Patents Examined by Binh B Tran
  • Patent number: 11224127
    Abstract: A flexible printed circuit board and an electronic device using the same are provided. The electronic device includes a first casing, a second casing, and a printed circuit board combination. The printed circuit board combination includes a first printed circuit board, a second printed circuit board, and a flexible printed circuit board. The flexible printed circuit board includes a body portion, a first extending end, and a second extending end. The body portion defines an opening. The first extending end bends from a first side of the body portion toward the body portion and extends toward a first direction after passing through the opening to connect the first printed circuit board. The second extending end extends from a second side of the body portion toward a second direction to connect the second printed circuit board.
    Type: Grant
    Filed: May 8, 2020
    Date of Patent: January 11, 2022
    Assignee: PEGATRON CORPORATION
    Inventors: Mao-Hsiang Huang, Wei-Chih Hsu, Pen-Uei Lu
  • Patent number: 11212916
    Abstract: The present invention is directed to flexible printed circuits for dermal applications that include a synthetic polymer membrane 702 and at least one electrically conductive trace 705. In an alternative embodiment, the electrically conductive trace is located on both sides of the microporous synthetic polymer membrane. The electrically conductive trace may be located on the surface of or be imbibed into the pores and through the thickness of a microporous synthetic polymer membrane. The flexible printed circuits may be electrically coupled to an electronic component to form a flexible printed circuit board and adhered to the skin 701 by a dermally acceptable adhesive. The flexible printed circuit or the flexible printed circuit board may be coupled to an electronic module 703 to form a hybrid flexible printed circuit board. The flexible printed circuit, flexible printed circuit board, and hybrid flexible printed circuit board achieve a balance of comfort, flexibility, and durability for on-skin use.
    Type: Grant
    Filed: May 8, 2018
    Date of Patent: December 28, 2021
    Assignee: W. L. Gore & Associates, Inc.
    Inventors: Mark D. Edmundson, Paul D. Gassler
  • Patent number: 11196174
    Abstract: Deployable reflector antenna includes a fabrication hub in which at least one additive fabrication unit disposed. The additive fabrication unit is configured to form at least one rigid structural element of a reflector antenna system. In a stowed condition, an RF reflector material comprised of a flexible webbing is disposed in a stowed configuration proximate to the fabrication hub. A fabrication control system controls the additive fabrication unit so as to form the at least one rigid structural element. The RF reflector material is arranged to transition during the additive fabrication process from the stowed configuration in which the flexible webbing material is furled compactly at the fabrication hub, to a deployed configuration in which the flexible webbing material is unfurled.
    Type: Grant
    Filed: September 14, 2020
    Date of Patent: December 7, 2021
    Assignee: EAGLE TECHNOLOGY, LLC
    Inventors: Robert M. Taylor, Philip J. Henderson
  • Patent number: 11197376
    Abstract: A method of forming an electronics assembly includes providing a substrate, attaching an electronics component to the substrate, disposing one or more dielectric ramps on the substrate along at least a portion of a perimeter of the electronics component, disposing a first ground plane over the substrate and the dielectric ramp(s), disposing a first dielectric over the first ground plane, disposing a stripline over the first dielectric, disposing a second dielectric over the stripline and the first dielectric, and disposing a second ground plane over the second dielectric.
    Type: Grant
    Filed: October 10, 2019
    Date of Patent: December 7, 2021
    Assignee: THE BOEING COMPANY
    Inventor: John E. Rogers
  • Patent number: 11189910
    Abstract: An antenna and cap, in an example implementation, can include a system, comprising a computing device, a clearance region coupled to the computing device, and an antenna comprising a first antenna portion and a second antenna portion. The first antenna portion can be coupled to the computing device and to the clearance region, and the second antenna portion can be coupled to the clearance region. The system can include a first cap coupled to the second antenna portion via a first interconnection, and a second cap coupled to the second antenna portion via a second interconnection. The first cap and the second cap can be coupled to the computing device.
    Type: Grant
    Filed: October 8, 2019
    Date of Patent: November 30, 2021
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Sung Oh, Philip Wright
  • Patent number: 11184976
    Abstract: Disclosed are compositions, devices, systems and fabrication methods for stretchable composite materials and stretchable electronics devices. In some aspects, an elastic composite material for a stretchable electronics device includes a first material having a particular electrical, mechanical or optical property; and a multi-block copolymer configured to form a hyperelastic binder that creates contact between the first material and the multi-block copolymer, in which the elastic composite material is structured to stretch at least 500% in at least one direction of the material and to exhibit the particular electrical, mechanical or optical property imparted from the first material. In some aspects, the stretchable electronics device includes a stretchable battery, biofuel cell, sensor, supercapacitor or other device able to be mounted to skin, clothing or other surface of a user or object.
    Type: Grant
    Filed: November 13, 2018
    Date of Patent: November 23, 2021
    Assignee: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
    Inventors: Joseph Wang, Rajan Kumar, Ying Shirley Meng, Jae Wook Shin, Lu Yin
  • Patent number: 11178751
    Abstract: A printed circuit board includes a differential signal via pairs to route differential signal between layers of the printed circuit board. A first differential signal via pair is oriented in a first orientation and a second differential signal via pair is oriented perpendicular to the first orientation. The second differential signal via pair is located such that a midpoint of a first line segment drawn between centers of first and second vias of the second differential signal pair intersects a first ray drawn from a center of a first via of the first differential signal via pair through a center of a second via of the first differential signal via pair. Further, the second differential signal via pair is located such that the midpoint of the first line segment is at a characteristic via-to-via pitch distance for the printed circuit board from the center of the second via of the first differential signal via pair.
    Type: Grant
    Filed: March 16, 2018
    Date of Patent: November 16, 2021
    Assignee: Dell Products L.P.
    Inventors: Vijendera Kumar, Sanjay Kumar, Arun R. Chada, Mallikarjun Vasa, Bhyrav M. Mutnury
  • Patent number: 11178768
    Abstract: Three-dimensional (3-D) volumetric board architectural design provides technical solutions to technical problems facing miniaturization of circuit boards. The 3-D volumetric architecture includes using more of the unused volume in the vertical dimension (e.g., Z-dimension) to increase the utilization of the total circuit board volume. The 3-D volumetric architecture is realized by mounting components on a first PCB and on a second PCB, and inverting and suspending the second PCB above the first PCB. The use of 3-D volumetric board architectural design further enables formation of a shielded FEMIE, providing shielding and improved volumetric use with little or no reduction in system performance or increase in system Z-height.
    Type: Grant
    Filed: April 1, 2016
    Date of Patent: November 16, 2021
    Assignee: Intel Corporation
    Inventors: Khang Choong Yong, Stephen H. Hall, Tin Poay Chuah, Boon Ping Koh, Eng Huat Goh
  • Patent number: 11140770
    Abstract: Printed circuit board assembly (PCBA) technology is disclosed. A PCBA can include a printed circuit board (PCB). The PCBA can also include a capacitor operably mounted on a side of the PCB. In addition, the PCBA can include a damper material coupled to the PCB and operable to dissipate kinetic energy generated by the capacitor during operation. An electronic system including a capacitor and damping material, and a method for minimizing acoustic vibration in an electronic system are also disclosed.
    Type: Grant
    Filed: March 20, 2018
    Date of Patent: October 5, 2021
    Assignee: Intel Corporation
    Inventor: Chia-Pin Chiu
  • Patent number: 11133656
    Abstract: A cable manager includes one or more cable manager units. Each cable manager unit includes a pair of side cable guides, each comprised of a plurality of finger-like projections extending forwardly from a support column. At least one of the pair of support columns has a socket arranged at a side thereof. Each cable manager unit further includes a separate midsection member capable of insertion into the socket for interconnecting the pair of side cable guides.
    Type: Grant
    Filed: June 10, 2019
    Date of Patent: September 28, 2021
    Assignee: Chatsworth Products, Inc.
    Inventors: William Krietzman, Joshua James Young, D. Brian Donowho
  • Patent number: 11129279
    Abstract: An optical subassembly includes: a support block made of ceramic in front of the first surface, the support block having a substrate mounting surface, the support block having a first side opposite to a surface in front of the first surface; an element-mounted substrate on the substrate mounting surface, the element-mounted substrate having a first conductor pattern; a pedestal made of metal and configured to be the same potential as the eyelet, the pedestal situated in front of the first surface; and a lead pin in the through-hole and for transmitting the electric signal. The support block has a metallization pattern that is electrically connected to the pedestal and is continuous from at least a part of the substrate mounting surface to at least a part of the first side.
    Type: Grant
    Filed: September 2, 2020
    Date of Patent: September 21, 2021
    Assignee: CIG PHOTONICS JAPAN LIMITED
    Inventors: Daisuke Noguchi, Hiroshi Yamamoto
  • Patent number: 11122682
    Abstract: Tamper-respondent assemblies and fabrication methods are provided which utilize liquid crystal polymer layers in solid form. The tamper-respondent assemblies include a circuit board, and an enclosure assembly mounted to the circuit board to enclose one or more electronic components coupled to the circuit board within a secure volume. The assembly includes a tamper-respondent sensor that is a three-dimensional multilayer sensor structure, which includes multiple liquid crystal polymer layers, and at least one tamper-detect circuit. The at least one tamper-detect circuit includes one or more circuit lines in a tamper-detect pattern disposed on at least one liquid crystal polymer layer of the multiple liquid crystal polymer layers. Further, a monitor circuit is provided disposed within the secure volume to monitor the at least one tamper-detect circuit of the tamper-respondent sensor for a tamper event.
    Type: Grant
    Filed: April 4, 2018
    Date of Patent: September 14, 2021
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: James A. Busby, John R. Dangler, Mark K. Hoffmeyer, William L. Brodsky, William Santiago-Fernandez, David C. Long, Silvio Dragone, Michael J. Fisher, Arthur J. Higby
  • Patent number: 11108140
    Abstract: Devices and methods are provided for an implantable medical device (IMD) comprising a device housing having electronic components therein, a feedthrough assembly joined to the device housing, an antenna assembly, and a header body mounted to the device housing and enclosing the antenna assembly and feedthrough assembly. The antenna assembly including an inner conductor, a dielectric material, and an outer conductor arranged to form a coaxial structure.
    Type: Grant
    Filed: November 18, 2019
    Date of Patent: August 31, 2021
    Assignee: Pacesetter, Inc.
    Inventors: Perry Li, James T. Dean, Christopher A. Crawford
  • Patent number: 11108135
    Abstract: A base station antenna includes a panel that has a ground plane, first and second arrays that have respective first and second sets of linearly arranged radiating elements mounted on the panel, and a decoupling unit positioned between a first radiating element of the first array and a first radiating element of the second array. The decoupling unit includes at least a first sidewall that faces the first radiating element of the first array, a second sidewall that faces the first radiating element of the second array and an internal cavity that is defined in the region between the sidewalls. The first and second sidewalls are electrically conductive and electrically connected to the ground plane.
    Type: Grant
    Filed: August 19, 2019
    Date of Patent: August 31, 2021
    Assignee: CommScope Technologies LLC
    Inventors: Mohammad Vatankhah Varnoosfaderani, Syed Muzahir Abbas, Zhonghao Hu
  • Patent number: 11108167
    Abstract: An antenna system, includes a first substrate, a plurality of chips, and a waveguide antenna element based beam forming phased array. The waveguide antenna element based beam forming phased array has a unitary body that comprises a plurality of radiating waveguide antenna cells in a first layout for millimeter wave communication. Each radiating waveguide antenna cell comprises a plurality of pins that are connected with a body of a corresponding radiating waveguide antenna cell that acts as ground for the plurality of pins. A first end of the plurality of radiating waveguide antenna cells of the waveguide antenna element based beam forming phased array, as the unitary body, in the first layout is mounted on the first substrate. The plurality of chips are electrically connected with the plurality of pins and the ground of each of the plurality of radiating waveguide antenna cells to control beamforming.
    Type: Grant
    Filed: April 23, 2019
    Date of Patent: August 31, 2021
    Assignee: SILICON VALLEY BANK
    Inventors: Seunghwan Yoon, Ahmadreza Rofougaran, Sam Gharavi, Kartik Sridharan, Donghyup Shin, Farid Shirinfar, Stephen Wu, Maryam Rofougaran, Alfred Grau Besoli, Enver Adas, Zhihui Wang
  • Patent number: 11089688
    Abstract: A sensor device includes a printed circuit board (PCB) substrate having a top surface, a bottom surface, a slot between the top and bottom surfaces, and two holes through the top surface and reaching into the slot. The sensor device further includes a sensor chip mounted on the top surface of the PCB substrate and above one of the two holes. The sensor device further includes a molding compound covering the sensor chip and sidewall surfaces and the top surface of the PCB substrate.
    Type: Grant
    Filed: April 29, 2019
    Date of Patent: August 10, 2021
    Assignee: TT ELECTRONICS PLC
    Inventors: Brent Hans Larson, Shivesh Langhanoja
  • Patent number: 11088453
    Abstract: Technologies directed to vertical coupling structures for antenna feeds of phased array antennas are described. One circuit board includes a first layer with a first portion of a RF coupling structure, a second layer with a second portion of the RF coupling structure, and a first insulation layer located between the first layer and the second layer. The RF coupling structure is configured to electromagnetically couple a first conductive trace on the first layer and a second conductive trace on the second layer at RF frequencies. The circuit board also includes a third layer with a first antenna element and a second insulation layer located between the third layer and the first layer, the second insulation layer including a first via through which the first antenna element is coupled to the first conductive trace.
    Type: Grant
    Filed: April 10, 2020
    Date of Patent: August 10, 2021
    Assignee: Amazon Technologies, Inc.
    Inventor: Gordon Coutts
  • Patent number: 11088457
    Abstract: An antenna system includes a first substrate, a plurality of chips and a waveguide antenna element based beam forming phased array that includes a plurality of radiating waveguide antenna cells for millimeter wave communication. Each radiating waveguide antenna cell includes a plurality of pins where a first pin is connected with a body of a corresponding radiating waveguide antenna cell and the body corresponds to ground for the pins. The first pin includes a first and a second current path, the first current path being longer than the second current path. A first end of the radiating waveguide antenna cells is mounted on the first substrate, where the plurality of chips are electrically connected with the plurality of pins and the ground of each of the plurality of radiating waveguide antenna cells to control beamforming through a second end of the plurality of radiating waveguide antenna cells for the communication.
    Type: Grant
    Filed: March 15, 2019
    Date of Patent: August 10, 2021
    Assignee: SILICON VALLEY BANK
    Inventors: Seunghwan Yoon, Ahmadreza Rofougaran, Sam Gharavi, Kartik Sridharan, Donghyup Shin, Farid Shirinfar, Stephen Wu, Maryam Rofougaran, Alfred Grau Besoli, Enver Adas
  • Patent number: 11075468
    Abstract: An antenna system, includes a first substrate, a plurality of chips, and a waveguide antenna element based beam forming phased array. The waveguide antenna element based beam forming phased array has a unitary body that comprises a plurality of radiating waveguide antenna cells in a first layout for millimeter wave communication. Each radiating waveguide antenna cell comprises a plurality of pins that are connected with a body of a corresponding radiating waveguide antenna cell that acts as ground for the plurality of pins. A first end of the plurality of radiating waveguide antenna cells of the waveguide antenna element based beam forming phased array, as the unitary body, in the first layout is mounted on the first substrate. The plurality of chips are electrically connected with the plurality of pins and the ground of each of the plurality of radiating waveguide antenna cells to control beamforming.
    Type: Grant
    Filed: April 23, 2019
    Date of Patent: July 27, 2021
    Assignee: SILICON VALLEY BANK
    Inventors: Seunghwan Yoon, Ahmadreza Rofougaran, Sam Gharavi, Kartik Sridharan, Donghyup Shin, Farid Shirinfar, Stephen Wu, Maryam Rofougaran, Alfred Grau Besoli, Enver Adas, Zhihui Wang
  • Patent number: 11064612
    Abstract: Embodiments are generally directed to a buried electrical debug access port. An embodiment of an apparatus includes a substrate or printed circuit board; one or more electronic components coupled with the substrate or printed circuit board; one or more electrical access ports coupled with the substrate or printed circuit board, each electrical access port including electrically conductive material; and an encapsulant material, the encapsulant material encapsulating the one or more access ports, wherein the one or more access ports are electrically connected to one or more circuits of the apparatus to provide debugging access to the apparatus.
    Type: Grant
    Filed: April 1, 2016
    Date of Patent: July 13, 2021
    Assignee: Intel Corporation
    Inventors: Florence R. Pon, Bilal Khalaf, Saeed S. Shojaie