exchanging wall is positioned in the gas duct assembly to control the temperature of the reaction gases and non-glass surfaces of the reaction zone.

Abstract: In a preferred embodiment of the invention, a manifold in the form of a pipe having a closed end is utilized to supply a finishing agent to orifices arranged at spaced intervals along the pipe. A foam material surrounds the manifold to receive the finishing agent and to apply it in a thin film to the curved surface of an element comprising a longitudinal section of a cylinder. The film is retained on the curved surface by surface tension as it moves under the force of gravity to a longitudinal edge of the cylindrical section. A web of fabric is tensioned against the section edge as the fabric moves past the cylindrical section. The direction of fabric movement is such that the film of finishing agent is applied to the fabric immediately ahead of the line of contact between the fabric and the section edge.

Abstract: To increase the response speed and sensitivity, while providing higher output voltages and permitting higher loading of the electrodes of gas sensors, particularly exhaust gas sensors to determine the transition of exhaust gases from internal combustion engines between reducing and oxidizing state, the sintering activity of the electrode which, typically, a cermet electrode, is selected to be less than that of the solid electrolyte body so that the resulting pore structure will be more open than that of the solid electrolyte body. The electrodes, essentially, consist of finely divided ceramic material, such as zirconium oxide, and finely divided electron conductive material such as platinum.

Abstract: A bath for the electroless deposition of palladium comprises an aqueous solution of divalent palladium, ammonia or amine, and a tertiary amine borane. The bath may contain thio-organic, iminonitrile or other stabilizers. A hard palladium alloy is plated, having the composition of 1-3% amorphous borone, 1-3% crystalline PdH.sub.0.706, the remainder amorphous palladium. A strong laminate is formed when the alloy is plated on electroless nickel.

Abstract: By sealing the periphery of a printed circuit board, the previously exposed edges of the board are substantially prevented from moisture wicking. This sealing of the periphery can be made concurrently with the plating of through-holes on the board. With this process, current leakage paths due to board moisture wicking within the board is significantly reduced.