Abstract: A pile fabric is disclosed and claimed, comprising a ground fabric of polyester filaments and a pile of natural fibers, up to four pile picks being woven between each two adjacent weft yarns of the ground fabric. The bond of the pile picks consists at least in part of three or five warp through-pile weavings.A special use of this fabric is an upholstery cloth for car seats and other seats of furniture.

Abstract: An improved multilayer flexible body system, adapted for use in protective sports equipment, is described which comprises in combination in sequence an inner cover layer; a first flexible padding layer; a first elastomer containing woven fabric layer; a woven metal mesh layer; a second elastomer containing woven fabric layer; a second flexible padding layer; and an outer cover layer, each of which are securely bonded together at their periphery. The construction method also ensures that the woven metal mesh layer is free to move between the adjacent fabric layers.

Abstract: A thermoplastic elastomer laminate comprising: a base fabric, a polyolefin intermediate layer formed on said fabric comprising a polyolefin, at least a part of which is modified by grafting with at least one monomer selected from unsaturated carboxylic acids and derivatives thereof, and a thermoplastic elastomer surface layer formed on said intermediate layer comprising a thermoplastic elastomer. The surface layer is comprised of a composition comprising: a polyolefin resin and an ethylene/alpha-olefin copolymer rubber, in which only said copolymer rubber is, or both said copolymer rubber and at least a part of said polyolefin resin are partially crosslinked. The product is attractive as an artificial leather.

Abstract: Disclosed is a non-inflammable insulating, composite material capable of being shooted onto a surface to be coated, such as the wall of a building to be insulated. This material comprises a fibrous-like, synthetic forsterite obtained by calcination of chrysolite asbestos fibers at a temperature from 650.degree. to 1450.degree. C.; an inorganic, lightweight filler selected amongst vermiculite, perlite and their mixtures; and a non-inflammable, hydraulic or silicate binder contained in such an amount as to make the material sufficiently adhesive to be shooted as a coating, either as such or after wetting, onto the surface to be insulated. The weight ratio of the synthetic forsterite to the inorganic filler is ranging from 20:80 to 80:20 to adjust the volumic weight of the final product from about 0.20 to about 0.50 gram per cm3. Also disclosed are methods of manufacturing such a non inflammable, insulating, composite material in a wet, ready-to-be-shooted form.

Abstract: A method of making an applique by printing a release adhesive upon a release sheet; flocking flock through an open section of a barrier into the adhesive to result in at least two patterns arranged to form a predetermined design adhered to the release sheet; applying a binding adhesive to free ends of the flock; transferring at least one of the predetermined designs of flock to a substrate material; and affixing the substrate material; with said predetermined design of flock to an article. An applique composed of substrate material adapted to be affixed to an article; and flock having end portions coated with a binder adhered in a predetermined design to the substrate material. A article composed of a surface area; a substrate material affixed to the surface area; a layer of binding adhesive on the substrate; and flock having end portions adhering to the layer of binding adhesive to form a predetermined design on the substrate material.

Abstract: A method for imparting and retaining hydrophilicity and liquid strike-through properties within an essentially hydrophobic polyolefin-containing nonwoven material and the corresponding fiber, fibrillated film, and nonwoven product thereof, whereby essentially hydrophobic polyolefin-containing fiber or film is topically treated with an effective amount of one or more of a water soluble polyalkoxylated polydimethylsiloxane, an alkoxylated ricinolein with certain fatty acids, or corresponding hydrogenated derivatives thereof.

Abstract: Insulating material comprising continuous filaments of a synthetic material characterized in that the filaments have a mean diameter of from 4 to 20 microns and in that the filaments have been separated by a stretching and subsequent relaxation of a crimped tow of said filaments.

Abstract: A composite structure having a fibrous reinforcing body formed from fibers of a refractory material, a ceramic matrix surrounding the fibers of the reinforcing body and an intermediate layer of a refractory material having a laminar structure disposed between the fibers of the refractory material having a laminar structure disposed between the fibers of the refractory material and the ceramic matrix and adherent to both. The intermediate layer has a thickness sufficient to reduce the susceptibility of the structure to crack propagation and to increase impact strength but not exceeding 3.0 microns. The intermediate layer is also elastically deformable in shear and has an elongation at break greater than the matrix.

Abstract: A laminated sail cloth includes a central layer of spaced intersecting scrim yarns which intersect at acute angles in such a matter to reinforce the fabric along the fill and bias directions of the fabric.

Abstract: A semiconductor device is fabricated by applying a glass layer of material over a junction area of a semiconductor die. Aluminum metalization layers are applied to the top and bottom of the die at locations spaced from the glass and are used for a high temperature brazing of contact members to the die. Etching of the die, plus unavoidable etching of the contact members, is conducted without contamination of the junction area.

Abstract: A processing apparatus and method for performing a descum process (i.e. a process for removal of polymers and other organic residues) which uses a remote plasma, supplied through a distributor which includes a two-stage showerhead, to achieve improved results.

Abstract: A process for forming backside contacts includes first forming an etch stop layer (12) beneath the surface of a silicon substrate. An active circuit is then formed in the silicon surface and associated metal interconnecting layers formed on the upper surface of the substrate. A planarizing layer is then formed on the upper surface of the substrate which is operable to be connected to a mechanical support. Thereafter, the backside of the substrate is etched away up to the etch stop layer (12). The thickness of the remaining substrate between the metal layers on the upper surface and the etch stop layer is sufficiently thin that the alignment marks on the upper surface can be seen through the substrate. These alignment marks are utilized to form vias from the backside to the active elements and then deposit and pattern interconnecting layers on the backside.

Abstract: A method for correctly positioning a metallic plate supporting a semiconductor chip in a mold used for encapsulation, wherein according to a first solution, at least a pair of retractable locating pins are utilized together with a lead connected to the supporting plate. The ends of the locating pins are retracted in the final phase of encapsulation, from the surfaces of the plate, whereas in the initial phase they are in direct contact with the surfaces. According to a second solution, a pair of clamping pins are indirectly connected to the plate through the interposition of insulating thicknessings.

Abstract: A process for flashing a thin layer of silver on metal leadframes using no mask steps and a minimal amount of silver. An unmasked metal leadframe is placed into a cleaning bath that includes silver in solution and has no outside electrical driving force to assist plating. The leadframe is removed from the cleaning bath once a uniform silver layer having a thickness of 100 to 1000 angstroms is plated thereon. The silver layer need not be exact and, therefore, it is not critical that the period of time the leadframe remains in the cleaning bath be exact.

Abstract: Magnetosensitive semiconductor devices are produced by forming a magnetosensitive part on one surface of a semiconductor substrate, pasting the semiconductor substrate thus formed on a jig, wrapping or etching the opposite surface of the semiconductor substrate, pasting a magnetic substrate on it with the jig pasted thereon, dividing the pasted substrates into individual unistructural elements each with a semiconductor chip and a magnetic piece, and die bonding, wire bonding and resin molding these individual elements.

Abstract: In a method for encapsulating microelectronic semiconductor and thin film devices, a reliable hermetically sealed encapsulation of the circuit components is achieved, even under long exposure to extreme environmental conditions of moisture and corrosive gases. A direct soldered connection and sealing of a metal foil capsule is achieved which is more reliable than glued capsules, and more economical than welded capsules.

Abstract: A processing apparatus and method for depositing doped or undoped polysilicon on a wafer utilizing a single process chamber to heat the wafer, provide a silicon comtaining gas, and if desired, an appropriate dopant gas to the chamber with the excitation energy being provided by either or both of a remotely generated plasma form and illumination of the wafer with an in situ generated ultraviolet energy.

Abstract: A method of annealing a wafer in a rapid thermal annealer is disclosed. The walls of the chamber are heated more rapidly than is the wafer. In a preferred embodiment, the interior of the graphite walls of the annealer is lined with a molybdenum sheet which is open toward the lamps that heat the chamber. Thus, the walls heat very rapidly to a temperature greater than the condensation point of arsenic, preventing arsenic condensation on the walls. Effective annealing can be achieved at wall temperatures in the range of 500.degree. to 600.degree. C. Prior to the heat ramp up, an arsenic atmosphere, preferably trimethylarsenic (TMAs) at an appropriate overpressure is introduced. This overpressure is maintained both during the heating and cooling cycle. By the use of this method, the exposure time for annealing can be reduced from prior times of as much as 20 minutes to as little as 10 seconds.

Abstract: A method of constructing a semiconductor laser includes producing a lead frame having a central lead which is used as a die pad at its central portion and two outside leads connected to the central lead by tie bars, mounting a semiconductor laser chip and a light receiving chip on the central lead of the lead frame, connecting the semiconductor laser chip and the light receiving chip to respective outside leads with wires, sealing portions of the leads, the wires, and both chips in a transparent package, and cutting the tie bars to disconnect the outside leads from the central lead.

Abstract: The coated optical fiber of the invention is prepared by providing a coating layer of an ultraviolet-curable organopolysiloxane or a composition comprising the same and irradiating the coating layer with ultraviolet. Specifically, each of the terminal silicon atoms of the organopolysiloxane, which preferably has a linear molecular structure, has two or more ethylenically unsaturated polymerizable groups bonded thereto through an oxygen atom, such as CH.sub.2 .dbd.CHCOOCH.sub.2 CH.sub.2 --, [CH.sub.2 .dbd.C(CH.sub.3)COOCH.sub.2 ].sub.3 C--CH.sub.2 -- and (CH.sub.2 .dbd.CHCOOCH.sub.2).sub.2 C(C.sub.2 H.sub.5)CH.sub.2 --. By virtue of this unique molecular structure of the organopolysiloxane, the coating layer is rapidly cured by ultraviolet irradiation to give a cured coating layer exhibiting very low water absorption and small temperature dependency of the Young's modulus at low temperatures.