Abstract: An electronic component comprises: a first board; a first flexible board that is used to connect the first board and a second board; and a first transmission wiring, formed on the first board, the second board and the first flexible board, that transmits a signal from the first board to the second board. One of the first flexible board is connected to the first board with a conductive connecting material, and a connector capable of attaching to and detaching from the second board is provided on the other end of the first flexible board.

Abstract: A wiring substrate includes a substrate having a first surface, a first lead terminal in contact with a ground conductor on the first surface, and a second lead terminal in contact with a signal conductor on the first surface and aligned with the first lead terminal. The first lead terminal includes a first end, a contacting part, a connecting part, a lead part and a second end. The contacting part includes the first end and is in contact with the ground conductor. The connecting part includes a first bend, a short-distance part and a second bend. The first bend is away from the first end across the contacting part. The second bend is closer to the second end than the first bend. The short-distance part has a shorter distance to the second lead terminal than the contacting part in plan view toward the first surface.

Abstract: A circuit board includes an input side and an output side oppositely arranged, and the output side is configured to electrically connect to a display substrate. The circuit board includes a plurality of signal lines extending in a direction from the input side to the output side. Each of the plurality of signal lines includes a main body and a plurality of output branches. Each of the plurality of output branches is connected to one end of the main body close to the output side and has a same line width. A line width of the main body is greater than a sum of line widths of all the output branches belonging to same signal line.

Abstract: A printed circuit board includes: an insulating layer; first and second pads respectively disposed on an upper surface of the insulating layer; and a solder resist layer disposed on the upper surface of the insulating layer, and having first and second openings at least partially exposing the first and second pads, respectively, wherein the solder resist layer contacts a side surface of the first pad, and the solder resist layer is spaced apart from the second pad.

Abstract: An electronic device includes a first circuit board, a second circuit board, and an interposer circuit board. The interposer circuit board defines a walled interface mechanically attaching the first circuit board to the second circuit board. One or more electronic circuit components are positioned within the walled interface and are mechanically attached to one of the first circuit board or the second circuit board. An electronic circuit interface component is mechanically attached to the first circuit board outside the walled interface. The electronic circuit interface component is electronically coupled to the one or more electronic circuit components.

Abstract: A substrate structure includes a carrier board and a laminated structure. The carrier board has a board body, through holes and conductive portions. The board body has a first surface and a second surface. The through holes communicate the first and second surfaces. Each through hole has a first opening and a second opening. The conductive portions are arranged on the first surface, and the first opening is sealed by a corresponding conductive portion. The laminated structure includes a viscid layer and conductive elements. One surface of the viscid layer is in surface contact with the second surface. Each conductive element passes through and accommodates in the viscid layer, and corresponds to one through hole in a projection direction of the carrier board. One end of each conductive element is electrically connected to one conductive portion through the corresponding through hole.

Abstract: The present disclosure relates to a printed circuit board. The printed circuit board includes a plurality of insulating layers each having a plurality of concave portions; a plurality of conductor pattern layers disposed in a plurality of concave portions of each of the plurality of insulating layers; first and second via holes connected to one of the plurality of concave portions independently of each other and penetrating through at least two of the plurality of insulating layers independently of each other; and first and second via conductors disposed in the first and second via holes, respectively, and connecting two of the plurality of conductor pattern layers independently of each other. An average width of the first via conductor is greater than that of the second via conductor on a cross-section.

Abstract: A release film includes a first release film disposed on a printed circuit board and a connector that is connected to the printed circuit board. The first release film comprises a fixing portion having a shape extending in one direction. A second release film is disposed under the printed circuit board. The second release film includes an incision portion. The fixing portion extends into the incision portion.

Abstract: An information handling system can comprise first and second housings having pivotally coupled rear edge portions such that the housings are pivotable between open and closed states. A hinge cover can extend along at least a portion of each housing's rear edge portion. A flexible printed circuit having opposing upper and lower surfaces can extend between the housings. The circuit can include a cover segment in which the circuit's upper surface is fixed to the hinge cover's inner surface, two housing segments that are each fixed to a respective one of the housings, and two free segment that each connect a respective one of the housings segments to the cover segment, are movable relative to the hinge cover and to the housings when the housings pivot between the open and closed states, and underlie the inner surface of the hinge cover when the housings are in the open state.

Abstract: According to one embodiment, an isolator includes: a first semiconductor chip; a second semiconductor chip; a first wiring board including a first surface provided thereon with the first semiconductor chip; a second wiring board including a second surface provided thereon with the second semiconductor chip, the second wiring board being spaced apart from the first wiring board; a third wiring board spaced apart from each of the first and second wiring boards; a first coil on the first surface; a second coil on the second surface; a third coil on a third surface of the third wiring board, the third surface facing the first and second surfaces, the third coil facing the first coil; a fourth coil on the third surface, facing the second coil, and electrically coupled to the third coil; and an insulator provided between the first to fourth coils.

Abstract: A substrate unit of an embodiment includes a plurality of substrates and a holding part. The plurality of substrates are arranged at a constant interval in a thickness direction. The holding part integrally holds the plurality of substrates and allows, relative to one substrate of the plurality of substrates, another substrate to be movable along a plane direction of the substrate.

Abstract: A multilayer substrate module includes a first substrate portion including a first substrate portion body including first insulator layers stacked in a vertical direction and a first conductor layer and/or a first interlayer connection conductor provided at the first substrate portion body. A second substrate portion includes a second substrate portion body including second insulator layers stacked in the vertical direction and a second conductor layer and a second interlayer connection conductor provided at the second substrate portion body, and is mounted on an upper surface of the first substrate portion. A mount device is mounted on an upper surface or a lower surface of the second substrate portion. At least a portion of an inductance component is defined by the first conductor layer and the first interlayer connection conductor.

Abstract: A flexible printed circuit board (FPCB) of an electronic device including a flexible display having a shape deformed by a hinge structure is provided. The FPCB of an electronic device includes a plurality of bending portions and a plurality of non-bending portions. The plurality of bending portions is bent according to a deformation of a shape of the electronic device. The plurality of non-bending portions are positioned on a periphery of the plurality of bending portions. The plurality of bending portions and the plurality of non-bending portions are formed to have different thicknesses.

Abstract: A drive circuit carrier and a display device. The drive circuit carrier includes a flexible substrate; and first test leads and second test leads, alternately staggered on a first surface of the flexible substrate in sequence. A first end of each first test lead is flush with a first edge of the first surface, and a second end of each second test lead is away from the first edge relative to the first end.

Abstract: According to one embodiment, an electronic device includes an insulating base including a first portion which is stretchable and a second portion which is adjacent to the first portion and is stretchable, the first portion and the second portion being integrally formed, and electrical elements disposed in the first portion and the second portion, respectively. A first elongation rate of the first portion is different from a second elongation rate of the second portion.

Abstract: A composite electronic component includes a ceramic electronic component including a body, comprising a dielectric layer and an internal electrode, and an external electrode disposed on the body and connected to the internal electrode; and an interposer including a substrate, disposed below the body, and a connection electrode disposed on the substrate and connected to the external electrode by a connection member. The external electrode includes a first electrode layer including metal particles and an insulating resin.

Abstract: A compact keyboard, monitor, and mouse (KMM) system includes a tray subsystem including a pair of drawer slides configured to mate with the equipment rack, each drawer slide having a bottom plane parallel to the ground when installed in the equipment rack. The system further includes a console housing supported by the tray subsystem. The console housing has a top surface that defines recesses for a keyboard and a monitor. The system also includes a keyboard. When secured in the keyboard recess, the keyboard is positioned parallel to the bottom plane of the tray subsystem. When positioned in the monitor recess, the monitor is canted at an angle relative to the bottom plane of the tray subsystem.

Abstract: A driver substrate and a display panel are disclosed. The driver substrate includes a base substrate and a flexible circuit board. The base substrate has a first bonding portion. The flexible circuit board is disposed on a bonding surface of the first bonding portion and bends from the bonding surface to a side of the first bonding portion away from the bonding surface. The flexible circuit board includes a bent portion, an anti-scratch structure is disposed between the bent portion and the first bonding portion, and the bent portion is attached to the anti-scratch structure.

Abstract: An optical module includes: a stem made of metal; a ground pin including a pin portion and a joint portion having a diameter larger than a diameter of the pin portion and joined to an outer flat surface of the stem; a flexible printed circuit including a wiring pattern on a front surface and a ground pattern having an exposed surface at a position facing the outer flat surface of the stem on a back surface, in which a tip portion of the pin portion of the ground pin penetrating a second through hole is electrically connected to the second through hole on the front surface; and a plate made of metal, having a back surface joined to the outer flat surface of the stem and a front surface joined to the exposed surface of the ground pattern.

Abstract: An electronic device includes at least a housing, a mainboard, a conductive coil, and a conductive adapter. The housing includes an inner surface and an outer surface provided opposite to each other. The mainboard is arranged on the inner surface. The conductive coil is arranged on the inner surface and is integrally arranged with the housing. The conductive coil includes a winding portion, an outer connection terminal, and an inner connection terminal. In a radial direction of the winding portion, the mainboard is located at an outer side of the winding portion. The outer connection terminal is connected to the winding portion and is located at the outer side of the winding portion. The outer connection terminal is electrically connected to the mainboard.