Abstract: A hinge assembly for a multi-part electronic device comprises a pair of opposing living hinge elements for connecting first and second parts of the multi-part electronic device. Each hinge element has a first segment, an intermediate segment and a second segment, and comprises a first hinged joint positioned at a junction of the first segment and the intermediate segment and defining a first hinge axis, and a second hinged joint positioned at a junction of the second segment and the intermediate segment and defining a second hinge axis. The second hinged joint is spaced apart from the first hinged joint by a length of the intermediate segment. Each of the first and second hinged joints is configured to permit 180 degrees of rotation. A multi-part electronic device having a double-acting hinge arrangement is also described.

Abstract: An electronic device includes a resin layer, a conductive layer buried in the resin layer, an electronic part buried in the resin layer, and a wiring layer arranged on the resin layer, the wiring layer including wiring and an opening, the wiring being connected electrically to the conductive layer and the electronic part, the opening communicating with the conductive layer.

Abstract: A power module and a manufacturing method thereof are provided, and the power module includes a carrier substrate, an interconnection layer, a first chip, a second chip, a ceramic bonding substrate, a top interconnection layer and a lead frame. The interconnection layer is disposed on the carrier substrate. The first chip and the second chip are disposed on the interconnection layer, and electrically connected to the interconnection layer. The ceramic bonding substrate is disposed on the interconnection layer, and is disposed in between the first chip and the second chip so as to separate the first chip from the second chip. The top interconnection layer is disposed on the ceramic bonding substrate, covers the first chip and the second chip, and is electrically connected to the first chip and the second chip. The lead frame is disposed on the top interconnection layer and electrically connected to the top interconnection layer.

Abstract: Systems, and apparatus for aligning structures are provided. One of the apparatus includes a first communication module including: a printed circuit board, one or more integrated circuit packages mounted on the printed circuit board, and one or more magnets positioned relative to the one or more integrated circuit packages, wherein the one or more magnets are configured to attractively couple the first communication module to a second communication module positioned in proximity to the first communication module.

Abstract: A rail vehicle control relay board includes a main frame, a mother board and a daughter board assembly which are arranged in the main frame, the main frame includes a board face mounting frame and a daughter board mounting frame which protrudes from the board face mounting frame, the mother board is arranged in the board face mounting frame, and multiple daughter board assemblies perpendicular to the mother board are arranged side by side in the daughter board mounting frame, the daughter board assemblies are electrically connected to the mother board, and multiple first connectors configured to perform output outwards are arranged on the mother board. The rail vehicle control relay board has a high strength, and may reduce the daughter board loosening faults, extend a wiring space and increase the number of relays arranged.

Abstract: The present disclosure provides a carrying structure for carrying electronic device. The carrying structure comprises a carrying base, a start-up member, a linkage module, a latch member, a first buckle member, and a releasing member. When an electronic device is disposed to the carrying base, the electronic device drives the start-up member, which drives the latch member via the linkage module so that the latch member can fix the electronic device to the carrying base. To disassemble the electronic device from the carrying base, press the releasing member, which pushes the first buckle member and makes the latch member depart from the first buckle member and restore to the original position. Consequently, the start-up member and the linkage module can restore to the original positions. Thereby, the effects of rapid assembling and disassembling can be achieved.

Abstract: A facial-interface system for a head-mounted display may include (1) a facial interface having a positioning abutment surface and (2) a facial-interface adjustment apparatus. The facial-interface adjustment apparatus may include a positioning member that is rotatable about a pivot, the positioning member comprising an extending surface and a contracting surface. The facial-interface adjustment apparatus may also include an actuation member that that is movable to rotate the positioning member about the pivot between (1) an extended holding position in which the extending surface of the positioning member faces and abuts the positioning abutment surface of the facial interface, and (2) a contracted holding position in which the contracting surface of the positioning member faces and abuts the positioning abutment surface of the facial interface. Various other systems, devices, and methods are also disclosed.

Abstract: A printed circuit board includes: a core board including, on a first surface thereof, an element mounting part and an element non-mounting part; an insulation layer disposed on the element non-mounting part; a copper-clad laminate plate disposed on the insulation layer; a first penetration via penetrating the insulation layer and the copper-clad laminate plate; and a second penetration via disposed in the core board and connected to the first penetration via.

Abstract: An intermediate connection layer interposed between a wiring substrate and an electronic part includes a rigid substrate and a flexible substrate. A plurality of conductor portions are formed on opposed principal surfaces of the respective flexible and rigid substrates. The rigid substrate is provided with an opening, and a fuse portion on the flexible substrate faces the opening. The flexible substrate and the rigid substrate are bonded together with solders. The respective rigid and flexible substrates are separately made, solder pastes are applied to the rigid substrate, both substrates are overlaid on each other, and the solder pastes are heated and solidified to make the intermediate connection layer.

Abstract: A display device includes a flexible insulating substrate, an insulating layer on the insulating substrate, and a plurality of terminals made of a conductive material on the insulating layer. The insulating layer is disposed outside the area located between the terminals. The insulating substrate has a groove between the terminals.

Abstract: In embodiments of a flexible display extendable assembly, an extendable assembly includes a slideable display guide integrated in a first housing part of an extendable electronic device. The extendable electronic device includes a flexible display that slide-engages into the first housing part of the extendable electronic device. The extendable assembly includes an extendable mechanism that is coupled in a second housing part of the extendable electronic device and to the slideable display guide. The first and second housing parts of the extendable electronic device slide-engage relative to each other. The extendable mechanism is implemented to extend as the first and second housing parts slide apart relative to each other, and also to retract as the first and second housing parts slide together relative to each other.

Abstract: Embodiments disclosed herein generally relate to a hard disk drive system with improved isolation from operational vibration. More particularly, embodiments disclosed herein provide a hard disk drive system with a vibration isolation frame and flexible connection without deviation from standard form factor. The standard form factor is the form factor of the hard disk drive with the base plate, but without the isolation frame. The hard disk drive with the isolation frame has the same form factor as the hard disk drive without the isolation frame, but with the base plate. Examples of form factors that may be utilized include the form factors for 3.5 inch and 2.5 inch hard disk drives. It is to be understood that 3.5 inch and 2.5 inch form factors are simply examples. Other size form factors are contemplated as well.

Abstract: A protective cover for an electronic device includes a first hardshell member, a second hardshell member, and a flexible hinge member. The first hardshell member removably attaches to a first portion of the electronic device to protect the first portion of the electronic device. The second hardshell member removably attaches to a second portion of the electronic device to protect the second portion of the electronic device. The flexible hinge member includes a flexible material and is attached to the first hardshell member and the second hardshell member such that the flexible hinge member aligns with a hinge of the electronic device. The flexible hinge member flexes to allow the second portion of the electronic device to remain articulable relative to the first portion of the electronic device when the protective cover is on the electronic device.

Abstract: An apparatus relating generally to an interposer is disclosed. In such an apparatus, the interposer has a plurality of conductors for coupling an integrated circuit die to the interposer to provide a stacked die. The interposer includes a pad coupled to a conductive network of the interposer to dissipate electrostatic charge from the interposer.

Abstract: Electronic apparatus includes a laminated multi-layer circuit substrate, including first and second rigid cards and a flexible section between the first and second rigid cards. First and second sets of electrical terminals are disposed respectively on the first and second rigid cards and arranged to mate with respective bus connectors configured in accordance with a predefined bus standard. At least one bus interface circuit is configured to communicate over a bus in accordance with the predefined bus standard and disposed on the first rigid card. Printed conductors run continuously from the first rigid card, over the flexible section of the substrate, to the second rigid card and connect the at least one bus interface circuit on the first rigid card to the second set of electrical terminals on the second rigid card.

Abstract: Flexible printed circuit (FPC) connector includes a flex circuit having first and second side surfaces and a thickness extending between the first and second side surfaces. The flex circuit includes a plurality of stacked substrate layers. The FPC connector also includes a conductive pathway extending through the flex circuit and a substrate protrusion coupled to the second side surface and projecting a distance away from the second side surface. The substrate protrusion is formed from at least one dielectric layer. The FPC connector also includes a contact pad that is directly coupled to at least one of the substrate protrusion or the second side surface of the flex circuit. The contact pad is electrically coupled to the conductive pathway.

Abstract: A computer with cable access door which securely conceals connected cables. In one example embodiment, the computer includes a housing including a cable access door having an open position and a closed position and a connector within the housing for connecting to a cable originating from outside the housing. The cable access door conceals the connector and the cable when the cable access door is in the closed position.

Abstract: A printed circuit board including an electronic component and a method of producing the same are provided. The printed circuit board includes a multilayered substrate including an insulation layer and an inner circuit layer laminated therein, a cavity disposed in the multilayered substrate, a via disposed in the insulation layer and configured to electrically connect the inner circuit layer with another inner circuit layer, a first electronic component inserted in the cavity, and a bump pad disposed on a surface of the cavity facing the first electronic component, and the bump pad is formed by having the insulation layer and the via exposed to a lateral side of the cavity.

Abstract: A connection structure of circuit members includes a first circuit member, a second circuit member, and a joint portion. The first circuit member has a first main surface on which a light-transparent electrode is provided. The second circuit member has a second main surface on which a metal electrode is provided. The joint portion is interposed between the first main surface and the second main surface. The joint portion includes a resin portion and a solder portion. The solder portion electrically connects the light-transparent electrode and the metal electrode. The light-transparent electrode contains an oxide that includes indium and tin, and the solder portion contains bismuth and indium.

Abstract: In one general aspect, an electronic device module includes a first board, a first device mounted on a first surface of the first board, a second board disposed below the first board, and a plurality of second devices disposed between the first board and the second board, wherein a surface of each second device the plurality of second devices is bonded to a second surface of the first board and another surface of each of the second devices is bonded to the second board.