Patents Examined by Binh Tran
  • Patent number: 10206278
    Abstract: An apparatus is provided with a component configured with an interface comprising a resilient material. In a first state, the component is mechanically and/or electrically attached to a substrate. Exposure of the interface to the temperature that meets or exceeds the transition temperature of interface causes the resilient material to undergo a state change. The state change of the interface alters the position of the component, including separation of the component from the substrate. The separation disrupts the attachment thereby mitigating damage to the substrate and/or component.
    Type: Grant
    Filed: November 6, 2017
    Date of Patent: February 12, 2019
    Assignee: International Business Machines Corporation
    Inventors: Bruce J. Chamberlain, Scott B. King, Joseph Kuczynski, David J. Russell
  • Patent number: 10205283
    Abstract: Power outlets adapted for installation within an enclosure are provided. Power outlets are provided having a safety interlock adapted to prevent the creation of a hazardous condition within the enclosure as a result of the continued operation of an electrical device within the enclosed space. The safety interlock may include current limiting circuitry and hardware, hazard sensing devices interconnected with such current limiting circuitry and hardware or other circuit breaker switches, and combinations of such safety interlocks. The power outlets may also be adapted for installation within a movable enclosure, such as, for example, a drawer.
    Type: Grant
    Filed: April 13, 2017
    Date of Patent: February 12, 2019
    Assignee: JTech Solutions, Inc.
    Inventor: J. Scott Dickey
  • Patent number: 10206275
    Abstract: A control unit has a substrate with an electrically conductive structure, an integrated circuit device, which is installed on the substrate in an electrically conductive manner, and a sacrificial structure on the substrate. The sacrificial structure is configured to be irreversibly destroyed if the integrated circuit device is removed from the substrate. The electrically conductive structure has at least one conducting track applied to the substrate. The sacrificial structure is formed by a segment of the conducting track. An electrically insulating connecting layer that connects the integrated circuit device, the substrate, and the segment of the conducting track is formed. The sacrificial structure can be destroyed by the connecting layer when the integrated circuit device is removed.
    Type: Grant
    Filed: December 11, 2012
    Date of Patent: February 12, 2019
    Assignee: Continental Automotive GmbH
    Inventors: Jan Keller, Thomas Riepl
  • Patent number: 10204865
    Abstract: An electronic package is provided, which includes: an insulator; an electronic element embedded in the insulator and having a sensing area exposed from the insulator; and a conductive structure disposed on the insulator and electrically connected to the electronic element, thereby reducing the thickness of the overall structure.
    Type: Grant
    Filed: January 8, 2016
    Date of Patent: February 12, 2019
    Assignee: PHOENIX PIONEER TECHNOLOGY CO., LTD.
    Inventors: Chu-Chin Hu, Shih-Ping Hsu
  • Patent number: 10201093
    Abstract: Provided is a master printed circuit board (PCB). The master PCB includes panels defined by grooves cut in the master PCB, the grooves separating one panel from another. A final PCB is formable via use of one or more jumpers, wherein the jumpers are configured to extend across at least one of the grooves to electrically connect one panel to another panel. The electrically connected panels form the final PCB.
    Type: Grant
    Filed: January 19, 2017
    Date of Patent: February 5, 2019
    Assignee: GE LIGHTING SOLUTIONS, LLC
    Inventors: Zoltan Szabo, Katalin Eszter Horvath, Andras Majoros
  • Patent number: 10185352
    Abstract: A modular electrical system for controlling a liquid crystal display (LCD) contained within a chassis. The system may include a backplane in communication with a power module and video module through connectors on the back plane and respective connectors on the modules. The system may also include a timing and control board (TCON) that is in communication with the backplane via conduction lines that are provided to carry power, video signals, etc., to the TCON. Guides may be provided to ensure proper alignment of the power module and video module with the backplane. In some embodiments, the power module and video module may include input and output connectors that facilitate connection of multiple displays in a daisy chain fashion.
    Type: Grant
    Filed: February 20, 2017
    Date of Patent: January 22, 2019
    Assignee: Manufacturing Resources International, Inc.
    Inventors: William Dunn, Jerry Wasinger
  • Patent number: 10187030
    Abstract: A multilayer fringe capacitor includes first and second interdigitated capacitor electrodes, both parallel to and intersecting a first planar surface; third and fourth interdigitated capacitor electrodes, the first and second electrodes parallel to and separated by a non-zero distance from the third and fourth electrodes; a first set of coupling vias that electrically couples the first electrode to the third electrode; and a second set of coupling vias that electrically couples the second electrode to the fourth electrode.
    Type: Grant
    Filed: April 25, 2017
    Date of Patent: January 22, 2019
    Assignee: Kumu Networks, Inc.
    Inventors: Wilhelm Steffen Hahn, Alfred Riddle, Ernie Landi
  • Patent number: 10162205
    Abstract: Provided is a display device capable of reducing a bezel space. The display device includes: a display panel; a lower chassis receiving the display panel; and a metal line fixed to one edge of the display panel and the lower chassis.
    Type: Grant
    Filed: March 9, 2017
    Date of Patent: December 25, 2018
    Assignee: Samsung Display Co., Ltd.
    Inventors: Chung Hui Lee, Seung-Won Kuk, Jee Su Park
  • Patent number: 10165684
    Abstract: A fluid control apparatus is provided which makes it possible to effortlessly perform cable connection even when a plurality of the fluid control apparatuses are disposed adjacent to each other. The fluid control apparatus includes fluid control units to control a flow rate or pressure of a fluid, an electric circuit board to send and receive a signal to and from the fluid control units, a casing to accommodate therein the fluid control units and the electric circuit board, and an apparatus-side connector interposed between the electric circuit board and a cable electrically connected thereto. The fluid control apparatus further includes a connector board configured to mount thereon the apparatus-side connector. The connector board is secured to the electric circuit board with at least a part of the connector board in surface contact with the electric circuit board, or overlapping the electric circuit board with a clearance therebetween.
    Type: Grant
    Filed: March 17, 2017
    Date of Patent: December 25, 2018
    Assignee: HORIBA STEC, Co., Ltd.
    Inventor: Katsuya Ohtani
  • Patent number: 10162388
    Abstract: Examples herein include modules and connections for modules to couple to a computing device. An example module includes a housing comprising an end to couple to a computing device, multiple capacitive pads that each include data contacts to enable data transfer, a power contact pad to provide or receive power, and a ground contact pad to couple to ground. The ground contact pad is larger in size than the power contact pad, and the ground contact pad is positioned closer than the power contact pad to the end of the housing configured to couple to the computing device.
    Type: Grant
    Filed: October 26, 2017
    Date of Patent: December 25, 2018
    Assignee: Google LLC
    Inventors: Paul Eremenko, Ara Knaian, Seth Newburg, David Fishman
  • Patent number: 10165693
    Abstract: The present invention relates to an attachment device for micro devices, comprising a main body and an attachment member seat in connection with the main body. The main body provides a receiving space to accommodate a functional module element. The attachment member seat provides a cavity to accommodate at least one attachment member to attach the attachment device to an article. A wearable micro device comprising the functional module element and the attachment device is also disclosed.
    Type: Grant
    Filed: September 1, 2016
    Date of Patent: December 25, 2018
    Inventors: Min-Chih Hsuan, Yu-Han Huang
  • Patent number: 10157753
    Abstract: A wiring board (1) includes an insulating substrate (11) having a cutout (12) opened in a main surface and a side surface of the insulating substrate (11), and an inner electrode (13) formed on an inner surface of the cutout (12). The inner electrode (13) includes a plurality of metal layers. The inner electrode (13) includes, as an intermediate layer, at least one metal layer (17b) selected from the group consisting of a nickel layer, a chromium layer, a platinum layer, and a titanium layer, and includes a gold layer as an outermost layer (17a). The metal layer (17b) is exposed at an outer edge portion of the inner electrode (13).
    Type: Grant
    Filed: September 25, 2015
    Date of Patent: December 18, 2018
    Assignee: KYOCERA CORPORATION
    Inventors: Yukio Morita, Kenji Sugimoto
  • Patent number: 10158339
    Abstract: Techniques for reducing multi-reflection noise via compensation structures are described herein. An example system includes a capacitive component. The example system further includes a capacitive compensation structure coupled to two ends of the capacitive component. The example system includes a partially meshed ground plane coupled to one side of a dielectric substrate. The example system also includes one or more signal conductors coupled to another side of the dielectric substrate and electrically coupled to the capacitive component. The one or more signal conductors are located parallel to a meshed length of the partially meshed ground plane.
    Type: Grant
    Filed: December 11, 2015
    Date of Patent: December 18, 2018
    Assignee: Intel Corporation
    Inventors: Jackson Chung Peng Kong, Bok Eng Cheah, Khang Choong Yong, Howard L. Heck, Wil Choon Song
  • Patent number: 10158203
    Abstract: A fusible conductive material can be used to electrically connect or join power distribution bus bars that are placed on opposing sides of an electrically insulating bus support. The fusible conductive material can be placed in an opening or hole in the bus support with the bus bars abutting the fusible conductive material on opposing sides. The fusible conductive material can then be ignited, such as by applying a voltage drop, to produce a localized heat source suitable to electrically join the bus bars together. By electrically connecting the bus bars in this manner, the bus bars can better conduct, be less susceptible to separation and require less maintenance with respect to connectivity.
    Type: Grant
    Filed: March 31, 2017
    Date of Patent: December 18, 2018
    Assignee: Rockwell Automation Technologies, Inc.
    Inventor: Corey A. Peterson
  • Patent number: 10159144
    Abstract: A semiconductor device according to an embodiment has a first semiconductor component and a second semiconductor component which are electrically connected with each other via an interposer. The interposer has a plurality of first signal wiring paths, and a plurality of second signal wiring paths each having a path distance smaller than each of the plurality of first signal wiring paths. Furthermore, the first semiconductor component includes a first electrode, a second electrode, and a third electrode arranged in order in a first direction. Furthermore, the second semiconductor component includes a fourth electrode, a fifth electrode, and a sixth electrode arranged in order in the first direction. Furthermore, the first electrode is connected with the fourth electrode via the first signal wiring path, the second electrode is connected with the fifth electrode via the first signal wiring path, and the third electrode is connected with the sixth electrode via the first signal wiring path.
    Type: Grant
    Filed: August 20, 2015
    Date of Patent: December 18, 2018
    Assignee: RENESAS ELECTRONICS CORPORATION
    Inventors: Shuuichi Kariyazaki, Wataru Shiroi, Kenichi Kuboyama
  • Patent number: 10154601
    Abstract: Various embodiments of a modular electromechanical device are described herein. The modular electromechanical device includes a chassis and a plurality of functional modules that can be connected to the chassis. Each module is associated with a different functionality. The functionality of the modular electromechanical device is defined based on various attributes including the functionality of the different functional modules that are connected to the electromechanical device, the sequence in which the different functional modules are connected to the electromechanical device, the specific attachment structures used to attach the functional modules to the electromechanical device, or a pattern of traces formed within the chassis.
    Type: Grant
    Filed: January 17, 2017
    Date of Patent: December 11, 2018
    Assignee: Facebook, Inc.
    Inventors: Baback Elmieh, Alexandre Jais, Rex Wenters Crossen, Andrew Alexander Robberts
  • Patent number: 10147662
    Abstract: A circuit board includes: a base body formed of ceramics or sapphire, the base body being provided with a through hole which penetrates therethrough from one principal face to another principal face of the base body; a through conductor containing silver as a major constituent, the through conductor being located inside the through hole of the base body; metallic wiring layers located on the respective principal faces of the base body and on the through conductor; and regions in which a compound containing at least one substance selected from Sn, Cu, and Ni is present between the through conductor and the metallic wiring layers.
    Type: Grant
    Filed: October 29, 2015
    Date of Patent: December 4, 2018
    Assignee: Kyocera Corporation
    Inventor: Yuuichi Abe
  • Patent number: 10149402
    Abstract: An IO subsystem, for use with an IT computing device, includes a cage assembly configured to releasably engage a chassis of the IT computing device and to receive a plurality of IO adapter cards. A midplane adapter assembly, positioned within the cage assembly, includes a first electrical connector system configured to engage a generic connector system included within the IT computing device and a second electrical connector system configured to engage the plurality of IO adapter cards. A coupling system is configured to releasably couple the cage assembly to the chassis of the IT computing device.
    Type: Grant
    Filed: September 30, 2015
    Date of Patent: December 4, 2018
    Assignee: EMC IP Holding Company LLC
    Inventors: Daniel Dufresne, James L. Pringle, Jr.
  • Patent number: 10143080
    Abstract: A dynamically flexible article or device, such as an armband, includes a flexible electronic component, such as a flexible electronic display, and a flexible support structure coupled to the flexible electronic component, wherein the flexible support and the flexible electronic component are flexible along two dimensions to thereby be able to conform to a complex curved surface. The flexible support includes bending limiting structure that constrains bending of the flexible electronic component to prevent undesirable bending.
    Type: Grant
    Filed: January 27, 2017
    Date of Patent: November 27, 2018
    Assignee: FLEXTERRA, INC.
    Inventors: Hjalmar Edzer Ayco Huitema, Philippe Inagaki
  • Patent number: 10143081
    Abstract: Disclosed are compositions, devices, systems and fabrication methods for stretchable composite materials and stretchable electronics devices. In some aspects, an elastic composite material for a stretchable electronics device includes a first material having a particular electrical, mechanical or optical property; and a multi-block copolymer configured to form a hyperelastic binder that creates contact between the first material and the multi-block copolymer, in which the elastic composite material is structured to stretch at least 500% in at least one direction of the material and to exhibit the particular electrical, mechanical or optical property imparted from the first material. In some aspects, the stretchable electronics device includes a stretchable battery, biofuel cell, sensor, supercapacitor or other device able to be mounted to skin, clothing or other surface of a user or object.
    Type: Grant
    Filed: November 21, 2017
    Date of Patent: November 27, 2018
    Assignee: The Regents of the University of California
    Inventors: Joseph Wang, Rajan Kumar, Ying Shirley Meng, Jae Wook Shin, Lu Yin