Abstract: An antenna system includes a first substrate, a plurality of chips, a system board having an upper and lower surface, and a beam forming phased array that includes a plurality of radiating waveguide antenna cells for millimeter wave communication. Each radiating waveguide antenna cell includes a plurality of pins where a first pin is connected with a body of a corresponding radiating waveguide antenna cell and the body corresponds to ground for the pins. A first end of the radiating waveguide antenna cells is mounted on the first substrate, where the upper surface of the system board comprises a plurality of electrically conductive connection points to connect the first end of the plurality of radiating waveguide antenna cells to the ground.

Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric layer and an internal electrode, an electrode layer connected to the internal electrode, and a conductive resin layer disposed on the electrode layer. The conductive resin layer includes a conductive metal, a metal having a lower melting point than the conductive metal, a conductive carbon, and a base resin. The metal having the lower melting point than the conductive metal is tin (Sn). The conductive metal of the conductive resin layer includes at least one of copper (Cu), nickel (Ni), silver (Ag), and silver-palladium (Ag—Pd).

Abstract: A display device is provided, which includes a display panel including a first surface and a second surface of the display panel disposed opposite to each other; a backlight module including a first surface and a second surface of the backlight module disposed opposite to each other, wherein the first surface of the backlight module is attached to the second surface of the display panel; a circuit board including an end attached to the first surface of the display panel and another end bent to the second surface of the backlight module; and an adhesive layer including a first surface and a second surface disposed opposite to each other, wherein the first surface of the adhesive layer is bonded to a side of the backlight module close to the circuit board, and the second surface of the adhesive layer is bonded to the circuit board.

Abstract: Embodiments are generally directed to a buried electrical debug access port. An embodiment of an apparatus includes a substrate or printed circuit board; one or more electronic components coupled with the substrate or printed circuit board; one or more electrical access ports coupled with the substrate or printed circuit board, each electrical access port including electrically conductive material; and an encapsulant material, the encapsulant material encapsulating the one or more access ports, wherein the one or more access ports are electrically connected to one or more circuits of the apparatus to provide debugging access to the apparatus.

Abstract: Provided is an electronic component including a pad region including a plurality of pads extending along corresponding extension lines and arranged in a first direction, and a signal wire configured to receive a driving signal from the pad region, wherein the plurality of pads include a plurality of first pads arranged continuously and a plurality of second pads arranged continuously, and extension lines of the plurality of first pads substantially converge into a first point and extension lines of the plurality of second pads substantially converge into a second point different from the first point.

Abstract: A display device and an electronic apparatus. The display device includes a display panel, a first circuit board and a second circuit board. The display panel includes a light-outgoing side and a non-light-outgoing side opposite to the light-outgoing side; the first circuit board is electrically connected to the display panel and positioned at the non-light-outgoing side; and the second circuit board is configured to be electrically connected to the first circuit board, and the second circuit board includes a functional circuit in signal connection with the display panel.

Abstract: A flexible electronic device (SED) that can conform to a three-dimensional structure, and methods for manufacturing the SED, are disclosed herein. The SED comprises a flexible substrate which is modified in accordance with a folding pattern. The flexible substrate can be folded or unfolded along crease lines of the folding pattern, and the largest deformations of the substrate are localized at the crease lines. Various functional components of the SED are positioned on rigid regions of the substrate defined by the folding pattern. Such that the various functional components are protected from large deformations due to a folding or unfolding process, ensuring good performance of the functional components.

Abstract: A voice-activated electronic device including a first portion with a first internal surface having a first attachment structure, and a second portion with a second internal surface having a second attachment structure. The first and second internal surfaces have compatible shapes that permit the first and second portions to be moved from a separated position to a joined position, where when the first portion and the second portion are in the joined position the first and second internal surfaces form a nested arrangement. The first and second attachment structures form a secure but separable connection to one another when the first and second portions are in the joined position. The first and second portions are configured to be joined securely and separated through manual human manipulation of one or both of the first portion and the second portion to move the first and second portions between separated and joined positions.

Abstract: An antenna system includes a first substrate, a plurality of chips, a system board having an upper and lower surface, and a beam forming phased array that includes a plurality of radiating waveguide antenna cells for millimeter wave communication. Each radiating waveguide antenna cell includes a plurality of pins where a first pin is connected with a body of a corresponding radiating waveguide antenna cell and the body corresponds to ground for the pins. A first end of the radiating waveguide antenna cells is mounted on the first substrate, where the upper surface of the system board comprises a plurality of electrically conductive connection points to connect the first end of the plurality of radiating waveguide antenna cells to the ground.

Abstract: Disclosed are compositions, devices, systems and fabrication methods for stretchable composite materials and stretchable electronics devices. In some aspects, an elastic composite material for a stretchable electronics device includes a first material having a particular electrical, mechanical or optical property; and a multi-block copolymer configured to form a hyperelastic binder that creates contact between the first material and the multi-block copolymer, in which the elastic composite material is structured to stretch at least 500% in at least one direction of the material and to exhibit the particular electrical, mechanical or optical property imparted from the first material. In some aspects, the stretchable electronics device includes a stretchable battery, biofuel cell, sensor, supercapacitor or other device able to be mounted to skin, clothing or other surface of a user or object.

Abstract: One embodiment of the present invention provides a highly reliable display device. In particular, a display device to which a signal or a power supply potential can be supplied stably is provided. Further, a bendable display device to which a signal or a power supply potential can be supplied stably is provided. The display device includes, over a flexible substrate, a display portion, a plurality of connection terminals to which a signal from an outside can be input, and a plurality of wirings. One of the plurality of wirings electrically connects one of the plurality of connection terminals to the display portion. The one of the plurality of wirings includes a first portion including a plurality of separate lines and a second portion in which the plurality of lines converge.

Abstract: In one embodiment, a semiconductor package may be formed having a first side and a second side that is substantially opposite to the first side. An embodiment may include forming an attachment clip extending substantially laterally between the first and second sides wherein the attachment clip is positioned near a distal end of the first and second sides. An embodiment may also include forming the attachment clip to have a flexible main portion that can bend away from a plane of the main portion toward a bottom side of the semiconductor package.

Abstract: A substrate carries electrical components. It is bent into a non-planar shape to fit into a contact lens. For example, the substrate may be constructed from a flexible circuit board. The circuit board has certain regions for mounting electrical components. The flexible circuit board is bent into a three-dimensional shape that fits into the contact lens. The regions used to mount electrical components remain flat.

Abstract: A display device includes a display substrate comprising a polymer layer including a first non-bending area, a second non-bending area that overlaps the first non-bending area when viewed in a plan view, and a bending area arranged between the first non-bending area and the second non-bending area. A display element layer is disposed on the polymer layer. A plurality of signal pad groups is disposed in the second non-bending area and is configured to be electrically connected to the display element layer. An upper substrate is disposed on a top surface of the display substrate. A flexible circuit board comprising a plurality of connection pad groups is arranged in correspondence to the signal pad groups. An area of the upper substrate is larger than an area of the display substrate when viewed in a plan view.

Abstract: The display assembly includes a display module, a flexible printed board, an integrated circuit chip, and a composite tape. The integrated circuit chip and a binding portion of the flexible printed board are respectively in binding connection with the display module. The composite tape includes: a conductive fabric layer comprising a first part and a second part, the first part covering the integrated circuit chip and the binding portion, and the second part covering at least part of a grounding portion of the flexible printed board; and an insulating film layer on a side of the conductive fabric layer facing the integrated circuit chip and the flexible printed board, and including a third part, which is at the first part of the conductive fabric layer and covering the integrated circuit chip and the binding portion, and the insulating film layer avoiding the at least part of the grounding portion.

Abstract: The present disclosure relates to a semiconductor package device including a stacked antenna structure with a high-k laminated dielectric layer separating antenna and ground planes, and a method of manufacturing the structure. A semiconductor die is laterally encapsulated within an insulating structure comprising a first redistributions structure. A second redistribution structure is disposed over and electrically coupled to the first redistribution structure and the die. The second redistribution structure includes the stacked antenna structure which includes first and second conductive planes separated by a high dielectric constant laminated dielectric structure. The first conductive plane includes openings and the second conductive plane is configured to transmit and receive electromagnetic waves through the openings in the first conductive plane.

Abstract: Near-field antennas and methods of operating and manufacturing near-field antennas are provided herein. An example near-field antenna for transmitting radio frequency (RF) power transmission signals includes: (i) a conductive plate including one or more channels extending through the conductive place, a respective channel of the one or more channels having first and second segments, and (ii) a feed element configured to direct a plurality of RF power transmission signals towards the conductive plate. At least some of the RF power transmission signals cause an accumulation of RF energy within a near-field distance of the conductive plate. Furthermore, the accumulation of RF energy includes: (i) a first zone of accumulated RF energy at the first segment, and (ii) a second zone of accumulated RF energy at the second segment, the second zone of accumulated RF energy being distinct from the first zone of accumulated RF energy.

Abstract: A circuit board having multiple degrees of freedom, comprises a flat board and a conductive and flexible unit disposed on the flat board. The conductive and flexible unit comprises: an inner support plate, an outer support plate, and at least one flexible connector; a hollow portion is provided on the outer support plate; the inner support plate and the flexible connector are disposed in the hollow portion; the inner and the outer support plates are connected by the flexible connector; the flexible connector comprises an outer connecting portion, an inner connecting portion corresponding to the outer connecting portion, and an extension located between the outer connecting portion and the inner connecting portion. The circuit board has a simple and compact structure; the production efficiency is high; costs are low; a multi-axis flexible anti-shaking effect can be achieved without folding a flexible structure; the resilience performance is good.

Abstract: A display apparatus, includes: a flexible circuit board including a first board pad and a second board pad, which are spaced apart from each other in a first direction and extend in a second direction intersecting the first direction; a main circuit board coupled to the flexible circuit board; and a display panel coupled to the flexible circuit board, the display panel including a first display pad overlapped with the first board pad and a second display pad overlapped with the second board pad, wherein the first board pad includes a first, second, and third portions, and the second board pad includes a first, second, and third portions.

Abstract: A display apparatus includes a display panel that displays an image, a first flexible printed circuit film disposed on a rear surface of the display panel, and a cover window disposed on the display panel. The first flexible printed circuit film includes a first horizontal portion electrically connected to the display panel and extending in a first direction, a first vertical portion electrically connected to the first horizontal portion and extending in a second direction intersecting the first direction, and a protruding portion that protrudes from a side surface of the first vertical portion.