Abstract: An electrical device includes a circuit board (101), a light source (104), and a light guide (105). The light guide receives light from the light source and conducts the received light to an end of the light guide so that the light crosses, in a direction parallel with the circuit board, an edge of the circuit board. The end of the light guide constitutes a display surface for showing the light to a user. On a fringe area extending from the edge of the circuit board a distance (D) towards the opposite edge of the circuit board, the light guide is between geometrical planes parallel and coinciding with surfaces of the circuit board. Hence, the light guide does not require room in directions perpendicular to the circuit board. Therefore, for example, more connectors, key buttons, and/or other instruments can be placed on a control panel of the electrical device.

Abstract: An electronic assembly and device are provided. The electronic assembly includes a first circuit board, with PCB pads located adjacent to an edge of the circuit board, and a corresponding plurality of contacts, each contact soldered to one of the PCB pads. Each contact has a first portion, soldered to the PCB pad, and a second portion that extends past the edge of the circuit board and forms a leaf spring. The leaf spring compresses when placed in contact with a PCB pad of a second circuit board, where the PCB pad is substantially coplanar with a surface of the second circuit board. A restoring force of the second portion maintains contact between the second portion and the PCB pad of the second circuit board. The contact forms an electrical connection between the PCB pad of the first circuit board and the PCB pad of the second circuit board.

Abstract: An insulating support includes a pillar-shaped portion made of resin, a metal insert buried in one end surface of the pillar-shaped portion in an axial direction, a metal insert buried in the other end surface of the pillar-shaped portion in the axial direction, and one protrusion made of the resin and provided in a ring shape and integrally with the pillar-shaped portion on an outer circumferential surface of the pillar-shaped portion on a side of the metal insert. The metal insert includes a first cylindrical base portion and a first distal end portion. The metal insert includes a second cylindrical base portion and a second distal end portion. A whole of the first distal end portion is disposed within an extended range of the protrusion in the axial direction.

Abstract: A composite transmission line includes a laminated insulator including insulator layers, signal transmission lines including first and second signal transmission lines and a power transmission line. The power transmission line includes a power transmission conductor pattern along the insulator layers, and an interlayer connection conductor that interlayer-connects power transmission conductor patterns. The first signal conductor pattern of the first signal transmission line, the second signal conductor pattern of the second signal transmission line, and the power transmission conductor pattern are parallel or substantially parallel to each other on the insulator layers that are mutually different from each other. The first and second signal conductor patterns interpose a first ground conductor in the laminating direction of the insulator layers. The power transmission line is in a side portion of the first signal conductor pattern.

Abstract: A differential trace pair system includes a board having a first board structure member and a second board structure member. A differential trace pair in the board includes a first differential trace pair portion of a first width outside the board structure, and a second differential trace pair portion of a second width extending through the board structure. A first outer edge and a second outer edge of the second differential trace pair portion define the second width that is less than the first width. A first board structure member channel is defined by the first outer edge adjacent the first board structure member, a second board structure member channel is defined by the second outer edge adjacent the second board structure member and the first and second board structure member channels provide a third width of the second differential trace pair portion that is less than the second width.

Abstract: Passive device assembly for accurate ground plane control is disclosed. A passive device assembly includes a device substrate conductively coupled to a ground plane separation control substrate. A passive device disposed on a lower surface of the device substrate is separated from an embedded ground plane mounted on a lower surface of the ground plane separation control substrate by a separation distance. The separation distance is accurately controlled to minimize undesirable interference that may occur to the passive device. The separation distance is provided inside the passive device assembly. Conductive mounting pads are disposed on the lower surface of the ground plane separation control substrate to support accurate alignment of the passive device assembly on a circuit board. By providing sufficient separation distance inside the passive device assembly, the passive device assembly can be precisely mounted onto any circuit board regardless of specific design and layout of the circuit board.

Abstract: A semiconductor package includes: a semiconductor chip including an effective chip region at a center of the semiconductor chip and in which pads connected to chip wirings are formed, and a dummy chip region at a side of the effective chip region and in which pads not connected to the chip wirings are formed; a base film including a chip mounting section on which the semiconductor chip is mounted; and a plurality of wiring patterns disposed on the base film and electrically connected to the chip wirings of the semiconductor chip, wherein first wiring patterns, which are a part of the plurality of wiring patterns, extend on a first region of the chip mounting section corresponding to the dummy chip region.

Abstract: A base substrate which prevents burrs generated during the cutting process includes: multiple conductive layers stacked in one direction with respect to the base substrate; at least one insulation layer being alternately stacked with said conductive layers and electrically separating said conductive layers; and a through-hole penetrating said base substrate covering said insulation layer at the contact region where said cut surface and said insulation layer meet during the cutting of said base substrate in accordance with a predetermined region of the chip substrate. A method of manufacturing the base substrate includes alternately stacking conductive layers and insulation layers and forming a through-hole.

Abstract: A programmable circuit includes an array of printed groups of microscopic transistors or diodes. The devices are pre-formed and printed as an ink and cured. A patterned hydrophobic layer defines the locations of the printed dots of the devices. The devices in each group are connected in parallel so that each group acts as a single device. Each group has at least one electrical lead that terminates in a patch area on the substrate. An interconnection conductor pattern interconnects at least some of the leads of the groups in the patch area to create logic circuits for a customized application of the generic circuit. The groups may also be interconnected to be logic gates, and the gate leads terminate in the patch area. The interconnection conductor pattern then interconnects the gates for form complex logic circuits.

Abstract: A portable electronic device packaged into a System-in-Package assembly is disclosed. The portable electronic device can include a substrate and a plurality of components mounted on the substrate and included in one or more subsystems. Interference between subsystems or from external sources can be reduced or eliminated by disposing an insulating layer over the components, forming narrow trenches between subsystems, and conformally coating the insulating layer and trenches with a metal shielding layer. In some examples, trenches between subsystems can be formed using a laser source. In some examples, trenches between subsystems can have angled walls. In some examples, the metal shielding layer can be formed using at least one of electroplating, electroless plating, chemical vapor deposition, and physical vapor deposition.

Abstract: A component-embedded substrate includes: a resin substrate having a mount surface and a peripheral surface surrounding a perimeter of the mount surface; a first mounted component mounted on the mount surface; a second mounted component mounted on the mount surface and spaced from the first mounted component; a first chip-type electronic component disposed in the resin substrate; and a second chip-type electronic component disposed in the resin substrate and spaced from the first chip-type electronic component. The first and second chip-type electronic components are spaced from each other along a cross direction crossing an arrangement direction along which the first mounted component and the second mounted component that are arranged with respect to each other. The first and second chip-type electronic components are each arranged to cross the cross direction.

Abstract: A universal magnetic mounting assembly having a case assembly with a hole that has a first circumference, and a rear wall, first and second lateral walls, and top and bottom walls. The rear wall has interior and exterior faces. The case assembly cradles an electronic device. A magnet has an interior wall, a perimeter edge having a second circumference, an exterior wall, an angled wall, and an interior edge. The angled wall is concavely shaped and extends from the exterior wall to the interior edge. The magnet protrudes through the hole, whereby the first circumference is larger than the second circumference. A cover plate has a third circumference larger than the first circumference and is ferromagnetic and/or metallic. The cover plate is positioned between the electronic device and the interior face of the rear wall. Further having a mounting device with a base and a spherically shaped metallic surface.

Abstract: An apparatus is for use with an electrical module. The apparatus includes a connection module having a connection housing enclosing a connection electrical circuit. A connection registration feature is configured to be in registered alignment with a registration feature of the electrical module. A connection circuit terminal is electrically connected to the connection electrical circuit. A connection magnet is configured to be magnetically attracted to (or magnetically repelled from) a magnet of the electrical module.

Abstract: A flexible printed circuit board installed on a substrate in a display device is provided.

Abstract: An electronic device is provided according to the present application, which includes a first body having a working surface; and a second body having a main body and a support body, the main body has an operational surface, and the main body rotatably couples to the first body and the support body via respective opposing edges of the main body. The electronic device is operable in a stand mode, wherein respective corresponding edges of the main body and the support body are arranged to rest on a support surface to prevent the operational surface of the main body from contacting against the support surface in the stand mode.

Abstract: A waterproof housing including a frame structure and a waterproof structure is provided. The frame structure includes an opening. The waterproof structure is fixed on the frame structure and covers whole of the external surface and the opening of the frame structure. The waterproof structure includes a plurality of ribs extending toward the opening correspondingly and located in the opening. An electronic device is further provided including the waterproof housing and a keyboard module. The keyboard module includes a plurality of keys. The keyboard module is disposed under the waterproof housing and passes into the opening from an underside of the frame structure. The waterproof structure covers the keyboard module disposed in the opening and is fixed between the keys via the ribs. Therefore, the electronic device and the waterproof housing thereof have an improved water-proof function and are convenient in use.

Abstract: A motor driving device including a printed board on which an insulating component is mounted. The insulating component integrally includes a plate-shaped insulation part formed by a heat resistant resin having an electrical insulation property, and a plate-shaped adhesive part provided at an end portion of the insulation part and formed by a thermoplastic resin having an electrical insulation property, and the insulating component is adhered to a surface of the printed board by thermal welding by heating and melting the adhesive part.

Abstract: An housing of electronic device, includes a resin molded housing with an opening there through, a sheet metal positioned within the opening and a water proofing tape positioned on a side of the sheet metal, wherein a periphery of the sheet metal and an entirety of the water proofing tape are encased within the resin molded housing so as to seal the opening in a water tight manner, and, a front central portion of the sheet metal and a rear central portion of the sheet metal are exposed.

Abstract: A package substrate is provided, which includes a plurality of dielectric layers and a plurality of circuit layers alternately stacked with the dielectric layers. At least two of the circuit layers have a difference in thickness so as to prevent warpage of the substrate.

Abstract: A cable manager includes one or more cable manager units. Each cable manager unit includes a pair of side cable guides, each comprised of a plurality of finger-like projections extending forwardly from a support column. At least one of the pair of support columns has a socket arranged at a side thereof. Each cable manager unit further includes a separate midsection member capable of insertion into the socket for interconnecting the pair of side cable guides.