Patents Examined by Binh B Tran
  • Patent number: 11570895
    Abstract: An electronic device is provided. The electronic device includes a first printed circuit board having a first surface and a second surface, a second printed circuit board having a first surface and a second surface disposed to be spaced apart from the first printed circuit board, a battery disposed between the first printed circuit board and the second printed circuit board, a first connection member to electrically connect the first printed circuit board and the second printed circuit board, and a second connection member to electrically connect the first printed circuit board and the second printed circuit board, wherein the first connection member and the second connection member may be arranged to at least partially overlap at a portion passing by the battery.
    Type: Grant
    Filed: May 7, 2021
    Date of Patent: January 31, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Wanjae Ju, Jaehan Kim, Seunghak Lee, Jungyong Yun, Sungchel Hwang
  • Patent number: 11564315
    Abstract: A flexible circuit board and a display panel are provided. The flexible circuit board includes a circuit board substrate layer, devices, a fluorinated-liquid solidification layer, and an insulating film. The devices are disposed on the circuit board substrate layer. Surfaces of the devices away from the circuit board substrate layer are covered with fluorinated liquid. The insulating film includes an insulating film substrate layer and a fluorine-containing adhesive layer. The fluorine-containing adhesive layer includes a resin adhesive and a fluorine-containing substance, and is in contact with the fluorinated liquid.
    Type: Grant
    Filed: June 2, 2021
    Date of Patent: January 24, 2023
    Assignees: Wuhan Tianma Micro-Electronics Co., Ltd., Wuhan Tianma Microelectronics Co., Ltd. Shanghai Branch
    Inventors: Di Liu, Qiwen Zu, Mingyan Huang
  • Patent number: 11553442
    Abstract: A wireless communication method to alter RF regulatory channel hopping requirements (regulations) between a pair of transceivers is envisioned wherein an embedded transceiver embedded in an RF attenuating medium transmits signals at a lower hopping requirement than a paired open-air transceiver. The communication method adheres to these regulations, which define a threshold power for transmission above which require a high degree of frequency hopping. Because the attenuating medium attenuates the open-air RF signal from the embedded transceiver, channel hopping in the embedded transceiver is lowered however, the channel hopping in the open-air transceiver is not lowered. The two transceivers are essentially powered equally.
    Type: Grant
    Filed: June 25, 2021
    Date of Patent: January 10, 2023
    Assignee: HerdStrong LLC.
    Inventors: Mark Daniel Matlin, Scott David Dalgleish, Jason Michael Wild
  • Patent number: 11552401
    Abstract: An antenna system includes a first substrate, a plurality of chips and a waveguide antenna element based beam forming phased array that includes a plurality of radiating waveguide antenna cells for millimeter wave communication. Each radiating waveguide antenna cell includes a plurality of pins where a first pin is connected with a body of a corresponding radiating waveguide antenna cell and the body corresponds to ground for the pins. The first pin includes a first and a second current path, the first current path being longer than the second current path. A first end of the radiating waveguide antenna cells is mounted on the first substrate, where the plurality of chips are electrically connected with the plurality of pins and the ground of each of the plurality of radiating waveguide antenna cells.
    Type: Grant
    Filed: May 25, 2021
    Date of Patent: January 10, 2023
    Assignee: MOVANDI CORPORATION
    Inventors: Seunghwan Yoon, Ahmadreza Rofougaran, Sam Gharavi, Kartik Sridharan, Donghyup Shin, Farid Shirinfar, Stephen Wu, Maryam Rofougaran, Alfred Grau Besoli, Enver Adas
  • Patent number: 11546995
    Abstract: A method of forming an electronics assembly includes providing a substrate, attaching an electronics component to the substrate, disposing one or more dielectric ramps on the substrate along at least a portion of a perimeter of the electronics component, disposing a first ground plane over the substrate and the dielectric ramp(s), disposing a first dielectric over the first ground plane, disposing a stripline over the first dielectric, disposing a second dielectric over the stripline and the first dielectric, and disposing a second ground plane over the second dielectric.
    Type: Grant
    Filed: November 5, 2021
    Date of Patent: January 3, 2023
    Assignee: THE BOEING COMPANY
    Inventor: John E. Rogers
  • Patent number: 11542377
    Abstract: Provided are an expandable or bendable circuit board having good body-contact feel, strong against bending and folding, and an electronic device made therefrom. The bendable circuit board includes: a film comprising a polyurethane synthesized by reacting a long-chain polyol with polyisocyanate and having a storage modulus at 25° C. of 20 to 200 MPa, a tensile strength of 20 to 80 MPa, and an elongation at break of 500 to 900%, and the temperature of which the storage elastic modulus reaches to 1 MPa is at 155° C. or higher; and circuit wiring formed in contact with a surface of the film. Alternatively, an expandable circuit board having the ratio ?/?0 of the specific electrical resistance ? of the circuit wiring when the circuit wiring is expanded to the specific electrical resistance (?·cm) ?0 of the circuit wiring before the circuit wiring is expanded is within a range of 1.05 to 10.0.
    Type: Grant
    Filed: October 25, 2019
    Date of Patent: January 3, 2023
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Tadahiro Sunaga, Jun Okabe, Shizuo Tokito, Koji Yokosawa
  • Patent number: 11545752
    Abstract: Technologies directed to coupling structures for antenna feeds of phased array antennas are described. One circuit board includes a first layer with a first portion of a RF coupling structure, a second layer with a second portion of the RF coupling structure, and a first insulation layer located between the first layer and the second layer. The RF coupling structure is configured to electromagnetically couple a first conductive trace on the first layer and a second conductive trace on the second layer at RF frequencies. The circuit board also includes an RF shielding structure coupled to a ground connection on the second layer and located in the first insulation layer. The RF shielding structure is configured to operate as a RF short circuit between the ground connection and a third conductive trace on the first layer at RF frequencies.
    Type: Grant
    Filed: July 7, 2021
    Date of Patent: January 3, 2023
    Assignee: Amazon Technologies, Inc.
    Inventor: Gordon Coutts
  • Patent number: 11543867
    Abstract: A flexible circuit board includes a plurality of first wires that have a first connection area and a first insulating layer that covers the first wires such that the first connection area is exposed. A printed circuit board includes a plurality of second wires that have a second connection area, a second insulating layer that covers the second wires such that the second connection area is exposed, and a plurality of island conductors adjacent to the second wires across a gap. The second connection area is covered with an anisotropic conductive layer. Each of the second wires in the second connection area at least partially faces a corresponding one of the first wires in the first connection area across the anisotropic conductive layer. The plurality of island conductors include an island conductor that is in contact with the anisotropic conductive layer and partially exposed from the anisotropic conductive layer.
    Type: Grant
    Filed: December 7, 2020
    Date of Patent: January 3, 2023
    Assignee: SHARP KABUSHIKI KAISHA
    Inventors: Hitoshi Tomizawa, Atsuji Okada, Yohichiroh Sakaki, Mitsuhiro Sugimoto, Hiroaki Nakaminami
  • Patent number: 11546454
    Abstract: Various embodiments of the present disclosure relate to an electronic device which may include: a circuit board; at least one electronic component mounted on the upper surface of the circuit board; at least one connector mounted on the upper surface of the circuit board and electrically connected to the circuit board or the at least one electronic component; and a conductive frame which includes a side wall surrounding a space, in which the at least one electronic component and the at least one connector are disposed, and an extension part extending from one end of the side wall into the space.
    Type: Grant
    Filed: September 11, 2020
    Date of Patent: January 3, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: Eunseok Hong
  • Patent number: 11539143
    Abstract: An antenna system, includes a first substrate, a plurality of chips, and a waveguide antenna element based beam forming phased array. The waveguide antenna element based beam forming phased array includes a plurality of radiating waveguide antenna cells. Each radiating waveguide antenna cell includes a plurality of pins that are connected to ground. A body of each radiating waveguide antenna cell corresponds to the ground. The plurality of chips are electrically connected with the plurality of pins and the ground of each of the plurality of radiating waveguide antenna cells to control beamforming through a second end of the plurality of radiating waveguide antenna cells.
    Type: Grant
    Filed: July 1, 2021
    Date of Patent: December 27, 2022
    Assignee: Movandi Corporation
    Inventors: Seunghwan Yoon, Ahmadreza Rofougaran, Sam Gharavi, Kartik Sridharan, Donghyup Shin, Farid Shirinfar, Stephen Wu, Maryam Rofougaran, Alfred Grau Besoli, Enver Adas, Zhihui Wang
  • Patent number: 11528816
    Abstract: An electronic control module, particularly for a transmission, includes a first circuit board element and a sensor unit carrier fastened to the first circuit board element. The sensor unit carrier has a sensor unit receptacle configured to receive a sensor unit. The sensor unit has a sensor element fastened and electrically connected to a second circuit board element so as to detect at least one measured value. The sensor unit is fastened in the sensor unit receptacle. The second circuit board element has a flexible region that separates a first sub-region of the second circuit board element from a second sub-region of the second circuit board element. The first sub-region has a predetermined angle to the second sub-region. The sensor element is electrically connected to the first circuit board element by the second sub-region of the second circuit board element.
    Type: Grant
    Filed: January 22, 2018
    Date of Patent: December 13, 2022
    Assignee: Robert Bosch GmbH
    Inventor: Matthias Kraus
  • Patent number: 11523493
    Abstract: An electronic control unit includes: a wiring substrate having a first surface on which a conductor wire is formed; a first electronic component that is implemented on the first surface of the wiring substrate, and has a large heat generation amount; a second electronic component that is implemented on the first surface of the wiring substrate, and has a heat generation amount smaller than the first electronic component; and a resin that covers the first electronic component, the second electronic component, and the first surface of the wiring substrate, and a second surface of the wiring substrate that is opposite to the first surface. A distance between an outer surface of the resin immediately below the first electronic component, and the second surface of the wiring substrate is longer than a distance between an outer surface of the resin immediately above the second electronic component, and the first surface of the wiring substrate.
    Type: Grant
    Filed: June 27, 2019
    Date of Patent: December 6, 2022
    Assignee: Hitachi Astemo, Ltd.
    Inventors: Miki Hiraoka, Ryosuke Ishida, Yoshio Kawai
  • Patent number: 11515089
    Abstract: Apparatuses and methods are provided for a capacitor including two more plates. The capacitor includes one or more teeth cut in an edge of at least one plate of the two or more plates. The one or more teeth extends from the edge of the at least one plate to a point at a length into the at least one plate. Other aspects are described.
    Type: Grant
    Filed: June 27, 2020
    Date of Patent: November 29, 2022
    Assignee: Intel Corporation
    Inventors: Genadi Blay, Uzi Zohar, Ronen Levi
  • Patent number: 11510312
    Abstract: Disclosed are various embodiments related to a circuit board included in an electronic device. According to one embodiment, the circuit board may comprise: a core layer including an upper surface and a lower surface and formed as a substrate made of a prepreg material; a first flexible copper clad laminate including a plurality of conductive layers and laminated on the upper surface; at least one first substrate layer laminated above the first flexible copper clad laminate and including a conductive layer formed on the substrate made of a prepreg material; a second flexible copper clad laminate including a plurality of conductive layers and laminated on the lower surface; and at least one second substrate layer laminated under the second flexible copper clad laminate and including a conductive layer formed on the substrate made of a prepreg material. Various other embodiments are also possible.
    Type: Grant
    Filed: August 1, 2019
    Date of Patent: November 22, 2022
    Inventors: Youngsun Lee, Eunseok Hong, Byeongkeol Kim, Jongmin Jeon
  • Patent number: 11508663
    Abstract: Aspects of the disclosure provide a printed circuit board (PCB) system that includes an integrated circuit (IC) package, a first PCB and a PCB module. The IC package has a package substrate and an IC chip that is coupled to a top surface of the package substrate. The first PCB is configured to electrically couple with first contact structures that are disposed on a bottom surface of the package substrate. The PCB module includes a second PCB and one or more electronic components electrically coupled to the second PCB. The PCB module is configured to electrically couple with second contact structures that are disposed on the top surface of the package substrate.
    Type: Grant
    Filed: January 29, 2019
    Date of Patent: November 22, 2022
    Assignee: MARVELL ISRAEL (M.I.S.L) LTD.
    Inventors: Dan Azeroual, Eldad Bar-Lev
  • Patent number: 11503713
    Abstract: An antenna substrate includes: a first substrate including an antenna pattern disposed on an upper surface of the first substrate; a second substrate having a first planar surface, an area of which is smaller than an area of a planar surface of the first substrate; and a flexible substrate connecting the first and second substrates to each other and bent to allow the first planar surface of the second substrate to face a side surface of the first substrate, which is perpendicular to the upper surface of the first substrate.
    Type: Grant
    Filed: November 17, 2020
    Date of Patent: November 15, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Doo Il Kim, Young Sik Hur, Won Wook So, Yong Ho Baek
  • Patent number: 11502487
    Abstract: Embodiments disclosed herein relate to a protection device and/or system that may include a thimble capable of being placed over a transmission line, such as an electrical power cord, to provide protection in the form of cut resistance, abrasion resistance, and/or impact resistance. In some embodiments, a plurality of thimbles can be placed over the transmission line to form an overlapping arrangement to protect a desired length of the transmission line. While each thimble may be rigid, semi-rigid, and/or flexible, the arrangement can maintain flexibility to allow for many degrees of movement of the electrical power cord even as it is cladded in the protection system.
    Type: Grant
    Filed: January 11, 2021
    Date of Patent: November 15, 2022
    Assignee: Crane 1 Services, Inc.
    Inventors: Dan Love, Robert Milliron
  • Patent number: 11502417
    Abstract: An antenna system includes a first substrate, a plurality of chips and a waveguide antenna element based beam forming phased array that includes a plurality of radiating waveguide antenna cells for millimeter wave communication. Each radiating waveguide antenna cell includes a plurality of pins where a first pin is connected with a body of a corresponding radiating waveguide antenna cell and the body corresponds to ground for the pins. The first pin includes a first and a second current path, the first current path being longer than the second current path. A first end of the radiating waveguide antenna cells is mounted on the first substrate, where the plurality of chips are electrically connected with the plurality of pins and the ground of each of the plurality of radiating waveguide antenna cells.
    Type: Grant
    Filed: May 25, 2021
    Date of Patent: November 15, 2022
    Assignee: MOVANDI CORPORATION
    Inventors: Seunghwan Yoon, Ahmadreza Rofougaran, Sam Gharavi, Kartik Sridharan, Donghyup Shin, Farid Shirinfar, Stephen Wu, Maryam Rofougaran, Alfred Grau Besoli, Enver Adas
  • Patent number: 11488764
    Abstract: A voltage regulator module includes a first circuit board assembly and a magnetic core assembly. The first circuit board assembly includes a first printed circuit board, a plurality of switch elements and a first molding compound layer. The switch elements are mounted on a first surface of the first printed circuit board. The first molding compound layer is formed on the first surface of the first printed circuit board to encapsulate the switch elements. The magnetic core assembly is arranged beside a second surface of the first printed circuit board, and includes a magnetic core portion and at least one first U-shaped copper structure. The magnetic core portion includes a plurality of openings. Each first U-shaped copper structure is penetrated through two corresponding openings to define two inductors. A first terminal of each inductor and the corresponding switch element are connected in series to define a phase circuit.
    Type: Grant
    Filed: October 2, 2019
    Date of Patent: November 1, 2022
    Assignee: DELTA ELECTRONICS, INC.
    Inventors: Yahong Xiong, Da Jin, Qinghua Su
  • Patent number: 11490514
    Abstract: An electronic device may include a display panel, a plate disposed under the display panel and including a code area in which a unique code is disposed, and a circuit film electrically connected to the display panel. The circuit film includes a first portion, and a second portion extending from the first portion and covering the code area.
    Type: Grant
    Filed: March 2, 2021
    Date of Patent: November 1, 2022
    Assignee: SAMSUNG DISPLAY CO., LTD.
    Inventors: Bugyoon Yoo, Yunjae Kim