Patents Examined by Binh B Tran
  • Patent number: 11910531
    Abstract: A flexible printed circuit board (PCB) may have one or more coin cell batteries mounted thereto such that the flexibility of the flexible PCB is maintained. The flexible PCB has one or more battery contact pads fabricated thereon. Each battery contact pad includes a pattern of metalized vias each extending from a top surface to a bottom surface of the flexible PCB. A coin cell battery may be positioned over or under the battery contact pad. Conductive light curable epoxy is applied to and in each metalized via to contact and adhere to the coin cell battery to form a conductive path from the battery through the battery contact pad to printed conductors on the flexible PCB. Methods of mounting one or more coin cell batteries to a flexible PCB are also provided, as are other aspects.
    Type: Grant
    Filed: March 11, 2021
    Date of Patent: February 20, 2024
    Assignee: Ascensia Diabetes Care Holdings AG
    Inventor: Igor Y. Gofman
  • Patent number: 11908351
    Abstract: A bracket for a flexible display module is provided. The flexible display module includes a flexible display panel and a transparent cover plate. The flexible display panel includes a display region, a binding region opposite to the display region and a bending region connecting the display region and the binding region. The transparent cover plate is fixed to the display region of the flexible display panel. The bracket includes a first body and a second body fixedly connected with each other. An inner surface of the first body is provided with an accommodating region for accommodating the bending region of the flexible display panel. The second body is fixedly and detachably connected to a back of the flexible display panel.
    Type: Grant
    Filed: September 20, 2021
    Date of Patent: February 20, 2024
    Assignees: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Danyang Bi, Xiaoxia Liu, Xiaoliang Fu, Haotian Yang, Kang Wang, Renzhe Xu, Wei Chen, Xiaodong Hao
  • Patent number: 11899511
    Abstract: A desktop computing system having at least a central core surrounded by housing having a shape that defines a volume in which the central core resides is described. The housing includes a first opening and a second opening axially displaced from the first opening. The first opening having a size and shape in accordance with an amount of airflow used as a heat transfer medium for cooling internal components, the second opening defined by a lip that engages a portion of the airflow in such a way that at least some of the heat transferred to the air flow from the internal components is passed to the housing.
    Type: Grant
    Filed: November 1, 2022
    Date of Patent: February 13, 2024
    Assignee: APPLE INC.
    Inventors: Eugene A Whang, Christopher J. Stringer, Brett W. Degner, David H. Narajowski, Patrick Kessler, Eric R. Prather, Caitlin Elizabeth Kalinowski, Adam T. Stagnaro, Daniel L. McBroom, Matthew P. Casebolt, Michael D. McBroom
  • Patent number: 11899509
    Abstract: A desktop computing system having at least a central core surrounded by housing having a shape that defines a volume in which the central core resides is described. The housing includes a first opening and a second opening axially displaced from the first opening. The first opening having a size and shape in accordance with an amount of airflow used as a heat transfer medium for cooling internal components, the second opening defined by a lip that engages a portion of the airflow in such a way that at least some of the heat transferred to the air flow from the internal components is passed to the housing.
    Type: Grant
    Filed: January 21, 2022
    Date of Patent: February 13, 2024
    Assignee: APPLE INC.
    Inventors: Eugene A Whang, Christopher J. Stringer, Brett W. Degner, David H. Narajowski, Patrick Kessler, Eric R. Prather, Caitlin Elizabeth Kalinowski, Adam T. Stagnaro, Daniel L. McBroom, Matthew P. Casebolt, Michael D. McBroom
  • Patent number: 11903125
    Abstract: An optical module includes a box-shaped housing with an optical element mounted therein. Further, a wiring substrate is bonded to a part of a surface of a housing part of the housing, and an electric wiring, which is formed in the wiring substrate or on a surface of the wiring substrate, and an electric wiring, which is introduced into the housing part or onto a surface of the housing part, are electrically connected to each other.
    Type: Grant
    Filed: September 17, 2021
    Date of Patent: February 13, 2024
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Maiko Ariga, Yusuke Inaba, Kazuki Yamaoka, Atsushi Izawa, Kazuya Nagashima
  • Patent number: 11894294
    Abstract: A display apparatus includes a printed circuit board including first to fourth output pad regions and a flexible circuit board having a first end connected to a display panel and a second end connected to the printed circuit board. The first output pad region includes a 1st-1st output pad group and a 1st-2nd output pad group, the second output pad region includes a 2nd-1st output pad group and a 2nd-2nd output pad group, the fourth output pad region includes a 4th-1st output pad group and a 4th-2nd output pad group, and the printed circuit board includes a first input terminal electrically connected to the 1st-1st output pad group, a second input terminal electrically connected to the 2nd-2nd output pad group, a third input terminal electrically connected to the first input terminal, and a fourth input terminal electrically connected to the 4th-2nd output pad group.
    Type: Grant
    Filed: May 26, 2022
    Date of Patent: February 6, 2024
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Hanho Park, Jeongeun Park, Soyeon Joo
  • Patent number: 11895776
    Abstract: In a flexible printed wiring board (1), a first electrical conduction pattern (4) prepared on the first surface (3a) on which a bare chip (2) is mounted is prepared only inside a mounting region (3c) of the bare chip. Preferably, the first electrical conduction patterns (4) are prepared so as to avoid positions opposite to test electrodes (2b) which the bare chip comprises. Thereby, in the flexible printed wiring board used for mounting the bare chip, occurrence of malfunction resulting from electrical connection with a part other than a bump of the bare chip can be certainly prevented, and reliability of various devices using the bare chip can be improved.
    Type: Grant
    Filed: September 20, 2019
    Date of Patent: February 6, 2024
    Assignee: HITACHI METALS, LTD.
    Inventor: Takahiro Umeyama
  • Patent number: 11877392
    Abstract: A flexible wiring board includes: an insulator; a wiring layer supported by the insulator; a first terminal unit including connection terminals provided at one end of the wiring layer; and a second terminal unit including connection terminals provided at the other end. A portion of the wiring layer from a part adjacent to the first terminal unit to a part adjacent to the second terminal unit is provided between first and second insulator layers included in the insulator. First and second holes formed in the first or second insulator layer are provided in an intermediate portion in a first direction from the first terminal unit to the second terminal unit and are spaced apart from each other in the first direction, and an insulator region adjacent to the first hole in a second direction is adjacent to at least a part of the second hole in the first direction.
    Type: Grant
    Filed: April 21, 2022
    Date of Patent: January 16, 2024
    Assignee: CANON KABU KIKA HA KAISHA
    Inventors: Mitsutoshi Hasegawa, Yuya Okada, Satoru Higuchi, Koji Noguchi
  • Patent number: 11876310
    Abstract: A system for providing power to a device is provided. The system includes at least one gateway that provides power and/or data to at least one device in the system; and at least one adapter coupled to the gateway and the at least one device, wherein the adapter is configured to couple lengths of cable between devices that are daisy chained together. Related adapters are also provided herein.
    Type: Grant
    Filed: March 2, 2022
    Date of Patent: January 16, 2024
    Assignee: Wiser Systems, Inc.
    Inventors: Seth Edward-Austin Hollar, Ryan Michael Tedrick, Scott Fisher
  • Patent number: 11864318
    Abstract: An electronic device is provided. The electronic device includes a first printed circuit board having a first surface and a second surface, a second printed circuit board having a first surface and a second surface disposed to be spaced apart from the first printed circuit board, a battery disposed between the first printed circuit board and the second printed circuit board, a first connection member to electrically connect the first printed circuit board and the second printed circuit board, and a second connection member to electrically connect the first printed circuit board and the second printed circuit board, wherein the first connection member and the second connection member may be arranged to at least partially overlap at a portion passing by the battery.
    Type: Grant
    Filed: January 30, 2023
    Date of Patent: January 2, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Wanjae Ju, Jaehan Kim, Seunghak Lee, Jungyong Yun, Sungchel Hwang
  • Patent number: 11864322
    Abstract: Fabric may include one or more conductive strands. An insertion tool may insert an electrical component into the fabric during formation of the fabric. The electrical component may include an electrical device mounted to a substrate and encapsulated by a protective structure. An interconnect structure such as a metal via or printed circuit layers may pass through an opening in the protective structure and may be used to couple a conductive strand to a contact pad on the substrate. The protective structure may be transparent or may include an opening so that light can be detected by or emitted from an optical device on the substrate. The protective structure may be formed using a molding tool that provides the protective structure with grooves or may be molded around a hollow conductive structure to create grooves. An electrical component mounted to the fabric may be embedded within printed circuit layers.
    Type: Grant
    Filed: February 3, 2023
    Date of Patent: January 2, 2024
    Assignee: Apple Inc.
    Inventors: Bilal Mohamed Ibrahim Kani, Benjamin J. Grena, Kyusang Kim, David M. Kindlon, Pierpaolo Lupo, Kishore N. Renjan, Manoj Vadeentavida
  • Patent number: 11856741
    Abstract: A display apparatus capable of improving heat-dissipation performance while not increasing a total thickness thereof include a heat-dissipation member accommodated in a cushion plate. Thus, the heat-dissipation performance may be improved without increasing a thickness of the display apparatus. Thus, a mounting space for components may be secured without increasing a bezel area. Further, the heat-dissipation member having a predetermined thickness and an air gap are disposed in the heat-dissipation member accommodating space of the cushion plate, thereby maximizing the heat-dissipation from a driving integrated circuit disposed under the cushion plate so as to overlap the heat-dissipation member accommodating space.
    Type: Grant
    Filed: August 13, 2021
    Date of Patent: December 26, 2023
    Assignee: LG Display Co., Ltd.
    Inventors: Buhui Lee, Sangsoo Yoon, Dongwon Jang, Jongseok Cha
  • Patent number: 11856692
    Abstract: An interconnect for connecting a first electronic circuit to a second, external stretchable electronic circuit device comprises: conductive lines of the first electronic circuit arranged in a plane; connectors configured to define an overlap in the plane between each end of the conductive lines with a corresponding end of stretchable conductive lines providing an electrical connection between the conductive lines and the stretchable conductive lines over the entire overlap; and at least one anchoring structure for providing an anchoring of the first electronic circuit with the second, external stretchable electronic circuit device, wherein the at least one anchoring structure provides anchoring transverse to the plane in anchoring positions on opposite sides of the overlap.
    Type: Grant
    Filed: July 14, 2022
    Date of Patent: December 26, 2023
    Assignees: IMEC VZW, UNIVERSITEIT HASSELT
    Inventors: Steven Nagels, Thijs Vandenryt, Wim Deferme
  • Patent number: 11848146
    Abstract: A stacked electronic module includes a magnetic device comprising a magnetic body with electrodes of the magnetic device being disposed on a top and bottom surface of the magnetic body, wherein a molding body encapsulates the magnetic body, wherein conductive layers are disposed on a top and bottom surface of the molding body for electrically connected to the electrodes of the magnetic device.
    Type: Grant
    Filed: May 12, 2021
    Date of Patent: December 19, 2023
    Assignee: CYNTEC CO., LTD.
    Inventors: Da-Jung Chen, Chien Ming Chen
  • Patent number: 11839772
    Abstract: Energy delivery devices with a flexible circuit. The energy delivery devices may be used in the treatment of human tissue, and the flexible circuit move or flex during use. The flexible circuit may include an electronic component and a trace connected with the electronic component. The trace may have a plurality of sections that provide parallel current paths over a portion of the trace. Alternatively, the flexible circuit may include a plurality of traces that are connected with the terminal of the electronic component to provide parallel current paths over their entire length to the terminal of the electronic component. These redundant parallel current paths improve device reliability.
    Type: Grant
    Filed: February 1, 2022
    Date of Patent: December 12, 2023
    Assignee: Solta Medical Ireland Limited
    Inventors: Craig Collins, Kurt Duclos, Martin Kenney
  • Patent number: 11839022
    Abstract: A circuit board includes a support member having a first major surface and a second major surface opposite the first major surface, and an elastic interconnect substrate having a first surface and a second surface opposite the first surface, at least part of the second surface being fixed to the first major surface and the second major surface of the support member, wherein the first surface of the interconnect substrate includes a circuit region where an electronic component is mounted and at least one electrode region where at least one external electrode is arranged, wherein the circuit region is disposed indirectly on the first major surface of the support member, and wherein the interconnect substrate is bent around the support member, and at least part of the electrode region is disposed indirectly on the second major surface of the support member.
    Type: Grant
    Filed: July 25, 2022
    Date of Patent: December 5, 2023
    Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.
    Inventor: Kazuhiro Yoshida
  • Patent number: 11839018
    Abstract: A flexible printed circuit board and a display touch apparatus are provided. The flexible printed circuit board includes a binding terminal region, a first circuit region and a second circuit region; the binding terminal region includes multiple terminals, the first circuit region includes a driver circuit, multiple first signal lines, multiple second signal lines, and multiple third signal lines, and the second circuit region includes an external connector; first ends of the multiple first signal lines, the multiple second signal lines and the multiple third signal lines are respectively connected to the terminals of the binding terminal region; second ends of the multiple first signal lines and the multiple second signal lines are respectively connected to the driver circuit; and second ends of the multiple third signal lines are connected to the connector.
    Type: Grant
    Filed: December 17, 2020
    Date of Patent: December 5, 2023
    Assignees: Chengdu BOE Optoelectronics Technology Co., Ltd., BOE Technology Group Co., Ltd.
    Inventors: Wenxiao Niu, Xinpeng Wang, Hengzhen Liang, Xiaolong Zhu, Lianbin Liu
  • Patent number: 11837855
    Abstract: An outer cover body for electrical wires, which is formed by bending a resin sheet and to be attached to an outer periphery of an electrical wire, includes a plurality of wall parts extending along an extending direction of the electrical wire and forming an accommodating part for accommodating the electrical wire. At least one of the plurality of wall parts includes a wall surface overlapping part having an outer side wall surface having a first notch, and an inner side wall surface overlapping the outer side wall surface and having a second notch. A branch line through-hole is formed by overlapping the first notch and the second notch.
    Type: Grant
    Filed: November 16, 2018
    Date of Patent: December 5, 2023
    Assignees: Furukawa Electric Co., Ltd., Furukawa Automotive Systems Inc.
    Inventors: Takashi Oshino, Koichi Maeno, Naoyuki Kojima, Hideyuki Ikeda, Yoshikazu Kamei
  • Patent number: 11832392
    Abstract: In some embodiments, a method includes receiving, at a circuit board, a power from a power supply. The method further includes filtering, at the circuit board and via a power filter having at least three choke filters, the power to produce a filtered power. The method further includes dividing, at a first portion of a circuit on the circuit board, a power associated with the filtered power into a first power and a second power, a characteristic of the first power differing from a characteristic of the second power by a factor of at least 1.5 or at most one half.
    Type: Grant
    Filed: February 28, 2023
    Date of Patent: November 28, 2023
    Assignee: Management Services Group, Inc.
    Inventor: Thomas Scott Morgan
  • Patent number: 11832389
    Abstract: An electronic device according to various embodiments may include: a display, a first circuit board disposed under the display, a first component and a second component disposed on one surface of the first circuit board, the first and second components each having different heights, a first interposer surrounding at least one side surface of the first component and disposed in a first region of the first circuit board, the first interposer part having a first height, a second interposer part surrounding at least one side surface of the second component and disposed in a second region of the first circuit board, the second interposer part having a second height different from the first height, a first second circuit board, at least a portion of which is spaced apart from the first region of the first circuit board, the first second circuit board including a first first portion bonded to the first interposer part, and a second second circuit board, at least a portion of which is spaced apart from the second reg
    Type: Grant
    Filed: August 13, 2021
    Date of Patent: November 28, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Taewon Sun, Jichul Kim, Kicheol Bae, Jinyong Park, Jungje Bang, Yongjae Song